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Nokia 8890 Service Manual 04uif

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Page 1
PAMS Technical Documentation
NSB–6 Series Transceivers
UI Description
Issue 1 06/2000 E Nokia Mobile Phones Ltd.
Page 2
NSB–6 UI Description
PAMS Technical Documentation

CONTENTS

UI Description 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BB Interface 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LCD Module Interface 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio control 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Display Circuit 10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Keyboard 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Key 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Backlighting 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buzzer 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Speaker 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Microphone 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Vibra Alerting Device 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IR Module 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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PAMS Technical Documentation
NSB–6
UI Description
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NSB–6 UI Description

UI Description

Introduction

UI module is implemented on same PCB board with BB–module and RF– module. UI HW part are LCD, backlighting, audio parts, IR and vibra.
PAMS Technical Documentation
Buzzer Keys
1
2
2
BASEBAND
1
LED
8
5
LCD
3
IR
1
Vibra
BB Interface
Signal Parameter Min Typ Max Unit Notes
IRONX IR–module on/off 0 0.3 x VBB V IR on state
0.7 x VBB VBB Iout@2mA
FBUS_RX
FBUS_TX
VIBRA From VB 0.9 1.0 1.1 V
ROW (0:4) Rows 0
COL (0:4) COL0 0
VB 3.0 4.8 Battery voltage
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IR receive pulse 0 0.3 x VBB IR receive no pulse 0.7 x VBB VBB IR transmit pulse 0.7 x VBB VBB Iout@2mA IR transmit no pulse 0 03 x VBB
115 140 mA
0.3 x VBB
0.7 x VBB
0.3 x VBB
0.7 x VBB
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VBB
VBB
V Keyboard matrix
row
Keyboard matrix column
(for lights)
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PAMS Technical Documentation
NSB–6
UI Description
NotesUnitMaxTypMinParameterSignal
PWRONX 0
0.7 x VBB
ROW5/ LCDCD
SCL 0
SDA 0
LCDEN 0
LCDRSTX 0
GND 0 0 Ground BUZZER 0 0.3 x VBB PWM low level
LCD command / data 0
0.7 x VBB
0.7 x VBB
0.7 x VBB
0.7 x VBB
0.7 x VBB
0.7 x VBB VBB PWM high level 440 4700 Hz Buzzer PWM fre-
0 50 % PWM duty cycle
0.3 x VBB VBB
0.3 x VBB VBB
0.3 x VBB VBB
0.3 x VBB VBB
0.3 x VBB VBB
0.3 x VBB VBB
V Power on key
Keyboard matrix row 5
LCD driver code/ data selection
LCD driver serial clock
LCD driver serial data
LCD driver chip select
LCD driver reset
quency
VBB 2.7 2.8 2.9 V Logic supply volt-
age
LIGHT 0
0.7 x VBB
EARN 17.6 788 mV Connected to
EARP 17.6 788 mV Connected to
0.3 x VBB VBB
Illumination con­trol
COBBA EARN output.
COBBA EARP output.
LCD Module Interface
Pin Line
Symbol
1 VBB Supply voltage 2.7 2.8 2.9 V
2 SCLK Serial clock input 0 4.0 MHz VBB = 2.7V
3 SDA Serial data input 0 0.3xVBB
Parameter Mini-
mum
0 VBB V
Typical / Nomi-
nal
Maxi-
mum
300 uA
Unit Notes
4 LCDCDX Control/display data
flag input
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0.7xVBB VBB 0 0.3xVBB Control
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NSB–6 UI Description
PAMS Technical Documentation
Pin
Symbol
5 LCDCSX Chip select input 0 0.3xVBB Active
6 OSC External clock for LCD 30.4 32.0 33.6 kHz Connected
7 GND Ground 0 V 8 VOUT DC/DC voltage con-
9 LCDRSTX Reset 0 0.3xVBB Active
ParameterLine
verter output
Mini­mum
0.7xVBB VBB Data
0.7xVBB VBB
0.7xVBB VBB
Typical / Nomi-
nal
mum
9
NotesUnitMaxi-
to VBB on PCB
19
Display Driver
Viewing trought LCD cell
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PAMS Technical Documentation

