Panasonic TC-P55GT30 Service manual

ORDER NO.MTNC110218CE

B34 Canada: B62

55 inch Class 1080p Plasma HDTV

Model No. TC-P55GT30

GPF14DU Chassis

TABLE OF CONTENTS

PAGE PAGE

1 Safety Precautions -----------------------------------------------3

1.1. General Guidelines ----------------------------------------3

2 Warning --------------------------------------------------------------4

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices ----------4

2.2. About lead free solder (PbF) ----------------------------5

3 Service Navigation------------------------------------------------6

3.1. PCB Layout--------------------------------------------------6

3.2. Applicable signals------------------------------------------7

4 Specifications------------------------------------------------------8 5 Technical Descriptions----------------------------------------10

5.1. Specification of KEY for DTCP-IP, WMDRM and Widevine----------------------------------------------10

6 Service Mode----------------------------------------------------- 11

6.1. How to enter into Service Mode----------------------11

6.2. Option - Mirror---------------------------------------------13

6.3. Service tool mode---------------------------------------- 13

6.4. Hotel mode-------------------------------------------------14

6.5. Data Copy by SD Card ---------------------------------15

7 Troubleshooting Guide---------------------------------------- 18

7.1. Check of the IIC bus lines------------------------------18

7.2. Power LED Blinking timing chart-------------- -------19

7.3. No Power--------------------------------------------------- 19

7.4. No Picture--------------------------------------------------20

7.5. Local screen failure--------------------------------------21

8 Service Fixture & Tools---------------------------------------22

8.1. SC jig------------------------------------- -------------------22

9 Disassembly and Assembly Instructions---------------23

9.1. Remove the Rear cover --------------------------------23

9.2. Remove the AC inlet ------------------------------------23

9.3. Remove the P(MAIN)-Board -------------------------- 23

9.4. Remove the P(SUB)-Board----------------------------23

9.5. Remove the Terminal covers and the shield metals-------------------------------------------------------24

9.6. Remove the A-Board------------------------------------24

9.7. Remove the Side unit assy ----------------------------24

9.8. Remove the SU-Board----------------------------------25

9.9. Remove the SD-Board----------------------------------25

9.10. Remove the SC-Board----------------------------------25

9.11. Remove the SS-Board----------------------------------26

9.12. Remove the SS2-Board --------------------------------26

9.13. Remove the Fan------------------------------------------26

9.14. Remove the Speakers ----------------------------------26

9.15. Remove the Stand bracket-----------------------------27

9.16. Remove the K-Board------------------------------------27

9.17. Remove the S-Board------------------------------------27

9.18. Remove the V-Board------------------------------------27

9.19. Remove the Bottom cabinet assy-------------------- 27

9.20. Remove the Plasma panel section from the Cabinet assy.---------------------------------------------- 28

9.21. Remove the Contact metals--------------------------- 28

9.22. Remove the C1-Board ----------------------------------28

9.23. Remove the C2-Board ----------------------------------28

9.24. Remove the C3-Board ----------------------------------29

9.25. Replace the Plasma panel-----------------------------29

10 Measurements and Adjustments --------------------------30

10.1. Adjustment-------------------------------------------------30

11 Block Diagram ---------------------------------------------------35

11.1. Main Block Diagram------------------------------------- 35

11.2. Block (1/4) Diagram ---------- -------------------------- 36

11.3. Block (2/4) Diagram-------------------------------- -- --- 37

11.4. Block (3/4) Diagram-------------------------------- -- --- 38

11.5. Block (4/4) Diagram-------------------------------- -- --- 39

12 Wiring Connection Diagram -------------------------------- 41

12.1. Caution statement. -------------------------------------- 41

12.2. Wiring (1) - ------------------------------------------------- 41

12.3. Wiring (2) - ------------------------------------------------- 41

12.4. Wiring (3) - ------------------------------------------------- 42

12.5. Wiring (4) - ------------------------------------------------- 43

12.6. Wiring (5) - ------------------------------------------------- 44

12.7. Wiring (6) - ------------------------------------------------- 45

12.8. Wiring (7) - ------------------------------------------------- 46

13 Schematic Diagram 14 Printed Circuit Board 15 Exploded View

1 Safety Precautions

1.1. General Guidelines

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.

