Panasonic TH-103VX200C Service manual

Order Number ITD1012171CE

High Definition Plasma Display

Model No. TH-103VX200C

GPF13DMONV Chassis

TABLE OF CONTENTS

1 Safety Precautions----------------------------------------------- 3

1.1. General Guidelines---------------------------------------- 3

1.2. Touch-Current Check------------------------------------- 3

2 Warning--------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices---------- 4

2.2. About lead free solder (PbF)---------------------------- 5

3 Service Navigation----------------------------------------------- 6

3.1. Service Hint ------------------------------------------------- 6

3.2. Applicable signals ----------------------------------------- 8

4 Specifications ----------------------------------------------------- 9 5 Operating Instructions-----------------------------------------10 6 Service Mode -----------------------------------------------------11

6.1. CAT (Computer Aided Test) mode -------------------11

6.2. IIC mode structure (following items value is sample data)-----------------------------------------------15

7 Troubleshooting Guide----------------------------------------16

7.1. Self Check--------------------------------------------------16

7.2. No Power ---------------------------------------------------18

PAGE PAGE

7.3. No Picture-------------------------------------------------- 18

7.4. Local screen failure-------------------------------------- 19

8 Se rvice F ixtu re & Tools --------------------------------------- 20

8.1. SC jig-------------------------------------------------------- 20

9 Disassembly and Assembly Instructions---------------21

9.1. Rear Cover and Board---------------------------------- 21

9.2. Location of Rear Cover screws----------------------- 22

9.3. Removal of Side Angle (L), (R)-----------------------24

9.4. Removal of HX-Board-----------------------------------25

9.5. Removal of DS-Board --------------------- --------- ----26

9.6. Removal of A-Board------------------------------------- 26

9.7. Removal of DN-Board ---------------------------------- 27

9.8. Removal of PB-Board----------------------------------- 27

9.9. Removal of D-Board-------------------------------------27

9.10. Removal of P-Board (MAIN_1) -----------------------28

9.11 . Removal of P-Board (MAIN_2) -----------------------28

9.12. Removal of P-Board (SUB)----------------------------28

9.13. Removal of S1-Board and V2-Board----------------29

9.14. Removal of SU-Board ----------------------------------29

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9.15. Removal of SM-Board ----------------------------------30

9.16. Removal of SD-Board ----------------------------------31

9.17. Removal of SC-Board-----------------------------------32

9.18. Removal of SS2-Board --------------------------------33

9.19. Removal of SS3-Board --------------------------------33

9.20. Removal of SS-Board-----------------------------------34

9.21. Removal of Fan-------------------------------------------34

9.22. Removal of C1-Board (upper) ------------------------35

9.23. Removal of C2-Board (upper) ------------------------36

9.24. Removal of C3-Board (upper) ------------------------36

9.25. Removal of C4-Board (upper) ------------------------37

9.26. Removal of C5-Board (upper) ------------------------37

9.27. Removal of C6-Board (upper) ------------------------37

9.28. Removal of C1-Board (lower)-------------------------37

9.29. Removal of C2-Board (lower)-------------------------38

9.30. Removal of C3-Board (lower)-------------------------38

9.31. Removal of C4-Board (lower)-------------------------39

9.32. Removal of C5-Board (lower)-------------------------39

9.33. Removal of C6-Board (lower)-------------------------39

9.34. Removal of AC Inlet -------------------------------------40

9.35. Re moval of Front Glass, V1, V3, V-Board and Cabinet Assy ----------------------------------------------40

9.36. Removal of Plasma Display Panel-------------------44

10 Measurements and Adjustments --------------------------49

10.1. Adjustment Procedure ----------------------------------49

10.2. Adjustment-------------------------------------------------54

11 Block Diagram ---------------------------------------------------59

11.1. Diagram Notes -------------------------------------------59

1 1 .2. Main Block (1 of 2) Diagram---------------------------60 1 1 .3. Main Block (2 of 2) Diagram---------------------------61

11.4. Block (1 of 8) Diagram----------------------------------62

11.5. Block (2 of 8) Diagram----------------------------------63

11.6. Block (3 of 8) Diagram----------------------------------64

11.7. Block (4 of 8) Diagram----------------------------------65

11.8. Block (5 of 8) Diagram----------------------------------66

11.9. Block (6 of 8) Diagram----------------------------------67

11.10. Block (7 of 8) Diagram ----------------------------------68

11.11. Block (8 of 8) Diagram----------------------------------69

12 Wiring Connection Diagram---------------------------------71

12.1. Wiring (1)---------------------------------------------------71

12.2. Wiring (2)---------------------------------------------------73

12.3. Wiring (3)---------------------------------------------------75

13 Exploded View and Replacement Parts List-----------76

TH-103VX200C

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. Wh en wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug the m straight out.

