Pace TF3000, TF 3000 CSP Service Manual

Operation and Maintenance Manual for the TF 3000 BGA/CSP Rework System

MANUAL NO. 5050- 0482

REV B-PRM

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TABLE OF CONTENTS

Safety ....................................................................................................................................3

Introduction ............................................................................................................................4

Packing Contents ...................................................................................................................4

Parts Identification..................................................................................................................5

Set-Up...................................................................................................................................7

Operation ...............................................................................................................................7

Before Operating.............................................................................................................7

General Operating Procedure...........................................................................................8

Explanation of Each Operation .............................................................................................11

Placing PCB into Board Holder .......................................................................................11

Component Alignment and Placement ............................................................................11

Component Reflow ........................................................................................................12

Adjusting Airflow ............................................................................................................13

Component Removal .....................................................................................................13

Creating and Saving Profiles ................................................................................................. 14

TF3000 PC Software ............................................................................................................ 16

Setup Page...................................................................................................................17

Alignment Page .............................................................................................................19

Operation Page .............................................................................................................21

Profile Development Page..............................................................................................23

Profile Creation ........................................................................................................26

Inspection Page.............................................................................................................28

Print/Review Page.........................................................................................................32

Language Editor................................................................................................................... 33

Maintenance......................................................................................................................... 34

Cleaning the Blower Filter ..............................................................................................34

Replacing the Top Heater ...............................................................................................34

Alignment and Calibration ..................................................................................................... 37

PCB to Optics................................................................................................................37

Sliding Shaft Holder (Indexing) .......................................................................................38

Vacuum Nozzle Planarity ...............................................................................................38

Reflow Head Planarity....................................................................................................39

Reflow Head – “Y” Directional Adjustment .......................................................................39

Specifications ....................................................................................................................... 41

Accessory Items................................................................................................................... 42

Service & Warranty Information 49

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Safety

The following safety precautions must be understood and followed when using or servicing PACE products.

1. POTENTIAL SHOCK HAZARD - Repair procedures on PACE products should be performed by Qualified Service Personnel only. Line voltage parts may be exposed when the equipment is disassembled. Service personnel must avoid contact with these parts when troubleshooting the product.

2. To prevent personnel injury, adhere to safety guidelines in accordance with OSHA and other applicable safety standards.

3. Always use PACE systems in a well ventilated area. A fume extraction system, such as those available from PACE, is highly recommended to help protect

personnel from exposure to solder flux fumes.

4. Exercise proper precautions when using chemicals (e.g., solder paste or cleaning solvents). Refer to the Material Safety Data Sheet (MSDS) supplied with each chemical and adhere to all safety precautions recommended by the manufacturer.

5. The following safety precautions cover use of PACE hot air systems/hand pieces (e.g., ThermoFlo®, ThermoJet®).

a) Be careful when using in places where combustible materials are

present. b) Do not use in the presence of an explosive atmosphere. c) A fire may arise if a hot air hand piece is not used with care. Do not

leave the hand piece unattended when in use. d) The heater assembly housing and any installed nozzle are hot when the

system is being cycled and for a period of time thereafter. DO NOT

touch the heater assembly housing, nozzle or heated air stream. Severe

burns may result!

Warning Symbols on Unit

HOT – DO NOT TOUCH

Warning, Use caution

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Introduction:

Thank you for purchasing the TF 3000 BGA/CSP Rework Station. As electronic devices continue to get smaller, lighter and more compact, components and printed circuit boards are also becoming smaller and the amount of available space on PCBs is continually decreasing. In order to maximize board space, area array devices have become the popular choice. Area array devices are BGAs, CSPs and “micro -BGAs”, LGAs, and Flip Chips. These devices require an optical overlay vision system to ensure proper placement and high levels of process control during installation to ensure successful installation. The TF 3000 has been specifically designed to rework these types of components and can also install and remove a variety of other SMT devices.

Agency Compliance

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference and (2) This device must accept any interference received, including interference that may cause undesired operation.

The TF 3000 also complies with 98/37/EC and 89/336/EEC.

Caution: During normal operation, the top heater, nozzle and bottom-side

heater(s) will get hot. Do not contact them directly as serious injury

may occur.

