Panasonic KX-TES824LA, KX-TEM824LA, KX-TE82461X, KX-TE82474X, KX-TE82480X Service Manual

...

ORDER NO. KMS0502047C3

Advanced Hybrid System

KX-TES824LA KX-TEM824LA

KX-TE82461X KX-TE82474X KX-TE82480X KX-TE82483X KX-TE82491X KX-TE82492X KX-TE82493X KX-A227X

(for Latin America)

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF. Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.

When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how it might be permissible to use Pb solder during service and repair work.

KX-TES824LA / KX-TE M824LA /

CONTENTS

Page Page

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 5

1.1. SUGGESTED PbF SOLDER

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

2 FOR SERVICE TECHNICIANS

3 CAUTION

3.1. SAFETY PRECAUTIONS

3.2. INSULATION RESISTANCE TEST

3.3. BATTERY CAUTION

3.4. CAUTION

4 SPECIFICATIONS

4.1. GENERAL DESCRIPTION

4.2. CHARACTERISTICS

4.3. SYSTEM CAPACITY

5 SYSTEM OVERVIEW

5.1. SYSTEM COMPONENTS

5.2. SYSTEM CONNECTION DIAGRAM

6 NAMES AND LOCATIONS

7 CONNECTION

7.1. SERIAL INTERFACE CONNECTION

8 DISASSEMBLY INSTRUCTIONS

8.1. DISASSEMBLY INSTRUCTION

9 BLOCK DIAGRAM

9.1. SYSTEM BLOCK DIAGRAM

9.2. POWER BLOCK DIAGRAM

9.3. KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM

9.4. KX-TEM824LA 2AP BLOCK DIAGRAM

9.5. KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT BLOCK DIAGRAM

10 EXPLANATION OF BLOCK DIAGRAM

10.1. MAIN UNIT (KX-TES824LA/KX-TEM824LA)

11 CIRCUIT OPERATION

11.1. POWER SUPPY CIRCUIT

11.2. CO INTERFACE CIRCUIT

11.3. CROSS POINT SWITCH CIRCUIT

11.4. INTERCOM CIRCUIT

11.5. POWER FAILURE THROUGH CALL SWITCHING CIRCUIT

11.6. DATA COMMUNICATION CIRCUIT

11.7. CONTROL CIRCUIT

11.8. TONE GENERATOR CIRCUIT

11.9. DTMF GENERATOR CIRCUIT

11.10. DTMF RECEIVER CIRCUIT

11.11. INT CALLID INTERFACE CIRCUIT

11.12. MODEM INTERFACE CIRCUIT

11.13. USB INTERFACE CIRCUIT

11.14. OGM INTERFACE CIRCUIT

11.15. RINGING SIGNAL GENERATO R CIRCUIT

11.16. SMDR INTERFACE CIRCUIT

11.17. DOORPHONE CARD INTERFACE (KX-TE8246 1X)

11.18. OGM CARD INTERFACE (KX-TE82491X)

10 11

16 17 17 18

21 23 27 29

30 31 33 34 35 36 37 37 38 38 39 39 40 40

8 8 8 8

9 9 9

11.19. BUILT in VOICE MESSAGE CARD INTERFACE (KXTE82492X)

11.20. CALL ID CARD INTERFACE (KX-TE82493X)

12 TROUBLESHOOTING GUIDE

12.1. NO OPERATION (Check POWER SUPPLY BOARD, MAIN BOARD)

12.2. NO DIAL TONE (KX-TES824LA, MAIN BOARD OF KXTEM824LA)

12.3. CANNOT DIAL (KX-TES824LA, MAIN BOARD OF KXTEM824LA)

12.4. CANNOT CALL EXTENSION (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

12.5. CANNOT USE PROPRIETARY TELEPHONE (KXTES824LA, MAIN BOARD OF KX-TEM824LA)

12.6. CANNOT RECEIVE INCOMING CALL (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

12.7. CANNOT SEND DTMF DIALING (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

12.8. CANNOT RECEIVE CALL DIAL TONE (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

12.9. CANNOT SEND A HOLD ON MUSIC (KX-TES824LA, MAIN BOARD OF KX-TEM824LA)

12.10. NO DIAL TONE (SUB BOARD OF KX-TEM824 LA)

12.11. CANNOT DIAL (SUB BOARD OF KX-TEM824LA)

12.12. CANNOT CALL EXTENSION (SUB BOARD OF KXTEM824LA)

12.13. CANNOT USE PROPRIETA RY TELEPHONE (SUB BOARD OF KX-TEM824LA)

12.14. CANNOT RECEIVE INCOMING CALL (SUB BOARD OF KX-TEM824LA)

12.15. CANNOT SEND DTMF DIALING (SUB BOARD OF KXTEM824LA)

12.16. CANNOT RECEIVE CALL DIAL TONE (SUB BOARD OF KX-TEM824LA)

12.17. CANNOT SEND A HOLD ON MUSIC (SUB BOARD OF KX-TEM824LA)

13 IC DATA

13.1. IC700

13.2. IC6

