Pace TF1000 Service Manual

TF 1000 BGA/CSP
Rework Station

Operation Manual

MANUAL NO. 5050-0501

REV. A
Safety
The following are safety precautions that personnel must understand and follow when using or servicing PACE products.
POTENTIAL SHOCK HAZARD -
1. products should be performed by Qualified Service Personnel only. Line voltage parts may be exposed when the equipment is disassembled. Service personnel must avoid contact with these parts when troubleshooting the product.
2. To prevent personnel injury, adhere to safety guidelines in accordance with OSHA and all other applicable safety standards.
3. Always use PACE systems in a well ventilated area. A fume extraction system, such as those available from PACE, is highly recommended to help protect personnel from solder flux fumes.
4. Exercise proper precautions when using chemicals (e.g., solder paste). Refer to the Material Safety Data Sheet (MSDS) supplied with each chemical and adhere to all safety precautions recommended by the manufacturer.
5. The following safety precautions cover use of PACE hot air systems/hand pieces (e.g., ThermoFlo®, ThermoJet®).
a) Be careful when using in places w her e ther e ar e combusti ble
materials. b) Do not use in the presence of an explosive atmosphere. c) A fire may arise if a hot air hand piece is not used with care.
Do not leave the hand piece unattended when in use. d) The heater assembly housing and any installed nozzle are
hot when the system is being cycled and for a period of time
thereafter. DO NOT touch the heater assembly housing,
nozzle or heated air stream. Severe burns may result.
Repair procedures on PACE
Table of Contents
Heading
A. Introduction 3
B. Regulation 3
C. Features 4
D. Structure 5
E. TF 1000 Setup 6
F. Before Operation 7
Page #
G. Installing PCB 8
H. Preparation for Component Rework 9
I. Component Alignment 10
J. Component Placement 11
K. Component Reflow 12
L. Specifications 15
M. Accessories 16
N. Maintenance 19
TF 1000 BGA/CSP Rework Station
A. Introduction
As electronic assemblies get smaller and lighter, PCB’s are steadily decreasing in size, and semiconductor devices are slowly being replaced by smaller area array packages such as BGA’s and CSP’s. The TF-1000 has been specifically designed for the rework of these devices, with an emphasis on small boards and components.
B. Regulation
The TF-1000 is in conformity with the European Machinery Directive 98/37/EC and EMC Directive 89/336/EMC, modified 92/31/ECC, 93/68/EEC.
Caution!
During normal operation, the top heater, nozzle, bottom-side-heater(s) and halogen lamps will get hot. Contacting them directly may result in serious injury.
C. Features
1. The TF 1000 System is lightweight and compact, with the placement station and reflow station combined in one unit
2. Up to 40 reflow profiles can be stored by the TF 1000. Saved profiles can be recalled at the touch of a button and are displayed on the LCD display panel.
3. A colored LED indicates each phase of the reflow cycle so the status of each operation can be easily seen and monitored.
4. Placement of small BGA/CSP is easily accomplished through the use of microscope optics with image overlay.
5. A highly efficient, 700-watt topside heater used in conjunction with a truly unique nozzle design insures the uniformity of the temperature across the assembly.
6. The infrared bottom side heater with a wide heating area is incorporated to prevent warping of the PCB, and to enhance the reflow of BGA/CSP.
7. The blower and vacuum pumps are self-contained. No external air supplies are required.
8. A cooling fan automatically activates at the end of the reflow cycle to cool the component, PCB, and nozzle.
9. The TF 1000 is versatile and ensures repeatable results
D. Structure
2345678
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10
11
1
12
1. Infrared Bottom-Side heater
2. Microscope Optics
3. Thermocouple inputs 1 and 2
4. Top-Side Heater Assembly
5. Control Panel
6. LCD Display
7. Component Alignment/Placement apparatus
8. Airflow control/Indicator
9. PCB and Component light adjustment
10. Power and Vacuum On/Off switch
11. Cooling Fan
12. PCB Holder

Operation Manual

E. TF 1000 Setup
1. Place the T F 1000 on a flat and stable work surface.
2. Install the PCB Holder assembly by inserting the rear rail of the PCB holder into the rolling guides on the TF 1000 housing and installing and tightening the four screws shown in the figure below.
