1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3.When conducting repairs and servicing, donot twist the Fasten connectors but plug them straight inor unplugthem straightout.
4.When servicing, observe theoriginal lead dress. If a short circuit isfound, replace all parts which have been overheated ordamaged by the short circuit.
5.After servicing, seeto it that allthe protective devices such as insulation barriers, insulation papers shields are properly installed.
6.After servicing, make the followingleakagecurrent checks to prevent the customerfrom being exposedto shock hazards.
1.2.Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Donot use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposedmetallic part onthe set and a good earth groundsuch as a water pipe, as shownin Figure 1.
3.Use Leakage Current Tester (Simpson 228orequivalent) to measure the potential across the measuring network.
4.Check each exposedmetallic part, andmeasure the voltage at each point.
5.Reservethe AC plug in the AC outlet and repeat each ofthe above measure.
6.The potential at any point (TOUCH CURRENT) expressedasvoltage U
For a. c.: U1 =35V (peak) and U2 = 0.35V (peak);
For d. c.: U
Note:
The limit value of U
mA d. c.The limit value U
7.In case a measurement is out ofthe limits specified, there is a possibility of a shock hazard, and the equipment should berepaired andrechecked beforeit is returnedto the customer.
=1.0 V,
1
= 0.35 V (peak) for a.c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
= 35V (peak) for a. c. correspond tothevalue 70mA (peak) a. c. for frequencies greater than 100kHz.
1
and U2, does not exceedthefollowing values:
1
Figure 1
3
2Warning
2.1.Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integratedcircuits andsome field-effect transistors andsemiconductor [chip] components. Thefollowing techniques should be usedto help reducethe incidence of component damage caused by electrostatic discharge(ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removedfor potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly ona conductive surface such as aluminum foil, toprevent electrostatic charge builduporexposure of theassembly.
3.Useonly a grounded-tip solderingiron tosolder or unsolder ES devices.
4.Use only an anti-staticsolder removal device.Some solder removal devices not classified as [anti-static (ESD protected)]can generate electrical chargesufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Mostreplacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7.Immediately before removing the protective material fromthe leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will beinstalled.
Caution
Besurenopower is appliedto the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions whenhandling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushingtogether of your clothes fabricor the lifting of your foot from acarpeted floor can generate static electricity (ESD) sufficient to damage an ES device).
4
2.2.About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder init'smanufacture due to environmental conservation issues. For service and repair work, we'dsuggest the use of Pb freesolder as well, althoughPb solder may beused.
PCBs manufactured using leadfree solder will have the PbF within a leaf Symbol PbFstamped on the back of PCB.
Caution
•Pb free solder has a higher meltingpoint than standardsolder. Typically the melting point is 50 ~ 70°F (30~40°C) higher. Please use a high temperature solderingiron and set it to 700 ± 20°F (370 ± 10 °C).
•Pb free solder will tend tosplash when heatedtoo high (about 1100 °F or 600°C).If you must usePbsolder, please completely remove all of the Pbfree solder on the pins or solder area beforeapplying Pb solder. If this is not practical, besureto heat the Pb free solder until it melts, beforeapplying Pb solder.
•After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)
Suggested Pb free solder
There areseveral kinds of Pbfree solder availablefor purchase. This product uses Sn+Ag+Cu(tin, silver, copper) solder. However,Sn+Cu (tin, copper), Sn+Zn+Bi(tin, zinc, bismuth) solder can also beused.
Card slot SD Card slot × 1
ETHERNET10BASE-T / 100BASE-TX
USB 1 / 2 /3USB 2.0 TYPE A Connectors DC 5 V, Max. 500 mA
DIGITAL AUDIO OUTPCM / Dolby Digital / DTS, Fibre optic
Standard ComplianceBluetooth 3.0Frequency Range2.402 GHz - 2.480 GHz
1
*
: The frequency and channel differ depending on the country.
2
: Not all the Bluetooth compatible devices are available with this TV.
*
Up to 5 devices can be used simultaneously (except the 3D Eyewear).
Q 3D Eyewear
Dimensions (W× H × D)167.7 mm × 42.2 mm × 170.7 mmMassApprox. 31 gLens typeLiquid Crystal ShutterUsage temperature range0 °C - 40 °CBattery*Coin-shaped lithium battery CR2025
Operation time: Approx. 75 hours in continuous use of the battery made by Panasonic
Viewing range*Within 3.2 m from front surface of the TVMaterialsMain body: Resin
Lens section: Liquid crystal glassCommunication system2.4 GHz band FH-SS (Frequency Hopping Spread Spectrum) * There are differences in the viewing range of the 3D Eyewear among individuals.