14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

15 HOW TO REPLACE A FLAT PACKAGE IC

15.1. PREPARATION

15.2. REMOVAL PROCEDURE

15.3. INSTALLATION PROCEDURE

15.4. REMOVING SOLDER FROM BETWEEN PINS

16 FIXTURES AND TOOLS

17 CABINET AND ELECTRICAL PARTS LOCATION

18 ACCESSORIES AND PACKING MATERIALS

19 REPLACEMENT PARTS LIST (KX-TES824LA/KX-TEM824LA)

19.1. CABINET AND ELECTRICAL PARTS

19.2. ACCESSORIES AND PACKING MATERIALS

41 41

47 47 48

51 53

56 56 56 56

60 60

KX-TES824LA / KX-TE M824LA /

19.3. MAIN BOARD PARTS 60

19.4. POWER SUPPLY BOARD PARTS

19.5. SUB BOARD PARTS

19.6. FIXTURES AND TOOLS

20 FOR THE SCHEMATIC DIAGRAM

21 SCHEMATIC DIAGRAM (KX-TES824LA/KX-TEM824LA)

21.1. MAIN No.1 (Extention A-D Block)

21.2. MAIN No.2 (Extention E-H Block)

21.3. MAIN No.3 (CO Block)

21.4. MAIN No.4 (Cross-Point Block)

21.5. MAIN No.5 (ASIC, Memory Block)

21.6. SUB

21.7. POWER SUPPLY

22 PRINTED CIRCUIT BOARD (KX-TES824LA/KX-TEM824LA)

22.1. MAIN BOARD

22.2. SUB BOARD

22.3. POWER SUPPLY

23 KX-TE82461X (4-PORT DOORPHONE CARD)

23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

23.2. LOCATION OF OPTIONAL CARDS

23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM

23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT OPERATIONS

23.5. TROUBLESHOOTING GUIDE

23.6. IC DATA

23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

23.8. ACCESSORIES AND PACKING MATERIALS

23.9. REPLACEMENT PARTS LIST (KX-TE82461X)

23.10. FOR THE SCHEMATIC DIAGRAM

23.11. SCHEMATIC DIAGRAM (KX-TE8246 1X)

23.12. PRINTED CIRCUIT BOARD (KX-TE8246 1X)

24 KX-TE82474X (8-PORT SLT EXTENSION CARD)

24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

24.2. LOCATION OF OPTIONAL CARDS

24.3. BLOCK DIAGRAM

24.4. EXPLANATION OF BLOCK DIAGRAM

24.5. TROUBLESHOOTING GUIDE

24.6. IC DATA

24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

24.8. CABINET AND ELECTRICAL PARTS

24.9. ACCESSORIES AND PACKING MATERIALS

24.10. REPLACEMENT PARTS LIST (KX-TE82474X)

24.11. FOR THE SCHEMATIC DIAGRAM

24.12. MEMO

24.13. SCHEMATIC DIAGRAM (KX-TE8247 4X)

24.14. PRINTED CIRCUIT BOARD (KX-TE8247 4X)

25 KX-TE82480X (2-PORT ANALOGUE CO LINE AND 8-PORT

SLT EXTENSION CARD)

70 71 77

80 84 88 92

96 100 110

114

114 116 118

119

120 121

122

124 125 126

127 128 129 131 132 134

135

136 137 140 140 147 149

150 151 151 152 156 157 158 164

166

25.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

25.2. LOCATION OF OPTIONAL CARDS

25.3. BLOCK DIAGRAM

25.4. EXPLANATION OF BLOCK DIAGRAM

25.5. CIRCUIT OPERATION

25.6. TROUBLESHOOTING GUIDE

25.7. IC DATA

25.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

25.9. CABINET AND ELECTRICAL PARTS

25.10. ACCESSORIES AND PACKING MATERIALS

25.11. REPLACEMENT PARTS LIST (KX-TE82480X)

25.12. FOR THE SCHEMATIC DIAGRAM

25.13. SCHEMATIC DIAGRAM (KX-TE8248 0X)

25.14. PRINTED CIRCUIT BOARD (KX-TE8248 0X)

26 KX-TE82483X (3-PORT ANALOGUE CO LINE AND 8-PORT

HYBRID EXTENSION)

26.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

26.2. LOCATION OF OPTIONAL CARDS

26.3. BLOCK DIAGRAM

26.4. EXPLANATION OF BLOCK DIAGRAM

26.5. CIRCUIT OPERATION

26.6. TROUBLESHOOTING GUIDE

26.7. IC DATA

26.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

26.9. CABINET AND ELECTRICAL PATRS

26.10. ACCESSORIES AND PACKING MATERIALS

26.11. REPLACEMENT PARTS LIST (KX-TE82483X)

26.12. FOR THE SCHEMATIC DIAGRAM

26.13. SCHEMATIC DIAGRAM (KX-TE8248 3X)

26.14. PRINTED CIRCUIT BOARD (KX-TE8248 3X)

27 KX-TE82491X (MESSAGE EXTENSION CARD FOR DISA/UCD

OGMs)