4. Wh en servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.2. Touch-Current Check

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Con nect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reserve the AC plug in the AC outlet and repeat each of the above measure.

6. The potential at any point (TOUGH CURRENT) expressed as voltage U For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak); For d. c.: U

Note:

The limit value of U mA d. c.

The limit value U

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

= 1.0 V,

= 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

and U2, does not exceed the following values:

Figure 1

TH-103VX200C

2Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor [chip] components. The following techniques should be used to help reduce the incid ence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

TH-103VX200C

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing proc ess and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be used. PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than st andard solder . Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

TH-103VX200C

3 Service Navigation

3.1. Service Hint

Board Name Function Board Name Function

A Digital Signal Processor, Microcomputer C1 (upper) Data drive (1) (upper)

DN 3D Digital Signal Processor, Microcomputer C2 (upper) Data drive (2) (upper)

D Format Converter, Plasma AI Processor

Sub-Field Processor

DS Slot Interface (Audio / Video / Sync Input Switch),

Sync Processor, Audio Processor, DC-DC Converter SC Scan drive C1 (lower) Data drive (1) (lower) SU Scan out (Upper) C2 (lower) Data drive (2) (lower) SM Scan out (Middle) C3 (lower) Data drive (3) (lower) SD Scan out (Lower) C4 (lower) Data drive (4) (lower) SS Sustain drive C5 (lower) Data drive (5) (lower)

SS2 Sustain out (Upper) C6 (lower) Data drive (6) (lower) SS3 Sustain out (Lower) P(MAIN_1) Power supply

V 3D Eyewear Transmitter P(MAIN_2) Power supply V1 LED-G, R P(SUB) Power supply V2 Key switch PB Fan Control V3 Remote receiver HX PC / RS-232C S1 Power switch

C3 (upper) Data drive (3) (upper) C4 (upper) Data drive (4) (upper) C5 (upper) Data drive (5) (upper) C6 (upper) Data drive (6) (upper)

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3.2. Applicable signals

4 Specifications

Power Source 200 V AC, 50/60Hz Power Consumption

Power on 1,450 W Stand-by condition 0.5 W Power off condition 0.3 W

Plasma Display panel Drive method: AC type 103-inch,

16:9 aspect ratio

Screen size 2,269 mm (W) × 1,276 mm (H) × 2,603 mm (diagonal)

(No. of pixels) 2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]

Operating condition

Temperature 0 °C - 40 °C Humidity 20 % - 80 %

Applicable signals

Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC Scanning format

PC signals VGA, SVGA, XGA, SXGA

Connection terminals

YUV / RGB

SERIAL External Control Terminal (D-sub 9 Pin) RS-232C compatible 3D SHUTTER AUDIO

Accessories Supplied

Remote Control Transmitter N2QAYB000563 Batteries R6 Size × 2 Fixing band TMME203 × 2

Dimensions (W × H × D) 2,412 mm × 1,419 mm × 129 mm (141 mm when including protruding portion of terminals) Mass (weight) approx. 199.0 kg net Notes:

• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.

• This equipment complies with the EMC standards listed below. GB13837-2003, GB17625.1-2003, GB8898-2001.

