Philips PCF8576CU-5-F1, PCF8576CU-7-F1, PCF8576CU-F1, PCF8576CU-10-F1, PCF8576CU-12-F1 Datasheet

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DATA SH EET
Product specification Supersedes data of 1997 Nov 14 File under Integrated Circuits, IC12
1998 Jul 30
INTEGRATED CIRCUITS
PCF8576C
1998 Jul 30 2
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
CONTENTS
1 FEATURES 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 PINNING 6 FUNCTIONAL DESCRIPTION
6.1 Power-on reset
6.2 LCD bias generator
6.3 LCD voltage selector
6.4 LCD drive mode waveforms
6.4.1 Static drive mode
6.4.2 1 : 2 multiplex drive mode
6.4.3 1 : 3 multiplex drive mode
6.4.4 1 : 4 multiplex drive mode
6.5 Oscillator
6.5.1 Internal clock
6.5.2 External clock
6.6 Timing
6.7 Display latch
6.8 Shift register
6.9 Segment outputs
6.10 Backplane outputs
6.11 Display RAM
6.12 Data pointer
6.13 Subaddress counter
6.14 Output bank selector
6.15 Input bank selector
6.16 Blinker 7 CHARACTERISTICS OF THE I2C-BUS
7.1 Bit transfer (see Fig.12)
7.2 Start and stop conditions (see Fig.13)
7.3 System configuration (see Fig.14)
7.4 Acknowledge (see Fig.15)
7.5 PCF8576C I2C-bus controller
7.6 Input filters
7.7 I2C-bus protocol
7.8 Command decoder
7.9 Display controller
7.10 Cascaded operation
8 LIMITING VALUES 9 HANDLING 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS
11.1 Typical supply current characteristics
11.2 Typical characteristics of LC D outputs 12 APPLICATION INFORMATION
12.1 Chip-on-glass cascadability in single plane 13 BONDING PAD LOCATIONS 14 PACKAGE OUTLINES 15 SOLDERING
15.1 Introduction
15.2 Reflow soldering
15.3 Wave soldering
15.3.1 LQFP
15.3.2 VSO
15.3.3 Method (LQFP and VSO)
15.4 Repairing soldered joints 16 DEFINITIONS 17 LIFE SUPPORT APPLICATIONS 18 PURCHASE OF PHILIPS I2C COMPONENTS
1998 Jul 30 3
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
1 FEATURES
Single-chip LCD controller/driver
Selectable backplane drive configuration: static or 2/3/4
backplane multiplexing
Selectable display bias configuration: static, 1/2 or 1/3
Internal LCD bias generation with voltage-follower
buffers
40 segment drives: up to twenty 8-segment numeric characters; up to ten 15-segment alphanumeric characters; or any graphics of up to 160 elements
40 × 4-bit RAM for display data storage
Auto-incremented display data loading across device
subaddress boundaries
Display memory bank switching in static and duplex drive modes
Versatile blinking modes
LCD and logic supplies may be separated
Wide power supply range: from 2 V for low-threshold
LCDs and up to 6 V for guest-host LCDs and high-threshold (automobile) twisted nematic LCDs.
A 9 V version is also available on request.
Low power consumption
Power-saving mode for extremely low power
consumption in battery-operated and telephone applications
I
2
C-bus interface
TTL/CMOS compatible
Compatible with any 4-bit, 8-bit or 16-bit
microprocessors/microcontrollers
May be cascaded for large LCD applications (up to 2560 segments possible)
Cascadable with 24-segment LCD driver PCF8566
Optimized pinning for plane wiring in both and multiple
PCF8576C applications
Space-saving 56-lead plastic very small outline package (VSO56) or 64-lead low profile quad flat package (LQFP64)
No external components
Compatible with chip-on-glass technology
Manufactured in silicon gate CMOS process.
2 GENERAL DESCRIPTION
The PCF8576C is a peripheral device which interfaces to almost any Liquid Crystal Display (LCD) with low multiplex rates. It generates the drive signals for any static or multiplexed LCD containing up to four backplanes and up to 40 segments and can easily be cascaded for larger LCD applications. The PCF8576C is compatible with most microprocessors/microcontrollers and communicates via a two-line bidirectional I2C-bus. Communication overheads are minimized by a display RAM with auto-incremented addressing, by hardware subaddressing and by display memory switching (static and duplex drive modes).
3 ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PCF8576CT VSO56 plastic very small outline package; 56 leads SOT190-1 PCF8576CU chip in tray PCF8576CU/2 chip with bumps in tray PCF8576CU/5 unsawn wafer PCF8576CU/7 chip with bumps on tape PCF8576CU/10 FFC chip-on-film frame carrier PCF8576CU/12 FFC chip with bumps on film frame carrier PCF8576CH LQFP64 plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2
1998 Jul 30 4
Philips Semiconductors Product specification
Universal LCD driver for low multiplex
rates
PCF8576C
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4 BLOCK DIAGRAM
handbook, full pagewidth
MLD332
LCD
VOLTAGE
SELECTOR
V
LCD
12
V
DD
5
TIMING BLINKER
OSCILLATOR
INPUT
FILTERS
I C - BUS
CONTROLLER
2
POWER-
ON
RESET
CLK
4
SYNC
3
OSC
6
V
SS
11
SCL
2
SDA
1
SA0
10
DISPLAY
CONTROLLER
COMMAND
DECODER
BACKPLANE
OUTPUTS
13
BP014BP215BP116BP3
INPUT
BANK
SELECTOR
DISPLAY
RAM
40 x 4 BITS
OUTPUT
BANK
SELECTOR
DATA
POINTER
SUB­ADDRESS COUNTER
DISPLAY SEGMENT OUTPUTS
DISPLAY LATCH
SHIFT REGISTER
17 to 56
S0 to S39
A07A18A2
9
PCF8576C
LCD BIAS
GENERATOR
40
Fig.1 Block diagram; VSO56.
1998 Jul 30 5
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
5 PINNING
SYMBOL
PIN
DESCRIPTION
SOT190 SOT314
SDA 1 10 I
2
C-bus serial data input/output
SCL 2 11 I
2
C-bus serial clock input SYNC 3 12 cascade synchronization input/output CLK 4 13 external clock input V
DD
5 14 supply voltage OSC 6 15 oscillator input A0 to A2 7 to 9 16 to 18 I
2
C-bus subaddress inputs
SA0 10 19 I
2
C-bus slave address input; bit 0
V
SS
11 20 logic ground
V
LCD
12 21 LCD supply voltage BP0, BP2, BP1, BP3 13 to 16 25 to 28 LCD backplane outputs S0 to S39 17 to 56 29 to 32, 34 to 47, 49 to 64, 2 to 7 LCD segment outputs n.c. 1, 8, 9, 22 to 24, 33 and 48 not connected
1998 Jul 30 6
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.2 Pin configuration; VSO56.
handbook, halfpage
PCF8576CT
MLD334
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
SDA
SCL
SYNC
CLK
V
OSC
A0 A1 A2
SA0
V
V
BP0 BP2 BP1 BP3
S0 S1 S2 S3 S4 S5 S6 S7 S8
S9 S10 S11
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29
S39 S38 S37 S36 S35 S34 S33 S32 S31 S30 S29 S28 S27 S26 S25 S24 S23 S22 S21 S20 S19 S18 S17 S16 S15 S14 S13 S12
DD
SS
LCD
1998 Jul 30 7
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
handbook, full pagewidth
PCF8576CH
MLD333
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
n.c. S34 S35 S36 S37 S38 S39
n.c.
n.c.
