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TF1500
Service Manual
38 pgs2.55 Mb0

Pace TF1500 Service Manual

TF 1500 BGA Rework Station
Operation and Maintenance Manual
Manual Number 5050-0525
Table of Contents
Packing Contents, Standard Items......................................3
Specifications..........................................................................3
Parts Identification..................................................................4
Safety Information..................................................................5
Features...................................................................................5
Set-Up ......................................................................................7
Operation...............................................................................19
Temperature Control ............................................................25
Available Nozzles/Accessories/Optional Items ...............25
Maintenance..........................................................................25
Regulation.............................................................................26
Service and Warranty..........................................................27
System Operations Manual
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1. Packing Contents, Standard Items Description Part Number
TF 1500 8007-0410 (120V) 8007-0411 (230V) PC ­Monitor ­Keyboard ­Mouse ­Vacuum Pick 1272-0005-P1 Vacuum Pick Kit 6993-0060 Suction Cups 6993-0202-P1 Alignment Board 4018-0100-P1 Mounting Platform Stencil 1321-0725 Mounting Platform Flux Dip 1321-0735 Hot Grip Removal Pad 1100-0307 Thermocouples (4) 1340-0174-P1 Hex Wrench Kit 6016-0034 Power Cord 1332-0224 Video Cable 3008-0168
2. Specifications:
Part Number 8007-0410
Dimensions 737 mm H x 686 mm W x 737 mm D
(29” x 27” x 29”) Weight (w/o computer) 45 kgs (100 lbs) Power Requirements 115 VAC, 60 hz or 230 VAC, 50 Hz
2000 watts PC Pentium 4, 256M Ram, Floppy, CD Top Heater Adjustable convective air (air or N2),
Maximum 20 SLPM, 1600 watts
100 to 400 deg C, 212 to 750 deg F Bottom Heater IR, 400 watts, 2 @ 200w each
100 to 221 deg C, 212 to 430 deg F Vacuum 450 mm Hg Optics High resolution, Dual Color Vision
Overlay System Positioning Accuracy (Z travel) +/- 25 umeters (0.001”) Video 2 Composite Video (external)
1 “S” Video (Internal)
15” Integrated color Flat Panel
Monitor PC Board Size 305 x 305 mm, 12” x 12” Component Size 35 mm x 35mm, 1.38” x 1.38” max.
System Operations Manual
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System Operations Manual
A B C
D
E F G H I
J
K L
TF 1500 Parts Identification
Figure 1
A. Air Flow Meter This device is used to control and monitor the airflow
through the reflow head.
B. Sensor Input The sensor inputs are K-type thermo-couples.
Measured temperatures are displayed through the PC
software in real time for use in making profile graphs. C. Cooling Fan The component and PCB are cooled by the cooling fan, which can be set to activate automatically after the
reflow cycle is complete or operated manually. D. LCD Display Monitor Displays PC software. E. Keyboard Used to enter information into software. F. Reflow Head Contains the top-side heater and moves up and down
via an electric motor that is controlled through the
software. The reflow head is clutched to prevent
excessive downward force from being applied.
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System Operations Manual
G. Optics Housing Contains the camera and beam splitter (prism). The
housing is retractable and should be kept in the retracted
position when not in use. The lights for the optics will
turn on/off automatically when the housing is
extended/retracted. H. Bottom Side Heater Used to warm the PCB from the underside. It is an IR
type heating source. I. Board Holder The board holder is fully adjustable in the X direction
only. Fine adjustment of both the X and Y direction is
achieved by using the adjusting knobs on the end of the
holder for X and on the front of the machine for Y. The right side of the holder is spring loaded to hold the
PCB securely. J. On / Off Switch Used to turn the system on or off. When turning off the
system, always turn off the PC using the windows
interface first. K. Mouse Used to enter information into software. L. Emergency Off Switch In case an emergency shut down is necessary, press
this button.
3. Safety Information
a. Do not contact the Heater or its peripheral parts during operation. b. Once turned off, let the unit cool completely before contacting. c. When using fluxes, use fume extraction equipment or use in a well-ventilated
area to minimize operator exposure to fumes. d. Do not use near combustible vapors. e. Do not leave the equipment unat tended when in use. f. Do not open rear panel without disconnecting power cable.
