NSC DAC1208LCJ-1, DAC1208LCJ Datasheet

February 1995
MICRO-DACTMDAC1208/DAC1209/DAC1210/DAC1230/ DAC1231/DAC1232 12-Bit, mP Compatible, Double-Buffered D to A Converters
MICRO-DAC DAC1208/DAC1209/DAC1210/DAC1230/DAC1231/DAC1232
12-Bit, mP Compatible, Double-Buffered D to A Converters
General Description
The DAC1208 and the DAC1230 series are 12-bit multiply­ing D to A converters designed to interface directly with a wide variety of microprocessors (8080, 8048, 8085, Z-80, etc.). Double buffering input registers and associated con­trol lines allow these DACs to appear as a two-byte ‘‘stack’’ in the system’s memory or I/O space with no additional in­terfacing logic required.
The DAC1208 series provides all 12 input lines to allow sin­gle buffering for maximum throughput when used with 16-bit processors. These input lines can also be externally config­ured to permit an 8-bit data interface. The DAC1230 series can be used with an 8-bit data bus directly as it internally formulates the 12-bit DAC data from its 8 input lines. All of these DACs accept left-justified data from the processor.
The analog section is a precision silicon-chromium (Si-Cr) R-2R ladder network and twelve CMOS current switches. An inverted R-2R ladder structure is used with the binary weighted currents switched between the I maintaining a constant current in each ladder leg indepen-
OUT1
and I
OUT2
dent of the switch state. Special circuitry provides TTL logic input voltage level compatibility.
The DAC1208 series and DAC1230 series are the 12-bit members of a family of microprocessor compatible DACs (MICRO-DACs
TM
). For applications requiring other resolu­tions, the DAC1000 series for 10-bit and DAC0830 series for 8-bit are available alternatives.
Typical Application
Features
Y
Linearity specified with zero and full-scale adjust only
Y
Direct interface to all popular microprocessors
Y
Double-buffered, single-buffered or flow through digital data inputs
Y
Logic inputs which meet TTL voltage level specs (1.4V logic threshold)
Y
Works withg10V referenceÐfull 4-quadrant multiplication
Y
Operates stand-alone (without mP) if desired
Y
All parts guaranteed 12-bit monotonic
Y
DAC1230 series is pin compatible with the DAC0830 series 8-bit MICRO-DACs
Key Specifications
Y
Current Settling Time 1 ms
Y
Resolution 12 Bits
Y
Linearity (Guaranteed over temperature) 10, 11, or 12 Bits of FS
Y
Gain Tempco 1.3 ppm/§C
Y
Low Power Dissipation 20 mW
Y
Single Power Supply 5 VDCto 15 V
DC
TL/H/5690– 1
TRI-STATEÉis a registered trademark of National Semiconductor Corp.
TM
MICRO-DAC
C
1995 National Semiconductor Corporation RRD-B30M115/Printed in U. S. A.
is a trademark of National Semiconductor Corp.
TL/H/5690
Absolute Maximum Ratings
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
(Notes 1 and 2)
Supply Voltage (V
Voltage at Any Digital Input VCCto GND
Voltage at V
Storage Temperature Range
Package Dissipation at T
(Note 3)
DC Voltage Applied to I
(Note 4)
ESD Susceptability 800V
Electrical Characteristics
e
V
10.000 VDC,V
REF
Note 13); all other limits T
Parameter Conditions Notes
)17V
REF
CC
Input
b
e
25§C.