27.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

27.2. LOCATION OF OPTIONAL CARDS

27.3. BLOCK DIAGRAM

27.4. TROUBLESHOOTING GUIDE

27.5. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

27.6. ACCESSORIES AND PACKING MATERIALS

27.7. REPLACEMENT PARTS LIST (KX-TE82491X)

27.8. FOR THE SCHEMATIC DIAGRAM

27.9. SCHEMATIC DIAGRAM (KX-TE82491X)

27.10. PRINTED CIRCUIT BOARD (KX-TE8249 1X)

28 KX-TE82492X (2-CHANNEL VOICE MESSAGE CARD)

28.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

28.2. LOCATION OF OPTIONAL CARDS

28.3. BLOCK DIAGRAM

28.4. CIRCUIT OPERATIONS

167 168 172 172 173 183 186

187 188 188 189 195 196 204

206

207 208 210 210 211 222 225

227 228 228 229 235 236 246

248

249 250 251 252

253 253 254 255 256 258

259

260 261 262 263

KX-TES824LA / KX-TE M824LA /

28.5. TROUBLESHOOTING GUIDE 264

28.6. IC DATA

28.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

28.8. ACCESSORIES AND PACKING MATERIALS

28.9. REPLACEMENT PARTS LIST (KX-TE82492X)

28.10. FOR THE SCHEMATIC DIAGRAM

28.11. SCHEMATIC DIAGRAM (KX-TE8249 2X)

28.12. PRINTED CIRCUIT BOARD (KX-TE8249 2X)

29 KX-TE82493X (3-PORT CALLER ID CARD)

29.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

29.2. LOCATION OF OPTIONAL CARDS

29.3. BLOCK DIAGRAM

266

267 267 268 269 270 272

273

274 275 276

29.4. CIRCUIT OPERATIONS

29.5. TROUBLESHOOTING GUIDE

29.6. IC DATA

29.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES

29.8. ACCESSORIES AND PACKING MATERIALS

29.9. REPLACEMENT PARTS LIST (KX-TE82493X)

29.10. FOR THE SCHEMATIC DIAGRAM

29.11. SCHEMATIC DIAGRAM (KX-TE8249 3X)

29.12. PRINTED CIRCUIT BOARD (KX-TE8249 3X)

30 KX-A227X (BACK-UP BATTERY CABLE)

30.1. ACCESSORIES AND PACKING MATERIALS

30.2. REPLACEMENT PARTS LIST (KX-A227X)

276 277 278

280 280 281 283 284 286

287

288 289

KX-TES824LA / KX-TE M824LA /

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)

Note:

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.

Caution

•

• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with

• •

temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please be careful not to heat too long.

•

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).

• •

•

• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible

• •

and be sure that any remaining is melted prior to applying the Pb solder.

•

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

• •

opposite side (See figure, below).

1.1. SUGGESTED PbF SOLDER

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper, (Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the

manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

KX-TES824LA / KX-TE M824LA /

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED

KX-TES824LA / KX-TE M824LA /

2 FOR SERVICE TECHNICIANS

ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover the plastic parts boxes with aluminum foil.

2. Ground the soldering irons.

3. Use a conductive mat on the worktable.

4. Do not touch IC or LSI pins with bare fingers.

KX-TES824LA / KX-TE M824LA /

3 CAUTION

3.1. SAFETY PRECAUTIONS

1. Before servicing, unplug the power cord to prevent an electric shock.

2. When replacing parts, use only the manufacturer´s recommended components for safety.

3. Check the condition of the power cord. Replace if wear or damage is evident.

4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.

5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent the customer from being exposed to shock hazards.

3.2. INSULATION RESISTANCE TEST

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.

2. Turn on the power switch.

3. Measure the resistance value with ohmmeter between the jumpers AC plug and each exposed metal cabinet part, such as screw threads, control shafts, handle brackets, etc.

Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired and rechecked before it is returned to the customer.

3.3. BATTERY CAUTION

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location when replacing it and soldering the replacement lithium battery in.

3.4. CAUTION

The power socket wall outlet should be located near this equipment and be easily accessible.

4 SPECIFICATIONS

4.1. GENERAL DESCRIPTION

Control Bus Original bus (16-bit, 24 MHz) Switching Space Division CMOS Crosspoint Switch Power Input 100 V AC to 240 V AC, 1.5A to 0.75A, 50 Hz/60Hz External Battery +24 V DC (+12 V DC x 2) Maximum Power Failure Tolerance 300 ms (without using backup batteries) Memory Backup Duration 7 years Dialling Outside (CO) Line Pulse (10 pps, 20 pps) or Tone (DTMF)

Extension Pulse (10 pps, 20 pps) or Tone (DTMF) Intercom Path 4 Mode Conversion Pulse-DTMF Ring Frequency 20 Hz/25 Hz (selectable) Operating Environment Temperature 0°Cto40°C

Humidity 10 % to 90 % (non-condensing) Conference Call Outside (CO) Line 2 Music on Hold (MOH) 1 port