•The 3D Eyewear may not operate correctly at the outside of the viewing range.
Note
•Design andSpecifications are subject to change without notice. Mass and Dimensions shown are approximate.
9
5Technical Descriptions
5.1.Specification of KEY for DTCP-IP, WIDEVINE, Netflix and One-to-One
5.1.1.General information:
1. EEPROM (IC8902) for spare parts has the seed of KEY for each.
2.The finalKEY data willbe generated by Peaks IC (IC8000) when SELF CHECK was done andare storedin both Peaks IC (IC8000) and EEPROM (IC8902).Four KEY are not generated for all models.The necessary KEY are only generatedand stored depend onthe feature of models.
5.1.2.Replacement of ICs:
When Peaks IC (IC8000) is replaced,EEPROM (IC8902) should be also replacedwithnew one the same time.When EEPROM (IC8902) is replaced, Peaks IC(IC8000) is not necessary to be replaced the same time.After the replacement of IC, SELF CHECK should be done togenerate the finalKEY data.How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds.TVwill be forced to the factory shipment setting after this SELFCHECK.
5.1.3.Model and Keys:
Model No.Keys
One-to-One
(For USB Rec.)
TH-P42GT50D/K/M/P/TNoneNoneYesYes
DTCP-IPWIDEVINENetflix
5.2.Panel-Type setting
Panel-Type setting isrequiredafter exchange the A-board.A-board for spareparts is common use for different inch size in same series.Go into Service Modeand confirm/select Panel-Type in OPTION to correct inchsize.
10
6Service Mode
6.1.How to enter into Service Mode
6.1.1.Purpose
After exchange parts, check and adjust the contents of adjustment mode.
While pressing [VOLUME ( - )] button of themain unit, press [i] button of the remote control three times within 2 seconds.
Note:
ServiceMode can not be enteredwhen 3D signal input.Input 2D signal to enter Service Mode.
6.1.2.Key command
[1] button...Main items Selectionin forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction[4] button...Sub items Selection in reverse direction [RED] button...AllSubitems Selection in reverse direction [GREEN] button...All Sub items Selection in forward direction[VOL] button...Value of sub items change inforward direction( + ), inreversedirection ( - )
6.1.3.How to exit
Switch off the power with the [POWER] buttonon the main unit or the [POWER] buttonon the remotecontrol.
11
6.1.4.Contents of adjustment mode
• Value is shown as a hexadecimal number.
• Preset value differs depending on models.
• After entering the adjustment mode, take note of the value in each item before starting adjustment.
BootROMSTBY-SET00EMERGENCYONCLK MODE00CLOCK000Y/C Delay0OPT 110110000OPT 211100110OPT 300001001OPT 400000000EDID-CLKMIDMIRROR00 (See Option-Mirror)
AMR-SELECTOFFVSUSLOWSee Vsus selectionAGINGALL WHITEBuilt-in test patterns can be
MIDDLE BLUE WITH MAGENTA OUTSIDE FRAME
MIDDLE STEP GREEN
MIDDLE STEP RED
LOW STEP WHITE
ALL BLUE
ALL GREEN
ALL RED
WHITE DIAGONAL STRIPE
RED DIAGONAL STRIPE
GREEN DIAGONAL STRIPE
BLUE DIAGONAL STRIPE
A-ZONE & B-ZONE
1% WINDOW
COLOR BAR
9 POINTS BRIGHT MEASURE
2 DOT OUTSIDE FRAME
DOUBLE FIXED 1% WINDOW
VERTICAL LINE SCROLL
ON/OFF
R/G/B/W ROTATION WITH COUNT DISPLAY
HALF FIXED ALL WHITE
ALL WHITE WITH COUNT DISPLAYSRV-TOOL00See Service tool mode
DRV CHECK USBHDD CHECK00See DRV Check-USBHDD Check
displayed.
12
6.2.Option - Mirror
Picture can be reversed left and right or up and down.
00 : Default (Normal picture is displayed)
01 : Picture is reversed left and right.
02 : Picture is reversed up and down.
Hint : If the defective symptom (e.g. Vertical bar or Horizontalbar) is movedby selection of this mirror, the possible causeis inA-board.
6.3.Service tool mode
6.3.1.How to access
1.Select [SRV-TOOL] in Service Mode.
2.Press [OK] button on the remote control.
6.3.2.Display of SOS History
SOS History (Number of LED blinking) indication.Fromleft side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.This indication will be cleared by [Self-check indicationand forced tofactory shipment setting].