65§Ctoa150§C
b
100 mV to V
e
25§C 500 mW
A
or I
OUT1
OUT2
e
11.4 VDCto 15.75 VDCunless otherwise noted. Boldface limits apply from T
CC
e
T
A
J
DC
g
25V
CC
Operating Conditions
Lead Temperature (Soldering, 10 sec.) 300§C
Temperature Range T
DAC1208LCJ, DAC1209LCJ, DAC1210LCJ, DAC1230LCJ, DAC1231LCJ, DAC1232LCJ, DAC1231LIN, DAC1232LIN DAC1208LCJ-1, DAC1210LCJ-1, DAC1230LCJ-1, DAC1231LCJ-1, DAC1232LCJ-1, DAC1231LCN, DAC1232LCN, DAC1231LCWM, DAC1232LCWM 0
Range of V
CC
Voltage at Any Digital Input VCCto GND
Typ
(Note 10)
Tested Design
Limit Limit Units
(Note 5) (Note 6)
s
MIN
b
40§CsT
CsT
§
4.75 VDCto 16 V
to T
MIN
A
A
T
A
s
s
MAX
s
a
a
Resolution 12 12 12 Bits
Linearity Error Zero and Full-Scale 4, 7, 13 (End Point Linearity) Adjusted
Differential Non-Linearity Zero and Full-Scale 4, 7, 13
DAC1208, DAC1230 DAC1209, DAC1231 DAC1210, DAC1232
Adjusted DAC1208, DAC1230 DAC1209, DAC1231 DAC1210, DAC1232
g
0.018g0.018 %ofFSR
g
0.024g0.024 %ofFSR
g
0.050g0.05 %ofFSR
g
0.018g0.018 %ofFSR
g
0.024g0.024 %ofFSR
g
0.050g0.05 %ofFSR
Monotonicity 4 12 12 12 Bits
Gain Error (Min) Using Internal R
Gain Error (Max)
e
V
ref
g
10V,g1V
Fb
Gain Error Tempco 7
Power Supply Rejection All Digital Inputs
Reference Input Resistance (Min) Reference Input Resistance (Max) 15 20 20
Output Feedthrough Error V
Output Capacitance All Data Inputs I
Latched High
13
e
20 Vp-p, fe100 kHz
REF
All Data Inputs Latched 9 3.0 mVp-p Low
Latched High I All Data Inputs I Latched Low I
OUT1 OUT2 OUT1 OUT2
b
7
7
7
0.1 0.0 % of FSR
b
0.1
g
1.3
g
3.0
b
0.2 % of FSR
g
6.0 ppm of FS/§C
g
30 ppm of FSR/V
15 10 10
200 pF
70 pF 70 pF
200 pF
kX
Supply Current Drain 13 2.0 2.5 mA
Output Leakage Current
I
OUT1
I
OUT2
Digital Input Threshold Low Threshold 13 0.8 0.8 V
Digital Input Currents Digital Inputsk0.8V 13
All Data Inputs Latched 11, 13 0.1 15 15 nA Low All Data Inputs Latched 11, 13 0.1 15 15 nA High
High Threshold 13 2.2 2.2 V
b
Digital Inputsl2.2V 13 10 10 mA
200
b
200 mA
DC DC
T
DC DC
MAX
85§C
70§C
DC
(see
2
Electrical Characteristics (Continued)
e
V
10.000 VDC,V
REF
Note 13); all other limits T
Symbol Parameter Conditions
e
11.4 VDCto 15.75 VDCunless otherwise noted. Boldface limits apply from T
CC
e
e
T
A
25§C.
J
See Typ
Note (Note 10)
to T
MIN
MAX
Tested Design
Limit Limit Units
(Note 5) (Note 6)
AC CHARACTERISTICS
OUT1
IL
IL
IL
IL
IL
IL
REF
e
e
e
e
e
e
or I
b
e
t
s
t
W
t
DS
t
DH
t
CS
t
CH
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
Note 3: This 500 mW specification applies for all packages. The low intrinsic power dissipation of this part (and the fact that there is no way to significantly modify
the power dissipation) removes concern for heat sinking.
Note 4: Both I example, if V
Note 5: Tested and guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 6: Design limits are guaranteed but not 100% tested. These limits are not used to calculate outgoing quality levels. Guaranteed for V
and V
Note 7: The unit FSR stands for full-scale range. Linearity Error and Power Supply Rejection specs are based on this unit to eliminate dependence on a particular V
REF
performing a zero and full-scale adjustment, the plot of the 4096 analog voltage outputs will each be within 0.012% zero and full-scale. The unit ppm of FSR(parts per million of full-scale range) and ppm of FS(parts per million of full-scale) are used for convenience to define specs of very small percentage values, typical of higher accuracy converters. In this instance, 1 ppm of FSR output voltage quantity. For example, the gain error tempco spec of
b
40§Ctoa85§Cofg(6)(V
Note 8: This spec implies that all parts are guaranteed to operate with a write pulse or transfer pulse width (t 100 ns. The entire write pulse must occur within the valid data interval for the specified t
Note 9: To achieve this low feedthrough in the D package, the user must ground the metal lid. If the lid is left floating the feedthrough is typically 6 mV.
Note 10: Typicals are at 25
Note 11: A 10 nA leakage current with R
Note 12: Human body model, 100 pF discharged through a 1.5 kX resistor.