3. Insert the Microscope Optics into the Optics Holding Bracket and tighten the Allen Screw after centering the Optics as shown below.
4 screws
Rolling Guides
Optics Holding
Bracket
Allen Screw
4. Connect the power cord to the AC power receptacle on the rear panel of the TF 1000 and to the proper AC power source.
F. Before Operation
1. Confirm the safety of the machine and the surrounding work area before turning the power on.
2. The bottom heater will take approximately 5-6 minutes to warm up to the desired temperature once power is applied. During this time the HEATER START light will flicker on and off. Once the desired temperature is reached the HEATER START light will remain lit, indicating the TF 1000 is ready to use.
3. Confirm that components/devices mounted to the PCB do not exceed the following height restrictions:
A. Top-side of PCB – 30 mm maximum height B. Bottom-side of PCB – 15 mm maximum height
G. Installing PCB
A
1. Loosen both (A) knobs to allow the PCB holders to glide freely in the X- axis, and set the distance between them so that the spring loaded PCB holder will hold the PCB firmly. T igh ten the (A) knob on the left first, and then slide the spring-loaded PCB holder into position and tighten the (A) knob on the right.
2. Pull back on the spring-loaded board holder and insert the PCB.
3. Once the PCB is in place, loosening knob (C) will allow the entire PCB to glide freely in the X-axis using the fine adjustment job (D). The PCB will also slide freely in the Y-axis. Tighten knob (C) to lock the PCB in place.
NOTE:
If profiling a PCB/Component and when using thermocouple(s), attach the thermocouple(s) to the desired position on the PCB and plug them into the Sensor 1 or 2 positions as shown below,
B B
C D
before
A (Spring Loaded)
inserting PCB into PCB holder.
Thermocouple Inputs
H. Preparation for Component Rework
1. The reflow nozzle to PCB standoff height can be established prior to
component placement. Pull the Reflow Nozzle Control Handle out from the housing and slide the Reflow Assembly down to the PCB as shown below.
Reflow Nozzle Control Handle
2. Fine placement of the ref low nozzle down to the PCB can be achieved by
setting the Nozzle to PCB Offset Limiter and twisting the nozzle control handle in either direction as shown below.
Start Finish
Nozzle to PCB Offset Limiter
3. The Reflow Nozzle can now be lowered gently to the PCB by twisting the
With the handle twisted so the
mechanics look like this…
Reflow Nozzle Control Handle back to the lowered position.
…the Reflow Nozzle will float
slightly off the PCB.
I. Component Alignment
1. The TF 1000 has three positions for the alignment apparatus: Standby, Alignment, and Placement. The positions are shown below.
2. The alignment apparatus is released by pulling the Z-Axis adjustment
Standby Alignment Placement
knob out as shown below.
Apparatus release
3. Bring the microscope into position by swinging the microscope into place. Release the alignment apparatus from the standby position and slide it down to the alignment position as shown above.
CAUTION:
Do not let the alignment apparatus drop freely to the position
below at any time. Damage to the TF 1000 or PCB may occur.
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4. Using the microscope, center the component pattern of the PCB in the viewer as shown below. The crosshairs and focus are adjusted by turning the eyepiece(s) on the microscope.
5. Center the vacuum pick so that it fills the viewer as shown below.
6. Press the “Vacuum On” button and attach the component to the vacuum pick. Using the X, Y, and Theta adjustment knobs, align the component over the PCB as shown below. Use the PCB/Device light adjustments to increase or decrease the contrast as needed.
Misaligned Aligned
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J. Component Placement
1. Swing the Microscope out to the standby position. Release the alignment apparatus and slide it down until the component gently touches the PCB as shown below.
2. Press the “Vacuum Off” button to release the component onto the PCB.
3. Slide the alignment apparatus up to the standby position.
K. Component Reflow
1. Using the Reflow Nozzle Control Handle, pull the reflow assembly out from the housing and slide it gently down to the PCB as shown below. Use the Nozzle to PCB Offset Limiter if necessary.
Reflow Nozzle Control Handle
Start Finish
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4. Select the desired profile using the LCD display. Push the Select button until the flashing cursor is located under the “Profile No.” position and push the Up and Down button until the desired profile number is displayed.
