Nokia 9110 Service Manual 02bsb_2
PAMS Technical Documentation
RAE–2 Series PDA Phone
Chapter 2
–Transceiver BS8–
Baseband Block
Original 02/99
Copyright 1999 Nokia Mobile Phones. All rights reserved.
RAE–2
PAMS
Baseband
Amendment
Number
Technical Documentation
AMENDMENT RECORD SHEET
Date Inserted By Comments
11/98 Original
Page 2– 2
Original 02/99
PAMS
RAE–2
Technical Documentation
CONTENTS –Baseband
Introduction 2– 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Summary 2– 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Specifications 2– 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Ratings 2– 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics 2– 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Characteristics 2– 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connectors 2– 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Connections from Baseband section of BS8 module 2– 9
Connectors to other modules of the product 2– 9. . . . . . . . . . . . . .
Bottom Connector 2– 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Connector 2– 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM card Connector 2– 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Card Connector 2– 13. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Board to Board Connector 2– 14. . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Coax cable connector 2– 17. . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Signals and Connections 2– 17. . . . . . . . . . . . . . . . . . . . . . .
Microphone 2– 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF– Baseband interface 2– 18. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband
Page No
Functional Descriptions 2– 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management 2– 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery identification 2– 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery charging 2– 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Startup charging 2– 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery overvoltage protection 2– 24. . . . . . . . . . . . . . . . . . . . . . .
Battery removal during charging 2– 25. . . . . . . . . . . . . . . . . . . . . .
PWM control 2– 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery temperature 2– 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage regulators 2– 26. . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD core regulator 2– 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switched mode supply VSIM 2– 28. . . . . . . . . . . . . . . . . . . . . . . .
Power up 2– 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power up with power switch (PWRKEYx) 2– 28. . . . . . . . . . .
Power up with a charger 2– 29. . . . . . . . . . . . . . . . . . . . . . . . . .
Service Request State (SRS) 2– 30. . . . . . . . . . . . . . . . . . . . . .
Active Mode 2– 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep Mode 2– 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charging 2– 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Off 2– 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog 2– 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Baseband
Audio control 2– 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PDA Tones 2– 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CMT Alert Signal Generation 2– 34. . . . . . . . . . . . . . . . . . . . . . . .
External audio connections 2– 34. . . . . . . . . . . . . . . . . . . . . . . . . .
Analog audio accessory detection 2– 36. . . . . . . . . . . . . . . . . . . .
Headset detection 2– 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Headset switch detection 2– 36. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal audio connections 2– 37. . . . . . . . . . . . . . . . . . . . . . . . . . .
4–wire PCM serial interface 2– 37. . . . . . . . . . . . . . . . . . . . . . . . .
Digital control 2– 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD2 2– 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD2 memory configuration 2– 40. . . . . . . . . . . . . . . . . . . . . .
MCU Memory Map 2– 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memories 2– 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Memory 2– 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SRAM Memory 2– 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EEPROM Memory 2– 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming 2– 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RAE–2 Flashing connections 2– 43. . . . . . . . . . . . . . . . . . . . . .
Flashing methods 2– 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flashing procedure 2– 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Security 2– 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COBBA–GJ ASIC 2– 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Documentation
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Technical Documentation
Introduction
This document contains the specification to the Baseband section of the
BS8 module. The BS8 module carries out almost all CMT functions of
RAE–2. BS8 can be divided into two functional sections; BaseBand (BB)
and RF. Some of CMT baseband circuits are implemented to both BS1
and BS2 modules.
The Baseband module BS8 comprises four ASICs (CHAPS, CCONT,
COBBA–GJ and MAD2) that perform the baseband functions of the mod-
ule.
BS1
earphone
HF
BS8
RF
BB
MIC
TX/RX
TXC RXC
COBBA
TXPa
Synthesizer
control
LNA
RF SUPPLIES
VREF
CCONT
VCOBBA
VBB
AFC
VCOPWR
32kHz
Baseband
VCTCXO
13MHz
PA SUPPLY
SIMCONN
VSIM
MMC IF
SCOTTY
CMT
UI
BS2
MMC
CONN
CMT–PDA IF
CMTUI IF
Ext. audio
IF
BOTTOM CONNECTOR
Figure 1. BS8 BaseBand block in RAE–2 product
Technical Summary
The BS8 module is implemented on a single double side 8–layer printed
circuit board. The main part of the baseband area is located on the bot-
tom side of the PCB and only some components (bottom connector, bat-
tery connector and some filter components) are placed on the upper side
(RF side). Component height space on the baseband is 2.0mm.
