The ML2201 is a PCM-based speech synthesizer LSI having an on-chip 384K Mask ROM, D/A Converter and
Low Pass Filter. Utilizing the serial interface enables smaller footprint packaging, which makes the chip an ideal
choice for a pre-recorded message subsystem used with today’s size-critical applications.
FEATURES
•
Sampling Frequency (Selectable for each single phrase)
Note:As of February 2000, ceramic oscillation on this chip is under development and thus the chip is not
functional with a ceramic oscillator. The manufacturer intends to add a ceramic oscillation option to the
chip. For more information on availability in commercial quantity, contact your sales representative.
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PIN LAYOUT (TOP VIEW)
FEDL2201-01
ML2201–XXX
BLOCK DIAGRAM
ST
PI
PDWN
ST
PI
GND
AOUT
Serial
Interface
1
2
3
4
8-Pin Plastic SSOP
5
16 bit Address
controller
PDWN
8
XT
7
6
XT
5
V
DD
16
384 Kbit ROM
8
Edit ROM 2 Kbit
(Phrase Control Table)
8
Address ROM 2 Kbit
(Phrase Address Table)
XT
XT
Timing
Controller
OSC
Circuit
DD
Reset, Power Down
8
PCM
Synthesizer
10
10 bit DAC
LPF
AOUTGNDV
Test ROM 2 Kbit
PCM data Area
378 Kbit
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PIN DESCRIPTION
Pin No.Pin NameI/ODescription
The playback trigger pin.
The number of pulses input to the PI pin, while this pin is held “L”,
1STI
2PII
3GND—The ground pin.
4AOUTO
5VDD—
6XTI
7XTO
8PDWNI
determines the Phrase Address for playback. At the ST’s rising edge, the
phrase address data is loaded into the LSI and playback starts. When no
pulse input to PI occurs w hile this p in is held “L”, the LS I recognizes it as the
“Stop Code” that results in stopping playback.
The address input pin.
The number of pulses input to this pin, while the ST pin is held “L”,
determines the Phrase Address for playback.
When 32 pulses are input, th e interna l counter ret urns to its initial v alue, “0”.
The analog output pin.
Configured as N-MOS open drain, analog signal is output in the form of
change in output (attraction) current. While the PDWN pin being held “H”,
this pin is sustained at 1/2 level and thus the current keeps on flowing.
When shifting to standby state and shifting back to ready state from
standby, the pop-noise canceller is put to work.
The power supply pin.
Insert a 0.1 µF bypass capacitor between this pin and the GND pin.
The external clock input pin.
The ceramic resonator connection pin for ceramic oscillation option under
development.
Keep this pin open.
The LSI’s operations may become unstable if this pin includes any
capacitive component.
The ceramic resonator connection pin for ceramic oscillation option under
development.
The power down pin.
The LSI stays standby state while the pin being held “L”.
FEDL2201-01
ML2201–XXX
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FEDL2201-01
Semiconductor
1
ML2201–XXX
ABSOLUTE MAXIMUM RATINGS
(GND = 0 V)
ParameterSymbolConditionRatingUnit
Power Supply VoltageV
Input VoltageV
Storage TemperatureT
DD
STG
IN
Ta = 25°C
—–55 to +150°C
–0.3 to +7.0V
–0.3 to V
+0.3V
DD
Power Drain AllowancePdTa = 25°C250mW
RECOMMENDED OPERATING CONDITIONS
(GND = 0 V)
ParameterSymbolConditionRangeUnit
f
= 3.5 to 4.5 MHz+2.0 to +5.5V
EXTCLK
f
Power Supply VoltageV
DD
= 3.5 to 13.5 MHz+2.6 to +5.5V
EXTCLK
f
= 3.5 to 17.0 MHz+3.0 to +5.5V
EXTCLK
Min.Typ.Max.
