NSC DP8570AVX, DP8570AV, DP8570AN Datasheet

TL/F/8638
DP8570A Timer Clock Peripheral (TCP)
May 1993
DP8570A Timer Clock Peripheral (TCP)
General Description
The DP8570A is intended for use in microprocessor based systems where information is required for multi-tasking, data logging or general time of day/date information. This device is implemented in low voltage silicon gate microCMOS tech­nology to provide low standby power in battery back-up en­vironments. The circuit’s architecture is such that it looks like a contiguous block of memory or I/O ports. The address space is organized as 2 software selectable pages of 32 bytes. This includes the Control Registers, the Clock Coun­ters, the Alarm Compare RAM, the Timers and their data RAM, and the Time Save RAM. Any of the RAM locations that are not being used for their intended purpose may be used as general purpose CMOS RAM.
Time and date are maintained from 1/100 of a second to year and leap year in a BCD format, 12 or 24 hour modes. Day of week, day of month and day of year counters are provided. Time is controlled by an on-chip crystal oscillator requiring only the addition of the crystal and two capacitors. The choice of crystal frequency is program selectable.
Two independent multifunction 10 MHz 16-bit timers are provided. These timers operate in four modes. Each has its own prescaler and can select any of 8 possible clock inputs. Thus, by programming the input clocks and the timer coun­ter values a very wide range of timing durations can be achieved. The range is from about 400 ns (4.915 MHz oscil­lator) to 65,535 seconds (18 hrs., 12 min.).
Power failure logic and control functions have been integrat­ed on chip. This logic is used by the TCP to issue a power fail
interrupt, and lock out the mp interface. The time power fails may be logged into RAM automatically when V
BB
l
VCC.
Additionally, two supply pins are provided. When V
BB
l
VCC, internal circuitry will automatically switch from the main supply to the battery supply. Status bits are provided to indi­cate initial application of battery power, system power, and low battery detect. (Continued)
Features
Y
Full function real time clock/calendar Ð 12/24 hour mode timekeeping Ð Day of week and day of years counters Ð Four selectable oscillator frequencies Ð Parallel Resonant Oscillator
Y
Two 16-bit timers Ð 10 MHz external clock frequency Ð Programmable multi-function output Ð Flexible re-trigger facilities
Y
Power fail features Ð Internal power supply switch to external battery Ð Power Supply Bus glitch protection Ð Automatic log of time into RAM at power failure
Y
On-chip interrupt structure Ð Periodic, alarm, timer and power fail interrupts
Y
Up to 44 bytes of CMOS RAM
Y
INTR/MFO/T1 pins programmable High/Low and push­pull or open drain
Block Diagram
TL/F/8638– 1
FIGURE 1
TRI-STATEÉis a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation RRD-B30M75/Printed in U. S. A.
Absolute Maximum Ratings (Notes1&2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
b
0.5V toa7.0V
DC Input Voltage (VIN)
b
0.5V to V
CC
a
0.5V
DC Output Voltage (V
OUT
)
b
0.5V to V
CC
a
0.5V
Storage Temperature Range
b
65§Ctoa150§C
Power Dissipation (PD) 500 mW
Lead Temperature (Soldering, 10 sec.) 260§C
Operation Conditions
Min Max Unit
Supply Voltage (V
CC
) (Note 3) 4.5 5.5 V
Supply Voltage (VBB) (Note 3) 2.2 V
CC
b
0.4 V
DC Input or Output Voltage
0.0 V
CC
V
(V
IN,VOUT
)
Operation Temperature (T
A
)
b
40
a
85§C
Electr-Static Discharge Rating TBD 1 kV
Transistor Count 15,200
Typical Values
i
JA
DIP Boarde45§C/W
Socket
e
50§C/W
i
JA
PLCC Boarde77§C/W
Socket
e
85§C/W
DC Electrical Characteristics
V
CC
e
5Vg10%, V
BB
e
3V, V
PFAIL
l
VIH,C
L
e
100 pF (unless otherwise specified)
Symbol Parameter Conditions Min Max Units
V
IH
