15 Appendix Information of Schematic Diagram ------- 111
16 Exploded View and Replacement Parts List---------- 112
16.1. IC Data ---------------------------------------------------- 112
16.2. Cabinet and Electric Parts----------------------------120
16.3. Accessories and Packing Materials ---------------- 122
16.4. Replacement Parts List -------------------------------123
2
KX-TDE200GR
1Safety Precautions
1. Before servicing, unplug the power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components for safety.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1.For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.2.Insulation Resistance Test
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as
screw threads, control shafts, handle brackets, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired
and rechecked before it is returned to the customer.
2Warning
2.1.Battery Caution
1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer's lnstructions.
2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location
when replacing it and soldering the replacement lithium battery in.
2.2.Caution
The power socket wall outlet should be located near this equipment and be easily accessible.
3
KX-TDE200GR
2.3.About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50° ~ 70° F, ( 3 0° ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature control and adjust it to 700° ± 20° F, (370° ± 10°C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, ( 60 0°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.3.1.Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
3Specifications
3.1.General Description
Control BusOriginal bus (16 bit, 8 MHz,10 megabytes per second)
Communication BusH.100 bus conformity (1024 time slot)
SwitchingNon Blocking
Power InputPSU-S100 V AC to 130 V AC; 1.4 A/200 V AC to 240 V AC; 0.8 A; 50 Hz/60 Hz
PSU-M100 V AC to 130 V AC; 2.5 A/200 V AC to 240 V AC; 1.4 A; 50 Hz/60 Hz
PSU-L100 V AC to 130 V AC; 5.1 A/200 V AC to 240 V AC; 2.55 A; 50 Hz/60 Hz
External Battery+36 V DC (+12 V DC x 3, recommended maximum capacity is 28 Ah)
Maximum Power Failure Tolerance300 ms (without using backup batteries)
Memory Backup Duration 7 years
Dialling TrunkDial Pulse (DP) 10 pps, 20 pps
Extension Dial Pulse (DP) 10 pps, 20 pps
Mode Conversion DP-DTMF, DTMF-DP
Ring Frequency 20 Hz/25 Hz (selectable)
Trunk Loop Limit 1600 Ω maximum
Operating
Environment
Conference Call Trunk From 10 x 3-party conference call to 4 x 8-party conference call
Music on Hold (MOH)2 ports (Level Control: -11 dB to +11 dB in 1 dB steps)
PagingInternal Level Control: -15 dB to +6 dB in 3 dB steps
Serial Interface PortRS-232C 1 (max 115.2 kbps)
LAN I/FRJ45 2 (10BASE-T/100BASE-TX)
Extension Connection CableSLT 1 pair wire (T, R)
DimensionKX-TDE200NE430 mm (W) x415 mm (H) x 276 mm (D)
Weight (when fully mounted) KX-TDE200NEUnder 16 kg (35.2 lb)
Temperature 0 °C to 40 °C
Humidity10%to 90% (non condensing)
External 2 ports (Volume Control: -15 dB to +15 dB in 1 dB steps)
Tone (DTMF) Dialling
Tone (DTMF) Dialling
MOH1: External Music Source port
MOH2: Selectable Internal/External Music Source port
Terminal Equipment Loop Limit• PT: KX-T7600 series DPT: 90 Ω; all other DPTs/APTs: 40Ω
• SLT: 600 Ω including set
• Doorphone: 20 Ω
• . CS: 130Ω; PT-interface CS: 65Ω
Minimum Leakage Resistance15000 Ω maximum
Maximum Number of Extension
Instruments per Line
Ring Voltage75 Vrms at 20 Hz/25 Hz depending on the Ringing Load
Trunk Loop Limit1600 Ω maximum
Hookswitch Flash/Recall Timing Range24 ms to 2032 ms
BRI Cards Internal ISDN ModeSupply Voltage: 40 V
Door Opener Current Limit24 V DC/30 V AC, 1 A maximum
External Relay Current Limit24 V DC/30 V AC, 1 A maximum
External Sensor Current LimitPower to the external sensor is provided from the EIO4 card and must be grounded through
1 for PT or SLT
2 by Parallel or eXtra Device Port connection of an APT/DPT and an SLT
3 by Digital eXtra Device Port connection of 2 DPTs and an SLT
Power Supply (BRI4): 4.5 W per 1 line, 10 W per 4 lines
Power Supply (BRI8): 4.5 W per 1 line, 20 W per 8 lines
Power Supply Method: Phantom Power Supply
the EIO4 card. For the connection diagram, refer to EIO4 Card (KX-TDA0164). The PBX
detects input from the sensor when the signal is under 100Ω.
