Philips MCB-204 Service Manual

Micro System

MCB204/05

TABLE OF CONTENTS

Page

Speciﬁ cations .......................................................................1-2

Measurement Setup .............................................................1-3

Service Aids, Safety Instruction, etc ...........................1-4 to 1-6

Service Test Program ..............................................................2

Set Block Diagram ...................................................................3

Set Wiring Diagram .................................................................4

Main Board .............................................................................. 5

Front Board..............................................................................6

MCU Board ..............................................................................7

Power Board ............................................................................8

Set Mechanical Exploded View & Parts List ............................9

All rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of Philips.

Published by SL 0716 Service Audio Printed in The Netherlands Subject to modification

Version 1.0

CLASS 1

LASER PRODUCT

SPECIFICATIONS

1-2

AMPLIFIER

Output power ........................................... 2 x 4W RMS

Signal-to-noise ratio .......................... t 60 dBA (IEC)

Frequency response ....................... 125 – 16000 Hz

Impedance loudspeakers ........................................... 4:

CD PLAYER

Frequency range ............................... 125 – 16000 Hz

Signal-to-noise ratio ............................................ 65 dBA

TUNER

FM wave range ................................... 87.5 – 108 MHz

MW wave range ................................ 531 – 1602 kHz

Sensitivity at 75 :

– FM 26 dB sensitivity .......................................... 20 µV

– MW 26 dB sensitivity ................................... 5 mV/m

Total harmonic distortion ..................................... d 5%

TAPE DECK

Frequency response

Normal tape (type I) ...... 125 – 8000 Hz (8 dB)

Signal-to-noise ratio

Normal tape (type I) .................................... 40 dBA

Wow and flutter .............................................. d 0.4% JIS

SPEAKERS

Bass reflex system Dimensions (w x h x d) . 146 x 228 x 160 (mm)

GENERAL INFORMATION

AC Power ..................................... 220 – 230 V / 50 Hz

Dimensions (w x h x d) ... 146 x 228 x 216(mm)

Weight (with/without speakers) ..................................

............................................................... approx. 4.4 / 2.0 kg

Power consumption

Active .......................................................................... 30 W

Standby .................................................................... < 5 W

Eco Power Standby ........................................... < 1 W

Specifications and external appearance are subject to change without notice.

MEASUREMENT SETUP

Tuner FM

1-3

Bandpass

LF Voltmeter

e.g. PM2534

RF Generator

e.g. PM5326

DUT

250Hz-15kHz

e.g. 7122 707 48001

Ri=50Ω

S/N and distortion meter

e.g. Sound Technology ST1700B

Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).

Tuner AM (MW,LW)

RF Generator

e.g. PM5326

Ri=50Ω

DUT

Frame aerial

e.g. 7122 707 89001

Bandpass

250Hz-15kHz

e.g. 7122 707 48001

LF Voltmeter

e.g. PM2534

S/N and distortion meter

e.g. Sound Technology ST1700B

To avoid atmospheric interference all AM-measurements have to be carried out in a Faraday´s cage. Use a bandpass filter (or at least a high pass filter with 250Hz) to eliminate hum (50Hz, 100Hz).

Use Audio Signal Disc (replaces test disc 3)

DUT

SBC429 4822 397 30184

S/N and distortion meter

e.g. Sound Technology ST1700B

LEVEL METER

e.g. Sennheiser UPM550

with FF-filter

Recorder

Use Universal Test Cassette CrO2 SBC419 4822 397 30069

or Universal Test Cassette Fe SBC420 4822 397 30071

LF Generator

e.g. PM5110

DUT

S/N and distortion meter

e.g. Sound Technology ST1700B

LEVEL METER

e.g. Sennheiser UPM550

with FF-filter

SERVICE AIDS

1-4

Service Tools:

Universal Torx driver holder .................................. 4822 395 91019

Torx bit T10 150mm ............................................. 4822 395 50456

Torx driver set T6 - T20 ......................................... 4822 395 50145

Torx driver T10 extended ...................................... 4822 395 50423

Cassette:

SBC419 Test cassette CrO2 ................................. 4822 397 30069

SBC420 Test cassette Fe ..................................... 4822 397 30071

MTT150 Dolby level 200nWb/M ............................ 4822 397 30271

Compact Disc:

SBC426/426A Test disc 5 + 5A ............................ 4822 397 30096

SBC442 Audio Burn-in Test disc 1kHz ................. 4822 397 30155

SBC429 Audio Signals disc .................................. 4822 397 30184

Dolby Pro-logic Test Disc ...................................... 4822 395 10216

HANDLING CHIP COMPONENTS

ESD Equipment:

Anti-static table mat - large 1200x650x1.25mm ... 4822 466 10953

Anti-static table mat - small 600x650x1.25mm ..... 4822 466 10958

Anti-static wristband .............................................. 4822 395 10223

Connector box (1MΩ) ............................................ 4822 320 11307

Extension cable

(to connect wristband to conn. box) .................. 4822 320 11305

Connecting cable

(to connect table mat to conn. box) .................. 4822 320 11306

Earth cable (to connect product to mat or box) .... 4822 320 11308

Complete kit ESD3

(combining all above products) ......................... 4822 320 10671

Wristband tester .................................................... 4822 344 13999

1-5

All ICs and many other semi-conductors are susceptible to electrostatic discharges (ESD). Careless handling during repair can reduce life drastically. When repairing, make sure that you are connected with the same potential as the mass of the set via a wrist wrap with resistance. Keep components and tools also at this potential.

Tous les IC et beaucoup d’autres semi-conducteurs sont sensibles aux décharges statiques (ESD). Leur longévité pourrait être considérablement écourtée par le fait qu’aucune précaution n’est prise à leur manipulation. Lors de réparations, s’assurer de bien être relié au même potentiel que la masse de l’appareil et enfiler le bracelet serti d’une résistance de sécurité. Veiller à ce que les composants ainsi que les outils que l’on utilise soient également à ce potentiel.

WARNING

ATTENTION

ESD

WARNUNG

Alle ICs und viele andere Halbleiter sind empfindlich gegenüber elektrostatischen Entladungen (ESD). Unsorgfältige Behandlung im Reparaturfall kan die Lebensdauer drastisch reduzieren. Veranlassen Sie, dass Sie im Reparaturfall über ein Pulsarmband mit Widerstand verbunden sind mit dem gleichen Potential wie die Masse des Gerätes. Bauteile und Hilfsmittel auch auf dieses gleiche Potential halten.

Alle IC’s en vele andere halfgeleiders zijn gevoelig voor electrostatische ontladingen (ESD). Onzorgvuldig behandelen tijdens reparatie kan de levensduur drastisch doen verminderen. Zorg ervoor dat u tijdens reparatie via een polsband met weerstand verbonden bent met hetzelfde potentiaal als de massa van het apparaat. Houd componenten en hulpmiddelen ook op ditzelfde potentiaal.

Tutti IC e parecchi semi-conduttori sono sensibili alle scariche statiche (ESD). La loro longevità potrebbe essere fortemente ridatta in caso di non osservazione della più grande cauzione alla loro manipolazione. Durante le riparazioni occorre quindi essere collegato allo stesso potenziale che quello della massa dell’apparecchio tramite un braccialetto a resistenza. Assicurarsi che i componenti e anche gli utensili con quali si lavora siano anche a questo potenziale.

WAARSCHUWING

AVVERTIMENTO

Safety regulations require that the set be restored to its original condition and that parts which are identical with those specified, be used

Safety components are marked by the symbol

Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in zijn oorspronkelijke toestand wordt teruggebracht en dat onderdelen, identiek aan de gespecificeerde, worden toegepast.

De Veiligheidsonderdelen zijn aangeduid met het symbool

Les normes de sécurité exigent que l’appareil soit remis à l’état d’origine et que soient utiliséés les piéces de rechange identiques à celles spécifiées.

Less composants de sécurité sont marqués

Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu beachten. Der Original zustand des Geräts darf nicht verändert werden; für Reparaturen sind Original-Ersatzteile zu verwenden.

Sicherheitsbauteile sind durch das Symbol

markiert.

Le norme di sicurezza esigono che l’apparecchio venga rimesso nelle condizioni originali e che siano utilizzati i pezzi di ricambio identici a quelli specificati.

Componenty di sicurezza sono marcati con

CLASS 1

LASER PRODUCT

Invisible laser radiation when open. Avoid direct exposure to beam.