2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Fasten connectors but plug t hem straight in or unplug them straight out.

4. When servicing, observe the original lead dress. If a sh ort circuit is found, replace all parts which have been overheated or damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shield s are properly installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1. Unplu g the AC cord and connect a jumper between the two prongs on the plug.

2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the chassis, the reading should be between 1Mohm and 5.2Mohm. When the exposed metal does not have a return path to the chassis, the reading must be .

1.1.2. Leakage Current Hot Check (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kohm, 10 watts resistor, in parallel with a

0.15μF capacitors, between each exposed metallic part on the set and a good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to the customer.

Figure 1

2 Warning

2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap, which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrica l assembly equ ipped with ES devices, place the assembly on a conductive su rface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to damage an ES device).

2.2. About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements. In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder. The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu). That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.

Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please use a high temperature soldering iron and set it to 700 ± 20 °F (37 0 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C). If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

3 Service Navigation

3.1. PCB Layout

Board Name Function Board Name Function

P(MAIN) Power Supply

Non serviceable. P(MAIN)-Board should be exchange for service.

P(SUB) Power Supply

Non serviceable P(SUB)-Board should be exchange for service

A Main AV input, processing SU Scan out (Upper) K Remote receiver, Power LED, C.A.T.S sensor SPower Switch V 3D Eyewear transmitter SD Scan out (Lower)

C1 Data Driver (Lower Right) C2 Data Driver (Lower Center) C3 Data Driver (Lower Left) SC Scan Drive SS Sustain Drive

SS2 Sustain out (Lower)

Non serviceable. SU-Board should be exchanged for service.

Non serviceable. SD-Board should be exchanged for service.

3.2. Applicable signals

* Mark: Applicable input signal for Component (Y, PB, PR), HDMI and PC

horizontal frequency (kHz) vertical frequency (Hz) COMPONENT HDMI PC 525 (480) / 60i 15.73 59.94 * * 525 (480) /60p 31.47 59.94 * * 750 (720) /60p 45.00 59.94 * * 1,125 (1,080) /60i 33.75 59.94 * * 1,125 (1,080) /60p 67.43 59.94 * 1,125 (1,080) /60p 67.50 60.00 * 1,125 (1,080) /24p 26.97 23.98 * 1,125 (1,080) /24p 27.00 24.00 * 640 × 400 @70 31.47 70.08 * 640 × 480 @60 31.47 59.94 * Macintosh13 inch (640 × 480) 35.00 66.67 * 640 × 480 @75 37.50 75.00 * 852 × 480 @60 31.44 59.89 * 800 × 600 @60 37.88 60.32 * 800 × 600 @75 46.88 75.00 * 800 × 600 @85 53.67 85.08 * Macintosh16 inch (832 × 624) 49.73 74.55 * 1,024 ×768 @60 48.36 60.00 * 1,024 ×768 @70 56.48 70.07 * 1,024 ×768 @75 60.02 75.03 * 1,024 ×768 @85 68.68 85.00 * Macintosh21 inch (1,152 × 870) 68.68 75.06 * 1,280 ×768 @60 47.78 59.87 * 1,280 ×1,024 @60 63.98 60.02 * 1,366 ×768 @60 48.39 60.04 *

Note

• Signals other than above may not be displayed properly.

• The above signals are reformatted for optimal viewing on your display.

• Computer signals which can be input are those with a horizontal scanning frequency of 15 to 110 kHz and vertical scanning frequency of 48 to 120 Hz. (However, the image will not be displayed properly if the signals exceed 1,200 lines.)