6.3.3.POWER ON TIME/COUNT
Note : To display TIME/COUNT menu, highlight position, then press MUTE for 3 sec.Time : Cumulative power on time, indicated hour : minute by decimalCount : Number of ON times by decimal
Note : This indication will not be cleared by either of the self-checks or any other command.
6.3.4.Exit
1. Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.
13
6.4.DRV Check - USB HDD Check
1. Select [DRV Check - USBHDD Check] in Service Mode.
2. Press [OK] button on the remote control for more than 3 seconds.
6.5.Hotel mode
1.PurposeRestrict a function for hotels.
2.Access command to theHotel mode setup menuIn order to display theHotel mode setup menu:While pressing [VOLUME (-)] button of the main unit, press [AV] button of theremote control three times within 2 seconds.
Then, the Hotel modesetupmenu is displayed.
3.To exit the Hotel modesetupmenuDisconnect AC power cord fromwall outlet.
4.Explain the Hotel modesetup menu
ItemFunctionHotel ModeSelect hotel mode On/OffInitial INPUTSelect input signal modes.
Set the input, when each time power is switchedon.Selection :Off,TV,AV1,AV2,PC,HDMI1,HDMI2,HDMI3,HDMI4
•Off: give priority to a last memory.
Initial POSSelect programme number.
Initial VOL LevelAdjust the volume when each time power is
Maximum VOL Level
Button LockSelect local key conditions.
Remote LockSelect remote control key conditions.
Private InformationSelect private information for VIERA Cast is Keep
Selection : Off/0 to 24
•Off: give priority to a last memory
switched on.Selection/Range :Off/0 to 100
•Off: give priority to a last memoryAdjust maximum volume.Range : 0 to 100
Selection : Off/SETUP/MENU/ALL
•Off: altogether valid
•SETUP: only F-key is invalid
(Tuning guide (menu) can not be selected.)
•MENU: only F-key is invalid
(only Volume/Mute can be selected.)
•ALL: altogether invalid.
Selection : Off/SETUP/MENU
•Off: altogether valid
•SETUP: only Setup menu is invalid
•MENU: Picture/Sound/Setup menu are invalid
or Reset if Hotel mode is set to [On] when TV power on.Selection :Keep/Reset
•Keep: private information for VIERA Cast is
keep
•Reset: private information for VIERA Cast is
reset
14
6.6.Data Copy by SD Card
6.6.1.Purpose
(a) Board replacement (Copy the data when exchanging A-board):
When exchanging A-board, the data in original A-board can be copied to SD card and then copy to new A-board.
(b) Hotel (Copy the data when installing a number of unitsin hotelor anyfacility):
When installing a number of units in hotel or any facility,the data in master TV can be copied to SD card and then copy to otherTVs.
6.6.2.Preparation
Make pwdfile as startup file for (a) or (b) in a empty SD card.
1.Insert a empty SD cardto your PC.
2.Right-click a blank area in a SD card window, pointto New,and then click text document. A new file is created by default (New Text Document.txt).
3.Right-click the new text document that you just created and select rename, and then change the name andextension of the file to thefollowing file name for (a) or (b) andpress ENTER.
File name:
(a) For Board replacement : boardreplace.pwd(b) For Hotel : hotel.pwd
Note:
Please make only one file toprevent theoperationerror.
No any other file should not be inSD card.
15
6.6.3.Data copy from TV set to SD Card
1. Turn on the TV set.
2. Insert SD card with a startup file (pwd file) to SD slot.
On-screen Display will be appeared according to the startup file automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2770
(b) For Hotel : 4850
Data will be copied from TV set toSD card.It takes around 2 to 6 minutes maximum for copying.
4.After the completion of copyingto SD card, removeSD card from TVset.
5.Turn off the TV set.
Note:
Following new folder will be createdin SDcardfor data from TV set.
(a) For Board replacement : user_setup(b) For Hotel: hotel
16
6.6.4.Data copy from SD Card to TV set
1. Turn on the TV set.
2. Insert SD card with Data to SD slot.
On-screen Display will be appeared according to the Data folder automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2771
(b) For Hotel : 4851
Data willbe copied from SD card to TV set.
4.After the completion of copying to SDcard, remove SD card from TV set.
(a) For Board replacement : Data willbedeleted after copying (Limited one copy).(b) For Hotel : Data will not be deleted and canbeused for other TVs.
5.Turn off theTVset.
Note:
1.Depending onthe failure of boards, function ofData copy for boardreplacement does not work.
2.This function can be effective among thesamemodel numbers.
