16, 19, 20, 21, 25, 27........................................-0.3V to +18V
• Pins: 12. 18 ...................................................... -0.3V to +16V
*NOTICE:Stresses above those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent
device failure. Functionality at or above these
limits is not implied. Exposure to absolute maximum ratings for extended periods may affect
device reliability.
3. No use for operation – For testing purpose only.
Basic Internal
Configuration
SΦ
SΦ
ECHA
ECHB
and Φ
and Φ
RA
RB
internal to TH7841A
DD
SS
UnitNoteMinTypMax
(1)
(2)
V
V
(3)
(3)
1998A–IMAGE–05/02
Table 2. Selection of Nominal Mode
OptionImplementationNote
V
(16) Connected to V
INH
Internal Sampling
SΦ
SΦ
ECHA
ECHB
(4) and Φ
(24) and Φ
Internal ResetΦRA(5) and ΦRB(21) Connected to VDD
Note:1. Make the straps as short as possible to avoid any parasitic coupling to these connec-
tions. The load capacitance introduced by the strap should not exceed 5 pF.
(3) Strapped
ECHA
ECHB
SS
(25) Strapped
(1)
3
Figure 1. Timing Diagram — Clocks and Video Output Timing Diagram in Internal Sampling Mode
Table 3. Drive Clock Characteristics (see Figure 1)
Value s
ParameterSymbolLogic
Transfer Clock
Φ
Register Transport ClockLow0.00.40.6
Register Transport Clock
Capacitance
Transfer Clock CapacitanceCΦ
PΦT
CΦ
T
P
High121314V
8001200pF
200300pF
Note:1. Transients under 0.0V in the clock pulses will lead to charge injection, causing a localized increase in the dark signal if such
spurious negative transients are present, they can be suppressed by inserting a serial resistor of appropriate value (typically
20 to 100Ω) in the corresponding driver output.
4
TH7841A
UnitNoteMinTypMax
(1)
1998A–IMAGE–05/02
Table 4. Static and Dynamic Electrical Characteristics
ParameterSymbol
TH7841A
Value s
UnitNoteMinTypMax
DC Output LevelV
Output ImpedanceZ
REF
S
81012V
500Ω
Register Single-stage Transfer EfficiencyCTE99.99299.998%V
Max. Data Output FrequencyFSmax.1220MHz
Input Current on Pins: 3, 5, 10,11,12, 13,
18, 19, 20, 21, 25
Peak Current Sink on Φ
Peak Current Sink on Φ
Clock(IΦT)
T
Clock(IΦP)
P
Output Amplifier Drain Supply CurrentI
Static Power DissipationP
Ie2µA
P
P
DD
D
500mAt
125mAt
17mA
255300mW
Notes: 1. VOS= average video output voltage. Measurement excludes first and last pixels.
2. F
=2FΦT. The minimum clock frequency is limited by the increase in dark signal.
S
Electro-optical
Performance
General measurement conditions: TC=25°C; Ti=1ms;FΦT=2.5MHz.
Light source: tungsten filament lamp (2854 K) + BG 38 filter (2 mm thick) + F/3.5 aperture. The filter limits the spectrum to 700 nm; in these conditions, 1 µJ/cm
to 3.5 lux.s.
Typical operating conditions; internal clock mode (see Table 2).
(1)
=1V
OS
(2)
Ve = 1 5V
All other pins: 0V
=15ns
rise
=15ns
rise
=0V
V
INH
V
=15V
DD
=0V
V
INH
V
=15V
DD
2
corresponds
First and last pixels, as well as reference elements, are excluded from the specification.
Measurements taken on each output in succession.
1998A–IMAGE–05/02
5
Table 5. Electro-optical Performance
Value s
ParameterSymbol
Saturation Output VoltageV
Saturation ExposureE
SAT
SAT
1.31.82.2V
0.33µJ/cm
ResponsivityR2.52.9V/µJ/cm
Responsivity Unbalance∆R/R28%
UnitNoteMinTypMax
(1)(2)
2
2
(3)
Photo-response No-uniformity Peak-topeak
Contrast Transfer Function at FN
(38 I p/mm)
PRNU±5±10% V
CTF70%V
Temporal Noise in Darkness160µVrms
Dynamic Range (Relative to rms Noise)DR30006000
Average Dark SignalV
DS
0.080.5mV
Dark Signal Non-uniformityDSNU0.150.5mV
Notes: 1. Value measured with respect to zero reference level (see Figure 1).
2. Conversion factor is typically 1.1 µV/e-.
3. ∆R/R is defined as
200 RA RB–
---------- ------------- -----------
RA RB+
where RA is responsivity of video output A
RB is responsivity of video output B
4. Measured in Correlated Double Sampling (C.D.S.) mode.
Figure 2. Typical Spectral Response
OS
VOS=50mVto1V
= 0.75V
OS
(4)
(1)
6
TH7841A
1998A–IMAGE–05/02
Figure 3. CTF Typical Curves (2854 K Source)
TH7841A
Electro-optical
Performance Without
Infrared Cut-off
The TH7841A special semiconductor process exploits the silicon’s high near infrared
sensitivity while maintaining good imaging performance in terms of response uniformity
and resolution. Typical changes in performance with and without IR filtering are summarized below.
Filtering
With IR Cut-off FilterNo IR Cut-off Filter
Average Video Signal Due To a Given Scene IlluminationV
PRNU (Single Defects Excluded)±5%±5%
CTF at Nyquist Frequency70%50%
Complementary
Operating Modes
The TH7841A may be used in several configurations in regards to video output sampling and charge sensing reset.
1. Sampling options
Inhibition of internal sampling pulses allows two possibilities:
a. no sampling: video output delivered in unsampled form,
b. sampling by external clocks: external sampling pulses directly applied to Φ
Φ
inputs.
ECHB
If internal sampling clocks SΦ
unpower the corresponding clock drivers, as this will greatly reduce on-chip power
consumption.
2. External reset position
ECHA
OS
and SΦ
are not used, it is recommended to
ECHB
VOSx4
ECHA
,
1998A–IMAGE–05/02
The position and period of the charge reset clocks may be optimized by using external
clocks on ΦRAand ΦRBinputs. This is especially interesting to optimize the video outputs
for Correlated Double Sampling (in order to reduce noise and improve S/N Ratio).
Control signals to be applied in the different configurations are shown in Table 6.
7
Table 6. Selection of Operating Modes
OptionImplementationNote
Φ
No Sampling
Sampling By External Clocks
Reset Control By External Clocks
(3) and Φ
ECHA
S
Φ
(4) and SΦ
ECHA
(16) Connected to V
V
INH
Sampling Clocks Connected to
SΦ
V
Ext.
Ext.
and SΦ
ECHA
(16) Connected to V
INH
Φ
on ΦRA(5) Input
RA
Φ
on ΦRB(21) Input
RB
(25) Connected to VDD
ECHB
(24) Unconnected
ECHB
DD
Φ
Unconnected
ECHB
DD
ECHA
- Φ
ECHB
(1)
See Figure 4 for sampling
clock timing
SeeFigure4for
reset clock timing
Note:1. Drain supply current IDDdecreases from 10 mA to 8 mA typically when internal sampling clock is disabled (V
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty
whichisdetailedinAtmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors
which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does
not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted
by the Company in connection w ith the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical
components in life support devices or systems.
AT ME L®is the registered trademark of Atmel.
Other terms and product names may be the trademarks of others.
Printed on recycled paper.
1998A–IMAGE–05/020M
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