Selectable MOH: Internal/External/Tone

Paging Internal 1

Extension 1 port Serial Interface Port RS-232C 1

USB 1.1 1 Extension Connection Cable SLT 1 pair wire (T, R)

PT 2-pair wire (T, R, H, L)

DSS Console 1-pair wire (H, L) Dimension 368 mm (W) x 284 mm (H) x 102 mm (D) Weight (when fully expanded) Approx. 3.5 kg

KX-TES824LA / KX-TE M824LA /

4.2. CHARACTERISTICS

Terminal Equipment Loop Limit PT 40 Ω

SLT 600 Ω including set

Doorphone 20 Ω Minimum Leakage Resistance 15000 Ω minimum Maximum Number of Extension

Instruments per Line Ring Voltage 75 Vrms at 20 Hz/25 Hz depending on the ringing load Outside (CO) Line Loop Limit 1600 Ω maximum Hookswitch Flash/Recall Timing Range 24 ms-2032 ms Door Opener Current Limit 30 V DC/125 V AC, 3 A maximum Paging Terminal Impedance 600 Ω MOH Terminal Impedance 10000 Ω

1 PT or SLT in standard connection

1 PT and 1 SLT in parallel connection

4.3. SYSTEM CAPACITY

4.3.1. System Capacity

KX-TES824 KX-TEM824

Basic System Outside (CO) lines 3 6

Extensions 8 16

Fully Expanded System Outside (CO) lines 8 8

Extensions 24 24

KX-TES824LA / KX-TE M824LA /

4.3.2. Maximum Cards Terminal Equipment

ltem KX-TES824 KX-TEM824 Extension Terminal 48 48 3-Port Analogue CO Line and 8-Port Hybrid Extension Card 1 2-Port Analogue CO Line and 8-Port Single Line Telephone Extension Card 1 1 8-Port Single Line Telephone Extension Card 1 1 Message Expansion Card for DISA/UCD OGMs 1 1 4-Port Doorphone Card 1 1 3-Port Caller ID Card 3 3 2-Channel Voice Message Card 1 1 Doorphone 4 4 Door Opener 4 4 Pager 1 1 Music on Hold (MOH) 1 1 DSS Console 2 2

4.3.3. System Data

ltem Max. Quantity Operator 1 System Speed Dialling 100 One-touch Dialling 24 per extension (PT) Personal Speed Dialling 10 per extension Call Park Area 10 Absent Message 6 Toll Restriction (TRS) COS 5 Extension Group 8 Message Waiting 8 per extension Message for Built-in Voice Message 128 messages (total 60 minutes)

5 SYSTEM OVERVIEW

5.1. SYSTEM COMPONENTS

Model Description

Main Unit KX-TES824LA

KX-TEM824LA

Optional Service Cards KX-TE82461X

KX-TE82474X KX-TE82480X KX-TE82483X KX-TE82491X KX-TE82492X KX-TE82493X

Proprietary Equipment KX-T30865

KX-A227X

Advances Hybrid System: 3 to 8 Outside (CO) Lines, 8 to 24 Extensions Advances Hybrid System: 6 to 8 Outside (CO) Lines, 16 to 24 Extensions

4-Port Doorphone Card 8-Port Single Line Telephone Extension Card 2-Port Analogue CO Line and 8-Port Single Line Telephone Extension Card 3-Port Analogue CO Line and 8-Port Hybrid Extension Card Message Expansion Card for DISA/UCD OGMs 2-Channel Voice Message Card 3-Port Caller ID Card

Doorphone Backup Battery Cable

5.2. SYSTEM CONNECTION DIAGRAM

KX-TES824LA / KX-TE M824LA /

•

• Connect a display-equipped proprietary telephone (PT) to extension jack 01, as this extension is automatically designated as

• •

the manager extension.

KX-TES824LA / KX-TE M824LA /

6 NAMES AND LOCATIONS

7 CONNECTION

7.1. SERIAL INTERFACE CONNECTION

8 DISASSEMBLY INSTRUCTIONS

8.1. DISASSEMBLY INSTRUCTION

1. Loosen the top cover screw (A).

2. Remove the top front cover.

Note

The screw cannot be removed front the cover.

KX-TES824LA / KX-TE M824LA /

3. Remove the 2 bottom-cover screws (B).

4. Open the bottom front cover.

KX-TES824LA / KX-TE M824LA /

5. Remove the 2 screws (A).

6. Remove the power supply board cover.

7. Pull out the 4 connectors.

8. Remove the 1 screw (D).

9. Remove the power supply board.

10. Pull out the 1 connector.

11. Remove the 2 screws (A) and (C).

12. Remove the main board.

Procedure:

•

• Insert the SW CABLE into AC POWER SWICH.

• •

Caution:

•

• Be sure each colored wire is inserted to the correct lug (very important).