Cursor
LCD Display
5. Push the “Cycle Start” button to start the reflow process. If needed, lifting the nozzle back up to the standby position will automatically stop the cycle at any time.
6. The status indicator lo cated below the LCD display will track the reflow process. Thermocouple readings are displayed at Sensor 1 and Sensor 2 as shown below.
Status
Indicators
Thermocouple Sensor Display
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7. Changes can be made during the reflow process by pressing the “Select” button to move the cursor to the desired setting to be changed and then pressing the Up/Down buttons until the desired setting is achieved.
Move
Cursor
Cycle Start
Change
Setting
8. At the end of the reflow process, an audible tone will be heard and the Reflow display will count down to 0. The cooling fan will activate automatically and can be turned off by pressing the “Cooling Off” button. Additionally, the angle of the fan can be adjusted so that the fan does not blow towards the PCB/Component at all. This may be required for CBGA to ensure the cooling process does not occur too rapidly.
9. The Reflow Nozzle assembly may now be returned to the standby position by lifting the Reflow Nozzle Control Handle up and in. If performing component removal, remove the component using the provided vacuum pick wand.
10. Pressing the “Memory” button twice will now save changes made to the profile during the reflow process. To save the changed profile as a new profile, press the “Memory” button once, select the profile number to save as, then press the “Memory” button again. An audible tone verifies the profile has been saved.
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L. Specifications
1. Heater (top-side)
2. Pre-heater (bottom-side) IR Heater, 450W (TF1000E 400W)
3. Heating Control K type thermocouple with closed loop control
4. Applicable Devices BGA/CSP/SMT 42mm x 42mm (1.65” x 1.65”) Max
5. Applicable PCB 280 mm x 450 mm (11” x 17.5”) Max
6. Hot Air Flow 16 LPM Max
7. Adjusting Range of X, Y, Z ± 10 mm (.4”)
8. Adjusting volume of X, Y, Z 0.5 mm (.02”) per revolution
9. Positioning Accuracy ± 25 µm (0.001”)
10. Maximum Vacuum 450 mm Hg
11. Power Source 100-120 VAC, 220-230 VAC (Export)
Convective style, 700 W
12. Power Consumption 1.1 KW 400 mm W x 400 mm L x 520mm H
13. Dimensions
14. Weight 25 Kg (55 lbs.)
15.74” W x 15.74” L x 20.47” H
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M. Accessories
Note:
for 1.5 mm clearance between the edge of the component and the nozzle wall. Example: The 30mm x 30mm nozzle will fit a 27mm x 27mm component.
Note:
for CBGA. Other components are specified as listed. Example: 27mm – 2 will fit a 27m m x 27mm PBGA
27mm – 4 will fit a 27mm x 27mm CBGA
Description Dimensions Part Number