525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) / 60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i

UXGA ..... (compressed)

Horizontal scanning frequency 15 - 110 kHz Vertical scanning frequency 48 - 120 Hz

Y / G (RCA Pin jack) with sync 1.0 Vp-p (75-ohm) P

/B (RCA Pin jack) 0.7 Vp-p (75-ohm)

B/CB

/R (RCA Pin jack) 0.7 Vp-p (75-ohm)

R/CR

AUDIO L-R (RCA Pin jack × 2) 0.5 Vrms (High-Density Mini D-sub 15 Pin) Y or G with sync 1.0 Vp-p (75-ohm)

Y or G without sync 0.7 Vp-p (75-ohm)

/ CB / B: 0.7 Vp-p (75-ohm)

/ CR / R: 0.7 Vp-p (75-ohm)

HD / VD: 1.0 - 5.0 Vp-p (high impedance) AUDIO (Stereo mini jack (M3) × 1) 0.5 Vrms HDMI 1-4 (TYPE A Connector × 4)

HDMI (Version 1.4 with 3D)

(M3 jack × 1, for 3D IR TRANSMITTER) L-R (RCA Pin jack × 2 (L / R))

Output level : Variable (- - 0 dB) [INPUT 1 kHz / 0dB, 10 k-ohm Load]

TH-103VX200C

5 Operating Instructions

Option Menu for GPF13DMONV series

GPF13DMONV chassis series have special function and operation setting facility called Option Menu. This Option Menu is useful for special function required customers. This should be set at the installation stage.

Option menus default setting Contents

Onscreen display On Enable/Disable to display input mode indication after power on and no signal

All Aspect Off Sets All Aspect mode (advanced aspect setting) or default aspect mode. Auto Setup Manual Sets the operational mode of the automatic position adjustment in the POS./

Studio mode Off Switching functions in setting menus used for television studio applications. 3D Emitter INT Set the infrared transmitter for the 3D Eyewear. Function button assign 1 3D settings Set the function to operate when the FUNCTION button 1 to 2 on the remote Function button assign 2 Signal 3D Safety Precautions On Set show/hide 3D Safety Precautions during power ON. Memory lock Locks or unlocks saved profi les. Also for setting passwords.

indication.

SIZE memu.

control is pressed.

6 Service Mode

6.1. CAT (Computer Aided Test) mode

TH-103VX200C

To exit the CAT mode, access the ID mode and switch off the main power.

6.1.1. IIC mode

Select the IIC mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on the remote control.

Subject and item are mentioned on [IIC mode structure]. To exit the IIC mode, press the RETURN button on the remote control.

TH-103VX200C

6.1.2. CD mode

Select the CD mode by Up/Down button on the remote control at the front page of CAT mode and then press the [5] button on the remote control more than 3 seconds.

Memory data change

To exit the CD mode, press the RETURN button on the remote control.

TH-103VX200C

6.1.3. SD mode

Select the SD mode by Up/Down button on the remote control at the front page of CAT mode and then press the OK button on the remote control.

To exit the SD mode, press the RETURN button on the remote control.

6.1.4. MS mode

Select the MS mode by Up/Down button on the remote control at the front page of CA T mode and then press the [5] button on the remote control more than 3 seconds.

To exit the MS mode, press the RETURN button on the remote control.

Caution:

Market Select should be set after exchange of A-Board.

Destination number

Number Destination Number Destination

0 Japan 16 -1 North America 17 -2 Europe 18 China 3 Others 19 China (Hotel) 4Britain20Russia 5 Taiwan 21 Russia (Hotel) 6 Thailand 22 Hong Kong 7--23-8 Japan (Hotel) 24 --

9 North America (Hotel) 25 -10 Europe (Hotel) 26 -11 -- 27 -12 Britain (Hotel) 28 Middle East/Hong Kong 13 -- 29 Middle East/Hong Kong (Hotel) 14 Thailand (Hotel) 30 Australia 15 -- 31 Australia (Hotel)

Default setting

Number Destination

1 North America

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6.1.5. ID mode

Select the ID mode by Up/Down button on the remote control at the front page of CAT mode and then press th e [5] button on the remote control more than 3 seconds.

To exit the ID mode, press the RETURN button on the remote control.

6.2. IIC mode structure (following items value is sample data)

TH-103VX200C

7 Troubleshooting Guide

7.1. Self Check

7.1.1. Display Indication

1. Self-check is used to automatically check the bus line controlled circuit of the Plasma display.

2. To get into the Self-check mode, press the button on the customer controls at the bottom of the set, at the same time pressing the OFF-TIMER button on the remote control, and the screen will show.