High Level Input Voltage Any Inputs Except OSC IN, 2.0 V (Note 4) OSC IN with External Clock V
BB
b
0.1 V
V
IL
Low Level Input Voltage All Inputs Except OSC IN 0.8 V
OSC IN with External Clock 0.1 V
V
OH
High Level Output Voltage I
OUT
eb
20 mAV
CC
b
0.1 V
(Excluding OSC OUT) I
OUT
eb
4.0 mA 3.5 V
V
OL
Low Level Output Voltage I
OUT
e
20 mA 0.1 V
(Excluding OSC OUT) I
OUT
e
4.0 mA 0.25 V
I
IN
Input Current (Except OSC IN) V
IN
e
VCCor GND
g
1.0 mA
I
OZ
Output TRI-STATEÉCurrent V
OUT
e
VCCor GND
g
5.0 mA
I
LKG
Output High Leakage Current V
OUT
e
VCCor GND
g
5.0 mA
T1, MFO, INTR Pins Outputs Open Drain
I
CC
Quiescent Supply Current F
OSC
e
32.768 kHz
(Note 7) V
IN
e
VCCor GND (Note 5) 260 mA
V
IN
e
VCCor GND (Note 6) 1.0 mA
V
IN
e
VIHor VIL(Note 6) 12.0 mA
F
OSC
e
4.194304 MHz or
4.9152 MHz
V
IN
e
VCCor GND (Note 6) 8 mA
V
IN
e
VIHor VIL(Note 6) 20 mA
I
CC
Quiescent Supply Current V
BB
e
GND
(Single Supply Mode) V
IN
e
VCCor GND
(Note 7) F
OSC
e
32.768 kHz 80 mA
F
OSC
e
4.9152 MHz or 7.5 mA
4.194304 MHz
I
BB
Standby Mode Battery V
CC
e
GND
Supply Current OSC OUT
e
Open Circuit,
(Note 8) Other Pins
e
GND
F
OSC
e
32.768 kHz 10 mA
F
OSC
e
4.9152 MHz or 400 mA
4.194304 MHz
I
BLK
Battery Supply Leakage 2.2VsV
BB
s
4.0V Other Pins at GND V
CC
e
GND, V
BB
e
4.0V 1.5 mA
V
CC
e
5.5V, V
BB
e
2.2V
b
5 mA
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: For F
OSC
e
4.194304 or 4.9152 MHz, VBBminimume2.8V. In battery backed mode, V
BB
s
V
CC
b
0.4V. Single Supply Mode: Data retention voltage is 2.2V min. In single Supply Mode (Power connected to V
CC
pin) 4.5VsV
CC
s
5.5V.
Note 4: This parameter (V
IH
) is not tested on all pins at the same time.
Note 5: This specification tests I
CC
with all power fail circuitry disabled, by setting D7 of Interrupt Control Register 1 to 0.
Note 6: This specification tests I
CC
with all power fail circuitry enabled, by setting D7 of Interrupt Control Register 1 to 1.
Note 7: This specification is tested with both the timers and OSC IN driven by a signal generator. Contents of the Test Register
e
00(H), the MFO pin is not
configured as buffered oscillator out and MFO, T1, INTR, are configured as open drain.
Note 8: This specification is tested with both the timers off, and only OSC IN is driven by a signal generator. Contents of the Test Register
e
00(H) and the MFO
pin is not configured as buffered oscillator out.
2
AC Electrical Characteristics
V
CC
e
5Vg10%, V
BB
e
3V, V
PFAIL
l
VIH,C
L
e
100 pF (unless otherwise specified)
Symbol Parameter Min Max Units
READ TIMING
t
AR
Address Valid Prior to Read Strobe 20 ns
t
RW
Read Strobe Width (Note 9) 80 ns
t
CD
Chip Select to Data Valid Time 80 ns
t
RAH
Address Hold after Read (Note 10) 3 ns
t
RD
Read Strobe to Valid Data 70 ns
t
DZ
Read or Chip Select to TRI-STATE 60 ns
t
RCH
Chip Select Hold after Read Strobe 0 ns
t
DS
Minimum Inactive Time between Read or Write Accesses 50 ns
WRITE TIMING
t
AW
Address Valid before Write Strobe 20 ns
t
WAH
Address Hold after Write Strobe (Note 10) 3 ns
t
CW
Chip Select to End of Write Strobe 90 ns
t
WW
Write Strobe Width (Note 11) 80 ns
t
DW
Data Valid to End of Write Strobe 50 ns
t
WDH
Data Hold after Write Strobe (Note 10) 3 ns
t
WCH
Chip Select Hold after Write Strobe 0 ns
TIMER 0/TIMER 1 TIMING
F
TCK
Input Frequency Range DC 10 MHz
t
CK
Propagation Delay Clock to Output Þ 120 ns
t
GO
Propagation Delay G0 to G1
100 ns
to Timer Output (Note 12) O
t
PGW
Pulse Width G0 or G1 É (Note 12) 25 ns
t
GS
Setup Time, G0, G1 to TCK (Note 13) 100 ns
INTERRUPT TIMING
t
ROLL
Clock Rollover to INTR Out is Typically 16.5 ms
Note 9: Read Strobe width as used in the read timing table is defined as the period when both chip select and read inputs are low. Hence read commences when both signals are low and terminates when either signal returns high.