Environmental Requirements

Ambient Operating Temperature: 0 ºC to 50 ºC (32 ºF to 120 ºF) Storage Temperature: -20 ºC to 75 ºC (-4 ºF to 170 ºF) 95% Humidity, non-condensing max.

Electrical Specification

15 Amp 115 VAC, 60 Hz Max OR 8 Amp, 230 VAC, 50 Hz Max Fuse: .5 Amp, SloBlo 115 V System .5 Amp TimeBlo, 230 V System

Packing Contents

TF 3000

1. TF 3000/E or TF 3000 L/E: 1 each

2. LCD VGA Display Monitor: 1 each

3. TF 3000 Software Package: Installed on PC

4. Hand Held Vacuum Pick for removal: 1 each

5. Rubber suction cups (spare for #4): 3 each

6. Vacuum nozzle for placement head: 1 each Large, Medium, Small and extra-small sizes

7. Hex Wrench Set and Screwdriver: 1 each

8. TF 3000 Manual: 1 each on PC as pdf file

9. NET-OP manual - 1 each on PC as pdf file

10. K-Type Thermocouple: 4 each

11. LED Extension wire

12. USB Track Ball

13. PCB Supports: 1 each

14. Odd shaped PCB holders: 4 each

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15. Alignment board and component: 1 each

16. Wooden shipping crate.

The wooden shipping crate must be kept by the end user. If a TF 3000 has to be returned to PACE for any reason, it MUST be returned in the original shipping crate. PACE is not responsible for any unit not returned in its original crate. If a TF 3000 is returned for service in a different container, the customer will be charge for a new crate for return shipment.

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J I C

G K M

P D B N E A L

Parts Identification

Figure 1: TF 3000 BGA/CSP Rework Station

Features: Please refer to Figure 1.

A) Reflow Head Contains the top -side heater and moves up and down via an

electric motor that is controlled through the software. The reflow head is clutched to prevent excessive downward force from being applied.

B) Removal Nozzle Vacuum port to connect Nozzle Vacuum Hose for Vacuum Port component removal

C) Air Flow Meter This device is used to control and monitor the airflow. D) Sensor 1 thru 4 Inputs The sensor inputs are K-type thermo-couples. Measured

temperatures are displayed through the PC Software in real time for use in making profile gr aphs.

E) Nozzle The nozzles for the TF 3000 are easily changed. Several

varieties are available. Use caution and proper hand protection when changing nozzles, as they will be hot.

F) Cooling Fan The component and the PCB are cooled by the cooling fan,

which can be set to activate automatically after the reflow cycle is complete.

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G) Sliding Shaft Holder Supports the rail system for the board holder. It is also used

to index the table from the Placement Position to the Reflow Position using the handle on the front.

H) On/Off Switch Used to turn the system on or off. When turning off the

system, always turn off the PC using the windows interface

first. I) LCD Display Monitor Displays PC software. Shown with optional articulated arm. J) Alignment Head X, Y, Z and T aspects of the component position are

adjusted in relation to the land pattern on the PCB through

this apparatus. K) Optics Housing Contains the camera and beam splitter (prism). The housing

is retractable and should be kept in the retracted position

when not in use. The lights for the optics will turn on/off

automatically when the housing is extended. L) Light Controls The upper (component side) and lower (PCB side) lights

within the optics housing can be adjusted for intensity

(overlay contrast) at this location. M) Board Holder The board holder is fully adjustable in both the X and Y

directions. The right side of the holder is spring loaded to

hold the PCB securely. Fine adjustment in the “X” direction

is achieved by using the adjustment knob on the Sliding

Shaft Holder and adjustment in the “Y” direction is achieved

using the knob on the right rail. N) Bottom Side Heater Used to warm the PCB from the underside. It is an IR type

of heating source.

O) Magnetic Lock Release Disengages magnetic lock to release platform when moving

from Reflow position to Placement position and vice-versa. P) Keyboard Tray Door The keyboard is stored behind this door. To access the

keyboard, open the door and pull the tray out .