4. Features
a. The TF 1500 is ideal for post assembly rework, repair, and low volume/short run
production operations. The TF 1500 can remove and install PBGAs, CSPs, FCs,
LGAs, LCC’s and other SMDs. b. Featuring unparalleled thermal performance, The TF 1500’s flexibility and state
of the art process software means no other system is easier to use. The TF 1500
is a PC driven, semi-automated system that requires a Pentium ® 4 PC featuring
Windows XP® Professional OS. The unique standard software package offers
much more than just an operator interface. TF 1500’s advanced vision and
placement system is highly accurate and can quickly magnify even the smallest
components for easy alignment. TF 1500 uses a combination of convective top
heating coupled with powerful IR bottom heating for an effective, repeatable
heating process. c. Economical and easy to use, the TF1500 Rework System delivers high -end
BGA/CSP functionality, moving far beyond expe nsive, bulky rework machines by
offering unparalleled performance at an affordable price. d. REFLOW FUNCTION
i. Unequalled programmability and process control ensures successful,
repeatable installation.
ii. The powerful and responsive 1600 Watt top heater, with closed loop
temperature control, coupled with proven TF 3000 nozzle design ensures uniform temperature distribution when heating.
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iii. High power bottom heaters allow for successful and repeatable reflow at
safe, low temperatures.
iv. Profiles are programmed through the PC software.
v. Creating the perfect profile is easy with real time adjustment of profile
parameters through the PC.
vi. Store and recall an infinite number of profiles.
vii. Two pre -defined profiles for use as baselines when developing custom
profiles are included.
viii. Self contained, no external air supply or vacuum connections required.
Can also be used with N2 from external source.
ix. Semi-automated, motorized reflow head.
x. Four thermo-couple sensor inputs ensure successful profile development
and monitoring.
xi. External fan to cool PCB and component to below solder melt
temperatures after reflow.
e. ALIGNMENT AND PLACEMENT FUNCTION
i. The component is held by a precision vacuum placement pick, which is
located within the heater assembly.
ii. High resolution Dual Color Vision Overl ay System (VOS) with color
camera and dichroic prism. VOS does not require routine calibration,
eliminating costly downtime and operator frustration. iii. Color Camera with 72x zoom capability, featuring auto-focus zoom. iv. Lighting system uses “Ultra Bright” Red and Blue LEDs for maximum
contrast of lands and solder balls on component.
v. Independent lighting controls for component and PCB to maximize
overlay contrast. vi. Retractable optics housing protects VOS from dirt and contamination.
vii. Accurately places any array package up to 35mm (1.3") square and as
small as 1 mm (.04”) square.
viii. Precise micrometer adjustment for X, and Y axis with Theta adjustment
ensures placement accuracy. ix. High-flow vacuum pick holds component securely.
x. Images are viewed through the PC in standa rd or full screen viewing
options.
f. PRE-HEAT FUNCTION AND BOARD HOLDER
i. Fully adjustable, precision, spring loaded board holder with top or bottom
PCB registration. Precise micrometer adjustment for X and Y adjustment
ensures placement accuracy for repeatability.
ii. Rugged, stable board platform to hold and support the PCB.
iii. Unique board holding fixtures that are able to hold very small and odd
shaped PCBs. iv. Board supports are standard with the system.
v. Integrated, powerful, IR pre-heater with closed loop temperat ure control
ensures process integrity by delivering heat evenly, time after time.
System Operations Manual
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System Operations Manual
N2 Key N2 Connection
5. Set-Up
a. Connect
i. The TF 1500 comes configured for internal or external air. Select air
source; internal pump or external N2. (Figure 2a & 2b)
Warning: Do not run unit in N2 mode unless N2 supply is connected and
on.
1. Open rear panel.
2. Turn key to desired air supply.
3. Close rear panel.
Figure 2a Figure 2b
ii. Insert PC into brackets on back of PC.
iii. Monitor
4. Connect power cord.
5. Connect video cable to the 9-pin connector of the PC.
iv. Keyboard – connect cable to computer.
v. Mouse – connect cable to computer.
vi. Connect cables between PC and back of TF 1500 according to labels.
vii. Connect power cords to TF 1500 and PC.
b. Start up
i. Turn on circuit breaker on back of unit.
ii. Turn on power switch on front of unit. iii. Turn on computer. iv. Turn on monitor.
v. Mouse click on TF 1500 icon. vi. Read and accept license.