VDD = 2.0 to 5.5 V3.54.0964.5
MHz
External Clock Frequencyf
EXTCLK
Operating TemperatureT
OP
V
= 2.6 to 5.5 V3.5—13.5
DD
V
= 2.7 to 5.5 V3.5—14.5
DD
VDD = 3.0 to 5.5 V3.5—17.0
—–40 to +85°C
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ELECTRICAL CHARACTERISTICS
DC Characteristics
FEDL2201-01
ML2201–XXX
VDD = 2.0 to 5.5 V, GND = 0 V, f
= 4.096 MHz, Ta = –40 to +85°C (unless otherwise specified)
EXTCLK
ParameterSymbolConditionMin.Typ.Max.Unit
F
“H” Input VoltageV
“L” Input VoltageV
“H” Input CurrentI
“L” Input CurrentI
Supply CurrentI
Standby CurrentI
IH
IL
IH
IL
DD
DS
EXTCLK
VDD = 3.0 to 5.5 V
f
EXTCLK
V
f
EXTCLK
V
f
V
F
EXTCLK
VDD = 3.0 to 5.5 V
f
EXTCLK
V
f
EXTCLK
VDD = 2.6 to 2.7 V
f
V
Except AOUT
output current
Ta = –40 to +70°C——10µA
Ta = –40 to +85°C——50µA
> 14.5 MHz
≤ 14.5 MHz
= 2.7 to 5.5 V
DD
≤ 13.5 MHz
= 2.6 to 2.7 V
DD
≤ 4.5 MHz
EXTCLK
= 2.0 to 5.5 V
DD
> 14.5 MHz
≤ 14.5 MHz
= 2.7 to 5.5 V
DD
≤ 13.5 MHz
≤ 4.5 MHz
EXTCLK
= 2.0 to 5.5 V
DD
VIH = V
DD
VIL = GND–10——µA
VDD = 5.5 V
f
= 4.096 MHz
EXTCLK
VDD = 3.0 V
f
= 4.096 MHz
EXTCLK
VDD = 2.0 V
f
= 4.096 MHz
EXTCLK
VDD = 5.5 V
f
= 16 MHz
EXTCLK
V
= 3.0 V
DD
f
= 16 MHz
EXTCLK
V
DD
× 0.85
V
DD
× 0.8
V
DD
× 0.85
V
DD
× 0.8
——V
——V
——V
——V
——
——
——
——
——10µA
—1.73.9mA
—0.92.1mA
—0.51.4mA
—4.612.0mA
—1.86.5mA
VDD = 2.0 to 5.5 V0.5—10.0mA
AOUT Output CurrentI
AOUT
At max.
output current
VDD = 5.5 V4.36.810.0mA
VDD = 3.0 V1.42.73.9mA
V
= 2.0 V0.51.22.2mA
DD
V
DD
× 0.15
V
DD
× 0.2
V
DD
× 0.15
V
DD
× 0.2
V
V
V
V
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AC Characteristics
FEDL2201-01
ML2201–XXX
VDD = 2.0 to 5.5 V, GND = 0 V, f
ParameterSymbolConditionMin.Typ.Max.Unit
Clock Oscillation Duty Cyclef
Reset Input Time after Powering Upt
PDWN Hold Time after Reset Inputt
D/A Converter Transit Time
(Pop-Noise Canceller Work Time)
t
DAR
Note *1
PDWN – ST Setup Timet
ST – PI Setup Timet
PI Pulse Widtht
PI Cycle Timet
ST – PI Hold Timet
ST – AOUT Setup Time
Note *2
Phrase Stop Time
Note *2
Silence Time between Phrases
Note *2
Stop ST Pulse Wi dtht
Phrase ST – Phrase ST Pulse Duration
Note *2
Phrase ST – Stop ST Pulse Duration
Note *2
Stop ST – Phrase ST Pulse Duration
Note *2
Sampling Frequency
Note *3
= 4.096 MHz, Ta = –40 to +85°C (unless otherwise specified)
EXTCLK
DUTY
RST
PDH
, t
PDSS
SPS
PW
PC
SPH
t
SAS
t
DPS
t
BLN
SSW
t
PP
t
PS
t
SP
f
SAM
DAF
—405060%
—10——µs
—10——µs
—606468ms
—1——µs
—1——µs
—0.35—2000µs
—0.7—4000µs
—1——µs
At f
= 8.0 kHz—1050µs
SAM
At f
= 8.0 kHz—700µs
SAM
At f
= 8.0 kHz—700µs
SAM
—0.35—2000µs
At f
= 8.0 kHz1050——µs
SAM
At f
= 8.0 kHz1050——µs
SAM
At f
= 8.0 kHz500——µs
SAM
—3.9—28.0kHz
Note *1: The value changes in proportion to the external clock frequency, f
Note *2: The value changes in proportion to the sampling frequency, f
SAM
EXTCLK
.
Note *3: The sampling frequency is determined by the external clock frequency, f
factor that is selected for each phrase.
.
, and the dividing
EXTCLK
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