®
RT8055
3A, 2MHz, Synchronous Step-Down Converter
General Description
The RT8055 is a high efficiency synchronous, step-down DC/DC converter. Its input voltage range is from 2.6V to 5.5V and provides an adjustable regulated output voltage from 0.8V to 5V while delivering up to 3A of output current.
The internal synchronous low on-resistance power switches increase efficiency and eliminate the need for an external Schottky diode. The switching frequency is set by an external resistor. The 100% duty cycle provides low dropout operation extending battery life in portable systems. Current mode operation with external compensation allows the transient response to be optimized over a wide range of loads and output capacitors.
The RT8055 is operated in forced continuous PWM Mode which minimizes ripple voltage and reduces the noise and RF interference.
The RT8055 is available in the WDFN-10L 3x3 and SOP-8 (Exposed Pad) packages.
Features
zHigh Efficiency : Up to 95%
zLow RDS(ON) Internal Switches : 100mΩ
zProgrammable Frequency : 300kHz to 2MHz
zNo Schottky Diode Required
z0.8V Reference Voltage Allows for Low Output Voltage
zForced Continuous Mode Operation
z100% Duty Cycle Operation
zInput Over Voltage Protection
zRoHS Compliant and Halogen Free
Applications
zPortable Instruments
zBattery-Powered Equipment
zNotebook Computers
zDistributed Power Systems
zIP Phones
zDigital Cameras
z3G/3.5GData Card
Ordering Information
RT8055
Package Type
QW : WDFN-10L 3x3 (W-Type)
SP : SOP-8 (Exposed Pad-Option 2)
Lead Plating System
G : Green (Halogen Free and Pb Free) Z : ECO (Ecological Element with
Halogen Free and Pb free)
Note :
Richtek products are :
`RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.
`Suitable for use in SnPb or Pb-free soldering processes.
Pin Configurations
(TOP VIEW)
SHDN/RT 1 |
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10 |
COMP |
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GND 2 |
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GND |
9 |
FB |
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LX 3 |
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8 |
VDD |
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LX 4 |
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7 |
PVDD |
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PGND 5 |
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11 6 |
PVDD |
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WDFN-10L 3x3 |
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SHDN/RT |
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8 |
COMP |
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GND |
2 |
GND |
7 |
FB |
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LX |
3 |
6 |
VDD |
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9 |
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PGND |
4 |
5 |
PVDD |
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SOP-8 (Exposed Pad)
Copyright ©2012 Richtek Technology Corporation. All rights reserved. |
is a registered trademark of Richtek Technology Corporation. |
DS8055-05 November 2012 |
www.richtek.com |
|
1 |
RT8055
Marking Information
RT8055GQW |
RT8055GSP |
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JN= : Product Code |
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RT8055GSP : Product Number |
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RT8055 |
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JN=YM |
YMDNN : Date Code |
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YMDNN : Date Code |
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GSPYMDNN |
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DNN |
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RT8055ZQW
JN : Product Code
YMDNN : Date Code
JN YM
DNN
Typical Application Circuit
VIN |
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5V |
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CIN |
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22µF |
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C1 |
0.1µF |
ROSC |
180k |
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L1 |
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PVDD |
LX |
2µH |
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VOUT |
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3.3V/3A |
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RT8055 |
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R1 |
COUT |
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VDD |
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22µF x 2 |
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75k |
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FB |
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R2 |
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SHDN/RT |
COMP |
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24k |
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GND |
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RCOMP |
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30k |
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PGND |
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CCOMP |
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470pF |
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Table 1. Recommended Component Selection
VOUT |
R1 (kΩ) |
R2 (kΩ) |
RCOMP (kΩ) |
CCOMP (nF) |
L1 (μH) |
COUT (μF) |
3.3 |
75 |
24 |
30 |
0.47 |
2.2 |
22 x 2 |
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2.5 |
51 |
24 |
27 |
0.47 |
2.2 |
22 x 2 |
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1.8 |
30 |
24 |
22 |
0.47 |
2.2 |
22 x 2 |
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1.5 |
21 |
24 |
18 |
0.47 |
2.2 |
22 x 2 |
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1.2 |
12 |
24 |
15 |
0.47 |
1.0 |
22 x 2 |
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1.0 |
6 |
24 |
13 |
0.47 |
1.0 |
22 x 2 |
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Copyright ©2012 Richtek Technology Corporation. All rights reserved. |
is a registered trademark of Richtek Technology Corporation. |
www.richtek.com |
DS8055-05 November 2012 |
2
RT8055
Functional Pin Description
Pin No. |
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Pin Name |
Pin Function |
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WDFN-10L 3x3 |
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SOP-8 |
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Shutdown Control or Frequency Setting Input. Connect a |
1 |
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SHDN/RT |
resistor to ground from this pin sets the switching frequency. |
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Force this pin to VDD or GND causes the device to be shut down. |
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Signal Ground. All small-signal components and compensation |