SDA
SCL
SYNC
CLK
V
OSC
A0
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
n.c. S17 S16 S15 S14 S13 S12 S11 S10 S9 S8 S7 S6 S5 S4 n.c.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
A1
A2
SA0
V
V
n.c.
n.c.
n.c.
BP0
BP2
BP1
BP3
S0
S1
S2
S3
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
S33
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
DD
SS
LCD
Fig.3 Pin configuration; LQFP64.
1998 Jul 30 8
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6 FUNCTIONAL DESCRIPTION
The PCF8576C is a versatile peripheral device designed to interface to any microprocessor/microcontroller to a wide variety of LCDs. It can directly drive any static or multiplexed LCD containing up to four backplanes and up to 40 segments. The display configurations possible with the PCF8576C depend on the number of active backplane outputs required; a selection of display configurations is given in Table 1.
All of the display configurations given in Table 1 can be implemented in the typical system shown in Fig.4.
The host microprocessor/microcontroller maintains the 2-line I
2
C-bus communication channel with the PCF8576C. The internal oscillator is selected by tying OSC (pin 6) to VSS (pin 11). The appropriate biasing voltages for the multiplexed LCD waveforms are generated internally. The only other connections required to complete the system are to the power supplies (VDD, VSS and V
LCD
) and the LCD panel chosen for the
application.
Table 1 Selection of display configurations
NUMBER OF 7-SEGMENTS NUMERIC
14-SEGMENTS
ALPHANUMERIC
DOT MATRIX
BACKPLANES SEGMENTS DIGITS
INDICATOR
SYMBOLS
CHARACTERS
INDICATOR
SYMBOLS
4 160 20 20 10 20 160 dots (4 × 40) 3 120 15 15 8 8 120 dots (3 × 40) 2 80 10 10 5 10 80 dots (2 × 40) 1 40 5 5 2 12 40 dots (1 × 40)
Fig.4 Typical system configuration.
handbook, full pagewidth
HOST
MICRO-
PROCESSOR/
MICRO-
CONTROLLER
R
t
r
2C
B
SDA
SCL
OSC
1 17 to 56
13 to 16
2 6
78
512
91011
40 segment drives
4 backplanes
LCD PANEL
(up to 160
elements)
PCF8576CT
A0 A1 A2SSSA0 V
SS
V
DD
V
DD
V
LCD
V
MBE524
1998 Jul 30 9
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.1 Power-on reset
At power-on the PCF8576C resets to a starting condition as follows:
1. All backplane outputs are set to VDD.
2. All segment outputs are set to VDD.
3. The drive mode ‘1 : 4 multiplex with1⁄3bias’ is selected.
4. Blinking is switched off.
5. Input and output bank selectors are reset (as defined in Table 5).
6. The I2C-bus interface is initialized.
7. The data pointer and the subaddress counter are cleared.
Data transfers on the I
2
C-bus should be avoided for 1 ms
following power-on to allow completion of the reset action.
6.2 LCD bias generator
The full-scale LCD voltage (V
op
) is obtained from
VDD− V
LCD
. The LCD voltage may be temperature
compensated externally through the V
LCD
supply to pin 12. Fractional LCD biasing voltages are obtained from an internal voltage divider of the three series resistors connected between VDD and V
LCD
. The centre resistor can be switched out of the circuit to provide a1⁄2bias voltage level for the 1 : 2 multiplex configuration.
6.3 LCD voltage selector
The LCD voltage selector co-ordinates the multiplexing of the LCD in accordance with the selected LCD drive configuration. The operation of the voltage selector is controlled by MODE SET commands from the command decoder. The biasing configurations that apply to the preferred modes of operation, together with the biasing characteristics as functions of V
op=VDD
V
LCD
and the
resulting discrimination ratios (D), are given in Table 2. A practical value for Vop is determined by equating V
off(rms)
with a defined LCD threshold voltage (Vth), typically when the LCD exhibits approximately 10% contrast. In the static drive mode a suitable choice is Vop>3Vth approximately.
Multiplex drive ratios of 1 : 3 and 1 : 4 with
1
⁄2bias are
possible but the discrimination and hence the contrast ratios are smaller ( = 1.732 for 1 : 3 multiplex or
= 1.528 for 1 : 4 multiplex).
The advantage of these modes is a reduction of the LCD full-scale voltage V
op
as follows:
1 : 3 multiplex (
1
⁄2bias):
Vop= = 2.449 V
off(rms)
1 : 4 multiplex (1⁄2bias):
V
op
= = 2.309 V
off(rms)
These compare with Vop=3V
off(rms)
when1⁄3bias is used.
3
21 3
----------
6V
off rms〈〉
×
43×()
3
----------------------- -
Table 2 Preferred LCD drive modes: summary of characteristics
LCD DRIVE MODE
NUMBER OF
LCD BIAS
CONFIGURATION
BACKPLANES LEVELS
static 1 2 static 0 1
1:2 2 3
1
2
0.354 0.791 2.236
1:2 2 4
1
3
0.333 0.745 2.236
1:3 3 4
1
3
0.333 0.638 1.915
1:4 4 4
1
3
0.333 0.577 1.732
V
off(rms)
V
op
-------------------- -
V
on(rms)
V
op
-------------------- -
D
V
on(rms)
V
off(rms)
-------------------- -
=
1998 Jul 30 10
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.4 LCD drive mode waveforms
6.4.1 S
TATIC DRIVE MODE
The static LCD drive mode is used when a single backplane is provided in the LCD. Backplane and segment drive waveforms for this mode are shown in Fig.5.
Fig.5 Static drive mode waveforms (Vop=VDD− V
LCD
).
V
state1
t() V
S
n
t() V
BP0
t()=
V
on(rms)Vop
=
V
state2
t() V
S
n1+
t() V
BP0
t()=
V
off(rms)
0V=
MBE539
V
DD
V
LCD
V
LCD
V
DD
V
LCD
V
op
V
op
state 1 0
BP0
S
n
S
n 1
V
op
V
op
state 2 0
(a) waveforms at driver
(b) resultant waveforms
at LCD segment
LCD segments
state 1
(on)
state 2
(off)
T
frame
V
DD
1998 Jul 30 11
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.4.2 1 : 2 MULTIPLEX DRIVE MODE When two backplanes are provided in the LCD, the 1 : 2 multiplex mode applies. The PCF8576C allows use of1⁄2bias or
1
⁄3bias in this mode as shown in Figs 6 and 7.
Fig.6 Waveforms for the 1 : 2 multiplex drive mode with1⁄2bias (Vop=VDD− V
LCD
).