17
7Troubleshooting Guide
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
7.1.Check of the IIC bus lines
7.1.1.How to access
7.1.1.1.Self-check indication only:
Produce TV reception screen, and while pressing[VOLUME ( - )] button on the main unit, press [OK] button ontheremote controlfor more than 3 seconds.
7.1.1.2.Self-check indication and forced to factory shipment setting:
Produce TV reception screen, and while pressing[VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds.
Disconnect the AC cordfrom walloutlet or switch off thepower with [ Power ] button on the main unit.
18
7.2.Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
Blinking TimesContentsCheck point
1Panel information SOS
PD Start SOS
2P+15V SOS A-Board
3IROM BOOT PROGRAM SOSA-Board
4Power SOSP-Board6Driver SOS1
(SN Energy recovery circuit)(A-SN FPC DET)
7Driver SOS2
(SN Connector DET)(SN Scan and Logic IC)
8Driver SOS3
(SS FPC DET)(SS Energy recovery circuit)
9Discharge Control SOSA-Board
10Sub 3.3V SOS
Tuner power SOSBE SOS
12Sound SOSA-Board
13Emergency SOSA-Board202nd BOOT PROGRAM SOS
(Watchdog timer over flow)
212nd BOOT PROGRAM SOS
(System error)
222nd BOOT PROGRAM SOS
(Main system bus freeze)
232nd BOOT PROGRAM SOS
(Accidental interrupt signal)
242nd BOOT PROGRAM SOS
(NAND Flash memory data transfer error finish)
252nd BOOT PROGRAM SOS
(Unsupported NAND Flash memory)
-
P-Board
P-Board
SN-Board
A-SN FPC
SN-Board
SS-Board
SS2-Board
SS FPC
SS2 FPC
A-BoardSN-BoardSS-Board
P-Board
Speaker
Woofer
A-Board
A-Board
A-Board
A-Board
A-Board
A-Board
19
7.3.No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit
2. Green is lit then turns red blinking a few seconds later. (See Power LED Blinking timing chart)
3. Only red is lit.
20
7.4.No Picture
21
7.5.Local screen failure
Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.
Fig-1
22
8Disassembly and Assembly Instructions
8.1.Disassembly Flow Chart for the Unit
This is a disassembly chart.
When assembling, perform this chart conversely.
23
8.2.Disassembly Procedure for the Unit
8.2.1.Remove the Pedestal stand
1. Remove the Plasma panel section from the servicing
stand and lay on a flat surface such as a table (covered
by a soft cloth) with the Plasma panel surface facing
downward.
2.Remove the screws (×4 )
3.Slide the Pedestal stand to the downside and remove the Pedestal stand.
8.2.2.Remove the Stand bracket cover
1.Remove the screws (×4 ) and remove the Standbracket cover.
8.2.4.Remove the Wi-LAN module
1. Remove the screw (×1 ) and remove the Wi-LAN
module.
8.2.5.Remove the Bluetooth module
1.Removethe screw (×1 ) and remove the Bluetooth module.
8.2.3.Remove the AC cord clamper B
1.Remove the screws (×2 ) and remove the AC cordclamper B.
8.2.6.Remove the Rear cover
1.Remove the screws (×18 , ×2 ).
2.Removethe M8 caps (×4 ).
3.Remove the Rear cover.
24
8.2.7.Remove the AC inlet
Caution:
To remove AC inlet wait 1 minute after power was off for
discharge from electrolysis capacitors.
1. Disconnect the connector (P9).
2. Remove the screws (×1 , ×1 ) and remove the AC
inlet.
8.2.8.Remove the P-Board
Caution:
Toremove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.
1.Unlock thecable clampers and thetapes to free the cables
2.Disconnect theconnectors (P2, P6, P9, P11 and P35).
3.Remove the screws (×6 ) and remove theP-Board.
8.2.9.Remove the A-Board
1. Unlock the cable clampers and the tapes to free the
cables.
2. Disconnect the connectors (A1, A6, A12 and A50).
3. Disconnect the USB cable (JK8605).
4. Disconnect the flexible cables (A20, A31, A32 and A33).
5.Remove the screws (×3 ).
6.Remove the Sideshield metal and the Bottomshield metal.
7.Remove the A-Board.
8.2.10.Remove the Control unit assy
1.Unlock the cable clampers tofree the cables.
2.Disconnect the connector (C14).
3.Remove the claws (×2 ) and remove the Control unit assy.
25
8.2.11.Remove the Speakers
1. Unlock the cable clampers and the tapes to free the
cables.
2. Disconnect the Relay connector.
3. Remove the Speaker clip (each) and remove the
Speakers (L, R).
8.2.12.Remove the Woofer
1.Unlock the cable clampers and the tapes tofree the cables.