4 Specifications

Q TV

Power Source AC 120 V, 60 Hz Power Consumption

Rated Power Consumption 434 W Standby condition 0.2 W

Plasma Display panel

Drive method AC type Aspect Ratio 16:9 Visible screen size 55 inch class (55.1 inches measured diagonally) (W × H × Diagonal) 48.0 inch × 27.0 inch × 55.1 inch (1,221 mm × 686 mm × 1,401mm) (No. of pixels) 2,073,600 (1,920 (W) × 1,080 (H)) [5,760 × 1,080 dots]

Sound

Audio Output 20 W [ 10 W + 10 W ] ( 10 % THD )

PC signals VGA, SVGA, XGA, WXGA, SXGA

Horizontal scanning frequency 31 - 69 kHz Vertical scanning frequency 59 - 86 Hz

Channel Capability (Digital/Analog) VHF/ UHF: 2 - 69, CATV: 1 - 135 Operating Conditions

Temperature: 32 °F - 104 °F (0 °C - 40 °C) Humidity: 20 % - 80 % RH (non-condensing)

Connection Terminals

VIDEO IN VIDEO: RCA PIN Type × 1 1.0 V [p-p] (75 Ω)

AUDIO L-R: RCA PIN Type × 2 0.5 V [rms]

COMPONENT IN Y: 1.0 V [p-p] (including synchronizatio n)

PB, PR: ±0.35 V [p-p] AUDIO L-R: RCA PIN Type × 2 0.5 V [rms]

HDMI 1-4 TYPE A Connector × 4

This TV supports [HDAVI Control 5] function.

USB 1-3 USB 2.0 Type A connector x 3 (DC 5 V MAX500mA) PC D-SUB 15 PIN: R, G, B / 0.7 V [p-p] (75 Ω)

LAN (for VIERA Connect) RJ45 (10BASE-T/100BASE-TX) Card slot SD CARD slot × 1 DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber Optic

FEATURES 3D Y/C FILTER

CLOSED CAPTION V-Chip VIERA Connect Media player 3D IMAGE VIEWER HDAVI Control 5

Dimensions (W × H × D)

Including pedestal TV Set only 51.1 inch × 31.2 inch × 1.5 (2.4) inch (1,297 mm × 790 mm × 37 (59) mm)

Mass

Including pedestal 82.7 lb. (37.5 kg) TV Set only 69.5 lb. (31.5 kg)

51.1 inch × 32.

6 inch × 15.3 inch (1,297 mm × 827 mm × 387 mm)

HD, VD / 1.0 - 5.0 V [p-p] (high impedance)

Note

• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

Q Wireless LAN Adaptor

Power supply DC 5 V (USB powered) 500 mA Antenna Tx 1, Rx 2 Interface USB 2.0 Standard Compliance IEEE802.11n / IEEE802.11a / IEEE802.11g / IEEE802.11b Transmission system MISO-OFDM system, OFDM system, DSSS system Frequency Range IEEE802.11n / IEEE802.11a:

5.150 GHz - 5.725 GHz for EU Countries

5.150 GHz - 5.850 GHz for USA, Canada

5.250 GHz - 5.850 GHz for Taiwan IEEE802.11g / IEEE802.11b / IEEE802.11n:

2.412 GHz - 2.472 GHz for EU countries

2.412 GHz - 2.462 GHz USA, Canada, Taiwan

Transfer rate (standard)* IEEE802.11n: Tx Max. 150 Mbps, Rx Max. 300 Mbps

IEEE802.11g / IEEE802.11a: Max. 54 Mbps IEEE802.11b: Max. 11 Mbps

Access Mode Infrastructure mode Security WPA2-PSK (TKIP/AES)

WPA-PSK (TKIP/AES) WEP (64 bit / 128 bit)

Dimensions (W × H × D) 1.18 inch × 0.42 inch × 3.73 inch (30.00mm × 10.72 mm × 94.85 mm) Mass 0.88 oz (25g) Net

*Transfer rates are theoretical values; however, actual communication rate will vary according to communication environment or connected equipment.

5 Technical Descriptions

5.1. Specification of KEY for DTCP-IP, WMDRM and Widevine

5.1.1. General information:

1. EEPROM (IC8902 ) for spare parts has the seed of KEY for each DTCP-IP for DLNA, WMDRM for Netflix and Widevine for CinemaNow.