Note 13: Tested limit for
Current Setting Time V
Write and XFER V Pulse Width Min. 320
Data Setup Time Min. V
Data Hold Time Min. V
Control Setup Time Min. V
Control Hold Time Min. V
and I
OUT1
e
REF
eb
10V toa10V.
REF
value to indicate the true performance of the part. The Linearity Error specification of the DAC1208 is 0.012% of FSR(max). This guarantees that after
must go to ground or the virtual ground of an operational amplifier. The linearity error is degraded by approximately V
OUT2
10Vthena1mVoffset, VOS,onI
/106)(125§C) org0.75 (10
REF
C and represent the most likely parametric norm.
§
b
1 suffix parts applies only at 25§C.
e
Fb
20k and V
e
0V, V
0V, V
0V, V
0V, V
0V, V
0V, V
OUT2
3
)V
10V corresponds to a zero error of (10c10
5V 1.0 ms
IH
e
5V
IH
e
5V 70 320
IH
e
5V 30 90
IH
e
5V 60 320
IH
e
5V 0 10
IH
will introduce an additional 0.01% linearity error.
g
6 ppm of FS/§C represents a worst-case full-scale gain error change with temperature from
which isg0.075% of V
REF
8
W,tDS,tDH
50 320
c
V
e
V
/106is the conversion factor to provide an actual
REF
.
REF
) of 320 ns. A typical part will operate with tWof only
W
and tSto apply.
b
9
c
20c103)c100% 10V or 0.002% of FS.
CC
of a straight line which passes through
REF
320
90
320
e
11.4V to 15.75V
d
OS
Connection Diagrams
Dual-In-Line Package Dual-In-Line Package
(see
ns
V
. For
REF
See Ordering Information
TL/H/5690– 2
3
Switching Waveforms
Typical Performance Characteristics
Digital Input Threshold vs V
CC
Digital Input Threshold vs Temperature
TL/H/5690– 3
Gain and Linearity Error Variation vs Temperature
Gain and Linearity Error Variation vs Supply Voltage Control Set-Up Time, t
Write Pulse Width, t
W
4
CS
Data Set-Up Time, t
Data Hold Time, t
DS
DH
TL/H/5690– 4
Definition of Package Pinouts
CONTROL SIGNALS (all control signals are level actuated)
CS: Chip Select (active low). The CS will enable WR1.
WR1: Write 1. The active low WR1 is used to load the digital
data bits (DI) into the input latch. The data in the input latch is latched when WR1 into two latches. One holds the first 8 bits, while the other holds 4 bits. The Byte 1/Byte 2 both latches when Byte 1/Byte 2 4-bit input latch when in the low state.
Byte 1/Byte 2
high, all 12 locations of the input latch are enabled. When low, only the four least significant locations of the input latch are enabled.
WR2
: Write 2 (active low). The WR2 will enable XFER.
XFER: Transfer Control Signal (active low). This signal, in
combination with WR2 available in the input latches to transfer to the DAC register.
DI
to DI11: Digital Inputs. DI0is the least significant digital
0
input (LSB) and DI (MSB).
I
: DAC Current Output 1. I
OUT1
digital code of all 1s in the DAC register, and is zero for all 0s in the DAC register.
I
: DAC Current Output 2. I
OUT2
I
,orI
OUT1
voltage). This constant current is
OUT1
divided by the reference input resistance.
: Feedback Resistor. The feedback resistor is provided
R
Fb
on the IC chip for use as the shunt feedback resistor for the external op amp which is used to provide an output voltage for the DAC. This on-chip resistor should always be used (not an external resistor) since it matches the resistors in the on-chip R-2R ladder and tracks these resistors over temperature.
V
: Reference Voltage Input. This input connects an ex-
REF
ternal precision voltage source to the internal R-2R ladder. V
can be selected over the range of 10V tob10V. This
REF
is also the analog voltage input for a 4-quadrant multiplying DAC application.
V
: Digital Supply Voltage. This is the power supply pin for
CC
the part. V optimum for 15 V
CC
GND: Pins 3 and 12 of the DAC1208, DAC1209, and DAC1210 must be connected to ground. Pins 3 and 10 of
is high. The 12-bit input latch is split
control pin is used to select
is high or to overwrite the
: Byte Sequence Control. When this control is
, causes the 12-bit data which is
is the most significant digital input
11
is a maximum for a
OUT1
is a constant minus
a
I
OUT2
V
REF
OUT2
e
constant (for a fixed reference
c
1
b
1
4096
#
J
can be from 5 VDCto 15 VDC. Operation is
.