Flash
512k
MAD
+
Memories
MAD
Sram
256k
MBUS
Eeprom
8k
VCHARG
CHAPS
LIM
Charger IF
VBATT
BATTERY
BATT.CONN
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PAMS
Baseband
Technical Documentation
The baseband is running from a 2.8V power rail, which is supplied by the
power controlling ASIC. In the CCONT ASIC there are 6 individually con-
trolled regulator outputs for RF–section and two outputs for the base-
band. In addition there is one +5V power supply output (V5V) for flash
programming voltage and for other purposes where a higher voltage is
needed. The CCONT contains also a SIM interface, which supports both
3V and 5V SIM–cards.
BaseBand Side RF Side
Figure 2. BS8 Module
The interface between the baseband and the RF section is handled by
the specific ASIC COBBA. The COBBA provides:
– A/D and D/A conversion of the in–phase and quadrature receive and
transmit signal paths
– A/D and D/A conversions of received and transmitted audio signals to
and from the UI section.
The COBBA supplies the analog TXC and AFC signals to the RF section
according to the MAD DSP digital control and converts the analog AGC
into digital signal for the DSP. The data transmission between the COB-
BA and the MAD is implemented using a parallel connection for high
speed signalling and a serial connection for PCM coded audio signals.
Digital speech processing is handled by the MAD asic.
The COBBA is a dual voltage circuit, the digital parts are running from the
baseband supply VBB and the analog parts are running from the analog
supply VCOBBA.
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Technical Documentation
The COBBA supports three microphone inputs and two earphone out-
puts. The inputs can be taken from an internal microphone, a headset mi-
crophone or from an external microphone signal source.
The output for the internal earphone is a dual ended type output capable
of driving a dynamic type speaker. Input and output signal source selec-
tion and gain control are performed inside the COBBA according to con-
trol messages from the MAD. Call alerts, keypad tones, DTMF, and other
audio tones are generated and encoded by the MAD and transmitted to
the COBBA for decoding.
EMC shielding (figure below) is implemented on the BB side using a me-
tallized plastic B–cover and conductive gasket between the B–cover and
the PCB. On the RF side the engine is shielded with a conductive frame
which makes a contact to a ground ring of the CMT board and a ground
plane of the PDA board. There is a conductive gasket between the frame
and the PCB for ensuring proper shielding. In addition he RF area has
three metal cans for RF shielding. Heat generated by the circuitry is con-
ducted out mainly via the PCB ground planes.
Baseband
Conductive frame +gasket
BS8 module
Metal
gasket
Metal cans
Bottom connector
Metallized B–cover
4 srews for fastening
B–cover to frame
Microphone
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RAE–2
PAMS
Baseband
Technical Documentation
Technical Specifications
Maximum Ratings
Parameter Rating
Battery voltage, idle mode –0.3 ... 4.1V without charger
Charger input voltage –5.0 ... 16V
Operating temperature range –25C to +70 C
Storage temperature range –40C to +85 C
DC Characteristics
Supply voltages
Line Symbol Minimum Typical /
Nominal
Supply battery voltage 3.0 3.6 4.1 V
Battery powerup voltage (HW) 2.9 3.0 3.1 V
Battery cut off voltage (HW) 2.7 2.8 2.9 V
Regulated baseband supply voltage 2.7 2.8 2.85 V
Regulated baseband supply current 3 50 125 mA
Regulated VCORE supply voltage 1.3 – 2.65 V (changeable)
Regulated VCORE supply current 50 mA
COBBA analog supply voltage 2.7 2.8 2.85 V
COBBA analog supply current 5 20 100 mA
Regulated 5V supply voltage 4.8 5.0 5.2 V
Regulated 5V supply current 0 1 30 mA
Regulated 5V SIM supply voltage 4.8 5.0 5.2 V
Regulated 5V SIM supply current 3 10 30 mA
Regulated 3V SIM supply voltage 2.8 3.0 3.2 V
Regulated 3V SIM supply current 1 6 30 mA
Voltage reference 1.4775 1.5 1.5225 V
Maximum Unit / Notes
Note: The RF voltages are described later
AC Characteristics
Line symbol Minimum Typical /
32kHz 32768 Hz, Sleep clock
RFIClk 13 MHz, System clock
PCMClk 8 kHz, PCM clock
SIMClk 3.25 MHz, SIM Clock
Page 2– 8
Table 1. AC Specifications
Maximum Unit / Notes
Nominal
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PAMS
RAE–2
Technical Documentation
Baseband
Connectors
External Connections from Baseband section of BS8 module
This section describes the external electrical connections and interface
levels on the baseband section of the BS8 module. The electrical inter-
face specifications are collected into tables that cover a connector or a
defined interface each.