If the IIC ports have been checked and found to be incorrect Or not located then [ - - ] will appear in place of [OK] [01] in the line of the [PTCT] means the number of blinks of the Power LED is 1. (Reference to 7.1.2) [H09] in the line of the [PTCT] is the error code.

To exit the CAT mode switch off the main power.

Note:

The line of the [PTCT] displays when you get into the Selfcheck mode for the first time only after the Power LED blinks.

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7.1.2. Power LED Blinking timing chart

1. Subject Information of LED Blinking timing chart.

2. Contents When an abnormality has occurred to the unit, the protection circui t operates and resets to the stand by mode. At this time, the defective block can be identified by the number of bli n ks of the Po wer LED on the front panel of the unit.

* Refer to 7.1.1 Display Indication

About blinking LED

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7.2. No Power

First check point There are following 3 states of No Power indication by power LED.

1. No lit.

2. Green is lit then turns red blinking a few seconds later.

3. Only red is lit.

7.3. No Picture

7.4. Local screen failure

Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.

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Fig - 1

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8 Service Fixture & Tools

8.1. SC jig

Purpose:

To find the failure board (SC or SU/SM/SD) when the power LED is blinking 7 times.

SC jig:

Jumper connector to connect to SC50 connector on SC board

Part number:

TZSC09187

How to use:

Caution: Remove SC jig from SC board after inspection.

1. Remove all connector between SC board and SU/SM/SD board to isolate SC board from SU/SM/SD board electrically.

Note: The board will be damaged if all connector is not removed (for example; remove connector only for SU board and stay connecting with SM/SD board. The board will be damaged.)

2. Connect SC jig to connector SC50 at left bottom side of SC board.

3. Turn on the TV/Display Unit and confirm the power LED blinking. LED blinking: Possible cause of failure is in SC board No LED blinking (Lighting or no lighting): Possible cause of failure is in SU, SM or SD board

4. After inspection, turn off the TV/Display Unit and wait a few minutes to discharge.

5. Remove SC jig from SC board.

9 Disassembly and Assembly Instructions

• To disassemble P.C.B., wait for 10 minute after power was off for discharge from electrolysis capacitors.

• , , and marks indicate screw positions.

9.1. Rear Cover and Board

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Rear Cover required to remove for each board exchange.

Board Name Rear Cover

A-Board B D-Board B DS-Board B SS-Board F SC-Board A SU-Board A SM-Board A SD-Board A C1-Board (upper) A C2-Board (upper) A, B C3-Board (upper) B, D C4-Board (upper) B, D C5-Board (upper) D, F C6-Board (upper) F C1-Board (lower) F C2-Board (lower) E, F C3-Board (lower) C, E C4-Board (lower) C, E C5-Board (lower) A, C C6-Board (lower) A S1-Board A SS2-Board F SS3-Board F V1-Board A, B, C, D, E, F V2-Board A

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Board Name Rear Cover

V3-Board A, B, C, D, E, F PB-Board D P-Board (MAIN_1) C P-Board (MAIN_2) E P-Board (SUB) D, E HX-Board B DN-Board B V(L)-Board E V(R)-Board C

9.2. Location of Rear Cover screws

9.2.1. Removal of Rear Cover ( A )

1. Remove Eye Bolt Covers.

TH-103VX200C

2. Remove screws (×21 , ×2 ) and then remove the Rear Cover ( A ).

9.2.2. Removal of Rear Cover ( B )

1. Remove screws ( ×21 , ×12 ) and then remove the Rear Cover ( B

9.2.3. Removal of Rear Cover ( C )

1. Remove screws (×19 ) and then remove the Rear Cover ( C

Note: when fixing Rear Cover ( C )

• Firstly screw on 2 screws (1-2) in order.

9.2.4. Removal of Rear Cover ( D )

1. Remove screws (×21 ) and then remove the Rear Cover ( D

Note: when fixing Rear Cover ( B )

• Firstly screw on 3 screws (1-3) in order.

Note: when fixing Rear Cover ( D

• Firstly screw on 2 screws (1-2) in order.

)

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9.2.5. Removal of Rear Cover ( E )

1. Remove screws (×25 ) and then remove the Rear Cover ( E

Note: when fixing Rear Cover ( E )

• Firstly screw on 2 screws (1-2) in order.