V
state1
t() V
S
n
t() V
BP0
t()=
V
on(rms)
0.791V
op
=
V
state2
t() V
S
n
t() V
BP1
t()=
V
off(rms)
0.354V
op
=
MBE540
V
(V )/2V
DD
V /2
op
V
op
state 1 0
BP0
S
n 1
(a) waveforms at driver
(b) resultant waveforms
at LCD segment
LCD segments
state 2
T
frame
DD LCD
V
LCD
BP1
S
n
V
op
V /2
op
V /2
op
V
op
state 2
0
V
op
V /2
op
state 1
V
(V )/2V
DD DD
LCD
V
LCD
V
LCD
V
LCD
V
DD
V
DD
1998 Jul 30 12
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.7 Waveforms for the 1 : 2 multiplex drive mode with1⁄3bias (Vop=VDD− V
LCD
).
V
state1
t() V
S
n
t() V
BP0
t()=
V
on(rms)
0.745V
op
=
V
state2
t() V
S
n
t() V
BP1
t()=
V
off(rms)
0.333V
op
=
MBE541
V
DD
2V /3
op
V
op
state 1 0
BP0
S
n 1
(a) waveforms at driver
(b) resultant waveforms
at LCD segment
LCD segments
state 2
T
frame
V V /3
DD
op
V
LCD
BP1
S
n
V
op
state 1
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V /3
op
2V /3
op
V /3
op
2V /3
op
V
op
state 2 0
V
op
V /3
op
2V /3
op
V /3
op
1998 Jul 30 13
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.4.3 1 : 3 MULTIPLEX DRIVE MODE When three backplanes are provided in the LCD, the 1 : 3 multiplex drive mode applies, as shown in Fig.8.
Fig.8 Waveforms for the 1 : 3 multiplex drive mode (Vop=VDD− V
LCD
).
V
state1
t() V
S
n
t() V
BP0
t()=
V
on(rms)
0.638V
op
=
V
state2
t() V
S
n
t() V
BP1
t()=
V
off(rms)
0.333V
op
=
MBE542
2V /3
op
V
op
state 1 0
BP0
(b) resultant waveforms
at LCD segment
LCD segments
state 2
T
frame
BP1
V
op
state 1
V /3
op
2V /3
op
V /3
op
2V /3
op
V
op
state 2 0
V
op
V /3
op
2V /3
op
V /3
op
S
n 1
S
n 2
(a) waveforms at driver
S
n
BP2/S23
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
1998 Jul 30 14
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.4.4 1 : 4 MULTIPLEX DRIVE MODE When four backplanes are provided in the LCD, the 1 : 4 multiplex drive mode applies, as shown in Fig.9.
MBE543
2V /3
op
V
op
state 1 0
BP0
(b) resultant waveforms
at LCD segment
LCD segments
state 2
T
frame
BP1
V
op
state 1
V /3
op
2V /3
op
V /3
op
2V /3
op
V
op
state 2 0
V
op
V /3
op
2V /3
op
V /3
op
S
n 1
BP2
S
n 2
S
n 3
(a) waveforms at driver
S
n
BP3
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
V
DD
V V /3
DD
op
V
LCD
V 2V /3
DD
op
Fig.9 Waveforms for the 1 : 4 multiplex drive mode (Vop=VDD− V
LCD
).
V
state1
t() V
S
n
t() V
BP0
t()=
V
on(rms)
0.577V
op
=
V
state2
t() V
S
n
t() V
BP1
t()=
V
off(rms)
0.333V
op
=
1998 Jul 30 15
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.5 Oscillator
6.5.1 I
NTERNAL CLOCK
The internal logic and the LCD drive signals of the PCF8576C are timed either by the built-in oscillator or from an external clock. When the internal oscillator is used, OSC (pin 6) should be connected to VSS (pin 11). In this event, the output from CLK (pin 4) provides the clock signal for cascaded PCF8566s or PCF8576Cs in the system.
Note that the PCF8576C is backwards compatible with the PCF8576. Where resistor R
osc
to VSS is present, the
internal oscillator is selected.
6.5.2 E
XTERNAL CLOCK
The condition for external clock is made by tying OSC (pin 6) to VDD; CLK (pin 4) then becomes the external clock input.
The clock frequency (f
clk
) determines the LCD frame frequency and the maximum rate for data reception from the I2C-bus. To allow I2C-bus transmissions at their maximum data rate of 100 kHz, f
clk
should be chosen to be
above 125 kHz. A clock signal must always be supplied to the device;
removing the clock may freeze the LCD in a DC state.
6.6 Timing
The timing of the PCF8576C organizes the internal data flow of the device. This includes the transfer of display data from the display RAM to the display segment outputs. In cascaded applications, the synchronization signal
SYNC maintains the correct timing relationship between the PCF8576Cs in the system. The timing also generates the LCD frame frequency which it derives as an integer multiple of the clock frequency (see Table 3). The frame frequency is set by the MODE SET commands when internal clock is used, or by the frequency applied to pin 4 when external clock is used.
The ratio between the clock frequency and the LCD frame frequency depends on the mode in which the device is operating. In the power-saving mode the reduction ratio is six times smaller; this allows the clock frequency to be reduced by a factor of six. The reduced clock frequency results in a significant reduction in power dissipation. The lower clock frequency has the disadvantage of increasing the response time when large amounts of display data are transmitted on the I2C-bus.
When a device is unable to digest a display data byte before the next one arrives, it holds the SCL line LOW until the first display data byte is stored. This slows down the transmission rate of the I
2
C-bus but no data loss occurs.
6.7 Display latch
The display latch holds the display data while the corresponding multiplex signals are generated. There is a one-to-one relationship between the data in the display latch, the LCD segment outputs and one column of the display RAM.
6.8 Shift register
The shift register serves to transfer display information from the display RAM to the display latch while previous data is displayed.
6.9 Segment outputs
The LCD drive section includes 40 segment outputs S0 to S39 (pins 17 to 56) which should be connected directly to the LCD. The segment output signals are generated in accordance with the multiplexed backplane signals and with data resident in the display latch. When less than 40 segment outputs are required the unused segment outputs should be left open-circuit.
6.10 Backplane outputs
The LCD drive section includes four backplane outputs BP0 to BP3 which should be connected directly to the LCD. The backplane output signals are generated in accordance with the selected LCD drive mode. If less than four backplane outputs are required the unused outputs can be left open-circuit. In the 1 : 3 multiplex drive mode BP3 carries the same signal as BP1, therefore these two adjacent outputs can be tied together to give enhanced drive capabilities. In the 1 : 2 multiplex drive mode BP0 and BP2, BP1 and BP3 respectively carry the same signals and may also be paired to increase the drive capabilities. In the static drive mode the same signal is carried by all four backplane outputs and they can be connected in parallel for very high drive requirements.