Connectors to other modules of the product
Bottom Connector
The bottom connector has spring type of connections. In BS8 module
there are contact pads for the spring connections.
10
9
11
Figure 3. Bottom connector pads in BS8 module
6
7
8
X170
5
4
2
3
1
The electrical specifications in the next table show the bottom connector
signals and levels on the baseband. The system connector is used to
connect the transceiver to accessories. The table gives the idle voltage
produced by the acceptable chargers at the DC connector input. The ab-
solute maximum input voltage is 30 V due to the transient suppressor that
is protecting the charger input.
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RAE–2
CTRL
Baud rate 9600 Bit/s
PAMS
Baseband
Technical Documentation
Table 2. Baseband signals of the bottom connector (X170)
Pin Name Min Typ Max Unit Notes
1 L_GND 0 0 V Supply ground
2 VIN
3 CHRG_
4 SGND
7.25
3.25
320
7.1
3.25
720
0 0.5 V Charger control PWM low
2.0 2.85 V Charger control PWM high
1 99 % PWM duty cycle
7.6
3.6
370
8.4
3.6
800
32 Hz PWM frequency for a ACP–9
47 Ω Output AC impedance (ref. GND)
10 µF Series output capacitance
380 Ω Resistance to phone ground
7.95
16.9
3.95
420
9.3
3.95
850
V
V
V
mA
V
V
mA
Unloaded ACP–7 Charger (5kohms load)
Peak charger output voltage (5kohms load)
Loaded charger output voltage (10ohms load)
Supply current
Unloaded ACP–9 Charger
Loaded charger output voltage (10ohms load)
Supply current
5 XEAR
HEAR 28 626 mV Earphone signal (HF– HFCM)
6 XMIC
HMIC 0 3.2 29.3 mV Microphone signal
47 Ω Output AC impedance (ref. GND)
10 µF Series output capacitance
16 300 Ω Load AC impedance to SGND (Headset)
4.7 10 kΩ Load AC impedance to SGND (Accessory)
1.0 Vpp Maximum output level (no load)
22 626 mV Output signal level
10 kΩ Load DC resistance to SGND (Accessory)
16 1500 Ω Load DC resistance to SGND (Headset)
2.8 V DC voltage (47k pull–up to VBB)
Connected to COBBA HF output
2.0 2.2 kΩ Input AC impedance
1 Vpp Maximum signal level
1.47 1.55 V Mute (output DC level)
2.5 2.85 V Unmute (output DC level)
100 600 µA Bias current
58 490 mV Maximum signal level
Connected to COBBA MIC3P input
7 MBUS 0 logic low 0.5 V Serial bidirectional control bus.
2.1 logic high 2.85
12,1
5
13 RF_OUT 5 (TX levels) 33 dBm RF signal from RF switch to internal antenna
14 RF_IN 5 (TX levels) 33 dBm RF signal from PA to RF switch.
GND 0 0 V RF ground
Page 2– 10
Phone has a 4k7 pullup resistor
Original 02/99
PAMS
RAE–2
Technical Documentation
The bottom connector has mounting holes for a fastening to a shielding
frame located between the PDA and CMT modules. The bottom connector has spring type connections to the CMT and the PDA module.
The bottom connector includes the following parts:
– DC connector for external plug–in charger and a desktop charger
– System connector for accessories.
– Connector for external RF signal. This connector is equipped with
throw–over–switch. This is needed to change the RF signal path between external and internal antenna depending whether the ext antenna cable is connected or not.
PDA connections
RXTXDTR
GND
Baseband
PDA SIDE
External RF with switch
MBUS
XMIC
DC–jack
GND
Battery Connector
The electrical specifications for the battery connector are listed in the
next table. The BSI contact of the battery connector is also used to detect
when the battery is removed suddenly.
This information is needed for driving the SIM card safely down before
supply voltage is lost. The BSI contact in the battery connector has
0.5mm shorter working length than
the supply power contacts to give
enough time for the SIM shut down.
CHRG_CTRL
VIN
Figure 4. Bottom Connector
XEAR
SGND
Guiding and locking holes
GND
CMT SIDE
X160
BSI BTEMP
VBATT
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Figure 5. Battery Connector
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RAE–2
PAMS
Baseband
Technical Documentation
Table 3. Battery Connector Electrical Specifications (X160)
Pin Name Min Typ Max Unit Notes
1 VBATT 3.0 3.6 4.1 V Battery voltage
2 BSI
3 BTEMP
4 GND 0 0 V Battery ground
0 2.85 V Battery size indication
CMT has 180kohm pull up resistor.