• Circuit Switching (includes gain adjustment function)
• Conference Call (3 people x 8 ~ 8 people x 3)
•MOH
•PAGING
•Clock
2) Configuration
• Power Supply: DC/DC Converter
• CPU: HITACHI SH7788 (400MHz)
• ASIC: Our own products
• ROM: 8Mbit x 1 (for boot programs)
• SDRAM: 512Mbit x 2 (for work area)
• SRAM: 16Mbit x 1 (for user data backup)
• SD card I/F (for operating programs) x 1
• LAN I/F (for PC programming and the VoIP) x 2
• MOH: External sound input x 2
• PAGING: External output x 2
• Expanded memory connector x 1
• Modem card connector x 1
3) Operation Rating
• Power Input: +15V_CON
• Power Output: +15V (for MOH)
+3.3V (for I/O)
+3.3VD_BB (back board signal line pull-up)
+3.3VD_B (for SRAM backup)
+1.25VD (for CPU core)
+2.5VD (for DDR-SDRAM, CPU, LAN SW IC amd FPGA)
+1.8VD (for LAN SW IC)
+1.2VD (for FPGA)
10
4.2.2.Description of Each Part
KX-TDE200GR
LED Lamp (BATT ALARM): Turns on to indicate the dropping of the lithium battery voltage (less than 2.8V).
LED Lamp (SD ACCESS): Turns on when the SD card is accessing.
SD card slot: Mounts the system program SD card.
Reset Switch: Press at the system reset.
System Initialize Switch:
On default startup, set the switch to the "SYSTEM INITIALIZE" position for the power ON. Return the switch to the "NORMAL"
position when the main power switch starts to flash. On normal startup, turn the power ON with the "NORMAL" position.
LAN connector: 1, 2. Used for the PC programming and the VoIP.
PAGING 1, 2: External PAGING output. Connect to the device with the built-in amplifier.
MOH 1, 2: External music on-hold input.
LED Lamp (LINK / ACT) Turns on: LINK OK. Blinking: ACTive data is communicated.
LED Lamp (100 / 10) Turns on: 100BASE-TX. Turns off: 10BASE-T.
11
KX-TDE200GR
4.2.3.Circuit Description
4.2.3.1.Outline of Block Description
• CPU2 block (BLOCK1)
This block operates the main unit control. Besides this operates various controls, select signal generation, DMA control and
serial port control. This contains the built-in clock function.
Configuration: IC101 (CPU), IC102 (clock buffer for PCI), and so on.
Function:
(IC101) Generates the select signal in accordance with the memory map and operates Readout/Storage of data between each
peripheral.
Controls the DMA transfer between built-in serial controller and memory.
Operates input/output control of each I/O signal in accordance with the program.
• CPU_POWER block (BLOCK2)
This block is a power supply part of CPU.
Configuration: IC101 (CPU), X501 (33.33MHz clock for CPU), and so on.
Function:
Power pins of CPU.(+3.3VD,+2.5VD,+1.25VD)
Clock oscillation circuit for CPU operation.
• MEMORY2 block (BLOCK3)
This is a work area and the main unit control program storage or the system boot program storage area.
Configuration: IC602 (Flash ROM), IC601, IC603 (DDR-SDRAM), CN601 (IPCMEC card connector) and so on.
Function:
(IC602) Saves (some of) the system boot program and the system data.
(IC601, IC603) The main program is loaded from the SD card on the system start-up.
Used as the program area and the CPU work area after start-up.
It is independent bus connection to CPU due to high-speed action (bus clock 166MHz).
• FPGA + RTC + SVM block (BLOCK 4)
The FPGA is a CPU Peripheral function IC.
Configuration: IC801 (FPGA), IC802 (RTC, 32.768kHz clock for CPU), IC804 ( SVM DSP ), IC805 ( SVM voice data FLASH )
and so on.
Function:
(IC801) has the functions of RTC I/F, LAN SW I/F(SPI I/F), reset control port, LED driver and address decoder and so on.
(IC802)This is working in the Real time clock function when system stops.
This IC is maintained by the onboard battery back-up.
(IC804,IC805) These are the simple voice mail function.
• LAN block (BLOCK 5)
It is LAN controller connected with PCI.
