ON Semiconductor NCP5612 Technical data

NCP5612
l
High Efficiency Ultra Small Thinnest White LED Driver
The NCP5612 product is a dual output LED driver dedicated to the
The built−in DC/DC converter is based on a high efficient charge pump structure with operating mode 1x and 1.5x. It provides a peak 87% efficiency together with a 0.2% LED to LED matching.
Features
Support the Single Wire Serial Link Protocol
Peak Efficiency 90% with 1x and 1.5x Mode
Programmable Dimming ICON Function
Built−in Short Circuit Protection
Provides 16 steps Current Control
Controlled Start−up Inrush Current
Built−in Automatic Open Load Protection
Tight 0.2% Matching Tolerance
Accurate 1% Output Current Tolerance
Smallest Available Package on the Market
This is a Pb−Free Device
http://onsemi.com
MARKING DIAGRAM
LLGA12 (2x2 mm)
MU SUFFIX
CASE 513AA
1
YD = Specific Device Code M = Date Code G = Pb−Free Package
(Note: Microdot may be in either location)
YD M G
PIN CONNECTIONS
G
T ypical Applications
Portable Back Light
Digital Cellular Phone Camera Photo Flash
LCD and Key Board Simultaneous Drive
V
CC
C5
1 mF/6.3 V 1 mF/6.3 V
GND
V
CC−cpu
I/O pin
MCU
GND
GND
Figure 1. Typical Single Wire White LED Driver
C3
R1
10k
V
bat
220 nF/10 V
C1
C1N
V
bat
NC
CNTL I
REF
GND
10
C1P
NCP5612
12
11
6
5 4
1
220 nF/10 V
C2
9
C2N
LED/ICON
U1
8 C2P
V
out
LED1
1 mF/10 V
C4
7
LWY87S
D1
2
3
GND
D2
LWY87S
GND C1N
10
V
bat
C1P C2N
9
C2P
8
V
7
OUT
LED1
2 12 11 3
LED2
I
4
REF
CNTL
5
NC
6
1
(Top View)
ORDERING INFORMATION
Device Package Shipping
NCP5612MUTBG LLGA12
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
3000/Tape & Ree
© Semiconductor Components Industries, LLC, 2006
August, 2006 − Rev. 0
1 Publication Order Number:
NCP5612/D
NCP5612
1 mF/6.3 V
GND
C3
CNTL
11
5
V
150 k
bat
DIGITAL CONTROL
V
bat
GND
C1
220 nF 220 nF
12 10
CHARGE PUMP
DC/DC CONVERTER
V
bat
C2
9 8
OVERVOLTAGE
Q1
7
LWY87S
2
C4
1 mF/10 V
GND
V
out
LWY87S
D1
D2
GND
R1
10 k
GND
NC
4
ANALOG CONTROL
1
6
OVERTEMPERATURE
CURRENT MIRRORS
GND
Q2
3
Figure 2. Simplified Block Diagram
http://onsemi.com
2
NCP5612
PIN FUNCTION DESCRIPTION
Pin No. Symbol Function Description
1 GND POWER This pin is the GROUND signal for the power analog blocks and must be
2 LED1 INPUT, POWER This pin sinks to ground and monitors the current flowing into the first LED,
3 LED2 INPUT, POWER This pin sinks to ground and monitors the current flowing into the second LED,
4 I
REF
INPUT, ANALOG This pin provides the reference current, based on the internal band−gap
5 CNTL INPUT, DIGITAL This pin supports the flow of data between the external MCU and the
6 NC No internal connection 7 V
OUT
OUTPUT, POWER This pin provides the output voltage supplied by the DC/DC converter. The
8 C2P POWER One side of the external charge pump capacitor (C
9 C2N POWER One side of the external charge pump capacitor (C
10 C1P POWER One side of the external charge pump capacitor (C
11 V
BAT
INPUT, POWER Input Battery voltage to supply the analog and digital blocks. The pin must be
12 C1N POWER One side of the external charge pump capacitor (C
1. Using low ESR ceramic capacitor, 50 mW maximum, is mandatory to optimize the Charge Pump ef ficiency.
2. Total DC/DC output current is limited to 60 mA.
connected to the system ground. This pin is the GROUND reference for the DC/DC converter and the output current control. The pin must be connected to the system ground, a ground plane being strongly recommended.
intended to be used in backlight application. The current is limited to 30 mA maximum (Note 2). The LED1 is deactivated when the ICON bit of the LED−REG register is High. The LED1 is automatically disconnected when an open load is sensed pin 2 during the operation.
intended to be used in backlight application. The current is limited to 30 mA maximum (Note 2). The LED2 fulfills the ICON function, LED1 being deactivated, when the ICON bit of the LED−REG register is High. The LED2 is automatically disconnected when an open load is sensed pin 3 during the operation.
voltage reference, to control the output current flowing in the LED. A 1% tolerance, or better, resistor shall be used to get the highest accuracy of the LED biases. An external current source can be used to bias this pin to dim the light coming out of the LED. In no case shall the voltage at pin 4 be forced either higher or lower than the 600 mV provided by the internal reference.
