NXP MicroPak, MicroPak II Technical data

NXP MicroPak and
MicroPak II packages for
single-, dual-, and triple­gate logic functions

World’s smallest leadless logic packages

MicroPak and MicroPak II packages are the world’s smallest packages for single-, dual-, and
triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger
pad size that provides a more rugged and reliable bond between the device and the PC board.

Key features

4 Smallest package, more space for

added functionality

4 Leadless format eliminates assembly

problems

4 Pb-free and RoHS compliant
4 Temperature range: -40 to +125 °C

Applications

4 Mobile phones and PDAs
4 Laptop computers and high-density

boards

4 Digital still cameras and MP3 players
4 Portable/handheld test and

measurement and consumer
equipment

Ideally suited for portable applications,
where board space is always a concern,
MicroPak and MicroPak II packages
create a smaller, slimmer design and
frees up space for added functionality.

The form factor is similar to that of
popular passive components and a
variety of popular functions are available,
including gates, flip-flops, single and
dual buffers, inverters, configurable
gates and translators.

MicroPak and MicroPak II use the same
silicon as found in the HC/T, AHC/T,
LVC, and AUP PicoGate families, so
the electrical performance is highly
predictable. For easy upgrades, the
MicroPak and MicroPak II packages also
maintain the industry-standard pad pitch
of 0.5 mm and 0.35mm.

The six-pin MicroPak (GM) package
measures only 1.0 x 1.45 x 0.5 mm, so
they are 65% smaller than PicoGate
equivalents housed in SOT363 (SC-88) or
GW packages. The eight-pin packages
deliver similar space savings.

The six-pin MicroPakII is 33% smaller
than the MicroPak measuring only 1.0 x

1.0 mm and is 75% smaller than PicoGate
SOT353/363 package.

The MicroPak package can be used
as drop-in replacements for BGA and
Wafer-level Chip Scale Package (WCSP)
devices, since the layout requirements
for alignment and geometry are the
same for all of them.

MicroPak and MicroPak II are more
rugged than WCSP. Encapsulation
protects the die from breaks, scratches,

0.15 mm

0.22 mm < 0.5 mm

0.127 mm

Wire bond (gold wire)

Mold compound

Matt tin

Die-attach material

Die

Package suffix

0.0

0.5

1.0

1.5

2.0

2.5

MicroPak

MicroPak II

Leadless

Leadless

Leaded

Leaded

Leadless

Leaded

Leaded

Leaded

SOT666 SOT553 fSv

SOT665

WCSP

FE

mm

2

Footprint (area)

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

MicroPak

MicroPak II

Leadless

Leadless

Leaded

Leaded

Leadless

Leaded

Leaded

Leaded

SOT666 SOT553 fSv

SOT665

WCSP

FE

mm

2

Contact area (total)

0

5

10

15

20

25

30

MicroPak

MicroPak II

Leadless

Leadless

Leaded

Leaded

Leadless

Leaded

Leaded

Leaded

SOT666 SOT553 fSv

SOT665

WCSP

FE

(%)

Contact — footprint ratio

0

5

10

15

20

25

MicroPak

MicroPak II

Leadless

Leadless

Leaded

Leaded

Leadless

Leaded

Leaded

Leaded

SOT666 SOT553 fSv

SOT665

WCSP

FE

Pull force

Dislocation force (Newtons)

0

5

10

15

20

25

Shear force

Single gate

Dual gate

Triple gate

GM GT GM GF
6-Pin 8-Pin 8-Pin 6-Pin

SOT886 SOT883 SOT902 SOT891

SOT886 SOT883 SOT902 SOT891

MicroPak cross sectional view

and environmental conditions. The
pads are 40% larger than on a WCSP
device, and 30% larger than on a leaded
package of the same footprint, so there’s
more contact area with the circuit board.

MicroPak and MicroPak II have no
leads, so they eliminate the assembly
problems associated with bent and non­planar leads. They’re also Pb-free and
RoHS compliant, so they meet higher
standards for environmental friendliness.

The NXP MicroPak and MicroPak II
packages evolved from the company’s
Micro Carrier Device (MCD), a discrete
MOS leadless package built using a
quad flat non-leaded technology. MCD
is the world’s smallest package for single
diodes and transistors and improves RF
performance by reducing the parasitic
capacitance between the die and its
package.

SOT883 SOT902

6-Pin 8-Pin 8-Pin 6-Pin

Width (mm) 1.00 1.00 1.60 1.00
Length (mm) 1.45 1.95 1.60 1.00
Pitch (mm) 0.50 0.50 0.50 0.35

MicroPak package outline (5-pin functions use SOT886-1, pin 5 is NC).

For more information about MicroPak
and MicroPak II, please visit
www.nxp.com/logic.

MicroPak™ is a trademark of

Fairchild Semiconductors

www.nxp.com

© 2006 NXP N .V.

All r ights reserved. Reproduc tion i n whol e or in pa rt is pro hibited wi thout the prior writ ten conse nt of the copyri ght ow ner. The

inform ation presente d in thi s do cument do es n ot form part of any qu otatio n or contrac t, is believed to be accura te and reliab le and

may be change d witho ut notice. N o liabil ity will be accepted by the pub lisher for a ny conseque nce of i ts use. Publ ication the reof

does no t convey nor i mply any licens e under patent- or o ther ind ustri al or intel lectual pro pert y rights.

MicroPak offers the largest total contact area, so it provides the greatest mechanical strength

Date of re lease: De cember 2006

Docum ent orde r number : 9397 750 15771

Printe d in the USA