• •

KX-TES824LA / KX-TE M824LA /

CID Card #3

KX-TES824LA / KX-TE M824LA /

9 BLOCK DIAGRAM

9.1. SYSTEM BLOCK DIAGRAM

Power Switch

DPH Block #1,#2

DPH4 Card

BV Card

IC3 IC4

SRAM

IC1 IC2

OGM Card

Serial

Int. CID x 3

CN708

DPH Block #3, #4

PIO

DSP#2

CN707

DSP#1

8Mbit

CN710

Flash

USB

CN704

RS232C

CN703

BGM

MODEM(Rx, Tx)

OGM(Play, Rec) x2

1AP Card

2AP Card

DOOR2 DOOR1

IC700

IC704

IC705

IC6

IC10

BV2

BV1

CPU DSP

SRAM

Flash

PIO

To ne

ROM

Host I/F

pan

battery

backup

change

Voltage

-15 V

+15V

+27V

705

Cross Point

nConn

IC500

Cross Point

nConn

circuit

check

Volt age

Amp.

Ringer

+3.3V

25Hz

IC600, IC601, IC602

CO1-3

ext1-8

DTMF-R

CO4-6

IC502

ext9-16

IC501

DTMF-R

circuit

Bell

IC613

IC614

IC511

IC512

Rectification

AC75V

IC601

25Hz

DTMF-G

control

IC7

for CO

3port

8port

3port

8port

circuit

Detect circuit

Over current

Rectification

POWER

Ext Paging

Ext Music

Block

Extension

Block

Extension

L1, L2

noise filter

SUPPLY

Surge protector

CN712

CN711

CN706

CN601

CN60

PIO

FPGA

FSK Detect x3

IC7

IC1A~C

CID

Card

CID

Card

AC IN

S/P

IC8

DTMF Detect

Stutter Detect x3

IC2A~C

CID

Card

Same as

CID

Card

Same as

3AP Card

IC700

CO7-8

IC701

PIO

Cross Point

Tone

Int.CID

Paiging

IC702

3BV2

INT

DPH

BGM

DTMF-G

IC703

ext17-24

DTMF-R

IC704

IC705

2port

Block

8port

Block

Extension

Jack x2 Jack x8 Jack x3 Jack x8 Jack x3

Jack x8

KX-TES824LA/KX-TEM824LA SYSTEM BLOCK DIAGRAM

9.2. POWER BLOCK DIAGRAM

KX-TES824LA / KX-TE M824LA /

9.3. KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM

CONNECTOR

Door Phone

Door Opener

CONNECTOR

CN701, CN702

CONNECTOR

POWER UNIT

CONNECTOR

CO CID

CN706

CN708

BV Card

CN707

Exp308

(2AP)

/Exp208

(3AP)

Card EXP

CN710

OGM Card

CN703

D-Sub

CN704

USB

CN705

(APT i/f)PRX2-3, PTX2-3, PTXE1-3

25Hz

DOOR1, 2

TAM1-2, TONE

CO4-8

(DSP)Serial Flash i/f

(UART)RXD, TXD

TONE(D)

NINT AC

Host i/f

IC6

PIO

ASIC

CROSS

POINT

IC600 IC601 IC602

IC709

ROM

IC704

SRAM

ASIC

8086 DSP

PIO

APT i/f

IC700

DTMFR(1,2)

IC613, IC614

620,440,350Hz

TONE

Q1-4,TOE1,2,STD1,2

(I/O)HOOK1-8,BELL1-8

(APT i/f)PRX,PTX,PTXE1-3

IC7

DTMF

Generator

CO1-3

PAGE

BGM

EXT1-8

(For EXT)

BELL

(I/O)

CO1

CO2

CO3

EXT1

EXT2

EXT3

EXT4

EXT5

EXT6

EXT7

EXT8

CN601

CN600

Paging jack

MOH jack

KX-TES824LA/KX-TEM824LA 1AP BLOCK DIAGRAM

KX-TES824LA / KX-TE M824LA /

9.4. KX-TEM824LA 2AP BLOCK DIAGRAM

Exp308

(2AP)

/Exp208

(3AP)

Card EXP

CONNECTOR

CN501, CN502

Host i/f

Q1- 4,TOE1,2,STD1,2

IC510, IC511

DTMFR(1,2)

(For EXT)

CO4-6

(APT i/f)PRX2,PTX2,PTXE1-3

CID4-6

PIO

ASIC

IC10

CROSS

POINT

IC500, IC501, IC502

(I/O)

CO4-6

(I/O)HOOK9-16,BELL9-16

EXT9-16

CO4

CO5

CO6

EXT9

EXT10

EXT11

EXT12

EXT13

EXT14

EXT15

EXT16

KX-TEM824LA 2AP BLOCK DIAGRAM

9.5. KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT BLOCK DIAGRAM

Q503

RL501

+27V

GND

+24V

GND

AC IN

CN1

Q503

RL501

D10~D13, C5

Surge

Absorber

Noise

Filter

L1, L2

Primary Circuit

Rectification

Smoothing

D101, C101

Secondary Circuit

Rectification

Smoothing

Voltage

Detection

Q101

Battery

Back up

D31 D32

AC Input

Detection

(14)