2. The fin al KEY data will be generated by Peaks IC (IC8000) when SELF CHECK was done and are stored in both Peaks IC (IC8000) and EEPROM (IC8902).

5.1.2. Replacement of ICs:

When Peaks IC is replaced, EEPROM should be also replaced with new one the same time. When EEPROM is replaced, Peaks IC is not necessary to be replaced the same time. After the replacement of IC, SELF CHECK should be done to generate the final KEY data. How to SELF CHECK: While pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds. TV will be forced to the factory shipment setting after this SELF CHECK.

6 Service Mode

6.1. How to enter into Service Mode

6.1.1. Purpose

After exchange parts, check and adjust the contents of adjustment mode.

While pressing [VOLUME ( - )] button of the main unit, press [INFO] button of the remote control three times within 2 seconds

Note:

Service Mode can not be entered when 3D signal input. Input 2D signal to enter Service Mode.

6.1.2. Key command

[1] button...Main items Selection in forward direction [2] button...Main items Selection in reverse direction [3] button...Sub items Selection in forward direction [4] button...Sub items Selection in reverse direction [VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

6.1.3. How to exit

Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.

6.1.4. Contents of adjustment mode

• Value is shown as a hexadecimal number.

• Preset value differs depending on models.

• After entering the adjustment mode, take note of the value in each item before starting adjustment.

Main item Sub item Sample Data Remark

ADJUST CONTRAST 000

COLOR 3C TINT 00 SUB-BRT 800

WB-ADJ R-CUT 80

G-CUT 80 B-CUT 80 R-DRV DF G-DRV FF B-DRV 7C ALL-CUT 80 ALL-DRV FF

OPTION Boot ROM Factory Preset

STBY-SET 00 EMERGENCY OFF CLK MODE 00 CLOCK 000 EDID-CLK HIGH

MIRROR 00 (See Option-Mirror) VSUS LOW See Vsus selection AGING ALL WHITE Built-in test patterns can be

ALL BLUE WITH WHITE OUTSIDE FRAME

ALL GREEN

ALL RED

LOW STEP WHITE

LOW STEP BLUE

LOW STEP GREEN

LOW STEP RED

WHITE DIAGONAL STRIPE

RED DIAGONAL STRIPE

GREEN DIAGONAL STRIPE

BLUE DIAGONAL STRIPE

A-ZONE & B-ZONE

1% WINDOW

COLOR BAR

9 POINTS BRIGHT MEASURE

2 DOT OUTSIDE FRAME

ALL BLUE

DOUBLE FIXED 1% WINDOW

VERTICAL LINE SCROLL

ON/OFF OR WHITE

R/G/B/W ROTATION

HALF FIXED ALL WHITE

ALL WHITE WITH COUNT DISPLAY SRV-TOOL - See Service tool mode

displayed.

6.2. Option - Mirror

Picture can be reversed left and right or up and down. 00 : Default (Normal picture is displayed) 01 : Picture is reversed left and right. 02 : Picture is reversed up and down.

Hint : If the defective symptom (e.g. Vertical bar or Horizontal bar) is moved by selection of this mirror, the possible cause is in A-board.

6.3. Service tool mode

6.3.1. How to access

1. Select [SRV-TOOL] in Service Mode.

2. Press [OK] button on the remote control.

6.3.2. Display of SOS History

SOS History (Number of LED blinking) indication. From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment. This indication except 2nd and 1st occurrence after shipment will be cleared by [Self-check indication and forced to factory shipment setting].

6.3.3. POWER ON TIME/COUNT

Note : To displa y TIME/COUNT menu, highlight position, then press MUTE for 3 sec. Time : Cumulative power on time, indicated hour : minute by decimal Count : Number of ON times by decimal Note : This indication will not be cleared by either of the self-checks or any other command.

6.3.4. Exit

1. Disconnect the AC cord from wall outlet.

6.4. Hotel mode

1. Purpose Restrict a function for hotels.

2. Access command to the Hotel mode setup menu In order to display the Hotel mode setup menu: While pressing [VOLUME (-)] button of the main unit, press [INPUT] button of the remote control three times within 2 seconds.

