Pioneer DLS-6 Service manual

DLS6

ORDER NO. MD0801003CE

Mechanism Unit

CONTENTS

Page Page

1 Mechanism Overview (DLS6) 2

2 Prevention of Electrostatic Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

3 Precaution of Laser Diode

4 About Lead Free Solder (PbF)

5 Handling Precautions for Traverse Unit

6 Mechanism Drive Unit

7 Mechanism Operation Description 11

8 Assembling & Disassembling

9 Disassembly Flow

10 DLS6 Mechanism Reliability

11 Exploded Views

12 Replacement Parts List

DLS6

1 Mechanism Overview (DLS6)

DLS6 mechanism is a single tray mechanism used for CD/DVD models. DVD system control is through the DVD/HDMI module except for traverse control.

2 Prevention of Electrostatic Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution:

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

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3 Precaution of Laser Diode

CAUTION :

This product utilizes a laser diode with the unit turned "on", invisible laser radiation is emitted from the pickup lens. Wavelength: 655 nm (DVD)/785 nm (CD) Maximum output radiation power from pickup: 100 µW/VDE

Laser radiation from the pickup unit is safety level, but be sure the followings:

1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.

2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.

3. Do not look at the focus lens using optical instruments.

4. Recommend not to look at pickup lens for a long time.

ACHTUNG :

Dieses Produkt enthält eine Laserdiode. Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der Lasereinheitadgestrahit.

Wellenlänge: 655 nm (DVD)/785 nm (CD) Maximale Strahlungsleistung der Lasereinhelt: 100 µW/VDE

Die strahlungan der Lasereinheit ist ungefährlich, wenn folgende Punkte beachtet werden:

1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten Laserdiode gefährlich ist.

2. Den werksseitig justierten Einstellregler der Lasereinheit nicht verstellen.

3. Nicht mit optischen Instrumenten in die Fokussierlinse blicken.

4. Nicht über längere Zeit in die Fokussierlinse blicken.

4 About Lead Free Solder (PbF)

4.1. Service caution based on legal restrictions

4.1.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that of the normal solder.

Definition of PCB Lead Free Solder being used

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder. (See right figure)

Service caution for repair work using Lead Free Solder (PbF)

" The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

" To put lead free solder, it should be well molten and mixed with the original lead free solder.

" Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

" Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt

the lead free solder.

" Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30

degrees C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

" The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

DLS6

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

DLS6

5 Handling Precautions for Traverse Unit

The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be taken avoid caution to electrostatic breakdown when servicing and handling the laser diode in the traverse unit.

5.1. Cautions to Be Taken in Handling the Optical Pickup Unit

The laser diode in the optical pickup unit may be damaged due to electrostatic discharge generating from clothes or human body. Special care must be taken avoid caution to electrostatic discharge damage when servicing the laser diode.

1. Do not give a considerable shock to the optical pickup unit as it has an extremely high-precise structure.

2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the optical pickup unit removed should be short-circuited with a short pin or a clip (Figure 1).

5.2. Grounding for electrostatic breakdown prevention

Some devices such as the CD/DVD player use the optical pickup (laser diode) and the optical pickup will be damaged by static electricity in the working environment. Proceed servicing works under the working environment where grounding works is completed.

5.2.1. Worktable grounding

1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet (Figure 2).

5.2.2. Human body grounding

1. Use the anti-static wrist strap to discharge the static electricity form your body (Figure 2).

DLS6

6 Mechanism Drive Unit

6.1. Gears’ operations (Playability)

The arrows indicate the movement of the gears during play operation.

6.2. Traverse slide plate/Sub rack/OPU assembly

The arrows indicate the movement of the parts during play operation.

DLS6

6.3. Switch / Motors

7 Mechanism Operation Description

7.1. Open/Close Operation

Below shows the inter relation of parts during the open & close operations.

DLS6

7.2. Play Operation

Below shows the inter relation of parts during the play operation.

7.3. Initialization

During the power-up of main unit (using DLS6 mechanism), the state of switches is sensored by the micro-p IC and the traverse motor is adjusted accordingly. (This is the initialization process).

Note: Refer to Table 1 for the initialization process. Figures 6 & 7 show the flow of the initialization.

DLS6

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