Note 10: Hold time is guaranteed by design but not production tested. This limit is not used to calculate outgoing quality levels. Note 11: Write Strobe width as used in the write timing table is defined as the period when both chip select and write inputs are low. Hence write commences when
both signals are low and terminates when either signal returns high.
Note 12: Timers in Mode 3. Note 13: Guaranteed by design, not production tested. This limit is not used to calculate outgoing quality levels.
AC Test Conditions
Input Pulse Levels GND to 3.0V Input Rise and Fall Times 6 ns (10% – 90%) Input and Output
1.3V
Reference Levels TRI-STATE Reference Active High
a
0.5V
Levels (Note 15) Active Low
b
0.5V
Note 14: C
L
e
100 pF, includes jig and scope capacitance.
Note 15: S1
e
VCCfor active low to high impedance measurements.
S1
e
GND for active high to high impedance measurements.
S1
e
open for all other timing measurements.
Capacitance (T
A
e
25§C, fe1 MHz)
Symbol
Parameter
Typ Units
(Note 16)
C
IN
Input Capacitance 5 pF
C
OUT
Output Capacitance 7 pF
Note 16: This parameter is not 100% tested. Note 17: Output rise and fall times 25 ns max (10% –90%) with 100 pF load.
TL/F/8638– 23
3
Timing Waveforms
Read Timing Diagram
TL/F/8638– 24
Write Timing Diagram
TL/F/8638– 25
4
General Description (Continued)
The DP8570A’s interrupt structure provides four basic types of interrupts: Periodic, Alarm/Compare, Timer, and Power Fail. Interrupt mask and status registers enable the masking and easy determination of each interrupt.
One dedicated general purpose interrupt output is provided. A second interrupt output is available on the Multiple Func­tion Output (MFO) pin. Each of these may be selected to generate an interrupt from any source. Additionally, the MFO pin may be programmed to be either as oscillator out­put or Timer 0’s output.
Pin Description
CS,RD,WR(Inputs): These pins interface to mP control
lines. The CS
pin is an active low enable for the read and write operations. Read and Write pins are also active low and enable reading or writing to the TCP. All three pins are disabled when power failure is detected. However, if a read or write is in progress at this time, it will be allowed to com­plete its cycle.
A0–A4 (Inputs): These 5 pins are for register selection. They individually control which location is to be accessed. These inputs are disabled when power failure is detected.
OSC IN (Input): OSC OUT (Output): These two pins are used to connect the crystal to the internal parallel resonant oscillator. The oscillator is always running when power is applied to V
BB
and VCC, and the correct crystal select bits in
the Real Time Mode Register have been set.
MFO (Output): The multi-function output can be used as a second interrupt output for interrupting the mP. This pin can also provide an output for the oscillator or the internal Timer
0. The MFO output can be programmed active high or low, open drain or push-pull. If in battery backed mode and a pull-up resistor is attached, it should be connected to a volt­age no greater than V
BB
. This pin is configured open drain
during battery operation (V
BB
l
VCC).
INTR (Output): The interrupt output is used to interrupt the processor when a timing event or power fail has occurred and the respective interrupt has been enabled. The INTR output can be programmed active high or low, push-pull or open drain. If in battery backed mode and a pull-up resistor is attached, it should be connected to a voltage no greater than V
BB
. This pin is configured open drain during battery
operation (V
BB
l
VCC). The output is a DC voltage level. To clear the INTR, writea1totheappropriate bit(s) in the Main Status Register.
D0–D7 (Input/Output): These 8 bidirectional pins connect to the host mP’s data bus and are used to read from and write to the TCP. When the PFAIL
pin goes low and a write
is not in progress, these pins are at TRI-STATE.
PFAIL
(Input): In battery backed mode, this pin can have a
digital signal applied to it via some external power detection logic. When PFAIL
e
logic 0 the TCP goes into a lockout mode, in a minimum of 30 ms or a maximum of 63 ms unless lockout delay is programmed. In the single power supply mode, this pin is not useable as an input and should be tied to V
CC
. Refer to section on Power Fail Functional Descrip-
tion.
V
BB
(Battery Power Pin): This pin is connected to a back-
CC
becomes lower than VBB. Utiliz­ing this pin eliminates the need for external logic to switch in and out the back-up power supply. If this feature is not to be
used then this pin must be tied to ground, the TCP pro­grammed for single power supply only, and power applied to the V
CC
pin.