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1 SET-UP

TF 3000 Set up

1-1 Place the TF 3000/E or TF 3000 L/E on a flat and stable bench that can 1-2 The TF 3000 weighs 77 kg (170 lbs). To lift it, grasp the underside of the

1-3 Connect the hand -held vacuum pick to the vacuum port on the side of the TF

1-4 Connect the LCD display monitor to

1-5 Connect the TF 3000 and LCD Display Monitor power cables to the power

2 OPERATION

2-1 Before Operating

• Make sure the TF 3000 is on a stable platform

• It is recommended that the TF 3000 be turned on for at least 15 minutes before

• It is advisable to conduct a trial operation each day to ensure all systems are

support at least 90 kgs (200 lbs). frame. The unit should be moved by two people minimum. Each person

should be capable of lifting 45 Kgs (100 lbs). 3000 and hang the vacuum pick on the side of the TF 3000 using the bracket

provided (2A). the VGA output on the side of the TF

3000. See Figure 2.

2 1

1. Hand Wand Vacuum Switch

2. 3.5” Floppy Drive 2A Hand Wand Bracket

3. VGA Output – to connect the VGA monitor

4. Composite Video Inputs – to connect alternative video inputs

5. 9 pin Serial I/O – to connect a 9 pin serial device

6. Modem I/O – to connect to a phone line

7. Printer Port – to connect to a printer

8. USB I/O – to connect to USB compatable devices such as the track ball provided.

4 3

9. Hand Wand Vacuum

Connection – to connect the hand wand.

Figure 2: Image of Side Panel

inlet ports and then plug them into an appropriate 115 VAC, 60 Hz or 230 VAC 50 Hz power supply. The LCD Monitor can be plugged into the AC outlet on the back of the TF 3000. Do not pl ug any equipment requiring more than 1 amp into this outlet.

use to ensure the Bottom Side heater has reached its set temperature and stabilized. Once the bottom -side heater is at temperature it will deliver consistent heating, ensuring highly repeatable heating from operation to operation.

operating properly. Also, it is important to verify the airflow of the unit with each profile to be run: The recommended maximum airflow is 22 l/min and the recommended minimum airflow is 15 l/min.

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• Verify that the devices/parts being soldered to the PCB do not exceed the height limitations. Exceeding the limitations may interfere with the operation of the machine.

1. The maximum height of any component or device on the top of the PCB is limited to 30 mm (1.2”).

2. The maximum height of any component or device on the bottom of the PCB is limited to 15 mm (0.6”).

2-2 General Operating Procedure

1. Ensure sliding shaft holder is the placement position.

2. Insert PCB into Board Holder. See Figure 3.

Figure 3: Board Holder and PCB

3. Activate vacuum on TF 3000 from the Alignment screen on the TF 3000 Software. Place component on vacuum nozzle on placement head. See Figure

Figure 4: Component held by Vacuum Pick

4. Pull the optics housing out from the front of the TF 3000 using the handle. Be sure the Sliding Shaft Holder is in the Placement Position (Against the right bumper).

5. Center the land pattern in the optics display.

6. Adjust the lighting so the lands and solder balls are clear.

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7. Align component solder ball/lead pattern to the land pattern on the PCB using the adjustment knobs on the alignment apparatus. See Figure 5. The BGA (ball side) and the PCB pattern side are super-imposed on the computer monitor, by the optical system. See Figure 6.

Figure 5: Placement Head

(A) (B)

Figure 6 - Unaligned (A) and Aligned component (B) as they would appear.

8. Push optics housing back into unit.

9. Apply flux or solder paste: One of the following methods is applicable depending on the rework conditions, the specification of Device/PCB, or operator preference.

A) Dispense flux on the land pattern using a brush or flux pencil. (Most

common).

B) Apply solder paste to the land pattern using a conventional stenciling

technique.

C) Apply flux to the BGA, solder ball side, by means of a flux application

tool. See Reference Section.

D) Print paste on the BGA, solder ball side, by using one of PACE’s

component stenciling tool kits. See Reference Section.

Note: Method B must be completed prior to insertion of PCB into board

holder. Methods C and D apply flux/paste to the underside of the component, not the PCB. They should be performed before placing component with vacuum pick on TF 3000.

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10. Lower the Alignment Apparatus to PCB so the component is in contact with the PCB.