Then, the Hotel mode setup menu is displayed.

3. To exit the Hotel mode setup menu Disconnect AC power cord from wall outlet.

4. Explain the Hotel mode setup menu

Item Function Mode Select hotel mode On/Off Input Select input signal modes.

Set the input, when each time power is switched on. Selection:

-/RF/HDMI1/HDMI2/HDMI3/HDMI4/Component/Video/PC

• Off: give priority to a last memory.

Channel Select channel when input signal is RF.

Set the channel, each time power is switched on. Selection: Any channel number or [-]. [-] means the channel when turns off.

Volume Adjust the volume when each time power is

switched on. Range: 0 to 100

Vol. Max Adjust maximum volume.

Range: 0 to 100

OSD Ctrl Restrict the OSD.

Selection: Off/Pattern1

• Off: No restriction

• Pattern1: restriction

FP Ctrl Select front key conditions.

Selection: Off/Pattern1/All

• Off: altogether valid.

• Pattern1: only input key is valid.

• All: altogether invalid.

Pow Ctrl Select POWER-On/Off condition when AC

power cord is disconnected and then connected. Off: The same condition when AC power cord is disconnected. On: Forced power ON condition.

6.5. Data Copy by SD Card

6.5.1. Purpose

(a) Board replacement (Copy the data when exchanging A-board):

When exchanging A-board, the data in original A-board can be copied to SD card and then copy to new A-board.

(b) Hotel (Copy the data when installing a number of units in hotel or any facility):

When installing a number of units in hotel or any facility, the data in master TV can be copied to SD card and then copy to other TVs.

6.5.2. Preparation

Make pwd file as startup file for (a) or (b) in a empty SD card.

1. Insert a empty SD card to your PC.

2. Right-click a blank area in a SD card window, point to New, and then click text document. A new file is created by default (New Text Document.txt).

3. Right-click the new text document that you just created and select rename, and then change the name and extension of the file to the following file name for (a) or (b) and press ENTER.

File name:

(a) For Board replacement : boardreplace.pwd (b) For Hotel : hotel.pwd

Note:

Please make only one file to prevent the operation error. No any other file should not be in SD card.

6.5.3. Data copy from TV set to SD Card

1. Turn on the TV set.

2. Insert SD card with a startup file (pwd file) to SD slot. On-screen Display will be appeared according to the startup file automatically.

3. Input a following password for (a) or (b) by using remote control.

(a) For Board replacement : 2770

(b) For Hotel : 4850 Data will be copied from TV set to SD card. It takes around 2 to 6 minutes maximum for copying.

4. After the completion of copying to SD card, remove SD card from TV set.

5. Turn off the TV set.

Note:

Following new folder will be created in SD card for data from TV set.

(a) For Board replacement : user_setup (b) For Hotel : hotel

6.5.4. Data copy from SD Card to TV set

1. Turn on the TV set.

2. Insert SD card with Data to SD slot. On-screen Display will be appeared according to the Data folder automatically.

3. Input a following password for (a) or (b) by using remote control.

(a) For Board replacement : 2771 (b) For Hotel : 4851

Data will be copied from SD card to TV set.

4. After the completion of copying to SD card, remove SD card from TV set.

(a) For Board replacement : Data will be deleted after copying (Limited one copy). (b) For Hotel : Data will not be deleted and can be used for other TVs.

5. Turn off the TV set.

Note:

1. Depending on the failure of boards, function of Data copy for board replacement does not work.

2. This function can be effective among the same model numbers.

7 Troubleshooting Guide

Use the self-check function to test the unit.

1. Checking the IIC bus lines

2. Power LED Blinking timing

7.1. Check of the IIC bus lines

7.1.1. How to access

7.1.1.1. Self-check indication only:

Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control for more than 3 seconds.

7.1.1.2. Self-check indication and forced to factory shipment setting:

Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote control for more than 3 seconds.