DC
the DAC1230, DAC1231, and DAC1232 must be connected to ground. It is important that I potential for current switching applications. Any difference of potential (V change of
For example, if V mV offset from I
0.03%.
on these pins) will result in a linearity
OS
e
10V and these ground pins are 9
REF
and I
OUT
1
and I
3V
OUT
OUT
V
OS
REF
OUT
1
, the linearity change will be
2
2
are at ground
Definition of Terms
Resolution: Resolution is defined as the reciprocal of the
number of discrete steps in the DAC output. It is directly related to the number of switches or bits within the DAC. For example, the DAC1208 has 2 has 12-bit resolution.
Linearity Error: Linearity error is the maximum deviation from a
straight line passing through the endpoints of the
DAC transfer characteristic
for zero and full-scale. Linearity error is a parameter intrinsic to the device and cannot be externally adjusted.
National’s linearity test (a) and the best straight line test (b) used by other suppliers are illustrated below. The best straight line (b) requires a special zero and FS adjustment for each part, which is almost impossible for the user to determine. The end point test uses a standard zero FS ad­justment procedure and is a much more stringent test for DAC linearity.
Power Supply Sensitivity: Power supply sensitivity is a measure of the effect of power supply changes on the DAC full-scale output.
Settling Time: Full-scale current settling time requires zero to full-scale or full-scale to zero output change. Settling time is the time required from a code transition until the DAC output reaches within
Full-Scale Error: Full-scale error is a measure of the output error between an ideal DAC and the actual device output. Ideally, for the DAC1208 or DAC1230 series, full-scale is
b
V
1 LSB. For V
REF
V
FULL-SCALE
error is adjustable to zero.
e
10.0000Vb2.44 mVe9.9976V. Full-scale
Differential Non-Linearity: The difference between any two consecutive codes in the transfer curve from the theo­retical 1 LSB is differential non-linearity.
Monotonic: If the output of a DAC increases for increasing digital input code, then the DAC is monotonic. A 12-bit DAC which is monotonic to 12 bits simply means that input in­creasing digital input codes will produce an increasing ana­log output.
12
or 4096 steps and therefore
. It is measured after adjusting
g
(/2 LSB of the final output value.
e
10V and unipolar operation,
REF
a) End Point Test After Zero
and FS Adjust
b) Shifting FS Adjust to Pass
TL/H/5690– 5
Best Straight Line Test
5
Application Hints
1.0 DIGITAL INTERFACE
These DACs are designed to provide all of the necessary digital input circuitry to permit a direct interface to a wide variety of microprocessor systems. The timing and logic lev­el convention of the input control signals allow the DACs to be treated as a typical memory device or I/O peripheral with no external logic required in most systems. Essentially these DACs can be mapped as a two-byte stack in memory (or I/O space) to receive their 12 bits of input data in two successive 8-bit data writing sequences. The DAC1230 se­ries is intended for use in systems with an 8-bit data bus. The DAC1208 series provides all 12 digital input lines which can be externally configured to be controlled from an 8-bit bus or can be driven directly from a 16-bit data bus.
All of the digital inputs to these DACs contain a unique threshold regulator circuit to maintain TTL voltage level compatibility independent of the applied V Any input can also be driven from higher voltage CMOS logic levels in non-microprocessor based systems. To pre­vent damage to the chip from static discharge, all unused digital inputs should be tied to V shooting aid, if any digital input is inadvertently left floating, the DAC will interpret the pin as a logic ‘‘1’’.
Double buffered digital inputs allow the DAC to internally format the 12-bit word used to set the current switching R­2R ladder network (see section 2.0) from two 8-bit data write cycles. ters and their controlling logic circuitry. The timing diagrams for updating the DAC output are shown in sections 1.1, 1.2 and 1.3 for three possible control modes. The method used depends strictly upon the particular application.
Figures 1
and2show the internal data regis-
or ground. As a trouble-
CC
to the DAC.
CC
FIGURE 1. DAC1208, DAC1209, DAC1210 Functional Diagram
FIGURE 2. DAC1230, DAC1231, DAC1232 Functional Diagram
6
TL/H/5690– 6
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