9.2.6. Removal of Rear Cover ( F )

1. Remove Eye Bolt Covers.

2. Remove screws (×21 ) and then remove the Rear Cover ( F

9.3. Removal of Side Angle (L), (R)

1. Remove Side Angle (L), (R) beforehand when remove the following Boards.

Board name Side Angle

SU-Board Side Angle (R) SM-Board Side Angle (R) SD-Board Side Angle (R) SC-Board Side Angle (R) C1-Board (upper) Side Angle (R) C6-Board (lower) Side Angle (R) SS2-Board Side Angle (L) SS3-Board Side Angle (L) SS-Board Side Angle (L) C6-Board (upper) Side Angle (L) C1-Board (lower) Side Angle (L)

9.3.1. Removal of Side Angle (L)

1. Remove 4 screws (A) of the Plate.

TH-103VX200C

2. Remove 15 screws ( ).

3. Remove 4 screws ( ) and then remove the Side Angle (L).

9.3.2. Removal of Side Angle (R)

1. Disconnect the connectors (DS22, P34).

5. Remove 4 screws (B) of the Plate.

6. Remove 15 screws ( ).

7. Remove 4 screws ( ) and then remove the Side Angle (R).

2. Remove 2 screws ( ).

3. Remove 2 screws ( ) and then slide the Side Power Unit upward.

4. Remove the Side Power Unit.

9.4. Removal of HX-Board

1. Disconnect the connectors (A14).

TH-103VX200C

2. Remove 2 Hexagonal-Head screws and 5 screws ( ) and 1 screws ( ) and 4 screws ( ) and then remove HX-

Board Block.

3. Turn over the HX-Board Block.

4. Disconnect the connectors (HX1).

5. Remove 2 Hexagonal-Head screws and 1 screws ( ) and 1 screws ( ) and then remove HX-Board Block.

2. Remove 3 screws and then remove the DS-Board and Fixed Plate.

3. Disconnect the connector (DS44).

4. Remove the flexible cables from the connectors (DS1).

5. Remove 2 screws and then remove DS-Board.

9.6. Removal of A-Board

Check that no bright points appears by Ve Life adjustment after both A and D board exchange.

9.5. Removal of DS-Board

1. Remove HX-Board Block. (Refer to Removal of HX-Board)

2. Remove the DS-Board Fixed Plate. (Refer to Removal of DS-Board)

3. Discon nect the connector (A3, A6, A7, A8, A9, A22, A33, A44).

4. Remove the flexible cables from the connectors (A1, A10, A16).

TH-103VX200C

5. Remove 3 screws and then remove A-Board.

9.7. Removal of DN-Board

4. Remove 4 screws and then remove DN-Board.

Note:

A re-setup of the destination is performed by MS mode after DN-Board exchange.

9.8. Removal of PB-Board

1. Remove Duct Barrier K.

2. Disconnect the connectors (DN1, DN4, DN5, DN8).

3. Remove the flexible cables from the connectors (DN10, DN16).

1. Disconnect the connectors (PB30, PB31, PB53, PB54, PB59, PB61, PB62, PB67, PB69, PB71).

2. Remove 4 screws and then remove PB-Board.

9.9. Removal of D-Board

Check that no bright points appears by Ve Life adjustment after both A and D board exchange.

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3. Disconnect the connectors (D3, D4, D5, D21, D25).

4. Remove the flexible cables from the connectors (D20, D31, D32, D33, D34).

5. Remove 4 screws and then remove D-Board.

9.11. Removal of P-Board (MAIN_2)

1. Discon nect the connectors (CM1, CM2, CM3, CM4, P6, P11, P35).

2. Remove 10 screws and then remove P-Board (MAIN_2).

9.10. Removal of P-Board (MAIN_1)

1. Disconnect the connectors (CM1, CM2, CM3, CM4, CM5, P2, P6, P35).

2. Remove 10 screws and then remove P-Board (MAIN_1).

9.12. Removal of P-Board (SUB)

1. Discon nect the connectors (CS1, CS2, CS3, CS4, CS5, CS6, CS7, CS8, CS9, P7, P9, P25, P34).

2. Remove 9 screws and then remove P-Board (SUB).

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