11. Release component by turning off the vacuum and return alignment apparatus to the upper position.

12. Index the sliding shaft holder from the Placement Position to the Reflow Position.

13. Select the desired profile or enter time and temperature parameters for pre-heat, soak, and reflow phases. See Figure 7.

Figure 7: Profile Development Page

14. Lower the reflow head using the reflow head buttons (Fig 7) and start the cycle by clicking on the “Start Button” on the profile development or Operations Page.

15. Once the reflow profile has been completed, the reflow head will lift up automatically and the cooling fan will turn on for the user-selected amount of time. Airflow from the cooling fan may be directed by loosening the locking thumbscrew on the fan and rotating it around its shaft.

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Placement Position

3 EXPLANATION OF EACH OPERATION

3-1 Placing BCB into Board Holder - See Figure 8..

1. Center the sliding shaft (8) in the holder (9).

2. Adjust the sides of the board holder so that the distance between them is 3 mm smaller (half the width of the rail) than the width of the PCB. Secure the sides by tightening the setscrews (6 & 2)

4. The right side of the board holder is spring loaded. Insert the PCB into the support slots while holding the right side of the board holder open. When the PCB is positioned, let the right side close.

Figure 8: Board Holder and Base

3-2 Component Alignment and Placement - Refer to Figures 5 and 8.

1. Set the sliding shaft holder at the Placement Position at the far right side of the base

2. Extend the optical housing by pulling the handle towards you. The LEDs will turn on automatically.

3. Center the PCB array pattern on the display. Zooming in on the array allows for easier centering

4. Tighten the setscrews (#1 & 5, Fig.

8) to secure the “Y” position of the PCB.

5. Tighten the setscrew (#3, Fig. 8) on the sliding shaft holder (#9, Fig. 8) to secure ”X” position of the PCB.

6. Focus the array pattern on the PCB by focusing manually or by using the AUTO FOCUS feature. Switch the feature off after the array pattern has been focused.

7. Switch on the vacuum on using the “Vacuum” button on the Alignment screen in the software.

8. Place the component to be placed on the end of the vacuum nozzle. See Figure

9. Adjust the lighting using the adjustment knobs (#L, Fig 1) so the image of the PCB land pattern and the image of the solder balls on the component can be seen clearly.

10. Adjust the height of the device with the height (Z-axis) adjusting screw (Fig 4) to bring solder balls/lea ds into focus. Failure to focus the component may result in inaccurate alignment.

11. Turn the “AUTO-FOCUS” feature on after the PCB and component are in focus.

12. Adjust ? aspect of the component by turning the ? adjustment knob (Fig. 5).

13. Adjust the X and Y aspects of the component by adjusting the X and Y adjustment knobs (Fig. 5).

‰+n

Reflow Position

Figure 9

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14. When the component is aligned (See Figure 6), return the optics housing to its retracted position. The lights will turn off automatically.

15. Using the handle, lift the alignment apparatus upward by hand to release, then lower the apparatus slowly.

NOTE: The alignment apparatus can be lowered while the optics housing is

extended; DO NOT hit the glass with the component or vacuum nozzle.

NOTE: When repeating operations using the same PCB and device, steps 4

and 11 may be eliminated. However, when changing devices, it is important to include steps 4 and 11 in the initial setup procedure.

16. Confirm that the component is in contact with the PCB. Turn off the vacuum switch using the “Vacuum” button on the Alignment screen in the software.

When repeating operations using the same PCB and device, the mechanical stop

on the right side of the alignment apparatus may be set to ensure repeatability.

17. Return the alignment apparatus to its original position.

18. Move the sliding shaft holder to the “Reflow Position” by disengaging the magnetic lock and using the handle on the sliding shaft holder.

3-3 Component Reflow

1) Make sure that an appropriately sized nozzle is fitted to the reflow head.

2) Verify the sliding shaft holder is at the Reflow Position at the far left side of the base

3) Select a profile or enter reflow parameters. Refer to section 4.

3) From either the “Operations” or “Profile Development” screens, click on the NOZZLE DOWN button. (Figure 7) The nozzle will go down and stop automatically 5 mm (will vary with PCB thickness) above the PCB.

5) Visually confirm that the component position is aligned with the nozzle. Press and hold the NOZZLE DOWN button. The reflow head will lower itself, slowly. Lower the reflow head until there is no gap between the nozzle and the PCB. See Figure 10.