Configuration: IC1002 (MAC+PHY (LAN controller)), X1001 ( 25MHz clock for LAN controller) and so on.
Function:
(IC1002) This is a function to communicate LAN through LAN SW.
• LAN_SW_5P block (BLOCK 6)
5ports LAN SW and the external I/F LAN connector.
Configuration: IC1101 (LAN SW), JK1102, JK1103 (LAN connector) and so on.
Function:
(IC1101) It is a hub that does LAN signal of two internal ports and two external ports in the switching.
(JK1102, JK1103) These are connectors with built-in LAN transformer and LED.
• SD and RS232 block (BLOCK 7)
SD card I/F and RS232 (serial) I/F
Configuration: IC1201 (SD card controller), CN1201 (SD card connector) , IC1202 (RS232 D/R)and so on.
Function:
(IC1201) This provides the SD card I/F function and loads the main unit program and the system data from the SD card storing
the main unit control program.
(IC1202). This provides the serial I/F driver / receiver function.
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KX-TDE200GR
• NEXUS ( + SRAM ) block (BLOCK 8)
This provides the communication function between each option card, call control (TSW function), conference call, tone generation and gain control function.
Configuration: IC1303(ASIC(NEXUS)), IC1302, X1301,IC1301(SRAM) , CN1301(RMT card connector) and so on.
Function:
(IC1303) This functions as the bus master of EC bus (synchronous bus with 16 bit width, transmission rate max.10Mbps).
Communicates with ASIC mounted to each option card via EC bus and controls the option card.
Controls CT bus (HW clock 8.192MHz, 8 highway, 128 timeslot) for TSW function.
Controls the conference call for 3 people x ~8 parties ~ 8 people x ~3 parties.
Generates single and DTMF tone in any highway and timeslot.
Provides the digital gain control function by data conversion.Provides some I/O ports for CODEC channel pulse generation,
modem encoding rule setting and music on-hold switching and is controlled by CPU.
(IC1301) Saves the user configuration data (such as key assign data per PT).
The memory is maintained by the onboard battery back-up.
• MOH/PAGING block (BLOCK 9)
This provides the external music on-hold input x 2, the external paging output x 2 port. And also this provides the external music
on-hold input 1 system and exclusively the internal music on-hold output.
Configuration:
IC1501, IC1502 (CODEC), IC1503, IC1504 (OP Amp), IC1505 (Melody IC), Q1501~Q1505 (transistor), JK1501~JK1504 (pin
jack) and so on.
Function:
The external music on-hold 1 is input from JK1502 and is A/D converted in IC1501 via AGC (Auto Gain Control) circuit, which
consists of IC1503, Q1502, Q1504 and other CR, this is then connected to the call line HW.
Likewise, the external music on hold 2 is input from JK1504 and is made A/D conversion in IC1502 via AGC (Auto Gain Control)
circuit, which consists of IC1504, Q1503, Q1505 and other CR, this is then connected to the call line HW. The external music onhold 2 and IC1505 is exclusively connected to IC1502 input (by software control).
The various tones & DTMF tone and the voice data generated in IC1303 (ASIC(NEXUS)) are made D/A conversion in IC1501
and IC1502. They are output via JK1501, JK1503 respectively.
• EC_CT CON block (BLOCK 10)
This is the connector that connects IPCMPR and Back Board.
Configuration: CN1601 (Back Board connector) and so on.
Function:
(CN1601) Connection of EC bus, CT bus, and control signals for the option card.
• VOIP_PCI_CON block (BLOCK 11)
This is the connector for 16 VOIP DSP/ 64 VOIP DSP card.
Configuration: CN1701 (Original PCI connector) and so on.
Function:
(CN1601) Connection of PCI bus and LAN data for 16 VOIP DSP/ 64 VOIP DSP card.
• debug_PCI_CON block (BLOCK 12)
This is the connector for debug. ( Not mounted connector )
Configuration: CN1801 (Original PCI connector) and so on.
Function:
Nothing
13
KX-TDE200GR
• POWER block (BLOCK 13)
This consists of DC/DC converter circuit and various regulators.
Configuration:
IC1901 ( 3.3V, 2.5V DC/DC converter ), IC1902 ( 1.25 DC/DC converter ), IC1908 (1.8V regulator), IC1907 (1.2V regulator),
IC1903 (Comparator), Q1901, Q1902, Q1903 (FET, transistor), B1901, IP1901 (circuit protection device) and so on.