Power

Down

Q22 Q23

Controller

Over

Current

Detection

PC1

PC31

Q201, T2, IC201

DC-DC

Converter

IC601

Ringer

Amplifier

KX-TES824LA/KX-TEM824LA POWER SUPPLY UNIT BLOCK DIAGRAM

+15V

3.3V

-15V

OUTPUT AC75V 25Hz

INTPUT 20/25Hz

AC Alarm

CN301

KX-TES824LA / KX-TE M824LA /

10 EXPLANATION OF BLOCK DIAGRAM

10.1. MAIN UNIT (KX-TES824LA/KX-TEM824LA)

10.1.1. Power Supply Circuit

This power supply unit is a switching power supply. Power supply unit supplies DC voltage (+27V,+15V,-15V,3.3V) to main board and other optional cards. And this unit has an adaptor circuit to back up battery. And this unit amplified the BELL signal (20/25Hz sign wave outputted from the ASIC) and supply bell signal to the telephone.

10.1.2. COL Interface Circuit

There are the interface circuits linking the CO line (CO1 -CO3) and the cross point circuit section. In case of KX-TEM824, the system has 6CO line (CO1 - CO6).

10.1.3. Cross Point Circuit

This is a space division switching system for connecting the following: The eight extension circuits with the eight CO, DTMF generator, DTMF receiver, INT-CALL ID, MODEM, OGM, VB, paging, music

on hold, tone etc. It is composed of 3 C-MOS IC´s. (8 X 16 matrix: 2pcs and 4 X 8 matrix: 1pce). *In case of KXTEM824, the system has 6 C-MOS IC´s (8 X 16 matrix: 3pcs and 4 X 8 matrix: 2pce, 8 X 8 matrix: 2pce).

10.1.4. Intercom Circuit

This is the interface circuit of the single line telephone, and it is composed of 8 intercom circuit (ICM1-8) In case of KX-TEM824, the system has 16 intercom circuits(ICM1-16).

10.1.5. Power Failure Through Call Switching Circuit

KXTES824 have one power failure transfer circuit (CO1-EXT101). In case of KXTEM824,the system has 2 power failure circuit (CO1-EXT101 CO4 -EXT109).

10.1.6. Data Communication Circuit

The APT i/f module which performs communication with a private telephone machine is built in ASIC. 8ch are controlled per block. Control of 3 blocks (24ch) is possible for ASIC at the maximum.

10.1.7. Control Circuit

A control block consists of only the [ASIC] CPU (compatibility with Intel 8086) (IC700), Flash ROM (8Mbit) (IC705), SRAM (4Mbit) (IC704), and PIO ASIC (IC6). PIO ASIC mainly performs extension control and PIO built in ASIC CPU mainly performs extension control. RTC (Real Time Clock) and SRAM inside CPU are backed up by the lithium battery in order to hold time, system data, etc.

10.1.8. Tone Generator Circuit

The rectangle wave generated by the timer of ASIC is changed into sine wave with a low path filter, and various tones are generated.

10.1.9. DTMF Generator Circuit

A DTMF generator is used for dispatch to outside line, and communication with the voice mail connected to the extension.

10.1.10. DTMF Receiver Circuit

The circuit which receives the Dial Tone Multi Frequency by which extension dispatch is carried out with the DTMF receiver connected to the crossing point.

10.1.11. Int Call ID Circuit

FSK/Dial Tone Multi Frequency generated by DSP in ASIC are connected even to a crossing point through AMP. The circuit which sends out a CALLID signal to the telephone connected to an extension by connecting the line of INT-CALL-ID with arbitrary extensions.

10.1.12. Modem Circuit

The MODEM signal generated by DSP in ASIC is connected even to a crossing point through AMP. The circuit which connects the line of MODEM with arbitrary outside line, and enables MODEM communication with outside line.

KX-TES824LA / KX-TE M824LA /

10.1.13. USB Circuit

The circuit which makes communication possible by PC and 1.1 standards by the USB controller in ASIC.

10.1.14. OGM Circuit

4M connected to ASIC by the memory controller in ASIC A maximum of 3-minute storing of OGM is possible to a serial flash Circuit.

10.1.15. Ring Signal Generator Circuit

This section generates the ring signal for the single line telephone. A 20/25Hz square wave is generated by the ASIC timer and sent to low pass filter and the ringing signal amplifier circuit and stepped by BELL transformer, and then passed it through the ringing signal switching relay to the single line telephone.

10.1.16. SMDR Interface Circuit

This is the RS232C interface port. When the port is connected to a printer. The port can be used to output the SMDR feature recording messages and the contents of the system program.

10.1.17. Door Phone Interface

An intercom card interface consists of two intercom paths connected to a crossing point, and address data and CS signals.

10.1.18. OGM Interface

An OGM card interface consists of the memory control signal, and the address data and CS signal which are connected to ASIC.

10.1.19. Call ID Interface

A CALLID card interface consists of three CALLID signal lines from outside line, and address data and CS signal.