TCK, G1, G0, (Inputs), T1 (Output): TCK is the clock input to both timers when they have an external clock selected. In modes 0, 1, and 2, G0 and G1 are active low enable inputs for timers 0 and 1 respectively. In mode 3, G0 and G1 are positive edge triggers to the timers. T1 is dedicated to the timer 1 output. The T1 output can be programmed active high or low, push-pull or open drain. Timer 0 output is avail­able through MFO pin if desired. If in battery backed mode and a pull-up resistor is attached to T1, it should be con­nected to a voltage no greater than V
BB
. The T1 pin is con-
figured open drain during battery operation (V
BB
l
VCC).
VCC: This is the main system power pin.
GND: This is the common ground power pin for both V
BB
and VCC.
Connection Diagrams
Dual-In-Line
TL/F/8638– 5
Top View
Order Number DP8570AN
See NS Package Number N28B
Plastic Chip Carrier
TL/F/8638– 6
Top View
Order Number DP8570AV
See NS Package Number V28A
5
Functional Description
Figure 1
.
The blocks are described in the following sections:
1. Real Time Clock
2. Oscillator Prescaler
3. Interrupt Logic
4. Power Failure Logic
5. Additional Supply Management
6. Timers
The memory map of the TCP is shown in the memory ad­dressing table. The memory map consists of two 31 byte pages with a main status register that is common to both pages. A control bit in the Main Status Register is used to select either page.
Figure 2
shows the basic concept. Page 0 contains all the clock timer functions, while page 1 has scratch pad RAM. The control registers are split into two separate blocks to allow page 1 to be used entirely as scratch pad RAM. Again a control bit in the Main Status Register is used to select either control register block.
TL/F/8638– 4
FIGURE 2. DP8570A Internal Memory Map
6
Functional Description (Continued)
INITIAL POWER-ON of BOTH V
BB
and V
CC
VBBand VCCmay be applied in any sequence. In order for the power fail circuitry to function correctly, whenever power is off, the V
CC
pin must see a path to ground through a maximum of 1 MX. The user should be aware that the con­trol registers will contain random data. The first task to be carried out in an initialization routine is to start the oscillator by writing to the crystal select bits in the Real Time Mode Register. If the DP8570A is configured for single supply mode, an extra 50 mA may be consumed until the crystal select bits are programmed. The user should also ensure that the TCP is not in test mode (see register descriptions).
REAL TIME CLOCK FUNCTIONAL DESCRIPTION
As shown in
Figure 2
, the clock has 10 bytes of counters, which count from 1/100 of a second to years. Each counter counts in BCD and is synchronously clocked. The count se­quence of the individual byte counters within the clock is shown later in Table VII. Note that the day of week, day of month, day of year, and month counters all roll over to 1. The hours counter in 12 hour mode rolls over to 1 and the AM/PM bit toggles when the hours rolls over to 12 (AM
e
0, PMe1). The AM/PM bit is bit D7 in the hours
counter.
All other counters roll over to 0. Also note that the day of year counter is 12 bits long and occupies two addresses. Upon initial application of power the counters will contain random information.
READING THE CLOCK: VALIDATED READ
1. Initialize program for reading clock.
2. Dummy read of periodic status bit to clear it.
3. Read counter bytes and store.
4. Read rollover bit, and test it.
5. If rollover occured go to 3.
6. If no rollover, done.
To detect the rollover, individual periodic status bits can be polled. The periodic bit chosen should be equal to the high­est frequency counter register to be read. That is if only SECONDS through HOURS counters are read, then the SECONDS periodic bit should be used.
READING THE CLOCK: INTERRUPT DRIVEN
Enabling the periodic interrupt mask bits cause interrupts just as the clock rolls over. Enabling the desired update rate and providing an interrupt service routine that executes in less than 10 ms enables clock reading without checking for a rollover.
READING THE CLOCK: LATCHED READ
Another method to read the clock that does not require checking the rollover bit is to write a one into the Time
INITIALIZING AND WRITING TO THE CALENDAR-CLOCK
Upon initial application of power to the TCP or when making time corrections, the time must be written into the clock. To correctly write the time to the counters, the clock would normally be stopped by writing the Start/Stop
bit in the Real Time Mode Register to a zero. This stops the clock from counting and disables the carry circuitry. When initializing the clock’s Real Time Mode Register, it is recommended that first the various mode bits be written while maintaining the Start/Stop
bit reset, and then writing to the register a
second time with the Start/Stop
bit set.