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System Operations Manual
Vacuum pick
Nozzle
c. Inserting/changing vacuum pick.
i. Insert proper size vacuum pick. The diameter needs to be smaller than
the top of the component. The pick screws into place. (Figure 3a)
Figure 3a
d. Inserting/changing nozzle. (Figure 3b)
i. Insert proper size nozzle. The nozzle should be 3 mm larger than the
outside of the component. If the proper nozzle size cannot fit onto the PCB due to adjacent components being to close, use a smaller nozzle or keep the nozzle approximately 1mm above the part. Align the nozzle under the square hole in the reflow head. The nozzle snaps into place. The nozzle can be positioned with the front surface parallel to the PCB or at a diagonal by moving the lever by the nozzle housing.
Figure 3b
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System Operations Manual
i ii iii iv v vi
vii
viii ix x xi
xii xiii
xiv xv xvi xvii xviii
xix
e. Set up screen features. (Figure 4)
Figure 4
i. Set Password. Setup and profile settings can be password protected.
ii. Set Language. Software text language can be changed. iii. Set temperature for Celsius or Fahrenheit. iv. Set yellow temperature reference lines on the profile graph.
v. Set setback time. Machine will go into setback after selected idle time.
Setback reduces heater temperatures during extended idle times to extend heater life.
vi. Set auto shutoff time. Machine will completely shut down after selected
idle time.
vii. Set the limit on the focus range and nozzle movement.
viii. Set setback and auto shutoff times for component release and PCB
removal.
ix. Type the text for these three displays.
x. Run the activity log. xi. Initiate prism calibration sequence. Further explanation is in par. 5e.
xii. Initiate heater arm sensor test. Checks proper orientation and operation
of heat er arm position sensors.
xiii. Initiate camera sensor test. Checks proper orientation and operation of
camera position sensor.
xiv. Initiate pick sensor test. Checks proper orientation and operation of pick
position sensor.
xv. Blower test. Checks operation of heater blower.
xvi. Cooling fan test. Checks operation of cooling fan.
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System Operations Manual
xvii. Vacuum pump test. Tests operation of vacuum pump.
xviii. Thermocouple test. Tests active thermocouple circuitry.
xix. Reset diagnostics. Must be clicked after any diagnostic test is performed
to reset the tests to default settings.
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System Operations Manual
i
ii iii iv
v
vii vi
f. Alignment Screen Features (Figure 5)
Figure 5
i. Component/PCB alignment image. Proper alignment is viewed here
showing the PCB pads (blue) directly under the component pads (red).
ii. Zoom bar. The image can be zoomed in or out using this bar or the up
and down arrows on the keyboard.
iii. Focus bar. The image can be manually focused using the slider on this
bar or it can be automatically focused by checking the box by ‘auto’.
iv. Instructions. Follow these instructions to proceed through the alignment
sequence.
v. Screen options.
1. Edit – Change Instructions.
2. Cancel – Cancel changes made to instructions.
3. Save – Save changes made to instructions.
4. Reset – Returns to factory set instructions.
vi. Full Screen. Click on here to view image full screen.
vii. Nozzle step adjustment. If component (red) cannot be aligned to PCB
(blue) or you cannot focus, adjust nozzle height up or down with this option until better alignment or focus is achieved.
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System Operations Manual
ii iii iv
v
vi ix x xi xii
xiii xiv
xv xvi i vii viii
g. Production Screen Features (Figure 6)
Figure 6
i. Profile Indicator. Indicates currently selected profile. A new profile can
be selected from a list of saved profiles by clicking on the arrow.
ii. Profile Instructions. Instructions entered by the developer can be viewed
here.
iii. Temperature and time settings. Settings for the profile are indicated
here.
iv. Sensor indicators. Real-time sensor readings can be viewed here if
thermocouples are used.
v. Graph. A saved graph and, if thermocouples are used, an active trace
graph are viewed here.
vi. Profile Status Bar. Indicates the current status of a running profile.
vii. Heater Button. Used to turn the heater back on after the machine has
been in setback. Blinks red if in setback and must be selected to continue sequence.
viii. Status Bar.
1. System status – shows if system is ‘normal’, in ‘setback’ or ‘shutdown’.
2. Heater status – Shows ‘ready’ if bottom heater is in range. Shows ‘not ready’ if bottom heater is not in range. The software will not continue until it is in ‘ready’ status.
3. Bottom heater temperature – Shows real time bottom heater temperature.
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