Function:
+15V_CON input is stepped down to +3.3VD and +2.5VD by DC/DC converter circuit which consists of IC1901, Q1901 and
Q1902 and is supplied to each IC power.
Q1901 and Q1902 and is supplied to each IC power.
+3.3VD is generated by the DC/DC converter is converted to +1.25VD and supplied to IC101 core power.
+2.5VD is generated by the DC/DC converter is converted to +1.8VD and supplied to IC1101 core power.
+2.5VD is generated by the DC/DC converter is converted to +1.2VD and supplied to IC801 core power.
BAT1901, which is a lithium battery for backup, is connected to the power supply of IC1301 (SRAM) and IC802 (RTC) via D1904,
D1905.
IC1903 compares B1901 output voltage to the reference voltage (about +2.7V) and drives LED (BATT ALARM) that indicates
dropping of backup voltage.
• TDA600_CON block (BLOCK 14)
This provides the control interface between IPCEMPR Card and BUS-M Card. ( Not mounted connector and so on)
Configuration: CN2001 (Connector for BUS-M ),IC2001 ~ IC2001(buffer) and so on.
Function:
Nothing
• SVM_VOX block (BLOCK 15)
It is VOX detection circuit.
Configuration: IC2201, IC2202 (CODEC), IC2203, IC2204 (OP Amp), IC2205, IC2206 (Comparator) and so on.
Function:
The SVM voice data are made D/A conversion in IC2201, IC2202 amd IC804 (SVM DSP). After these are amplified with the
amplifier, the sound is detected with the comparator.
14
KX-TDE200GR
4.3.Back Board Circuit Operation
The back board (BB) connects signals between all cards in KX-TDE200. It also supplies power from the power supply unit to the
cards.
CONNECTORS EXPLANATION
(1) Power Supply Unit Connector: CN100
(2) Free Slot Connectors: CN102-CN106
(3) Option Card Slot Connector: CN107
(4) IPCMPR Card Connector: CN112
(5) RS-232C Connector: CN113
CN113 is connected D-Sub connector in front of the product.
(6) LED Connector: CN114
CN114 is connected LED Board on the product.
15
KX-TDE200GR
4.4.Outline
4.4.1.General Description
The control system of this unit is composed of the main control section (IPCMPR) controlling the entire system, exchanging
voice data, the circuit control section (LPR) controlling various telephone lines and the power supply section (POWER).
IPCMPR, LPR and POWER are connected each other through the System BUS (ADDRESS BUS, DATA BUS and CONTROL
BUS). IPCMPR LPR are under I/O control (I/O Read/Write) by MPR.
MPR controls LPR which has a microprocessor by the lnter-Microprocessor Communication System supported by ASIC. That
is, IPCMPR and LPR exchange controlling messages through bi-directional buffer and CPU controls LPR so that it can manage
multiple telephone lines.
I/O address for LPR access is fixed per each free slot. CPU discriminates the sort of LPR through the inter-processor communication system.
POWER detects the voltage drop of the AC input and the DC output and transfers it to IPCMPR.
4.4.2.IPCMPR Card
This card is the main control section of this unit. It controls all the cards mounted on the free slots, and communication of RS232C ports.
The front of the IPCMPR card is equipped with two LEDs (LED1 and LED2) that indicate the operating status of this card, There
are no rotary switches on IPCMPR and a push switch used to execute the system reset.
This control circuit execute the control signals for the exchange process, and this card is composed of the following
(A) 32bit CPU (32bit data bus)
(B) DDR_SDRAMs, SRAM
(C) Flash memory
(D) Lithium Battery for back-up of clock IC and Static RAM
4.4.3.Back Board
BB (back board) is the mother board of the basic shelf. This board connects each card (POWER, IPCMPR, and optional cards)
together. This board has one RS-232C connector.
4.4.4.Power Supply Unit
This unit is switching regulator power supply and supplies DC voltages to IPCMPR card, optional card (free slot).