PRESCALER/OSCILLATOR FUNCTIONAL DESCRIPTION
Feeding the counter chain is a programmable prescaler which divides the crystal oscillator frequency to 32 kHz and further to 100 Hz for the counter chain (see
Figure 3
). The crystal frequency that can be selected are: 32 kHz, 32.768 kHz, 4.9152 MHz, and 4.194304 MHz.
Once 32 kHz is generated it feeds both timers and the clock. The clock and timer prescalers can be independently enabled by controlling the timer or clock Start/Stop
bits.
TL/F/8638– 2
FIGURE 3. Programmable Clock Prescaler Block
7
Functional Description (Continued)
The oscillator is programmed via the Real Time Mode Reg­ister to operate at various frequencies. The crystal oscillator is designed to offer optimum performance at each frequen­cy. Thus, at 32.768 kHz the oscillator is configured as a low frequency and low power oscillator. At the higher frequen­cies the oscillator inverter is reconfigured. In addition to the inverter, the oscillator feedback bias resistor is included on chip, as shown in
Figure 4
. The oscillator input may be driv­en from an external source if desired. Refer to test mode application note for details. The oscillator stability is en­hanced through the use of an on chip regulated power sup­ply.
The typical range of trimmer capacitor (as shown in Oscilla­tor Circuit Diagram
Figure 4
, and in the typical application) at the oscillator input pin is suggested only to allow accurate tuning of the oscillator. This range is based on a typical printed circuit board layout and may have to be changed depending on the parasitic capacitance of the printed circuit board or fixture being used. In all cases, the load capaci- tance specified by the crystal manufacturer (nominal value 11 pF for the 32.768 crystal) is what determines proper os­cillation. This load capcitance is the series combination of capacitance on each side of the crystal (with respect to ground).
TL/F/8638– 3
FIGURE 4. Oscillator Circuit Diagram
XTAL C
o
C
t
R
OUT
(Switched Internally)
32/32.768 kHz 47 pF 2 pF – 22 pF 150 kX to 350 kX
4.194304 MHz 68 pF 0 pF – 80 pF 500X to 900X
4.9152 MHz 68 pF 29 pF–49 pF 500X to 900X
INTERRUPT LOGIC FUNCTIONAL DESCRIPTION
Figure 5
and Table I.)
The interrupts are enabled by writing a one to the appropri­ate bits in Interrupt Control Register 0 and/or 1. Any of the interrupts can be routed to either the INTR pin or the MFO pin, depending on how the Interrupt Routing register is pro­grammed. This, for example, enables the user to dedicate the MFO as a non-maskable interrupt pin to the CPU for power failure detection and enable all other interrupts to appear on the INTR pin. The polarity for the active interrupt can be programmed in the Output Mode Register for either active high or low, and open drain or push pull outputs.
TABLE I. Registers that are Applicable
to Interrupt Control
Register Name
Register Page
Address
Select Select
Main Status Register X X 00H Periodic Flag Register 0 0 03H Interrupt Routing
0 0 04H
Register
Interrupt Control
1 0 03H
Register 0
Interrupt Control
1 0 04H
Register 1
Output Mode
1 0 02H
Register
The Interrupt Status Flag D0, in the Main Status Register, indicates the state of INTR and MFO outputs. It is set when either output becomes active and is cleared when all TCP interrupts have been cleared and no further interrupts are pending (i.e., both INTR and MFO are returned to their inac­tive state). This flag enables the TCP to be rapidly polled by the mP to determine the source of an interrupt in a wiredÐ OR interrupt system.
Status for the interrupts are provided by the Main Status Register and the Periodic Flag Register. Bits D1 – D5 of the Main Status Register are the main interrupt bits.
These register bits will be set when their associated timing events occur. Enabled Alarm or Timer interrupts that occur will set its Main Status Register bit to a one. However, an external interrupt will only be generated if the appropriate Alarm or Timer interrupt enable bits are set (see
Figure 5
).
Disabling the periodic bits will mask the Main Status Regis­ter periodic bit, but not the Periodic Flag Register bits. The Power Fail Interrupt bit is set when the interrupt is enabled and a power fail event has occurred, and is not reset until the power is restored. If all interrupt enable bits are 0 no interrupt will be asserted. However, status still can be read from the Main Status Register in a polled fashion (see
Fig-
ure 5
).
To clear a flag in bits D2 –D5 of the Main Status Register a 1 must be written back into the bit location that is to be cleared. For the Periodic Flag Register reading the status will reset all the periodic flags.
8
Loading...
+ 18 hidden pages