10.1.20. BV Interface

BV card interface consists of two BV telephone call paths connected to a crossing point, and address data and CS signals.

11 CIRCUIT OPERATION

11.1. POWER SUPPY CIRCUIT

11.1.1. The function of the power unit are listed below

KX-TES824LA / KX-TE M824LA /

AC-DC Inverter Function This function isolates and transduces the AC input voltage to

DC-DC Converter Function This function outputs DC+15V, -15V and 3.3V from the

Ringing Signal Output Function Based on the 20/25Hz sine wave signal output from KX-

AC Power Failure Detection This function detects any cut off of the AC power supply and

Battery Back Up Adaptor Function This function connects battery and service unit without battery

DC input and output of DC27V.

inputted DC27V.

TES824/KX-TEM824, this function generates ringing and supplies to the system.

outputs an AC alarm signal to the CPU.

adaptor, only needs a cable connected to the battery and service unit.

KX-TES824LA / KX-TE M824LA /

11.1.2. Control Section

1) AC-DC Inverter Function

The AC input voltage is rectified and smoothed by D10-13 and C5. The obtained DC voltage is converted into a rectangular wave by the switching transistor Q1, then isolated and transduced by T1. This converted rectangular wave is rectified and smoothed by D101 and C101 to output DC27V. The DC27V is transmitted to the primary side by PC1 and then PWM- controlled to keep constant. The switching frequency of Q1 is approximately 100KHz (70KHz~160KHz).

2) DC-DC Inverter Function

The DC27V as input is converted into a rectangular wave by the switching transistor Q201, then isolated and transduced by T2. DC+15V, -15V and 3.3V are outputted by a rectification smoothing circuit composed of D401, D301, D701, C401, C301 and C702. The +3.3V of the three outputs is PWM-controlled by IC201 to keep constant.The switching frequency of the Q2 is approx. 55 KHz.

3) Ringing signal output function

Ringing signal (20/25Hz, 75Vac from main board) is amplified in power by power amplifier circuits (including of IC501, R601~R608, C601~C603).

Ringing signal amplified in power is transmitted to the ringing transformer through pin 4 of CN601.

4) AC Power Failure Detection

AC power failure is detected by D31~D32, R33~R41, C31, PC31. When AC power is on, PC31 is on. When AC power is turned off, PC31 is off.

5) Battery back up function

This back up battery adaptor circuit has DC supply function, from battery (+24V) to service unit and DC charge from service unit to battery (+24V). Charge current is typ. 0.4A.

KX-TES824LA / KX-TE M824LA /

11.2. CO INTERFACE CIRCUIT

11.2.1. Composition

This is composed of the following circuit:

1) Bell signal detection

2) DC loop formation circuit

3) Pulse dial transmission circuit

4) CALL ID interface circuit

5) COL bidirectional amplifier circuit

1) Bell signal detection

When CO line is idle, photo coupler PC1, PC2 are OFF. When there is an incoming signal from CO line, the current flows PC1 as in the following way. Tip → L1 → R2 → PC1(1-2) → C3 → T2 → R5 → L1 → Ring: This cause pin4 of PC1 to change the level from High to low. Ring → L1 → R5 → T2 → C3 → PC2(1-2) → R2 → L1 → Tip: This cause pin4 of PC2 to change the level from High to low.

KX-TES824LA / KX-TE M824LA /

2) DC loop formation circuit

In the off hook status, PC5 is ON. DC loop path: Tip→L1→D1→D2→D3→Q10(E-C)→Q1(C-E)→R9→R8→D3→L1→Ring At this time, the output of the photo coupler PC1 changes level from High to low. Ring→L1→D3→R8→R9→Q1(E-C)→Q10(C-E)→D3→D2→D1→L1→Tip At this time, the output of the photo coupler PC2 changes level from High to low. Afterwards, G/A monitor this change (low level to high level). If the high level continues for a specified time set by system data

programming. G/A assumes that CO line has become On hook status. And the CO line circuits is restored to the idle status.

3) Pulse dial transmission circuit

When the Off hook status, pulse dial transmission is executed by alternating On hook and Off hook. The status of On hook or Off hook is controlled by the switching transistor Q10.

KX-TES824LA / KX-TE M824LA /

4) CALL ID interface circuit

It is insulated by the transformer in a COL circuit, and the call ID signal inputted from outside line is transmitted to a CALLID option card.

The flow of a CALLID signal Tip→L1→R2→PC1(1-2)→C3→T2→R5→L1→Ring Ring→L1→R5→T2→C3→PC2(1-2)→R2→L1→Tip

5) COL Bidirectional Amplifier circuit

This circuit consists of bidirectional amplifier function for communication between the extensions and COL, returns loss compensation for conference, shunt function and mute function.

(Composition)

For transmitting signals from the extensions to COL, this circuit consists of R34, R35, R26, R27, R18, R29, C14, C15, C10, C16 and the operational amplifier (IC1).

For transmitting signals from the COL to extensions, this circuit consists of R24, R25, R31, R28, R37, R30, C12, C13, C17, C18, and the operational amplifier (IC1).

