NXP 74HC 4066D NXP Datasheet

INTEGRATED CIRCUITS
DATA SH EET
74HC4066; 74HCT4066
Quad bilateral switches
Product specification Supersedes data of 1998 Nov 10
2003 Jun 17
Quad bilateral switches 74HC4066; 74HCT4066

FEATURES

Very low ON-resistance: –50Ω(typical) at VCC= 4.5 V –45Ω(typical) at VCC= 6.0 V –35Ω(typical) at VCC= 9.0 V.
Complies with JEDEC standard no. 8-1A
ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V.
Specified from 40 to +85 °C and 40 to +125 °C.

QUICK REFERENCE DATA

GND = 0 V; T
=25°C; tr=tf= 6 ns.
amb
SYMBOL PARAMETER CONDITIONS
t
PZH/tPZL
t
PHZ/tPLZ
C
I
C
PD
turn-on time nE to V turn-off time nE to V
os os
input capacitance 3.5 3.5 pF power dissipation
CL= 15 pF; RL=1kΩ; VCC=5V1112ns CL= 15 pF; RL=1kΩ; VCC=5V1316ns
notes 1 and 2 11 12 pF
capacitance per switch
C
S
maximum switch capacitance

GENERAL DESCRIPTION

The 74HC4066 and 74HCT4066 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4066B. Theyare specified in compliance with JEDEC standard no. 7A.
The 74HC4066 and 74HCT4066 have four independent analog switches. Each switch has two input/output pins (pins nY or nZ) and an active HIGH enable input pin (pin nE).Whenpin nE = LOW the belonging analogswitch is turned off.
The 74HC4066/74HCT4066 is pin compatible with the 74HC4016/74HCT4066 but exhibits a much lower on-resistance. In addition, the on-resistance is relatively constant over the full input signal range.
TYPICAL
UNIT
74HC4066 74HCT4066
88pF
Notes
1. C
is used to determine the dynamic power dissipation (PDin µW).
PD
PD=CPD× V
2
× fN+Σ[(CL+CS)×V
CC
2
× fo] where:
CC
fi= input frequency in MHz; fo= output frequency in MHz; CL= output load capacitance in pF; CS= maximum switch capacitance in pF; VCC= supply voltage in Volts; N = total load switching outputs; Σ[(CL+CS)×V
2
× fo] = sum of the outputs.
CC
2. For 74HC4066 the condition is VI= GND to VCC.
For 74HCT4066 the condition is VI= GND to VCC− 1.5 V.
2003 Jun 17 2
Quad bilateral switches 74HC4066; 74HCT4066

FUNCTION TABLE

See note 1.
INPUT nE SWITCH
L off
Note
1. H = HIGH voltage level.
L = LOW voltage level.

ORDERING INFORMATION

TYPE NUMBER
PACKAGE
TEMPERATURE RANGE PINS PACKAGE MATERIAL CODE
74HC4066N 40 to 125 °C 14 DIP14 plastic SOT27-1 74HCT4066N 40 to 125 °C 14 DIP14 plastic SOT27-1 74HC4066D 40 to 125 °C 14 SO14 plastic SOT108-1 74HCT4066D 40 to 125 °C 14 SO14 plastic SOT108-1 74HC4066DB 40 to 125 °C 14 SSOP14 plastic SOT337-1 74HCT4066DB 40 to 125 °C 14 SSOP14 plastic SOT337-1 74HC4066PW 40 to 125 °C 14 TSSOP14 plastic SOT402-1 74HCT4066PW 40 to 125 °C 14 TSSOP14 plastic SOT402-1 74HC4066BQ 40 to 125 °C 14 DHVQFN14 plastic SOT762-1 74HCT4066BQ 40 to 125 °C 14 DHVQFN14 plastic SOT762-1