7.1.2. Exit

Disconnect the AC cord from wall outlet.

7.1.3. Screen display

7.1.4. Check Point

Confirm the following parts if NG was displayed.

DISPLAY Check Ref. No. Description Check P.C.B. PEAKS IC8000 PEAKS-LDA3 A-Board TUN TU4801 TUNER A-Board AVSW IC3001 AUDIO/VIDEO SW A-Board STBY IC8000 PEAKS-LDA3 (STM) A-Board MEM1 IC8902 PEAKS EEPROM A-Board MEM2 IC8901 STM EEPROM A-Board TEMP IC3753 TEMP SENSOR A-Board iPOD-CP IC3900 iPOD-CP A-Board ID A-Board LP1 IC9300 LP1 A-Board HDMI-SW IC4700 HDMI SW A-Board IRDRV IC5901 IR LED DRIVER A-Board

7.2. Power LED Blinking timing chart

1. Subject Information of LED Flashing timing chart.

2. Contents When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.

Blinking Times Contents Check point

1 Panel information SOS

LP1 Start SOS 3 P+ 3.3V SOS A-Board 4 Power SOS P(MAIN)-Board

5 P+ 5V SOS A-Board 6 Driver SOS1

(SC Energy recovery circuit)

(A-SC FPC DET) 7 Driver SOS2

(SU/SD Connector DET)

(SU/SD Scan and Logic IC) 8 Driver SOS3

(SS FPC DET)

(SS Energy recovery circuit)

9 Discharge Control SOS A-Board

10 Sub 5V SOS

Sub 3.3V SOS

Tuner power SOS

11 FAN SOS A-Boar d

12 Sound SOS A-Board

13 Emergency SOS A-Board 14 IR LED SOS A-Board

P(SUB)-Board

SC-Board

A-SC FPC

SU-Board SD-Board

SS-Board

SS2-Board

SS FPC

SS2 FPC

A-Board SC-Board SS-Board

P(MAIN)-Board

P(SUB)-Board

FAN

Speaker

*Use SC jig to isolate the board.

7.3. No Power

First check point There are following 2 states of No Power indication by power LED.

1. No lit

2. Red is lit then turns red blinking a few seconds later. (See 7.2.)

7.4. No Picture

7.5. Local screen failure

Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area .

Fig-1

8 Service Fixture & Tools

8.1. SC jig

Purpose:

To find the failure board (SC or SU/SD) when the power LED is blinking 7 times.

SC jig:

Jumper connector to connect to SC50 connector on SC board

Part number:

TZSC09187

How to use: Caution: Remove SC jig from SC board after inspection.

1. Remove all connector between SC board and SU/SD board to isolate SC board from both SU and SD board electrically. Note: The board will be damaged if all connector is not removed (for example; remove connector only for SU board and stay connecting with SD board. The board will be damaged.)

2. Connect SC jig to connector SC50 at left bottom side of SC board

3. Turn on the TV/Display Unit and confirm the power LED blinking. LED blinking: Possible cause of failure is in SC board No LED blinking (Lighting or no lighting): Possible cause of failure is in SU or SD board

4. After inspection, turn off the TV/Display Unit and wait a few minutes to discharge.

5. Remove SC jig from SC board.

Remark: This SC jig can be used for all 2011 Plasma TV and Plasma Display .

9 Disassembly and Assembly Instructions

9.1. Remove the Rear cover

1. See PCB Layout (Section 3)

9.2. Remove the AC inlet

Caution:

To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Unlock the cable clampers to free the cable.

2. Disconnect the connector (P9).

3. Remove the screws (×2 ) and remove the Inlet metal.

4. Remove the screw (×1 ) and remove the AC inlet.

9.4. Remove the P(SUB)-Board

Caution:

To re move P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Unlock the cable clampers to free the cable.

2. Disconnect the connectors (P51, P55 and P57).

3. Disconnect the connector (P9).

4. Remove the screws (×4 ) and remove the P(SUB)- Board.

9.3. Remove the P(MAIN)-Board

Caution:

To remove P.C.B. wait 1 minute after power was off for discharge from electrolysis capacitors.