1998 Jul 30 16
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.11 Display RAM
The display RAM is a static 40 × 4-bit RAM which stores LCD data. A logic 1 in the RAM bit-map indicates the on state of the corresponding LCD segment; similarly, a logic 0 indicates the off state. There is a one-to-one correspondence between the RAM addresses and the segment outputs, and between the individual bits of a RAM word and the backplane outputs. The first RAM column corresponds to the 40 segments operated with respect to backplane BP0 (see Fig.10). In multiplexed LCD applications the segment data of the second, third and fourth column of the display RAM are time-multiplexed with BP1, BP2 and BP3 respectively.
When display data is transmitted to the PCF8576C the display bytes received are stored in the display RAM in accordance with the selected LCD drive mode. To illustrate the filling order, an example of a 7-segment numeric display showing all drive modes is given in Fig.11; the RAM filling organization depicted applies equally to other LCD types.
With reference to Fig.11, in the static drive mode the eight transmitted data bits are placed in bit 0 of eight successive display RAM addresses.
In the 1 : 2 multiplex drive mode the eight transmitted data bits are placed in bits 0 and 1 of four successive display RAM addresses. In the 1 : 3 multiplex drive mode these bits are placed in bits 0, 1 and 2 of three successive addresses, with bit 2 of the third address left unchanged. This last bit may, if necessary, be controlled by an additional transfer to this address but care should be taken to avoid overriding adjacent data because full bytes are always transmitted. In the 1 : 4 multiplex drive mode the eight transmitted data bits are placed in bits 0, 1, 2 and 3 of two successive display RAM addresses.
Table 3 LCD frame frequencies
PCF8576C MODE
FRAME
FREQUENCY
NOMINAL
FRAME
FREQUENCY
(Hz)
Normal mode
64
Power-saving mode
64
f
clk
2880
------------ -
f
clk
480
--------- -
Fig.10 Display RAM bit-map showing direct relationship between display RAM addresses
and segment outputs, and between bits in a RAM word and backplane outputs.
0
0 1 2 3
1234 3536373839
display RAM addresses (rows) / segment outputs (S)
display RAM bits
(columns) /
backplane outputs
(BP)
MBE525
1998 Jul 30 17
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.12 Data pointer
The addressing mechanism for the display RAM is realized using the data pointer. This allows the loading of an individual display data byte, or a series of display data bytes, into any location of the display RAM. The sequence commences with the initialization of the data pointer by the LOAD DATA POINTER command. Following this, an arriving data byte is stored starting at the display RAM address indicated by the data pointer thereby observing the filling order shown in Fig.11. The data pointer is automatically incremented in accordance with the chosen LCD configuration. That is, after each byte is stored, the contents of the data pointer are incremented by eight (static drive mode), by four (1 : 2 multiplex drive mode) or by two (1 : 4 multiplex drive mode).
6.13 Subaddress counter
The storage of display data is conditioned by the contents of the subaddress counter. Storage is allowed to take place only when the contents of the subaddress counter agree with the hardware subaddress applied to A0, A1 and A2. The subaddress counter value is defined by the DEVICE SELECT command. If the contents of the subaddress counter and the hardware subaddress do not agree then data storage is inhibited but the data pointer is incremented as if data storage had taken place. The subaddress counter is also incremented when the data pointer overflows.
The storage arrangements described lead to extremely efficient data loading in cascaded applications. When a series of display bytes are sent to the display RAM, automatic wrap-over to the next PCF8576C occurs when the last RAM address is exceeded. Subaddressing across device boundaries is successful even if the change to the next device in the cascade occurs within a transmitted character (such as during the 14th display data byte transmitted in 1 : 3 multiplex mode).
6.14 Output bank selector
This selects one of the four bits per display RAM address for transfer to the display latch. The actual bit chosen depends on the particular LCD drive mode in operation and on the instant in the multiplex sequence. In 1 : 4 multiplex, all RAM addresses of bit 0 are the first to be selected, these are followed by the contents of bit 1, bit 2 and then bit 3. Similarly in 1 : 3 multiplex, bits 0, 1 and 2 are selected sequentially. In 1 : 2 multiplex, bits 0 and 1 are selected and, in the static mode, bit 0 is selected.
The PCF8576C includes a RAM bank switching feature in the static and 1 : 2 multiplex drive modes. In the static drive mode, the BANK SELECT command may request the contents of bit 2 to be selected for display instead of bit 0 contents. In the 1 : 2 drive mode, the contents of bits 2 and 3 may be selected instead of bits 0 and 1. This gives the provision for preparing display information in an alternative bank and to be able to switch to it once it is assembled.
6.15 Input bank selector
The input bank selector loads display data into the display RAM in accordance with the selected LCD drive configuration. Display data can be loaded in bit 2 in static drive mode or in bits 2 and 3 in 1 : 2 drive mode by using the BANK SELECT command. The input bank selector functions independent of the output bank selector.
1998 Jul 30 18
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
6.16 Blinker
The display blinking capabilities of the PCF8576C are very versatile. The whole display can be blinked at frequencies selected by the BLINK command. The blinking frequencies are integer multiples of the clock frequency; the ratios between the clock and blinking frequencies depend on the mode in which the device is operating, as shown in Table 4.
An additional feature is for an arbitrary selection of LCD segments to be blinked. This applies to the static and 1 : 2 LCD drive modes and can be implemented without any communication overheads.
By means of the output bank selector, the displayed RAM banks are exchanged with alternate RAM banks at the blinking frequency. This mode can also be specified by the BLINK command.
In the 1 : 3 and 1 : 4 multiplex modes, where no alternate RAM bank is available, groups of LCD segments can be blinked by selectively changing the display RAM data at fixed time intervals.
If the entire display is to be blinked at a frequency other than the nominal blinking frequency, this can be effectively performed by resetting and setting the display enable bit E at the required rate using the MODE SET command.
Table 4 Blinking frequencies
BLINKING MODE
NORMAL OPERATING
MODE RATIO
POWER-SAVING MODE
RATIO
NOMINAL BLINKING
FREQUENCY
Off −−blinking off
2Hz
2Hz
1Hz
1Hz
0.5 Hz
0.5 Hz
f
clk
92160
----------------
f
clk
15360
----------------
f
clk
84320
------------------ -
f
clk
30720
----------------
f
clk
368640
------------------- -
f
clk
61440
----------------
1998 Jul 30 19
Philips Semiconductors Product specification
Universal LCD driver for low multiplex
rates
PCF8576C
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handbook, full pagewidth
MBE534
S
2
n
S
1
n
S
7
n
S
n
S
n
S
3
n
S
5
n
S
2
n
S
3
n
S
1
n
S
1
n
S
1
n
S
2
n
S
n
S
6
n
S
n
S
4
n
DP
DP
DP
DP
a
f
b
g
e
c
d
a
f
b
g
e
c
d
a
f
b
g
e
c
d
a
f
b
g
e
c
d
BP0
BP0
BP0
BP1
BP1
BP2
BP1
BP2
BP3
BP0
n
c x x x
0 1 2 3
b x x x
a x x x
f x x x
g x x x
e x x x
d x x x
DP
x x x
n1
n2 n3 n4 n5 n6 n7
bit/ BP
n
a b x x
0 1 2 3
f g x x
e c x x
d
DP
x x
n1
n2 n3
bit/ BP
n
b
DP
c x
0 1 2 3
a d g x
f e x x
n1
n2
bit/ BP
n
a c b
DP
0 1 2 3
f e g d
n1
bit/ BP
cbaf gedDP
abf gecdDP
bDPcadgf e
acbDPf egd
MSB LSB
MSB LSB
MSB LSB
MSB LSB
drive mode
static
1 : 2
multiplex
1 : 3
multiplex
1 : 4
multiplex
LCD segments LCD backplanes display RAM filling order transmitted display byte
Fig.11 Relationships between LCD layout, drive mode, display RAM filling order and display data transmitted over the I2C-bus.
x = data bit unchanged.