SIM Card removal detection
(Threshold is 2.4V@VBB=2.8V)
17.1 18 18.9 kohm Field Test Battery (4.1V)
21.8 22 22.2 kohm BBS–5 Service battery (No cells)
31.35 33 34.65 kohm BLN–3 Li–ion battery (4.1V)
5 ms The minimum time from BSI contact disengaged its bat-
tery contact to VBATT/GND disengaged its battery con-
tacts when battery is removed.
0 1.4 V Battery temperature indication
CMT has a 100k (+–5%) pullup resistor,
Battery package has a NTC pulldown resistor:
47k+–5%@+25C , B=4050+–3%
0 1 kohm Local mode initialization (in production)
SIM card Connector
The SIM card connector is located on the baseband side of the BS8 module. The contacts of the SIM card connector are protected against electric discharge with ESD protection components.
VSIM
X150
GND
SIMRST
VSIM
SIMDATA SIMCLK
Page 2– 12
Figure 6. SIM Card Connector
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RAE–2
Technical Documentation
Table 4. SIM Connector Electrical Specifications (X150)
Pin Name Parameter Min Typ Max Unit Notes
4 GND GND 0 0 V Ground
3, 5 VSIM 5V SIM Card
3V SIM Card
6 DATA 5V Vin/Vout
3V Vin/V out
2 SIMRST 5V SIM Card
3V SIM Card
1 SIMCLK Frequency
Trise/Tfall
4.8
2.8
4.0
2.8
4.0
2.8
5.0
3.0
”1”
0
0
”0”
”1”
”0”
”1”
”1”
3.25
5.2
3.2
VSIM
0.5
VSIM
0.5
VSIM
VSIM
25
V Supply voltage
V SIM data
Trise/Tfall max 1us
V SIM reset
MHz
ns
SIM clock
VSIM supply voltages are specified to meet type approval requirements
regardless the tolerances in components.
Baseband
Memory Card Connector
The Memory card connector locates on BS8 module. Memory card is a
changeable Flash or ROM memory with variable memory size. The PDA
CPU can access with Memory card via synchronous serial interface.
Memory card signals are routed from BS1 module to BS8 module through
board to board connector.
MMC_DATA
MMC_GND
MMC_CLK
MMC_VSYS
MMC_GND
MMC_CMD
Figure 7. Memory Card Connector
X191
NC
The signals of the MMC connector are specified in the board to board
connector table.
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RAE–2
3,4
PAMS
Baseband
Board to Board Connector
All interfaces (except RF antenna
signal) from the BS8 module to the
other RAE–2 modules are routed
over a 50–pins board to board connector. The interfaces can be divided into several groups; CMT–UI,
CMT–HF audio, CMT–PDA, MMC–
PDA and supply lines for the BS1
and the BS2 modules.
The CMT keyboard with keyboard illumination parts and the CMT display
module with display illumination parts are implemented on a separate UI
module (BS2), which contains also the PDA user interface and an antenna matching circuit. The baseband signals to the UI are routed over an
board to board connector to the BS1 module and from the BS1 module
through the hinge flex to the BS2 module.
Technical Documentation
pin 25pin 1
X190
pin 26pin 50
Figure 8. BoBo Connector
The Handsfree speaker and earpiece are included in the audio holder.
Because the audio holder and the HF amplifier are located on the PDA
module, several signals through the board to board connector are needed for carrying audios from the CMT to the PDA.
There are data signals for data transmission between the CMT and the
PDA modules. Some I/O signals are needed for carrying logic state information between modules.
Signal definition and the most important specifications of signals are listed
in the next table.
Table 5. Board to Board Connector (X190)
Pin I/O Name Function Min Typ Max Unit Description /
1,2,
,
5
6 O XEAR Audio Output for Handsfree 500 mVpp
7 GND Global Ground Reference for oth-
8 O BATTDET Battery Position Information
9 O HFENA Internal Handsfree Amplifier
VBATT Battery Positive
Control
3.0 3.6 4.1 VDC Unregulated Bat-
1.5 1000 mA Current to BS1
0.23 0.26 0.28 VDC Field T est battery
0.28 0.30 0.33 VDC Service battery
0.39 0.43 0.48 VDC BLN–3 battery
0 0.5 VDC Low, HF amplifier
2.1 2.85 VDC High, HF amplifier
Note
tery Voltage
and BS2 module
(max=peak current)
er signals
(only R&D use)
(BBS–5)
disabled
enabled
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