COL side-tone suppression circuit which includes a balanced network BN1 consists of R22 R23, C11 and R16, R17, R20, R21. EXT side-tone suppression circuit which includes a balanced network BN2 consists of R41, R42 and R40, R43, R38, R39. Also extension side-tone suppression circuit which includes a balanced network BN3 consists of R45, R46 for supplementing

side-tone suppression during the conference communication. The analog switch (IC2) is used for the following: (1) Conference (Pin 6, 8 and 9) (2) Shunt (Pin 12, 10 and 11) (3) Mute (Pin 13, 1 and 2)

KX-TES824LA / KX-TE M824LA /

1) Conference switch

Normally, pin 6 of the analog switch IC2 is low level, but during conferences, this pin becomes high level. Because, during conferences, it should compensate the return loss by connecting the balance network BN2 and the balance network BN3 in parallel.

2) Mute switch

The mute switch consists of pin 13, 1 and 2 of the analog switch(IC2). This switch has the following functions. a) When a dial signal (DP) is sent to the COL, signals from the extensions are blocked. b) When the hold on music is sent to the COL, signals from the extensions are blocked. c) When the COL interface circuit is in the idle state, oscillation of COL bidirectional amplifier is inhibited. When pin 13 of IC2

changes to low level, the interval between pins 1 and 2 of the analog switch turns off, and signals are blocked.

3) Shunt switch

The shunt switch consists of pin 12, 10 and 11 of analog switch IC2.It is used to prevent the pulse dialing signal which is transmitted to the extensions. When pin 12 of IC2 changes to high from low, the analog switch becomes ON (the interval between pin 10 and 11), and GAIN of the COL cross point operational amplifier becomes zero.

Shunt SW Mute SW Conference SW pin no. of analog switch 12 13 6 No connection (idle) H (on) L (off) L (off) Two party call L (off) H (on) L (off) Conference L (off) H (on) H (on) Hold on music transmission L (off) H (on) L (off)

Condition of COL interface amplifier circuit and analog switches.

KX-TES824LA / KX-TE M824LA /

11.3. CROSS POINT SWITCH CIRCUIT

11.3.1. Composition

The cross point circuit composed of three cross point switch IC´s (IC600 and 601:8X16, IC602:4X8). *In case of KX-TEM824, the system add more cross point switch IC´s (IC500:8X16, IC501:8X8, IC502:4X8) which are in KX-

TE82483.

1) Cross Point Switch IC Operation

The cross point SW (IC600, IC601) contains a 8X16 array of cross point switches along with a 7 to 128 line decoder and latch circuits. Any one of the 128 switches can be addressed by selecting appropriate seven address bits. The selected switch can be turned on or off by applying either logical one or zero to the DATA input. Chip select allows the cross point array to be cascaded for matrix expansion. Start a new line at this point SW´s (IC602) contain 4X8 array of cross point switches along with a 5 to 32 line decoder and latch circuits.

Any one of the 32 switches can be addressed by selecting appropriate five address bits. The selected switch can be turned on or off by applying either logical one or zero to the DATE input. Chip select allows the cross point array to be cascaded for matrix expansion.

KX-TES824LA / KX-TE M824LA /

11.4. INTERCOM CIRCUIT

11.4.1. INTERCOM CIRCUIT

1) Composition

This is composed of the following circuits: a) +15V power source for the extension telephones b) Hook detect for SLT and pulse dialing detect c) Bell ring trip section

2) Circuit operation

a) Power supply to the telephone With the telephone off hook, a DC loop is formed, and current is supplied to the telephone. This circuit is limited to about 30mA

by Q200, Q202, R202, R204 and Q201, Q203, R203, R205. +15V→R204→R202→Q200→RL201→telephone→RL201→Q201→R203→R205→-15V

b) Hook detect for SLT and pulse dialing detect When the telephone handset is taken off, DC loop is formed and the collector of U200 3,6 pin change to L from H. The ASIC detects the off hook condition. When the handset is replaced back on hook, the DC loop is interrupted and collector of U200 3,6 pin change to H from L and

EXT Pulse dialing is input either in the on hook or off hook condition, and the break number (on hook condition) is counted and read as the dial number.

c) Bell ringing trip section When the telephone is a signal line telephone, extension calling is executed by means of a ringing signal. When the ringing

signal is supplied, RL201 turns ON and the current flows are as follows: Bell transformer → ringing signal line → RL201 → telephone → R206 → -15V → Bell transformer

KX-TES824LA / KX-TE M824LA /

11.5. POWER FAILURE THROUGH CALL SWITCHING CIRCUIT

11.5.1. Circuit operation

If an AC power failure lasts longer than one second (momentary power failure), the COL is directly connected to the extension. The COL1 will be connected with EXT101. When power failure, RL200 switches from EXT-line to CO [T/R]. *In case of KX-TEM824, and the COL4 will be connected with EXT109. *In case of KX-TE82480, and the CO7 will be connected with EXT117.

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