1998 Jul 30 20
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
7 CHARACTERISTICS OF THE I2C-BUS
The I2C-bus is for bidirectional, two-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.
7.1 Bit transfer (see Fig.12) One data bit is transferred during each clock pulse.
The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as a control signal.
7.2 Start and stop conditions (see Fig.13) Both data and clock lines remain HIGH when the bus is not
busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition (P).
7.3 System configuration (see Fig.14) A device generating a message is a ‘transmitter’, a device
receiving a message is the ‘receiver’. The device that controls the message is the ‘master’ and the devices which are controlled by the master are the ‘slaves’.
7.4 Acknowledge (see Fig.15) The number of data bytes transferred between the START
and STOP conditions from transmitter to receiver is unlimited. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges must pull-down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a STOP condition.
7.5 PCF8576C I
2
C-bus controller
The PCF8576C acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or transmit data to an I2C-bus master receiver. The only data output from the PCF8576C are the acknowledge signals of the selected devices. Device selection depends on the I2C-bus slave address, on the transferred command data and on the hardware subaddress.
In single device application, the hardware subaddress inputs A0, A1 and A2 are normally tied to VSS which defines the hardware subaddress 0. In multiple device applications A0, A1 and A2 are tied to VSS or VDD in accordance with a binary coding scheme such that no two devices with a common I2C-bus slave address have the same hardware subaddress.
In the power-saving mode it is possible that the PCF8576C is not able to keep up with the highest transmission rates when large amounts of display data are transmitted. If this situation occurs, the PCF8576C forces the SCL line LOW until its internal operations are completed. This is known as the ‘clock synchronization feature’ of the I2C-bus and serves to slow down fast transmitters. Data loss does not occur.
7.6 Input filters
To enhance noise immunity in electrically adverse environments, RC low-pass filters are provided on the SDA and SCL lines.
7.7 I
2
C-bus protocol
Two I2C-bus slave addresses (0111000 and 0111001) are reserved for the PCF8576C. The least significant bit of the slave address that a PCF8576C will respond to is defined by the level tied at its input SA0 (pin 10). Therefore, two types of PCF8576C can be distinguished on the same I2C-bus which allows:
1. Up to 16 PCF8576Cs on the same I2C-bus for very large LCD applications.
2. The use of two types of LCD multiplex on the same I2C-bus.
The I2C-bus protocol is shown in Fig.16. The sequence is initiated with a START condition (S) from the I2C-bus master which is followed by one of the two PCF8675C slave addresses available. All PCF8576Cs with the corresponding SA0 level acknowledge in parallel with the slave address but all PCF8576Cs with the alternative SA0 level ignore the whole I2C-bus transfer.
1998 Jul 30 21
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
After acknowledgement, one or more command bytes (m) follow which define the status of the addressed PCF8576Cs.
The last command byte is tagged with a cleared most significant bit, the continuation bit C. The command bytes are also acknowledged by all addressed PCF8576Cs on the bus.
After the last command byte, a series of display data bytes (n) may follow. These display bytes are stored in the display RAM at the address specified by the data pointer and the subaddress counter. Both data pointer and subaddress counter are automatically updated and the data is directed to the intended PCF8576C device. The acknowledgement after each byte is made only by the (A0, A1 and A2) addressed PCF8576C. After the last display byte, the I2C-bus master issues a STOP condition (P).
7.8 Command decoder
The command decoder identifies command bytes that arrive on the I
2
C-bus. All available commands carry a continuation bit C in their most significant bit position (Fig.17). When this bit is set, it indicates that the next byte of the transfer to arrive will also represent a command. If this bit is reset, it indicates the last command byte of the transfer. Further bytes will be regarded as display data.
The five commands available to the PCF8576C are defined in Table 5.
Fig.12 Bit transfer.
MBA607
data line
stable;
data valid
change
of data
allowed
SDA
SCL
Fig.13 Definition of START and STOP conditions.
handbook, full pagewidth
MBC622
SDA
SCL
P
STOP condition
SDA
SCL
S
START condition
1998 Jul 30 22
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.14 System configuration.
MGA807
SDA
SCL
MASTER
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
SLAVE
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
MASTER
TRANSMITTER/
RECEIVER
Fig.15 Acknowledgement on the I2C-bus.
handbook, full pagewidth
MBC602
S
START
condition
9821
clock pulse for
acknowledgement
not acknowledge
acknowledge
DATA OUTPUT
BY TRANSMITTER
DATA OUTPUT
BY RECEIVER
SCL FROM
MASTER
1998 Jul 30 23
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.16 I2C-bus protocol.
handbook, full pagewidth
MBE538
S A 0
S
011100 0AC
COMMAND
A
P
ADISPLAY DATA
slave address
/RW
acknowledge by
all addressed
PCF8576Cs
acknowledge
by A0, A1 and A2
selected
PCF8576C only
n 0 byte(s)n 1 byte(s)1 byte
update data pointers
and if necessary,
subaddress counter
Fig.17 General format of command byte.
MSA833
REST OF OPCODE
C
MSB LSB
C = 0; last command. C = 1; commands continue.
1998 Jul 30 24
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Table 5 Definition of PCF8576C commands
COMMAND OPCODE OPTIONS DESCRIPTION
MODE SET C 1 0 LP E B M1 M0 Table 6 Defines LCD drive mode.
Table 7 Defines LCD bias configuration. Table 8 Defines display status. The possibility to
disable the display allows implementation of blinking under external control.
Table 9 Defines power dissipation mode.
LOAD DATA POINTER
C 0 P5 P4 P3 P2 P1 P0 Table 10 Six bits of immediate data, bits P5 to P0,
are transferred to the data pointer to define one of forty display RAM addresses.
DEVICE SELECT
C1100A2A1A0Table 11 Three bits of immediate data, bits A0 to
A3, are transferred to the subaddress counter to define one of eight hardware subaddresses.
BANK SELECT
C11110IOTable 12 Defines input bank selection (storage of
arriving display data).
Table 13 Defines output bank selection (retrieval of
LCD display data). The BANK SELECT command has no
effect in 1 : 3 and 1 : 4 multiplex drive modes.
BLINK C 1110ABF1BF0Table 14 Defines the blinking frequency.
Table 15 Selects the blinking mode; normal
operation with frequency set by BF1, BF0 or blinking by alternation of display RAM banks. Alternation blinking does not apply in 1 : 3 and 1 : 4 multiplex drive modes.