PINNING

PIN SYMBOL DESCRIPTION
1 1Y independent input/output 2 1Z independent input/output 3 2Z independent input/output 4 2Y independent input/output
handbook, halfpage
1Y 1Z 2Z
1 2 3
14
V
CC
13
1E
12
4E
5 2E enable input (active HIGH) 6 3E enable input (active HIGH) 7 GND ground (0 V) 8 3Y independent input/output 9 3Z independent input/output
10 4Z independent input/output
2Y 2E 3E
GND
4
4066
5 6 7
MGR253
11
4Y
10
4Z
9
3Z
8
3Y
11 4Y independent input/output 12 4E enable input (active HIGH) 13 1E enable input (active HIGH) 14 V
CC
supply voltage
Fig.1 Pin configuration DIP14, SO14 and
(T)SSOP14.
2003 Jun 17 3
Quad bilateral switches 74HC4066; 74HCT4066
handbook, halfpage
2
1Z
3
2Z
4
2Y
5
2E
6
3E
Top view
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
V
1Y
CC
114
(1)
GND
8
7
GND 3Y
13
12
11
10
9
MBL891
1E
4E
4Y
4Z
3Z
Fig.2 Pin configuration DHVQFN14.
handbook, halfpage
1E
13
52E
63E
12 4E
MGR254
Fig.3 Logic symbol.
11Y 21Z
42Y 32Z
83Y 93Z
114Y 104Z
handbook, halfpage
1 13 # 4 5# 8 6# 11 12 #
MGR255
2
3
9
10
Fig.4 IEC logic symbol.
2003 Jun 17 4
handbook, halfpage
1
11
13 #
X1
4
11
5#
X1
8
11
6#
X1
11
11
12 #
X1
2
3
9
10
MGR256
Quad bilateral switches 74HC4066; 74HCT4066
handbook, halfpage
6
4
5
1
13 1E
1Y
1Z 2
2E
2Y
3E
2Z 3
Fig.5 Functional diagram.
8 3Y
3Z 9
12 4E
11 4Y
4Z 10
MGR257
handbook, halfpage
nE
Fig.6 Schematic diagram (one switch).
V
GND
CC
nY
V
CC
nZ
MGR258
2003 Jun 17 5
Quad bilateral switches 74HC4066; 74HCT4066

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS
UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
74HC4066 74HCT4066
V
CC
V
I
V
S
T
amb
supply voltage 2.0 5.0 10.0 4.5 5.0 5.5 V input voltage GND V switch voltage GND V operating ambient
temperature
see DC and AC characteristics
40 +25 +85 40 +25 +85 °C
40 +125 40 +125 °C
GND V
CC
GND V
CC
CC CC
V V
per device
t
r,tf
input rise and fall times VCC= 2.0 V 6.0 1000 6.0 500 ns
= 4.5 V −−500 −−−ns
V
CC
V
= 6.0 V −−400 −−−ns
CC
V
= 10.0 V −−250 −−−ns
CC