Functional Description

Audio control
The audio control and processing is taken care by the COBBA–GJP, which contains the audio (and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio sig­nals.
NSB–6
UI Description
MICP/N
XMICP/N
XEARP/N
Bias + EMC
EMC + Acc.
Interf.
EMC
MIC2 MIC1
MIC3
HFCM
AuxOut
HF
EARP/N
Preamp
Amp Multipl.
Multipl.Premult.
COBBA
Pre & LP
LP
A
D
D
A
DSP
MAD
MCU
The baseband supports three microphone inputs and two earphone out­puts. The inputs can be taken from an internal microphone, a headset mi­crophone or PPH–1 microphones. The microphone signals from different sources are connected to separate inputs at the COBBA–GJP ASIC. In­puts for the microphone signals are differential type.
Buzzer Driver in
UISWITCH
Buzzer
The MIC1 inputs are used for a headset microphone that can be con­nected directly to the HS/HF connector. The internal microphone is con­nected to MIC2 inputs. In COBBA there are also three audio signal out­puts of which dual ended EAR lines are used for internal earpiece and HF line for accessory audio output. The third audio output AUXOUT is used for bias supply to the headset microphone. PData(2) is used for PPH–1 mute control.
The output for the internal earphone is a dual ended type output capable of driving a dynamic type speaker. The output for the external accessory and the headset is dual ended (differential). Input and output signal source selection and gain control is performed inside the COBBA–GJP asic according to control messages from the MAD2. Keypad tones, DTMF, and other audio tones are generated and encoded by the MAD2 and transmitted to the COBBA–GJP for decoding.
External audio connections
The external audio connections are presented on the next page. A head­set and PPH–1 can be connected directly to the system connector. The headset microphone bias is supplied from COBBA AUXOUT output and fed to microphone through XMICP line.
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NSB–6 UI Description
PAMS Technical Documentation
10k
10k
Baseband
MAD
HeadDet
CCUT
HookDet
CCONT
EAD
AUXOUT
PData(2)
2.8 V
100k
100k
2.8 V
470R
100R
220k
33k
100k
100k
10k
10k
10m
CTIM
CHAPS
COBBA
HF
HFCM
MIC1P
MIC1N
MIC3N
MIC3P
33n
33n 33n
33n
10m
2k2
2k2
470R
33k
100R
1k
Combined headset and system connector audio signals, does not include EMC parts.
(Headset can be connected to system connector)
XEARP
XEARN
XMICP
100R
XMICN
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Analog audio accessory detection
In XEARP signal there is a 100 kW pullup and 33k pulldown in the trans­ceiver for HeadDet. The HeadDet is pulled up when an accessory is con­nected, and pulled down when disconnected. To get HeadDet work prop-
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NSB–6
PAMS Technical Documentation
UI Description
erly the system connector must be assembled otherwise the transceiver will assume that some accessory is connected. In XMICN signal there is a
1.0 kW pulldown in transceiver and serial 1040 W from AUXOUT to XMICP. The XMICN is connected to transistor which is then connected to the HookDet line (in MAD).
External accessory notices powered–up phone by detecting voltage in HeadDet line.
Accessory connected HookDet*) HeadDet**) Notes
No accessory connected High Low Headset with a button switch pressed Low High XEAR and XMIC loaded (dc) Headset with a button switch released High High XEAR and XMIC loaded (dc) Handsfree (PPH–1) Low High XMIC loaded (dc)
*) HookDet is used only for detect button in headset **) HeadDet is used only for detect that some accessory is connected into sys-
tem connector
NOTE: Charging must stop when the detection sequences is done! Headset detection
The external headset device is connected to the headset connector, from which the signals are routed to COBBA headset microphone inputs and earphone outputs. In the XMICN line there is a 1.0 kW pulldown in the transceiver. The microphone is a low resistancepullup compared to the transceiver pulldown.
When there is no call going, the AUXOUT is in high impedance state and the XMICN and XMICP is pulled down. When a headset is connected, the XMICP is pulled up. The switch inside the system connector is connected to the HeadDet line (in MAD), an interrupt is given due to both connection and disconnection.
NOTE: If the headset is connected switch closed the transceiver can not detect if headset or PPH–1 in power off mode is connected. When switch is released to open transceiver can not any more detect the headset with­out polling by SW.