Table 6 Mode set option 1
Table 7 Mode set option 2
LCD DRIVE MODE BITS
DRIVE MODE
BACKPLANE M1 M0
Static 1 BP 0 1 1 : 2 MUX (2 BP) 1 0 1 : 3 MUX (3 BP) 1 1 1 : 4 MUX (4 BP) 0 0
LCD BIAS BIT B
1
⁄3bias 0
1
⁄2bias 1
Table 8 Mode set option 3
Table 9 Mode set option 4
DISPLAY STATUS BIT E
Disabled (blank) 0 Enabled 1
MODE BIT LP
Normal mode 0 Power-saving mode 1
1998 Jul 30 25
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Table 10 Load data pointer option 1
Table 11 Device select option 1
Table 12 Bank select option 1
Table 13 Bank select option 2
DESCRIPTION BITS
6 bit binary value of 0 to 39 P5 P4 P3 P2 P1 P0
DESCRIPTION BITS
3 bit binary value of 0 to 7 A0 A1 A2
STATIC 1 : 2 MUX BIT I
RAM bit 0 RAM bits 0 and 1 0 RAM bit 2 RAM bits 2 and 3 1
STATIC 1 : 2 MUX BIT O
RAM bit 0 RAM bits 0 and 1 0 RAM bit 2 RAM bits 2 and 3 1
Table 14 Blink option 1
Table 15 Blink option 2
BLINK FREQUENCY
BITS
BF1 BF0
Off 0 0 2Hz 0 1 1Hz 1 0
0.5 Hz 1 1
BLINK MODE BIT A
Normal blinking 0 Alternation blinking 1
7.9 Display controller
The display controller executes the commands identified by the command decoder. It contains the status registers of the PCF8576C and co-ordinates their effects. The controller is also responsible for loading display data into the display RAM as required by the filling order.
7.10 Cascaded operation
In large display configurations, up to 16 PCF8576Cs can be distinguished on the same I
2
C-bus by using the 3-bit hardware subaddress (A0, A1 and A2) and the programmable I2C-bus slave address (SA0). When cascaded PCF8576Cs are synchronized so that they can share the backplane signals from one of the devices in the cascade. Such an arrangement is cost-effective in large LCD applications since the backplane outputs of only one device need to be through-plated to the backplane electrodes of the display. The other PCF8576Cs of the cascade contribute additional segment outputs but their backplane outputs are left open-circuit (Fig.18).
The
SYNC line is provided to maintain the correct synchronization between all cascaded PCF8576Cs. This synchronization is guaranteed after the power-on reset. The only time that SYNC is likely to be needed is if synchronization is accidentally lost (e.g. by noise in adverse electrical environments; or by the definition of a multiplex mode when PCF8576Cs with differing SA0 levels are cascaded). SYNC is organized as an input/output pin; the output selection being realized as an open-drain driver with an internal pull-up resistor. A PCF8576C asserts the SYNC line at the onset of its last active backplane signal and monitors the SYNC line at all other times. Should synchronization in the cascade be lost, it will be restored by the first PCF8675C to assert SYNC. The timing relationship between the backplane waveforms and the SYNC signal for the various drive modes of the PCF8576C are shown in Fig.19.
For single plane wiring of packaged PCF8576Cs and chip-on-glass cascading, see Chapter “Application information”.
1998 Jul 30 26
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.18 Cascaded PCF8576C configuration.
handbook, full pagewidth
HOST
MICRO-
PROCESSOR/
MICRO-
CONTROLLER
SDA
SCL
CLK
OSC
SYNC
1
17 to 56
13,15,
14,16
13,15,
14,16
2 3 4 6
78
512
91011
40 segment drives
4 backplanes
40 segment drives
LCD PANEL
(up to 2560
elements)
PCF8576CT
A0 A1 A2SSSA0 V
SS
V
DD
V
LCD
V
DD
V
LCD
V
MBE533
SDA SCL
SYNC
CLK OSC
15 12 2 3 4
6
17 to 56
BP0 to BP3 (open-circuit)
A0 A1 A2 SAO V
SS
V
DDVLCD
PCF8576CT
BP0 to BP3
R
t
r
2C
B
1998 Jul 30 27
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.19 Synchronization of the cascade for the various PCF8576C drive modes.
Excessive capacitive coupling between SCL or CLK and SYNC may cause erroneous synchronization. If this proves to be a problem, the capacitance of the
SYNC line should be increased (e.g. by an external capacitor between SYNC and VDD). Degradation of the positive edge of the SYNC pulse may be
countered by an external pull-up resistor. (a) static drive mode. (b) 1 : 2 multiplex drive mode. (c) 1 : 3 multiplex drive mode. (d) 1 : 4 multiplex drive mode.
handbook, full pagewidth
T=
framefframe
1
BP0
SYNC
BP1
(1/2 bias)
SYNC
BP2
(a) static drive mode.
(b) 1 : 2 multiplex drive mode.
(c) 1 : 3 multiplex drive mode.
(d) 1 : 4 multiplex drive mode.
BP3
SYNC
SYNC
BP1
(1/3 bias)
MBE535
1998 Jul 30 28
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
8 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
9 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see
“Handling MOS Devices”
).
SYMBOL PARAMETER MIN. MAX. UNIT
V
DD
supply voltage 0.5 +8.0 V
V
LCD
LCD supply voltage VDD− 8.0 V
DD
V
V
I1
input voltage CLK, SYNC, SA0, OSC, A0 to A2 VSS− 0.5 VDD+ 0.5 V
V
I2
input voltage SDA, SCL VSS− 0.5 +8.0 V
V
O
output voltage S0 to S39, BP0 to BP3 V
LCD
0.5 VDD+ 0.5 V
I
I
DC input current 20 +20 mA
I
O
DC output current 25 +25 mA
I
DD
, ISS, I
LCDVDD
, VSS or V
LCD
current 50 +50 mA
P
tot
total power dissipation 400 mW
P
O
power dissipation per output 100 mW
T
stg
storage temperature 65 +150 °C
1998 Jul 30 29
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
10 DC CHARACTERISTICS
V
DD
= 2 to 6 V; VSS=0V;V
LCD=VDD
2VtoVDD− 6V;T
amb
= 40 to +85 °C; unless otherwise specified.
Notes
1. V
LCD
VDD− 3 V for1⁄3bias.
2. LCD outputs are open-circuit; inputs at VSS or VDD; external clock with 50% duty factor; I2C-bus inactive.
3. Resets all logic when VDD< V
POR
.