NCP5612 internal registers. The protocol makes profit of a Single Wire structure associated to a Serial 8 bits format data flow.
V
pin must be decoupled to ground by a 1 mF ceramic capacitor located as
out
close as possible to the pin. Cares must be observed to minimize the parasitic inductance at this pin. The circuit shall not operate without such bypass capacitor connected across the V
pin and ground.
out
The output voltage is internally clamped to 5.5 V maximum in the event of no load situation. On the other hand, the output current is limited to 40 mA (typical) in the event of a short circuit to ground.
) is connected to this
FLY
pin, associated with C2N (Note 1)
) is connected to this
FLY
pin, associated with C2P (Note 1)
) is connected to this
FLY
pin, associated with C1N (Note 1)
decoupled to ground by a 1.0 mF minimum ceramic capacitor.
) is connected to this
FLY
pin, associated with C1P (Note 1)
http://onsemi.com
3
NCP5612
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply V
BAT
Output Power Supply Vout 7.0 V Digital Input Voltage
CNTL −0.3 < V < V
Digital Input Current Human Body Model: R = 1500 W, C = 100 pF (Note 3)
ESD 2.0
Machine Model LLGA12 Package
Power Dissipation @ TA = +85°C (Note 4) Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air Operating Ambient Temperature Range T Operating Junction Temperature Range T Maximum Junction Temperature T Storage Temperature Range T
R
R
P
D
q
JC
q
JA A J
Jmax
stg
Latch−up Current Maximum Rating per JEDEC Standard: JESD78 "100 mA
Moisture Sensitivity (Note 5) 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
3. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) "2.0 kV per JEDEC standard: JESD22−A114. Machine Model (MM) "200 V per JEDEC standard: JESD22−A115.
4. The maximum package power dissipation limit must not be exceeded.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
7.0 V
BAT
1.0
mA
kV
200
200
51
200
mW
°C/W °C/W
−40 to +85 °C
−40 to +125 °C +150 °C
−65 to +150 °C
V
V
POWER SUPPLY SECTION (Typical values are referenced to T
temperature, operating conditions 2.85 V < V
< 5.5 V , unless otherwise noted.)
bat
= +25°C, Min & Max values are referenced −40°C to +85°C ambient
A
Rating Pin Symbol Min Typ Max Unit
Power Supply 11 V Continuous DC Current in the Load @ Vf = 3.8 V , 3.2 V < V
< 5.5 V , ICON = L
bat
7 I
(30 mA per LED)
Output ICON Current (ICON bit = H) @ 3.2 V < V
< 4.2 V , TA = +25°C 7 I
bat
Continuous Output Short Circuit Current 7 I Output Voltage Compliance (OVP) 7 V DC/DC Start Time (C
operation, @ V
Output Voltage T urn−off ( C
V
= 5%
out
Standby Current, 0°C < TA < +85°C
V
= 3.6 V , I
bat
out
Operating Current, @ I Output LED to LED Current Matching, V
I
= 10 mA, LED1 & LED2 are Identical −25°C < TA < 85°C
LED
Output Current Tolerance @ V
= 1.0 mF) from end of the CNTL T
out
= 3.6 V
bat
= 1 mF) From Last Low Level at CNTL pin to
out
= 0 mA, ICON = L
= 0 mA, ICON = H, V
out
bat
= 3.6 V , I
bat
delay to full load
dst
12 T
12 T
11 I
= 3.6 V 11 I
bat
= 3.6 V ,
= 10 mA −25°C < Ta < 85°C 2, 3 I
LED
2, 3 I
Charge Pump Operating Frequency F Thermal Shutdown Protection T Thermal Shutdown Protection Hysteresis T Efficiency − LED1 = LED2 = 10 mA, Vf = 3.2 V , V
Efficiency − LED1 = LED2 = 30 mA, Vf = 3.75 V , V
= 3.8 V (Total = 20 mA)
bat
= 3.8 V (Total = 60 mA)
bat
bat
out
ICONTOL
sch
out
start
off
stdb
op
MAT
TOL
pwr
SD
SDH
E
PWR
2.7 5.5 V mA
60
450 550 mA
40 100 mA
4.8 5.7 V
150 ms
500 ms
1.0 mA
600 mA
"0.2 "1.0 %
"1.0 %
1.0 MHz
160 °C
30 °C
87 84
%
http://onsemi.com
4
Loading...
+ 7 hidden pages