1. Unlock the cable clampers to free the cable

2. Disconnect the connectors (P52, P56 and P58)

3. Disconnect the connectors (P2, P6, P11 and P35).

4. Disco nnect a short-jumper connector P34 and re-use for new P(MAIN)-Board.

5. Remov e the screws (×5 ) and remove the P(MAIN)Board.

9.5. Remove the Terminal covers and the shield metals

1. Remove the claw (×1 ).

2. Remove the Side terminal cover.

3. Remove the claw (×1 ).

4. Remove the Bottom terminal cover.

5. Remove the screw (×1 ).

6. Remove the USB terminal cover and USB shield metal.

9.6. Remove the A-Board

1. Remove the Terminal covers and th e Shield metals. (See section 9.5.)

2. Unlock the cable clampers to free the cable.

3. Disconnect the connectors (A1, A6, A8, A11, and A14).

4. Disconnect the flexible cables (A20, A31, A32 and A40).

5. Remove the screw (×1 ) and remove the A-Board.

7. Remove the screws (×2 ).

8. Remove the Bottom shield metal.

9. Remove the screw (×1 ).

10. Remove the Side shield metal.

9.7. Remove the Side unit assy

1. Disconnect the connector (C14).

2. Remove the claws (×2 ) and remove the Side unit assy.

3. Remove the screw (×1 ).

4. Remove the Side unit mount metal.

9.8. Remove the SU-Board

1. Disco nnect the flexible cables (SU1, SU2, SU3, SU4 and SU5) connected to the SU-Board.

2. Disconnect the flexible cable (SU11-SD11) and the bridge connector (SC41-SU41).

3. Remov e the screws (×2 , ×2 ) and remove the SU- Board.

9.9. Remove the SD-Board

1. Disconnect the flexible cables (SD1, SD2, SD3, SD4 and SD5) connected to the SD-Board.

2. Disconnect the flexible cable (SU11-SD11) and the bridge connectors (SC42-SD42 and SC46-SD46).

3. Remove the screws (×2 , ×2 ) and remove the SD- Board.

9.10. Remove the SC-Board

1. Remove the SU-Board and SD-Board. (See section 9.8. and 9.9.)

2. Disconnect the connector (SC2).

3. Disconnect the flexible cable (SC20).

4. Remove the screws (×7 ) and remove the SC-Board.

9.11. Remove the SS-Board

1. Disconnect the connector (SS11).

2. Disconnect the flexible cable (SS33).

3. Disconnect the flexible cable (SS53).

4. Remove the screws (×4 , ×4 ) and remove the SS- Board.

9.12. Remove the SS2-Board

1. Re move the Terminal metals and the Shield metals. (See section 9.5.)

2. Remove the SS-Board. (See section 9.11.)

3. Disconnect the flexible cables (SS54 and SS56).

4. Remove the screws (×2 ) and remove the SS2-Board.

9.13. Remove the Fan

1. Unlock the cable clampers to free the cable.

2. Remove the screws (×3 ).

3. Remove the Relay connector and remove the Fan.

9.14. Remove the Speakers

1. Unlock the cable clampers to free the cable.

2. Remove the screws (×3 , ×6 ) and remove the SP shield metal L.

3. Remove the screws (×3 , ×6 ) and remove the SP shield metal R.

4. Disconnect the Relay connector.

5. Remove the screws (×2 each) and remove the Speakers (L, R).

9.15. Remove the Stand bracket

1. Remove the Plasma panel section from the servicing stand and lay on a flat surface such as a table (covered by a soft cloth) with the Plasma panel surface facing downward.

2. Unlock the cable clampers to free cable.

3. Remove the Stand bracket fastening screws (×10 , ×4

, ×4 ) and the Stand bracket.

9.18. Remove the V-Board

1. Remove the SP shield metal R. (See section 9.14.)

2. Remove the Stand bracket. (See section 9.15.)

3. Remove the screw (×1 ) and remove the claws (×3 ).

4. Disconnect the connector (V14) and remove the V-Board

from the 3D LED panel.