Osynlig laserstrålning när apparaten är öppnad och spärren är urkopplad. Betrakta ej strålen.

Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina näkymättömälle laserisäteilylle. Älä katso säteeseen!

Usynlig laserstråling ved åbning når sikkerhedsafbrydere er ude af funktion. Undgå udsaettelse for stråling.

Warning !

Varning !

Varoitus !

Advarse !

After servicing and before returning set to customer perform a leakage current measurement test from all exposed metal parts to earth ground to assure no shock hazard exist. The leakage current must not exceed

0.5mA.

"Pour votre sécurité, ces documents doivent être utilisés par des spécialistes agréés, seuls habilités à réparer votre appareil en panne".

1 - 6

INFORMATION ABOUT LEAD-FREE SOLDERING

Philips CE is producing lead-free sets from 1.1.2005 onwards.

IDENTIFICATION:

Regardless of special logo (not always indicated) one must treat all sets from 1 Jan 2005 onwards, according next rules:

Example S/N:

Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is the week number, so in this case 2005 wk12

So from 0501 onwards = from 1 Jan 2005 onwards

Important note you avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher temperatures belong to this.

Due to lead-free technology some rules have to be respected by the workshop during a repair:

• Use only lead-free solder alloy Philips SAC305 with order code 0622 149 00106. If lead-free solder-paste is required, please contact

the manufacturer of your solder-equipment. In general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle.

• Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able

o To reach at least a solder-temperature of 40 o To stabilize the adjusted temperature at the solder-tip o To exchange solder-tips for different applications.

• Adjust your solder tool so that a temperature around

solder-joint should not exceed ~ 4 sec. Avoid temperatures above 400 otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. To avoid wear-out of tips switch off un-used equipment, or reduce heat.

• Mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but PHILIPS recommends strongly to avoid mixed

solder alloy types (leaded and lead-free). If one cannot avoid or does not know whether product is lead-free, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (SAC305).

• Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has to be purchased at

external companies.

• Special information for BGA-ICs:

- always use the 12nc-recognizable soldering temperature profile of the specific BGA (for de-soldering always use the lead-free temperature profile, in case of doubt)

- lead free BGA-ICs will be delivered in so-called 'dry-packaging' (sealed pack including a silica gel pack) to protect the IC against moisture. After opening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to be baked dry. (MSL=Moisture Sensitivity Level). This will be communicated via AYS-website. Do not re-use BGAs at all.

• For sets produced before 1.1.2005 (except products of 2004), containing leaded solder-alloy and components, all needed spare-part

will be available till the end of the service-period. For repair of such sets nothing changes.

: In fact also products of year 2004 must be treated in this way as long as

− is reached and stabilized at the solder joint. Heating-time of the

• On our website www.atyourservice.ce.Philips.com

BGA-de-/soldering (+ baking instructions)

∗

Heating-profiles of BGAs and other ICs used in Philips-sets

∗

You will find this and more technical information within the "magazine", chapter "workshop news".

For additional questions please contact your local repair-helpdesk.

you find more information to:

SERVICE INSTRUCTION

Safety regulations require that after a repair, the set must be returned in its original condition. Pay in particular attention to the following points:

· Route the wire trees correctly and fix them with the mounted cable clamps.

· Check the insulation of the AC Power lead for external damage.

· Check the strain relief of the AC Power cord for proper function.

· Check the electrical DC resistance between the AC Power Plug and the secondary side (only for sets which have a AC Power isolated power supply):

1. Unplug the AC Power cord and connect a wire between the two pins of the AC Power plug.

2. Set the AC Power switch to the "on" position (keep the AC Power cord unplugged!).

3. Measure the resistance value between the pins of the AC Power plug and the metal shielding of the tuner or the aerial connection on the set. The reading should be larger than 4.5 Mohm (For U.S. it should be between

4.2 Mohm and 12 Mohm).

4. Switch "off" the set, and remove the wire between the two pins of the AC Power plug.

• Check the cabinet for defects, to avoid touching of any

inner parts by the customer.

SET BLOCK DIAGRAM

3-1

SET WIRING DIAGRAM

4-1

5-1 5-1

PCB LAYOUT - MAIN BOARD (TOP VIEW)

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