4. Periodically sampled, not 100% tested.
5. Outputs measured one at a time.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DD
supply voltage 2 6V
V
LCD
LCD supply voltage note 1 VDD− 6 VDD− 2V
I
DD
supply current note 2
normal mode f
clk
= 200 kHz −−120 µA
power-saving mode f
clk
= 35 kHz;
VDD= 3.5 V; V
LCD
=0V;
A0, A1 and A2 tied to V
SS
−−60 µA
Logic
V
IL
LOW-level input voltage SDA, SCL, CLK, SYNC, SA0, OSC, A0 to A2
V
SS
0.3V
DD
V
V
IH1
HIGH-level input voltage CLK, SYNC, SA0, OSC, A0 to A2
0.7V
DD
V
DD
V
V
IH2
HIGH-level input voltage SDA, SCL 0.7V
DD
6.0 V
V
OL
LOW-level output voltage IOL=0mA −−0.05 V
V
OH
HIGH-level output voltage IOH= 0 mA VDD− 0.05 −− V
I
OL1
LOW-level output current CLK, SYNC VOL=1V; VDD=5V 1 −− mA
I
OH1
HIGH-level output current CLK VOH=4V; VDD=5V −1 −− mA
I
OL2
LOW-level output current SDA, SCL VOL= 0.4 V; VDD=5V 3 −− mA
I
L1
leakage current SA0, A0 to A2, CLK, SDA and SCL
VI=VDD or V
SS
1 +1 µA
I
L2
leakage current OSC VI=V
DD
1 +1 µA
I
pd
A0, A1, A2 and OSC pull-down current
VI=1V; VDD= 5 V 15 50 150 µA
R
SYNC
pull-up resistor (SYNC) 20 50 150 k
V
POR
power-on reset voltage level note 3 1.0 1.6 V
t
SW
tolerable spike width on bus −−100 ns
C
I
input capacitance note 4 −−7pF
LCD outputs
V
BP
DC voltage component BP0 to BP3 CBP=35nF −20 +20 mV
V
S
DC voltage component S0 to S39 CS=5nF −20 +20 mV
R
BP
output resistance BP0 to BP3 note 5; V
LCD=VDD
5V −−5k
R
S
output resistance S0 to S39 note 5; V
LCD=VDD
5V −−7.5 k
1998 Jul 30 30
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
11 AC CHARACTERISTICS
V
DD
= 2 to 6 V; VSS=0V; V
LCD=VDD
2VtoVDD− 6V;T
amb
= 40 to + 85 °C; unless otherwise specified.
Notes
1. At f
clk
< 125 kHz, I2C-bus maximum transmission speed is derated.
2. All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an input voltage swing of VSSto VDD.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
f
clk
oscillator frequency
normal mode V
DD
= 5 V; note 1 125 200 315 kHz
power-saving mode V
DD
= 3.5 V 21 31 48 kHz
t
clkH
CLK HIGH time 1 −−µs
t
clkL
CLK LOW time 1 −−µs
t
PSYNC
SYNC propagation delay time −−400 ns
t
SYNCL
SYNC LOW time 1 −−µs
t
PLCD
driver delays with test loads V
LCD=VDD
5V −−30 µs
Timing characteristics: I
2
C-bus; note 2
t
BUF
bus free time 4.7 −−µs
t
HD;STA
START condition hold time 4.0 −−µs
t
SU;STA
set-up time for a repeated START condition 4.7 −−µs
t
LOW
SCL LOW time 4.7 −−µs
t
HIGH
SCL HIGH time 4.0 −−µs
t
r
SCL and SDA rise time −−1µs
t
f
SCL and SDA fall time −−0.3 µs
C
B
capacitive bus line load −−400 pF
t
SU;DAT
data set-up time 250 −−ns
t
HD;DAT
data hold time 0 −−ns
t
SU;STO
set-up time for STOP condition 4.0 −−µs
Fig.20 Test loads.
MBE544
3.3 k 1.5 k
0.5V
DD
V
DD
V
DD
SDA, SCL
CLK
1 nF
BP0 to BP3, and S0 to S39
(2%)(2%)
6.8
V
DD
SYNC
(2%)
1998 Jul 30 31
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Fig.21 Driver timing waveforms.
handbook, full pagewidth
MBE545
0.7V
DD
0.3V
DD
1/ f
clk
t
PSYNC
t
clkH
t
clkL
0.7V
DD
0.3V
DD
SYNC
CLK
0.5 V
0.5 V
t
PLCD
BP0 to BP3,
and S0 to S39
t
PSYNC
t
SYNCL
(VDD = 5 V)
Fig.22 I2C-bus timing waveforms.
handbook, full pagewidth
SDA
MGA728
SDA
SCL
t
SU;STA
t
SU;STO
t
HD;STA
t
BUF
t
LOW
t
HD;DAT
t
HIGH
t
r
t
f
t
SU;DAT
1998 Jul 30 32
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
11.1 Typical supply current characteristics
Fig.23 ISS as a function of f
frame
.
VDD= 5 V; V
LCD
= 0 V; T
amb
=25°C.
0 200
50
0
10
MBE530
20
30
40
100
I
SS
(µA)
f (Hz)
frame
normal mode
power-saving mode
Fig.24 I
LCD
as a function of f
frame
.
VDD= 5 V; V
LCD
= 0 V; T
amb
=25°C.
0 200
50
0
10
MBE529
20
30
40
100
I
LCD
(µA)
f (Hz)
frame
Fig.25 ISS as a function of VDD.
V
LCD
= 0 V; external clock; T
amb
=25°C.
handbook, halfpage
010
50
0
10
MBE528 - 1
20
30
40
5
I
SS
(µA)
V (V)
DD
power-saving mode
f = 35 kHz
clk
normal mode
f = 200 kHz
clk
Fig.26 I
LCD
as a function of VDD.
V
LCD
= 0 V; external clock; f
clk
= nominal frequency.
handbook, halfpage
010
50
0
10
MBE527 - 1
20
30
40
5
V (V)
DD
I
LCD
(µA)
85 C
o
25 C
o
40 C
o
1998 Jul 30 33
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
11.2 Typical characteristics of LC D outputs
Fig.27 R
O(max)
as a function of VDD.
V
LCD
= 0 V; T
amb
=25°C.
handbook, halfpage
60
10
-1
MBE532 - 1
1
10
3
V (V)
DD
R
S
R
BP
R
O(max)
(kΩ)
Fig.28 R
O(max)
as a function of T
amb
.
VDD= 5 V; V
LCD
=0V.
40 0 40 120
2.5
0
2.0
MBE526
80
1.5
1.0
0.5
R
S
R
BP
R
O(max)
(kΩ)
T
amb
( C)
o
1998 Jul 30 34
Philips Semiconductors Product specification
Universal LCD driver for low multiplex
rates
PCF8576C
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12 APPLICATION INFORMATION
n
dbook, full pagewidth
PCF
8576CT
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20
SDA SCL
SYNC
CLK V
OSC
A0 A1 A2
SA0 V
V
BP0
BP2 BP1 BP3
S0 S1 S2 S3
24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38
S39 S38 S37 S36 S35 S34 S33 S32 S31 S30 S29 S28 S27 S26 S25 S24 S23 S22 S21
34 33
S17 S7 S8 S9
S10 S11
32 31 30 29
S16
S15
S13
S14
S12
DD
SS
LCD
PCF
8576CT
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17 18 19 20
BP0 BP2 BP1 BP3 S40 S41 S42 S43
24 25 26 27 28
56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38
S79 S78 S77 S76 S75 S74 S73 S72 S71 S70 S69 S68 S67 S66 S65 S64 S63 S62 S61
34 33
S57 S47 S48 S49 S50 S51
S51 S52 S53
32 31 30 29
S56
S55
S53
S54
S52
S50S39 S40S13S12
open
S10 S11S0 S79
backplanes segments
MBE537
SDA SCL SYNC CLK
V V V
DD SS
LCD
Fig.29 Single plane wiring of packaged PCF8576CTs.