Nozzle Nozzle Nozzle Nozzle Nozzle Nozzle Nozzle Nozzle Nozzle Nozzle Nozzle 30mm x 30 mm (1.18” x 1.18”) 4028-5027 Nozzle 27mm x 27mm (1.1” x 1.1”) 4028-5001 Nozzle 26.4mm x 26.4mm (1.04” x 1.04”) 4028-5026 Nozzle 25mm x 32.3mm (.98” x 1.27”) 4028-5028 Nozzle 25mm x 25mm (.99” x .99”) 4028-5011 Nozzle 23mm x 23mm (.91” x .91”) 4028-5002 Nozzle 22mm x 14mm (.87” x .55”) 4028-5023 Nozzle 21mm x 21mm (.83” x .83”) 4028-5016 Nozzle 19.25mm x 19.25mm (.76” x .76”) 4028-5024 Nozzle 19mm x 19mm (.75” x .75”) 4028-5019 Nozzle 18.5mm x 18.5mm (.73” x .73”) 4028-5025 Nozzle 17mm x 17mm (.67” x .67”) 4028-5015 Nozzle 16.25mm x 17.75mm (.64” x .70”) 4028-5006 Nozzle 16mm x 16mm (.63” x .63”) 4028-5022 Nozzle 15mm x 15mm (.59” x .59”) 4028-5005 Nozzle 13.45mm x 14.97mm (.53” x .59”) 4028-5007 Nozzle 13mm x 13mm (.51” x .51”) 4028-5004 Nozzle 11.97mm x 13.21mm (.47” x .52”) 4028-5009 Nozzle 10.42mm x 10.42mm (.41” x .41”) 4028-5008 Nozzle 8.64mm x 8.90mm (.34” x .35”) 4028-5010
Nozzle dimensions are the outside diameter of the nozzle. Please allow
Component Stenciling Tool Kits dimensions: - 2 are for PBGA and - 4 are
47.5mm x 47.5mm (1.87” x 1.87”) 44mm x 44mm (1.73” x 1.73”) 43mm x 43mm (1.69” x 1.69”)
42.5mm x 42.5mm (1.67” x 1.67”) 40mm x 40mm (1.57” x 1.57”)
37.5mm x 37.5mm (1.48” x 1.48”) 35mm x 35mm (1.38” x 1.38”) 33mm x 33mm (1.29” x 1.29”) 32mm x 32mm (1.26” x 1.26”)
31mm x 31mm (1.22” x 1.22”)
4028-5034 4028-5030 4028-5029 4028-5013 4028-5012 4028-5018 4028-5003 4028-5033 4028-5020
4028-5014
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Nozzle 7.75mm x 5.6mm (.31” x .22”) 4028-5501 Nozzle 4.1mm (0.16”) Jet Spacing x 6.1mm (0.24”) Jet Length 4028-4001 Nozzle 4.1mm (0.16”) Jet Spacing x 10.9mm (0.43”) Jet Length 4028-4002 Nozzle 7.9mm (0.31”) Jet Spacing x 10.9mm (0.43”) Jet Length 4028-4003 Nozzle 7.9mm (0.31”) Jet Spacing x 13.5mm (0.53”) Jet Length 4028-4004 Nozzle 7.9mm (0.31”) Jet Spacing x 16mm (0.63”) Jet Length 4028-4005 Nozzle 7.9mm (0.31”) Jet Spacing x 18.5mm (0.73”) Jet Length 4028-4006 Nozzle 11.68mm (0.46”) Jet Spacing x 20.83mm (0.82”) Jet Length 4028-4007 Nozzle 11.42mm (0.45”) Jet Spacing x 27.17mm (1.07”) Jet Length 4028-4008 Nozzle 18.6mm (0.73”) Jet Spacing x 12.8mm (0.50”) Jet Length 4028-4505
Nozzle 10.4mm (0.41”) Jet Spacing x 21.35mm (.84”) Jet Length 4028-4506 Component Stenciling Tool Kit, 40mm - 2 7016-0016 Component Stenciling Tool Kit, 35mm - 4 7016-0006 Component Stenciling Tool Kit, 35mm - 2 7016-0030 Component Stenciling Tool Kit, 33mm - 4 Component Stenciling Tool Kit, 31mm - 2 Component Stenciling Tool Kit, 31mm - 4 Component Stenciling Tool Kit, 27mm - 4 7016-0007 Component Stenciling Tool Kit, 27mm - 2 7016-0029 Component Stenciling Tool Kit, 25mm - 2 7016-0017 Component Stenciling Tool Kit, 25mm - 4 7016-0020 Component Stenciling Tool Kit, 23mm - 2 7016-0008 Component Stenciling Tool Kit, 23mm - 4 7016-0013 Component Stenciling Tool Kit, 17mm - 2 7016-0009 Component Stenciling Tool Kit, 17mm - 4 7016-0012 Component Stenciling Tool Kit, 15mm - 2 7016-0010 Component Stenciling Tool Kit, 15mm - 1 7016-0023 Component Stenciling Tool Kit, 13mm - 2 7016-0011 Component Stenciling Tool Kit, 13mm x 10mm 7016-0027 Component Stenciling Tool Kit, 12mm CSP 7016-0014 Component Stenciling Tool Kit, 11mm x 8mm CSP 7016-0015 Component Stenciling Tool Kit, 19mm 7016-0018 Component Stenciling Tool Kit, 19mm Socket 7016-0026 Component Stenciling Tool Kit, 16.5 x 8mm, CSP 7016-0019 Component Stenciling Tool Kit, 22mm x 14mm 7016-0022 Component Stenciling Tool Kit, 4mm LCC 7016-0024 Component Stenciling Tool Kit, 8mm x 10mm 7016-0031 Component Stenciling Tool Kit, PLCC 28 7016-0033 Component Stenciling Tool Kit, 9mm 7016-0034 Component Stenciling Tool Kit, 24mm - 4 7016-0035 Component Stenciling Tool Kit, 6mm 7016-0036 Stencil, 40mm x 503 1040-0503-P1 Stencil, 40mm x 432 1040-0432-P1