9.16. Remove the K-Board

1. Remove the SP shield metal L. (See section 9.14.)

2. Remove the Stand bracket. (See section 9.15.)

3. Remove the screw (×1 ).

4. Remove the claws (×3 ).

5. Disco nnect the connector (K1) and remove the K-Board from the LED panel.

9.17. Remove the S-Board

1. Remove the SP shield metal L. (See section 9.14.)

2. Remove the screws (×2 ).

3. Disconnect the connector (S10) and remove the S-Board.

9.19. Remove the Bottom cabinet assy

1. Remove the Speakers. (See section 9.14.)

2. Remove the Stand bracket. (See section 9.15.)

3. Remove the K, S and V-Board. (See section 9.16 - 18.)

4. Remove the screws (×2 ) and remove the Bottom cabinet assy.

9.20. Remove the Plasma panel section from the Cabinet assy.

1. Place the Cabinet assy on a flat surface of a table (covered by a soft cloth) and a cushion.

2. Remove the Bottom cabinet assy. (See section 9.19.)

3. Remove the screws (×8 , ×14 ).

9.21. Remove the Contact metals

1. Remove the Cabinet assy. (See section 9.20.)

2. Remove the Tape from the Contact metals.

3. Remove the screws (×6 ).

4. Remove the Contact metal side (L, R).

5. Remove the screws (×6 ).

6. Remove the Contact metal top.

7. Remove the screws (×15 ).

8. Remove the Contact metal bottom.

4. Remove the Plasma panel section from the Cabinet assy.

9.22. Remove the C1-Board

1. Remove the Contact metal bottom. (See section 9.21.)

2. Disconnect the flexible cables (CB1, CB2 and CB3).

3. Disconnect the flexible cable (C10).

4. Disconnect the connector (C14).

5. Remove the screws (×3 ) and remove the C1-Board.

9.23. Remove the C2-Board

1. Remove the Contact metal bottom. (See section 9.21.)

2. Disconnect the flexible cables (CB4, CB5, CB6, CB7, CB8 and CB9).

3. Disconnect the flexible cables (C20, C21 and C26).

4. Remove the screws (×4 ) and remove the C2-Board.

9.24. Remove the C3-Board

1. Remove the Contact metal bottom. (See section 9.21.)

2. Disconnect the flexible cables (CB10, CB11, CB12, CB13, CB14 and CB15).

3. Disconnect the flexible cables (C31 and C36).

4. Disconnect the connector (C35).

5. Remove the screws (×4 ) and remove the C3-Board.

9.25. Replace the Plasma panel

Caution:

Place the Plasma panel on a flat surface of a table (covered by a soft cloth) and a cushion.

A new Plasma panel itself without Cont act metals is fragile. To avoid the damage to new Plasma panel, carry a new Plasma panel taking hold of the Contact metals.

1. Plac e a carton box packed a new Plasma panel on the flat surface of the work bench.

2. Open a box and without taking a new Plasma panel.

3. Attach the Cabinet assy and each P.C.Board and so on, to the new Plasma panel.

10 Measurements and Adjustments

10.1. Adjustment

10.1.1. Vsus selection

Caution:

When Plasma panel or A-board is replaced, Vsus should be set to LOW or HIGH.

Procedure

1. Go into main item [VSUS] in Service Mode. LOW or HIGH will be displayed.

2. Press [OK] button to go to TEST stage. White pattern without On-Screen Display will be displayed during TEST and CONF stage. Press [5] button to display the On-Screen Display.

3. Press [VOL (-)] button to set to LOW.

4. In LOW setting

a. If no several dead pixel is visible remarkably in white pattern, press [3] button to go to CONF stage. b. If the several dead pixels are visible remarkably in white pattern, Set to HIGH by press [VOL (+)] button. Press [3] button

to go to CONF stage if the symptom is improved.

5. Press [OK] button in CONF stage to store LOW or HIGH.

6. Exit Service Mode by pressing [Power] button.

+ 88 hidden pages