When repeating operations using the same PCB and device, the mechanical stop

on the left side of the reflow apparatus may be set to ensure repeatability. Once set, simply lower the reflow head until the mechanical stop engages. The reflow head is fitted with a clutch that will engage if the nozzle applies pressure on the PCB or the mechanical stop. This ensures the safety of the PCB and protects the motor that drives the reflow head.

NOTE: In some instances the available space around a component will be

insufficient to bring the nozzle into contact with the PCB. Should this occur, select a nozzle with dimensions that are similar to the component body. For reflow, position the nozzle 1 mm above the component. The time of the reflow cycle may have to be adjusted to insure satisfactory results. A thermo-couple should always be used to verify reflow conditions.

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Figure 10: Properly Positioned Nozzle in Relation to PCB

6) When the nozzle is properly positioned, click the CYCLE START button. The cycle will begin. An audible alarm will sound seven (7) seconds before the end of the reflow phase.

7) When the reflow cycle is complete, the Reflow Head/nozzle will automatically raise and the COOLING FAN will turn on (if activated), cooling the soldered component, PCB and nozzle.

9) Do not remove the PCB from the board holder until the temperature of the component and PCB has reached “below solder melt” temperatures.

3-4 Adjusting Airflow

1) The knob on the air flow meter adjusts the airflow. Make sure to match the air

flow meter value with the value of “Air Flow” field on the software. The actual airflow will not be changed by the flow value displayed by the software. However, this value affects the heating so it is important to make sure the airflow regulator on the front panel of the machine matches in the airflow value in the profile.

3-5 Component Removal

There are two methods for removing components from the PCB.

Method 1 - Use a removal nozzle fitted with a vacuum pick-up.

1) Fit a removal nozzle to the TF 3000

2) Connect the vac uum hose to the vacuum port on the front of the system.

3) Run the removal profile.

4) The component will be lifted off when the reflow head lifts up at the

completion of the cycle.

Method 2 – Using the hand wand.

1) Run the removal profile.

2) When the audible alarm signals 7 seconds before the end of the reflow

phase, turn on the vacuum pump using the switch on the right side of the TF 3000 and pick up the hand wand.

3) Once the reflow head raises up, remove the component by using the hand

held vacuum wand.

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4 CREATING AND SAVING PROFILES

Please refer to Figure 7 for this section.

4-1 General Information

The TF 3000 comes with two profiles already installed that should be used as baselines when developing profiles. Profile Default 1 is recommended as a starting point for area arrays larger than 21 mm square. The Default 2 profile is recommended as a starting point for area arrays 21 mm square and smaller.

4-2 Additional Information

1) Temperature settings are as follows:

• Top Heater Pre -heat

• Bottom Heater Pre -heat

• Top Heater Soak

• Bottom Heater Soak

• Top Heater Reflow

• Bottom Heater Reflow

2) Time and temperature parameters can be changed while a reflow cycle is running from the Profile Development Screen. However, the PROFILE itself cannot be changed.

3) To determine a temperature, it is strongly recommended to use a thermo-couple to take temperature measurements. Profile creation is most successful when thermo-couples are used. For assistance, contact PACE or your local representative.

4) To ensure a successful installation the following conditions should be met in each profile.

During the PRE -HEAT phase, the PCB should experience a temperature of between 95 and 105 ºC before entering into SOAK.

During the SOAK phase, the solder balls should experience a temperature between 145 to 165 ºC for 30 to 60 seconds. Refer to your flux activation temperature.

During the REFLOW phase, the solder balls should experience a temperature of 190 to 220 ºC for 10 to 30 seconds. Always verify the component’s maximum allowable temperature with its manufacturer.

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4) The preset default profiles are as follows: (Time (s)/Top Heater Temperature/Bottom Heater Temperature)

Profile Preheat Soak Reflow AirFlow Default 1 °F 60/212/320 80/275/350 70/410/375 22 lpm Default 1 °C 60/100/160 80/135/175 70/210/190 22 lpm Default 2 °F 60/212/300 70/375/330 60/375/355 15 lpm Default 2 °C 60/100/150 70/135/165 60/190/180 15 lpm

Figure 11: Default Profile Table

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