Philips tda8768 DATASHEETS
INTEGRATED CIRCUITS
DATA SH EET
TDA8768
12-bit high-speed Analog-to-Digital
Converter (ADC)
Preliminary specification
Supersedes data of 1998 Feb 25
File under Integrated Circuits, IC02
1998 Aug 26
Philips Semiconductors Preliminary specification
12-bit high-speed Analog-to-Digital
Converter (ADC)
FEATURES
• 12-bit resolution
• Sampling rate up to 55 MHz
•−3 dB bandwidth of 190 MHz
• 5 V power supplies
• Binary or twos-complement CMOS outputs
• In-range CMOS-compatible output
• TLL-CMOS compatible static digital inputs
• 3 to 5 V CMOS-compatible digital outputs
• Differential clock input; Positive Emitter Coupled Logic
(PECL)-compatible
• Power dissipation 325 mW (typical)
• Low analog input capacitance (typical 2 pF), no buffer
amplifier required
• Integrated sample-and-hold amplifier
• Differential analog input
• External amplitude range control
• Voltage controlled regulator included.
TDA8768
APPLICATIONS
• High-speed analog-to-digital conversion for
– Video signal digitizing
– High Definition TV (HDTV)
– Imaging (camera scanner)
– Medical imaging
– Telecommunication
– Base-station receiver.
GENERAL DESCRIPTION
The TDA8768 is a bipolar 12-bit Analog-to-Digital
Converter (ADC) optimized for telecommunications and
professional imaging. It converts the analog input signal
into 12-bit binary coded digital words at a maximum
sampling rate of 55 MHz. All static digital inputs (SH,
and OTC) are TTL and CMOS compatible and all outputs
are CMOS compatible. A sine wave clock input signal can
also be used.
CE
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
CCA
V
CCD
V
CCO
I
CCA
I
CCD
I
CCO
INL integral non-linearity f
DNL differential non-linearity f
f
CLK(max)
analog supply voltage 4.75 5.0 5.25 V
digital supply voltage 4.75 5.0 5.25 V
output supply voltage 3.0 3.3 5.25 V
analog supply current − 33 tbf mA
digital supply current − 30 tbf mA
output supply current f
= 4 MHz; fi= 400 kHz − 3.2 tbf mA
CLK
= 4 MHz; fi= 400 kHz −±2.0 ±4.5 LSB
CLK
= 4 MHz; fi= 400 kHz −±0.6 ±1.0 LSB
CLK
maximum clock frequency
TDA8768H/4 40 −−MHz
TDA8768H/5 55 −−MHz
P
tot
total power dissipation − 325 tbf mW
ORDERING INFORMATION
TYPE
NUMBER
TDA8768H/4
TDA8768H/5 55
NAME DESCRIPTION VERSION
QFP44
plastic quad flat package; 44 leads
(lead length 1.3 mm); body 10 × 10 × 1.75 mm
PACKAGE
SOT307-2
SAMPLING
FREQUENCY (MHz)
40
1998 Aug 26 2
Philips Semiconductors Preliminary specification
12-bit high-speed Analog-to-Digital
Converter (ADC)
BLOCK DIAGRAM
V
V
V
handbook, full pagewidth
n.c.
V
ref
V
V
SH
V
CCA1
2
1, 5 to 8, 12 to 14, 16
11
43
I
42
I
sample-
and-hold
39
AMP
CCA2
CCA3
3
9
TDA8768
ANALOG-TO-DIGITAL
CCA4
41
CONVERTER
CLK
35
36
V
CCD1
LATCHES
CLK
CLOCK DRIVER
TDA8768
V
CCD2
15
37
OUTPUTS
18
CMOS
CEOTC
19
D11
21
28
29
32
33
D1022
D923
D824
D725
D626
D527
D4
D3
D230
D131
D0
MSB
data outputs
LSB
V
CCO
44
AGND1
10
AGND2
4
AGND3
40
AGND4
DGND1
Fig.1 Block diagram.