2.Disconnect the Relay connector.
3.Remove the screws (×3 ).
4.Remove the Woofer.
8.2.13.Remove the SN-Board
1. Unlock the cable clampers and the tapes to free the
cables.
2. Disconnect the flexible cables (SN21, SN22, SN23,
SN24, SN25, SN26, SN27 and SN28) connected to the
SN-Board.
3. Disconnect the connector (SN2).
4.Disconnect the flexible cable (SN20).
5.Remove the screws (×8 ) and remove the SN-Board.
8.2.14.Remove the SS-Board
1.Disconnect the connector (SS11).
2.Disconnect the flexible cable (SS33).
3.Disconnect the flexible cable (SS62).
4.Remove the screws (×4 , ×2 ) and remove the SS-Board.
26
8.2.15.Remove the SS2-Board
1. Disconnect the flexible cables (SS64 and SS67).
2. Remove the screws (×2 ) and remove the SS2-Board.
8.2.16.Remove the USB clamper
1.Remove the claws (×2) and remove the USB clamper.
2.Removethe USB cablefrom the USB clamper.
8.2.17.Remove the BT connector clamper
1. Unlock the cable clampers and the tapes to free the
cables.
2. Remove the claws (×2 ) and remove the BT cable.
3. Disconnect the connector (K1) and remove the A1-K1
cable.
4.Remove the claws (×2 ) and remove the BTconnector clamper.
8.2.18.Remove the Stand bracket plate
1.Remove the screws (×4 , ×2 , ×2 ) and removethe Standbracket plate.
27
8.2.19.Remove the Contact metal bottom
B
1. Remove the screws (×6 ).
2. Remove the Contact metal bottom B.
3. Remove the Cabinet assy from the Plasma panel section.
8.2.20.Remove the K-Board
1.Remove the screw (×1 ).
2.Disconnect the connector (K1) and removethe K-Board from the LED panel.
8.2.21.Remove the Cabinet assy from the Plasma panel section.
1.Place the Cabinet assy on a flat surface of a table (coveredby a soft cloth) and a cushion.
2.Remove the screws (×10 ).
8.2.22.Remove the Contact metals
1.Removethe Tape from the Contact metals.
2.Remove the screws (×6 ).
3.Removethe Contact metal side (L, R).
4.Remove the screws (×15 ).
5.Removethe Contact metal bottom A.
8.2.23.Remove the C1-Board
1.Disconnect the flexible cables (CB1, CB2, CB3, CB4, CB5, CB6 and CB7).
2.Disconnect the flexible cable (C11).
3.Disconnect the connectors (C10 and C14).
4.Remove the screws (×4 ) and remove theC1-Board.
28
8.2.24.Remove the C2-Board
1. Disconnect the flexible cables (CB8, CB9, CB10, CB11,
CB12, CB13, CB14 and CB15).
2. Disconnect the flexible cable (C21).
3. Disconnect the connectors (C20 and C25).
4. Remove the screws (×4 ) and remove the C2-Board.
8.2.25.Replace the Plasma panel
Caution:
Placethe Plasma panel ona flat surface of a table (coveredby a soft cloth) and a cushion.
A new Plasma panel itselfwithout Contact metals is fragile. To avoidthe damage to new Plasma panel, carrya new Plasma paneltaking hold of theContactmetals.
1.Placea carton box packed a new Plasma panel onthe flat surface of the work bench.
2.Open a box and without taking a newPlasmapanel.
3.Attach the Cabinet assy and each P.C.Board and so on, to the newPlasmapanel.
29
9Measurements and Adjustments
9.1.Adjustment
9.1.1.Vsus selection
Caution:
When Plasma panel or A-board is replaced, Vsus should be set to LOW or HIGH.
Procedure
1.Go into main item [VSUS] in Service Mode. LOW or HIGH will bedisplayed.
2.Press [OK] buttonto go to TEST stage. White pattern without On-Screen Display will be displayed during TEST and CONF stage. Press [5] button to display the On-Screen Display.
3.Press [VOL (-)] button toset toLOW.
4.In LOW setting
a.If no several dead pixel isvisible remarkably in white pattern, press [3] button to go to CONF stage.b.If the several dead pixels are visible remarkably in white pattern, Set to HIGH by press [VOL (+)] button. Press [3] button
to go to CONF stage if the symptom is improved.
5.Press [OK] button in CONF stage to store LOW or HIGH.
6.Exit Service Mode by pressing[Power] button.
Notes:
Do not overwrite because data is written in Peaks-EEPROM after executing adjustment of V-SUS Voltage.
30
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