7016-0021 7016-0028 7016-0032
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Stencil, 35mm x 388 1035-0388-P1 Stencil, 35mm x 456 1035-0456-P1 Stencil, 35mm x 313 1035-0313-P1 Stencil, 35mm x 352 1035-0352-P1 Stencil, 35mm x 480 1035-0480-P1 Stencil, 33mm x 503 1033-0503-P1 Stencil, 31mm x 304 1031-0304-P1 Stencil, 31mm x 329 1031-0329-P1 Stencil, 27mm x 352 1027-0352-P1 Stencil, 27mm x 316 1027-0316-P1 Stencil, 27mm x 225 1027-0225-P1 Stencil, 27mm x 256 1027-0256-P1 Stencil, 27mm x 272 1027-0272-P1 Stencil, 27mm x 292 1027-0292-P1 Stencil, 27mm x 324 1027-0324-P1 Stencil, 27mm x 328 1027-0328-P1 Stencil, 27mm x 336 1027-0336-P1 Stencil, 23mm x 169 1023-0169-P1 Stencil, 23mm x 288 1023-0288-P1 Stencil, 23mm x 324 1023-0324-P1 Stencil, 23mm x 208 1023-0208-P1 Stencil, 23mm x 256 1023-0256-P1 Stencil, 23mm x 484 1023-0484-P1 Stencil, 17mm x 208 1017-0208-P1 Stencil, 17mm x 256 1017-0256-P1 Stencil, 15mm x 156 1015-0156-P1 Stencil, 15mm x 160 1015-0160-P1 Stencil, 15mm x 196 1015-0196-P1 Stencil, 15mm x 196 1015-0196-P1 Stencil, 13mm x 144 1013-0144-P1 Stencil, 13mm x 64 1013-0064-P1 Stencil, 12mm x 144 1012-0144-P1 Stencil, 12mm x 160 1012-0160-P1 Stencil, 11mmx 8 x 72 1011-0072-P1 Stencil, 25m x 357 1025-0357-P1 Stencil, 25mm x 360 1025-0360-P1 Stencil, 19m x 225 1023-0256-P1 Stencil, 19m x 52 1023-0052-P1 Stencil, 16.5 x 8 x 52 1016-0052-P1 Stencil, 14 x 22 x 119 1014-0119-P1 Stencil, 4mm x 24 1004-0024-P1 Stencil, 4mm x 28 1004-0028-P1 Stencil, 4mm x 24 1004-2024-P1
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Stencil, 8mm x 48 1008-0048-P1 Stencil, PLCC 28 1012-0028-P1 Stencil, 9mm x 56 1009-0056-P1 Stencil, 24mm x 241 1024-0241-P1 Stencil, 6mm x 40 1006-0040-P1 Hand Held Vacuum Pick, TF1000 1272-0005-P1 Flux Applicator Tool Kit 6993-0218 K-Type Thermo Couple (2) 1340-0174-P5
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N. Maintenance
The TF 1000 is designed to be basically maintenance free. However, the Top Heater and consumable parts may need to be changed from time to time.
1. The Vacuum filter should be cleaned every three months. Remove the cover on the side of the TF 1000 as shown below. Remove the filter from the filter assembly and clean with mild soap and water. Let the filter dry completely before reassembling.
2. The Top Heater is easily replaced. Unplug the TF 1000 from the power source. Ensure the heater is cool. Remove the heater protection cover and remove the four screws that retain the heater assembly. Pull the heater assembly downwards to remove it from the socket and install the new heater. Install the four retaining screws and the protection cover.
Filter Assembly Location Remove and clean filter
Remove 4
Screws
Remove 4
Screws
Heater Protection Cover Heater Assembly
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