2, |
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2, |
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components should be connected to this ground, which in turn |
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GND |
connects to PGND at one point. The exposed pad must be |
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11 (Exposed Pad) |
9 (Exposed Pad) |
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soldered to a large PCB and connected to GND for maximum |
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power dissipation. |
3, 4 |
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3 |
LX |
Internal Power MOSFET Switches Output. Connect this pin to |
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the inductor. |
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5 |
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4 |
PGND |
Power Ground. Connect this pin close to the negative terminal of |
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CIN and COUT. |
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6, 7 |
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5 |
PVDD |
Power Supply Input. Decouple this pin to PGND with a capacitor. |
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8 |
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6 |
VDD |
Signal Supply Input. Decouple this pin to GND with a capacitor. |
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Generally, VDD is equal to PVDD. |
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9 |
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7 |
FB |
Feedback Pin. This pin receives the feedback voltage from a |
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resistive divider connected across the output. |
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Error Amplifier Compensation Point. The current comparator |
10 |
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8 |
COMP |
threshold increases with this control voltage. Connect external |
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compensation elements to this pin to stabilize the control loop. |
Function Block Diagram
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SHDN/RT |
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PVDD |
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SD |
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ISEN |
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OSC |
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Slope |
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COMP |
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Comp. |
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0.8V |
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OC |
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EA |
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Output |
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FB |
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Clamp |
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Limit |
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LX |
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Internal - |
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Driver |
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Soft Star |
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Control |
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0.7V |
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Logic |
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NISEN |
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PGND |
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OTP |
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POR |
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0.4V |
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N-MOSFET ILIM |
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GND |
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VDD |
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VREF |
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Copyright ©2012 Richtek Technology Corporation. All rights reserved. |
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is a registered trademark of Richtek Technology Corporation. |
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DS8055-05 November 2012 |
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www.richtek.com |
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3 |
RT8055
Absolute Maximum Ratings |
(Note 1) |
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z Supply Input Voltage, VDD, PVDD |
---------------------------------------------------------------------------- |
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−0.3V to 6.5V |
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z LX Pin Switch Voltage -------------------------------------------------------------------------------------------- |
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−0.3V to (PVDD + 0.3V) |
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<10ns ---------------------------------------------------------------------------------------------------------------- |
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−5V to 8.5V |
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z Other I/O Pin Voltages ------------------------------------------------------------------------------------------- |
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−0.3V to 6.5V |
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z LX Pin Switch Current -------------------------------------------------------------------------------------------- |
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4A |
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z Power Dissipation, PD @ TA = 25°C |
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WDFN-10L 3x3 ----------------------------------------------------------------------------------------------------- |
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1.667W |
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SOP-8 (Exposed Pad) ------------------------------------------------------------------------------------------- |
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1.333W |
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z Package Thermal Resistance (Note 2) |
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WDFN-10L 3x3, θJA ----------------------------------------------------------------------------------------------- |
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60°C/W |
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WDFN-10L 3x3, θJC ----------------------------------------------------------------------------------------------- |
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7.8°C/W |