1998 Jul 30 35
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
12.1 Chip-on-glass cascadability in single plane
In chip-on-glass technology, where driver devices are bonded directly onto glass of the LCD, it is important that the devices may be cascaded without the crossing of conductors, but the paths of conductors can be continued on the glass under the chip. All of this is facilitated by the PCF8576C bonding pad layout (Fig.30). Pads needing bus interconnection between all PCF8576Cs of the cascade are VDD, VSS, V
LCD
, CLK, SCL, SDA and SYNC. These lines may be led to the corresponding pads of the next PCF8576C through the wide opening between V
LCD
pad
and the backplane output pads.
The only bus line that does not require a second opening to lead through to the next PCF8576C is V
LCD
, being the
cascade centre. The placing of V
LCD
adjacent to V
SS
allows the two supplies to be tied together. When an external clocking source is to be used, OSC of all
devices should be tied to VDD. The pads OSC, A0, A1, A2 and SA0 have been placed between VSS and VDD to facilitate wiring of oscillator, hardware subaddress and slave address.
13 BONDING PAD LOCATIONS
Fig.30 Bonding pad locations.
Chip dimensions: approximately 2.92 × 3.20 mm. Pad area: 0.0121 mm2. Bonding pad dimensions: 110 × 110 µm.
S33
S32
S31
S29 S30
S28
S26
S25
S27
S24
S23
S22
S20 S21
S19
S18
S4
S6
S5
S7
S9
S10
S8
S11
S12
S13
S15
S14
S16
S17
OSC
A0
V
SYNC
SCL
CLK
SDA
S39
S38
S36
S37
S35
S34
A1
A2
2.92 mm
SA0
V
V
BP0
BP2
BP1
BP3
S1 S0
S2
S3
PCF8576C
DD
LCD
SS
3.20 mm
MBE536
1565554535251
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
29 28 27 26 25 24 23 22 21
20
19
18
17
16
15
14
13
11
10
9
8
12
3031323334
234567
x
y
0
0
1998 Jul 30 36
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
Table 16 Bonding pad locations (dimensions in µm) All x/y coordinates are referenced to the centre of the chip
(see Fig.30).
SYMBOL PAD x y
SDA 1 74 1380 SCL 2 148 1380 SYNC 3 355 1380 CLK 4 534 1380 V
DD
5 742 1380 OSC 6 913 1380 A0 7 1087 1380 A1 8 1290 1284 A2 9 1290 1116 SA0 10 1290 945 V
SS
11 1290 751
V
LCD
12 1290 485 BP0 13 1290 125 BP2 14 1290 285 BP1 15 1290 458 BP3 16 1290 618 S0 17 1290 791 S1 18 1290 951 S2 19 1290 1124 S3 20 1290 1284 S4 21 1074 1380 S5 22 914 1380 S6 23 741 1380 S7 24 581 1380 S8 25 408 1380 S9 26 248 1380 S10 27 75 1380 S11 28 85 1380 S12 29 258 1380 S13 30 418 1380 S14 31 591 1380
S15 32 751 1380 S16 33 924 1380 S17 34 1084 1380 S18 35 1290 1243 S19 36 1290 1083 S20 37 1290 910 S21 38 1290 750 S22 39 1290 577 S23 40 1290 417 S24 41 1290 244 S25 42 1290 84 S26 43 1290 89 S27 44 1290 249 S28 45 1290 422 S29 46 1290 582 S30 47 1290 755 S31 48 1290 915 S32 49 1290 1088 S33 50 1290 1248 S34 51 1083 1380 S35 52 923 1380 S36 53 750 1380 S37 54 590 1380 S38 55 417 1380 S39 56 257 1380
Alignment marks
C1 −−1290 1385 C2 −−1295 1385 F 1305 1405
SYMBOL PAD x y
1998 Jul 30 37
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
14 PACKAGE OUTLINES
UNIT A1A2A3b
p
cD
(1)E(2)
(1)
eHELLpQZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
0.3
0.1
3.0
2.8
0.25
0.42
0.30
0.22
0.14
21.65
21.35
11.1
11.0
0.75
15.8
15.2
1.45
1.30
0.90
0.55
7 0
o o
0.1 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
1.6
1.4
SOT190-1
96-04-02 97-08-11
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
X
(A )
3
A
y
56
29
281
pin 1 index
0.012
0.004
0.12
0.11
0.017
0.012
0.0087
0.0055
0.85
0.84
0.44
0.43
0.0295
2.25
0.089
0.62
0.60
0.057
0.051
0.035
0.022
0.004
0.2
0.008 0.004
0.063
0.055
0.01
0 5 10 mm
scale
VSO56: plastic very small outline package; 56 leads
SOT190-1
A
max.
3.3
0.13
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
1998 Jul 30 38
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
UNIT
A
max.
A1A2A3b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
1.60
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
10.1
9.9
0.5
12.15
11.85
1.45
1.05
7 0
o o
0.12 0.11.0 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT314-2
95-12-19 97-08-01
D
(1) (1)(1)
10.1
9.9
H
D
12.15
11.85
E
Z
1.45
1.05
D
b
p
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
16
c
D
H
b
p
E
H
A
2
v M
B
D
Z
D
A
Z
E
e
v M
A
X
1
64
49
48 33
32
17
y
pin 1 index
w M
w M
0 2.5 5 mm
scale
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
SOT314-2
1998 Jul 30 39
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
15 SOLDERING
15.1 Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
15.2 Reflow soldering
Reflow soldering techniques are suitable for all LQFP and VSO packages.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 50 and 300 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C.
15.3 Wave soldering
15.3.1 LQFP Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
CAUTION
Wave soldering is NOT applicable for all LQFP packages with a pitch (e) equal or less than 0.5 mm.
If wave soldering cannot be avoided, for LQFP packages with a pitch (e) larger than 0.5 mm, the following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves downstream and at the side corners.
15.3.2 VSO Wave soldering techniques can be used for all VSO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
The longitudinal axis of the package footprint must be parallel to the solder flow.
The package footprint must incorporate solder thieves at the downstream end.
15.3.3 M
ETHOD (LQFP AND VSO)
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
15.4 Repairing soldered joints
Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
1998 Jul 30 40
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
16 DEFINITIONS
17 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
18 PURCHASE OF PHILIPS I
2
C COMPONENTS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I
2
C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
1998 Jul 30 41
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
NOTES
1998 Jul 30 42
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
NOTES
1998 Jul 30 43
Philips Semiconductors Product specification
Universal LCD driver for low multiplex rates
PCF8576C
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1998 SCA60 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
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Printed in The Netherlands 415106/1200/06/pp44 Date of release: 1998 Jul 30 Document order number: 9397 750 04196
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