OVERFLOW/
UNDERFLOW
LATCH
38
17
DGND2
CMOS
OUTPUT
OGND
20
34
IR
MGR470
1998 Aug 26 3
Philips Semiconductors Preliminary specification
12-bit high-speed Analog-to-Digital
Converter (ADC)
PINNING
SYMBOL PIN DESCRIPTION
n.c. 1 not connected
V
CCA1
V
CCA3
AGND3 4 analog ground 3
n.c. 5 not connected
n.c. 6 not connected
n.c. 7 not connected
n.c. 8 not connected
V
CCA2
AGND2 10 analog ground 2
V
ref
n.c. 12 not connected
n.c. 13 not connected
n.c. 14 not connected
V
CCD2
n.c. 16 not connected
DGND2 17 digital ground 2
OTC 18 control input twos complement
CE 19 chip enable input
IR 20 in-range output
D11 21 data output; bit 11 (MSB)
D10 22 data output; bit 10
2 analog supply voltage 1 (+5 V)
3 analog supply voltage 3 (+5 V)
9 analog supply voltage 2 (+5 V)
11 reference voltage input
15 digital supply voltage 2 (+5 V)
output; active HIGH
(CMOS level; active LOW)
TDA8768
SYMBOL PIN DESCRIPTION
D9 23 data output; bit 9
D8 24 data output; bit 8
D7 25 data output; bit 7
D6 26 data output; bit 6
D5 27 data output; bit 5
D4 28 data output; bit 4
D3 29 data output; bit 3
D2 30 data output; bit 2
D1 31 data output; bit 1
D0 32 data output; bit 0 (LSB)
V
CCO
OGND 34 output ground
CLK 35 complementary clock input; active
CLK 36 clock input
V
CCD1
DGND1 38 digital ground 1
SH 39 sample-and-hold enable input
AGND4 40 analog ground 4
V
CCA4
V
I
V
I
AGND1 44 analog ground 1
33 output supply voltage (3 to 5.25 V)
LOW
37 digital supply voltage 1 (+5 V)
(CMOS level; active HIGH)
41 analog supply voltage 4 (+5 V)
42 positive analog input voltage
43 negative analog input voltage
1998 Aug 26 4
Philips Semiconductors Preliminary specification
12-bit high-speed Analog-to-Digital
Converter (ADC)
handbook, full pagewidth
I
VIV
AGND1
44
43
42
n.c.
1
V
V
AGND3
V
AGND2
CCA1
CCA3
n.c.
n.c.
n.c.
n.c.
CCA2
V
ref
2
3
4
5
6
7
8
9
10
11
CCA4
AGND4
V
41
40
TDA8768H
SH
39
DGND1
V
38
37
CCD1
CLK
36
CLK
35
OGND
34
TDA8768
V
33
CCO
D0
32
31
D1
30
D2
D3
29
28
D4
D5
27
26
D6
D7
25
24
D8
D9
23
12
n.c.
13
14
15
16
17
n.c.
n.c.
CCD2
V
n.c.
DGND2
Fig.2 Pin configuration.
18
OTC
19
CE
20
21
22
IR
D11
D10
MGR469
1998 Aug 26 5
Philips Semiconductors Preliminary specification
12-bit high-speed Analog-to-Digital
TDA8768
Converter (ADC)
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
V
V
∆V
V
V
I
O
T
T
T
CCA
CCD
CCO
CC
I
i(p-p)
stg
amb
j
analog supply voltage note 1 −0.3 +7.0 V
digital supply voltage note 1 −0.3 +7.0 V
output supply voltage note 1 −0.3 +7.0 V
supply voltage difference
− V
V
V
V
CCA
CCD
CCA
− V
− V
CCD
CCO
CCO
input voltage at pins 42 and 43 referenced to AGND 0.3 V
input voltage at pins 35 and 36 for
−1.0 +1.0 V
−1.0 +4.0 V
−1.0 +4.0 V
CCA
− V
CCD
differential clock drive (peak-to-peak
value)
output current − 10 mA
storage temperature −55 +150 °C
operating ambient temperature −10 +85 °C
junction temperature − 150 °C
V
V
Note
1. The supply voltages V
CCA
, V
CCD
and V
may have any value between −0.3 V and +7.0 V provided that the supply
CCO
voltage differences ∆VCC are respected.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITION VALUE UNIT
R
th(j-a)
thermal resistance from junction to ambient in free air 75 K/W
1998 Aug 26 6
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