16
4.4.5.System Control
4.4.5.1.System Control Block Diagram
KX-TDE200GR
17
KX-TDE200GR
4.4.5.2.Voice (TDM Highway) Bus Block Diagram
18
4.4.5.3.Voice Bus Logical Assignment
4.4.5.4.Back Board Signaling
KX-TDE200GR
Back board waveform of TDM bus for voice
19
KX-TDE200GR
4.4.6.Back Board Signal Connection Diagram
4.4.6.1.CT Bus System Connection Diagram
20
4.4.6.2.EC Bus System Connection Diagram
KX-TDE200GR
21
KX-TDE200GR
4.4.6.3.System Control and Analog Signal Connection Diagram
4.4.6.4.Power Supply System Connection Diagram
22
5Location of Controls and Components
5.1.Name and Locations
KX-TDE200GR
23
KX-TDE200GR
6Installation Instructions
6.1.System Overview
6.1.1.System Configurations
24
6.1.2.System Components
CategoryModel No.Description
ShelvesKX-TDE200GR Basic Shelf
Main Processing Card KX-TDE0101GR IP Convergence Main Processing Card
IPCMPR Option CardsKX-TDE0110
KX-TDE0111
KX-TDA0196
Activation Key CardsKX-NCS41044-Channel IP Trunk Activation Key (SHGW4)
KX-NCS42088-Channel IP Softphone/IP Proprietary Telephone Activation Key (IPPTS8)
KX-NCS45088-Channel IP Proprietary Telephone Activation Key (IPPT8)
KX-NCS471616-Channel SIP Extension Activation Key (SPE16)
KX-NCS4910Activation Key for Enhanced Features (UCAV2)
KX-TDA018116-Port Analogue Trunk Card (LCOT16)
KX-TDA01828-Port DID Card (DID8)
KX-TDA01834-Port Analogue Trunk Card (LCOT4)
KX-TDA01848-Port E & M Trunk Card (E&M8)
KX-TDA0187T-1 Trunk Card (T1)
KX-TDA0188E-1 Trunk Card (E1)
KX-TDA01898-Port Caller ID/Pay Tone Card (CID/PAY8)
KX-TDA01938-Port Caller ID Card (CID8)
KX-TDA02844-Port BRI Card (BRI4)
KX-TDA02888-Port BRI Card (BRI8)
KX-TDA0290PRI Card (PRI23)
KX-TDA04844-Channel VoIP Gateway Card (IP-GW4E)
KX-TDA049016-Channel VoIP Gateway Card (IP-GW16)
Physical Extension Cards KX-TDA01434 Cell Station Interface Card (CSIF4)
KX-TDA01448 Cell Station Interface Card (CSIF8)
KX-TDA01708-Port Digital Hybrid Extension Card (DHLC8)
KX-TDA01718-Port Digital Extension Card (DLC8)
KX-TDA017216-Port Digital Extension Card (DLC16)
KX-TDA01738-Port Single Line Telephone Extension Card (SLC8)
KX-TDA017416-Port Single Line Telephone Extension Card (SLC16)
KX-TDA017516-Port Single Line Telephone Extension with Message Lamp Card (MSLC16)
KX-TDA047016-Channel VoIP Extension Card (IP-EXT16)
Other Physical CardsKX-TDA01614-Port Doorphone Card (DPH4)
Power Supply Units(PSUs) KX-TDA0103L-Type Power Supply Unit (PSU-L)
KX-TDA0104M-Type Power Supply Unit (PSU-M)
KX-TDA0108S-Type Power Supply Unit (PSU-S)
Cell Stations (CSs)KX-TDA01412-Channel Cell Station Unit Using a DHLC/DLC Card (PTinterface CS) for 2.4
KX-TDA01423-Channel Cell Station Unit Using a CSIF Card for 2.4 GHz Portable Station
KX-TDA01512-Channel Cell Station Unit Using a DHLC/DLC Card (PTinterface CS) for 2.4
KX-TDA01524-Channel Cell Station Unit Using a CSIF Card for 2.4 GHz Portable Station
• Some optional service cards and features are not available for certain countries/areas. Consult your certified Panasonic dealer
for detailed instructions.
• This PBX supports SIP Extensions. However, some PBX features may not be available for SIP Extensions, depending on your
telephone type.
Important Notice
Prior to connection of this product, please verify that the intended operating environment is supported.
Satisfactory performance cannot be guaranteed for the following:
• interoperability and compatibility with all devices and systems connected to this product
• proper operation and compatibility with services provided by telecommunications companies over connected networks
26
6.1.3.System Connection Diagram
KX-TDE200GR
27
KX-TDE200GR
*Only 1 Server PC can be connected to the Hybrid IP-PBX.Two or more Server PCs cannot be used simultaneously.
28
7Operation Instructions
7.1.Type and Maximum Number of Slots
The PBX supports the following type and number of slots.