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SOP-8 (Exposed Pad), θJA ------------------------------------------------------------------------------------- |
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75°C/W |
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SOP-8 (Exposed Pad), θJC ------------------------------------------------------------------------------------- |
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15°C/W |
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z Junction Temperature --------------------------------------------------------------------------------------------- |
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150°C |
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z Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------- |
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260°C |
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z Storage Temperature Range ------------------------------------------------------------------------------------ |
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−65°C to 150°C |
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z ESD Susceptibility (Note 3) |
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HBM (Human Body Model) -------------------------------------------------------------------------------------- |
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2kV |
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Recommended Operating Conditions |
(Note 4) |
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z Supply Input Voltage ---------------------------------------------------------------------------------------------- |
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2.6V to 5.5V |
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z Junction Temperature Range ------------------------------------------------------------------------------------ |
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−40°C to 125°C |
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z Ambient Temperature Range ------------------------------------------------------------------------------------ |
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−40°C to 85°C |
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Electrical Characteristics |
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(VDD = 3.3V, TA = 25°C, unless otherwise specified) |
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Parameter |
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Symbol |
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Test Conditions |
Min |
Typ |
Max |
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Unit |
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Input Voltage Range |
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VDD |
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2.6 |
-- |
5.5 |
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V |
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Feedback Reference Voltage |
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VREF |
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0.784 |
0.8 |
0.816 |
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V |
Feedback Leakage Current |
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IFB |
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VFB = 3.3V |
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-- |
-- |
0.1 |
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μA |
DC Bias Current |
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Active , VFB = 0.7V, Not Switching |
-- |
500 |
-- |
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μA |
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Shutdown |
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-- |
-- |
1 |
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μA |
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Output Voltage Line Regulation |
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VLINE |
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VIN = 2.6V to 5.5V |
-- |
0.1 |
-- |
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%/V |
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Output Voltage Load Regulation |
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VLOAD |
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VIN = 5V, VOUT = 3.3V, |
-- |
0.4 |
-- |
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% |
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IOUT = 0A to 3A |
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Error Amplifier |
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gm |
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-- |
400 |
-- |
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μA/V |
Transconductance |
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Current Sense Transresistance |
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RS |
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-- |
0.4 |
-- |
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Ω |
RT Leakage Current |
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SHDN/RT = VIN = 5.5V |
-- |
-- |
1 |
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μA |
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Copyright ©2012 Richtek Technology Corporation. All rights reserved. |
is a registered trademark of Richtek Technology Corporation. |
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www.richtek.com |
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|
DS8055-05 |
November 2012 |
4
RT8055
Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Unit |
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ROSC = 180kΩ |
1.44 |
1.8 |
2.16 |
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Switching Frequency |
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MHz |
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Adjustable Switching Frequency |
0.3 |
-- |
2 |
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Range |
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Switch On Resistance, High |
RDS(ON)_P |
ISW = 0.3A |
-- |
100 |
160 |
mΩ |
Switch On Resistance, Low |
RDS(ON)_N |
ISW = 0.3A |
-- |
100 |
170 |
mΩ |
Peak Current Limit |
ILIM |
|
3.5 |
-- |
-- |
A |
Under Voltage Lockout |
|
VDD Rising @Full Temperature |
2.33 |
2.4 |
2.57 |
V |
Threshold (Note 5) |
|
VDD Falling @Full Temperature |
1.98 |
2.2 |
2.37 |
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Shutdown Threshold |
VSHDN |
VSHDN Rising |
-- |
VIN − 0.85 |
VIN − 0.4 |
V |
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions. Note 5. Guaranteed by design.
Copyright ©2012 Richtek Technology Corporation. All rights reserved. |
is a registered trademark of Richtek Technology Corporation. |
DS8055-05 November 2012 |
www.richtek.com |
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5 |