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
I
IK
I
SK
I
S
I
, I
CC
T
stg
P
tot
P
S
supply voltage 0.5 +11.0 V input diode current VI< 0.5 Vor VI>VCC+ 0.5 V −±20 mA switch diode current VS< 0.5 Vor VS>VCC+ 0.5 V −±20 mA switch current 0.5V<VO<VCC+ 0.5 V; note 1 −±25 mA
GNDVCC
or GND current −±50 mA storage temperature 65 +150 °C power dissipation T
= 40 to +125 °C; note 2 500 mW
amb
power dissipation per switch 100 mW
Notes
1. To avoid drawing V
current out of pin nZ, when switch current flows in pin nY, the voltage drop across the
CC
bidirectional switch must not exceed 0.4 V. If the switch current flows into pin nZ, no VCCcurrent will flow out of pin nY. In this case there is no limit for the voltage drop across the switch, but the voltages at pins nY and nZ may not exceed VCCor GND.
2. For DIP14 packages: above 70 °C derate linearly with 12 mW/K. For SO14 packages: above 70 °C derate linearly with 8 mW/K. For SSOP14 and TSSOP16 packages: above 60 °C derate linearly with 5.5 mW/K. For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.
2003 Jun 17 6
Quad bilateral switches 74HC4066; 74HCT4066
DC CHARACTERISTICS Family 74HC4066
Voltages are referenced to GND (ground = 0 V); Visis the input voltage at pins nY or nZ, whichever is assigned as an input; V
is the output voltage at pins nY or nZ, whichever is assigned as an output.
os
SYMBOL PARAMETER
T
= 40 to +85 °C; note 1
amb
V
IH
HIGH-level input voltage
V
IL
I
LI
I
S(OFF)
LOW-level input voltage 2.0 0.8 0.50 V
input leakage current VI=VCCor GND 6.0 −−±1.0 µA
analog switch current OFF-state
I
S(ON)
analog switch current ON-state
I
CC
quiescent supply current
TEST CONDITIONS
OTHER V
per channel; VI=VIHor VIL; VS=VCC− GND; see Fig.7
VI=VIHor VIL; VS=VCC− GND; see Fig.8
VI=VCCor GND; Vis= GND or VCC; Vos=VCCor GND
MIN. TYP. MAX. UNIT
(V)
CC
2.0 1.5 1.2 V
4.5 3.15 2.4 V
6.0 4.2 3.2 V
9.0 6.3 4.7 V
4.5 2.1 1.35 V
6.0 2.8 1.80 V
9.0 4.3 2.70 V
10.0 −−±2.0 µA
10.0 −−±1.0 µA
10.0 −−±1.0 µA
6.0 −−20.0 µA
10.0 −−40.0 µA
2003 Jun 17 7
Quad bilateral switches 74HC4066; 74HCT4066
SYMBOL PARAMETER
= 40 to +125 °C
T
amb
V
IH
HIGH-level input voltage
V
IL
I
LI
I
S(OFF)
LOW-level input voltage 2.0 −−0.50 V
input leakage current VI=VCCor GND 6.0 −−±1.0 µA
analog switch current OFF-state
I
S(ON)
analog switch current ON-state
I
CC
quiescent supply current
Note
1. All typical values are measured at T
TEST CONDITIONS
OTHER V
per channel; VI=VIHor VIL; VS=VCC− GND; see Fig.7
VI=VIHor VIL; VS=VCC− GND; see Fig.8
VI=VCCor GND; Vis= GND or VCC; Vos=VCCor GND
=25°C.
amb
MIN. TYP. MAX. UNIT
(V)
CC
2.0 1.5 −−V
4.5 3.15 −−V
6.0 4.2 −−V
9.0 6.3 −−V
4.5 −−1.35 V
6.0 −−1.80 V
9.0 −−2.70 V
10.0 −−±2.0 µA
10.0 −−±1.0 µA
10.0 −−±1.0 µA
6.0 −−40.0 µA
10.0 −−80.0 µA
2003 Jun 17 8
Quad bilateral switches 74HC4066; 74HCT4066
Family 74HCT4066
Voltages are referenced to GND (ground = 0 V); Visis the input voltage at pins nY or nZ, whichever is assigned as an input; V
is the output voltage at pins nY or nZ, whichever is assigned as an output.
os
SYMBOL PARAMETER
T
= 40 to +85 °C; note 1
amb
V
IH
HIGH-level input voltage
V
IL
I
LI
I
S(OFF)
LOW-level input voltage 4.5 to 5.5 1.2 0.8 V input leakage current VI=VCCor GND 5.5 −−±1.0 µA analog switch current
OFF-state
I
S(ON)
analog switch current ON-state
I
CC
quiescent supply current
I
CC
additional quiescent supply current per input
T
= 40 to +125 °C
amb
V
IH
HIGH-level input voltage
V
IL
I
LI
I
S(OFF)
LOW-level input voltage 4.5 to 5.5 −−0.8 V input leakage current VI=VCCor GND 5.5 −−±1.0 µA analog switch current
OFF-state
I
S(ON)
analog switch current ON-state
I
CC
quiescent supply current
I
CC
additional quiescent supply current per input
TEST CONDITIONS
OTHER V
per channel; VI=VIHor VIL; VS=VCC− GND; see Fig.7
VI=VIHor VIL; VS=VCC− GND; see Fig.8
VI=VCCor GND; Vis= GND or VCC; Vos=VCCor GND
VI=VCC− 2.1 V; other inputs at V
CC
or GND
per channel; VI=VIHor VIL; VS=VCC− GND; see Fig.7
VI=VIHor VIL; VS=VCC− GND; see Fig.8
VI=VCCor GND; Vis= GND or VCC; Vos=VCCor GND
VI=VCC− 2.1 V; other inputs at V
CC
or GND
MIN. TYP. MAX. UNIT
(V)
CC
4.5 to 5.5 2.0 1.6 V
5.5 −−±1.0 µA
5.5 −−±1.0 µA
4.5 to 5.5 −−20.0 µA
4.5 to 5.5 100 450 µA
4.5 to 5.5 2.0 −− V
10.0 −−±1.0 µA
10.0 −−±1.0 µA
4.5 to 5.5 −−40.0 µA
4.5 to 5.5 −−490 µA
Note
1. All typical values are measured at T
amb
=25°C.
2003 Jun 17 9
Quad bilateral switches 74HC4066; 74HCT4066
handbook, full pagewidth
(from enable inputs)
VI = VCC or GND
LOW
nY
nZ
MGR260
AA
GND
Fig.7 Test circuit for measuring OFF-state current.
VO = GND or V
CC
handbook, full pagewidth
VI = VCC or GND
HIGH
(from enable inputs)
nY
Fig.8 Test circuit for measuring ON-state current.
2003 Jun 17 10
nZ
MGR261
AA
GND
VO (open circuit)
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