Headset switch detection
In the XMICN line there is a 1.0 kW pulldown in the transceiver. The mi­crophone is a low resistance pullup compared to the transceiver pull­down. When a remote control switch is open, there is a capacitor in paral­lel with the microphone, so the XMICN is pulled up and HookDet pulled down by the phone, when AUXOUT is set to 2.1V. When the switch is closed, the XMICN is pulled down via the microphone and HookDet is pulled up. So both press and release of the button gives an interrupt when AUXOUT is set to 2.1V.
PPH–1 detection
The external Plug & Play PPH–1 device is connected to the system con­nector, from which the signals are routed to COBBA headset microphone
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NSB–6 UI Description
inputs and earphone outputs. In the XMICN line there is a 1.0 kW pull­down in the transceiver. The PPH–1 has a low resistance pullup compared to the transceiver pulldown. When there is no call going, the AUXOUT is in high impedance state and the XMICN and XMICP is pulled down. When a powered PPH–1 is connected, the XMICP is pulled up. The switch inside the system connector is connected to the HeadDet line (in MAD), an interrupt is given due to both connection and disconnection.
In PPH–1 device has two operating mode device with external micro­phone and without external microphone. When internal microphone is used the detection signal (EAD) is higher than when external microphone is used.
NOTE I: If the PPH–1 is connected power off mode the transceiver can not detect if device is a headset or a PPH–1 connected. When PPH–1 is powered on it is possible to detect when case of PPH–1.
NOTE II: If the external microphone is connected from or disconnected to PPH–1 it is not possible for transceiver to detect when that happens.
Internal audio connections
PAMS Technical Documentation
The speech coding functions are performed by the DSP in the MAD2 and the coded speech blocks are transferred to the COBBA for digital to ana­log conversion, down link direction. In the up link direction the PCM coded speech blocks are read from the COBBA by the DSP.
Display Circuit
The display circuit includes LCD module UX7 and two capacitors. The LCD module is COG (Chip on Glass) technology. The connection method for chip on the glass is ACF, Adhesive Conductive Film. The LCD module is connected to UI board with STAX elastomer. Capacitors are placed on PCB.
The display driver includes hw–reset, voltage tripler or quadrupler which depends on temperature, temperature compensating circuit and low pow­er control. Driver includes 84x48 RAM memory which is used when some elements are create on display. Elements can be created with software. Driver doesn’t include CG–ROM. One bit in RAM is same as one pixel on display.
GENSIO(1:0) ROW5
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LCDEN
LCDRSTX
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PAMS Technical Documentation
Keyboard
Matrix size is 5 row and 5 columns. Scanning is used for keyboard read­ing. Rows and columns is connected to MAD interface.
NSB–6
UI Description
Keyboard Matrix
ROW/COL 0 1 2 3 4
0 SLIDE SWT Side Key Send End/Mode Side Key 1 NC Soft left Up Down Soft Right 2 NC 1 4 7 * 3 NC 2 5 8 0 4 PWR switch 3 6 9 #
NC = Not Connected
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NSB–6 UI Description
Power Key
Micro switch is used as a power key on UI module. Circuitry includes mi­cro switch and two diodes which is needed for MAD interface. Power key is connected to CCONT. Power switch is active in LOW state. Power key is connected to ROW4.
Backlighting
Switching circuits for backlighting are placed on UI module. Display and keyboard lighting is connected together. When LIGHT–signal is HIGH the lights are on and when LIGHT–signal is LOW state lights are off.
PAMS Technical Documentation
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LCD backlighting is made by LEDs, two LEDs on right and two on left side of display. Light is on when LIGHT–signal is in HIGH state.
Keyboard backlighting is made by LEDs also. Backlighting is on when LIGHT–signal is on HIGH state.
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PAMS Technical Documentation
Buzzer
Alerting tones and/or melodies as a signal of an incoming call are gener­ated with a buzzer that is controlled with a PWM signal by the MAD via UISWITCH. Also keypress and user function response beeps are gener­ated with the buzzer. The buzzer is a SMD device and is placed on the mother board. Target for SPL is 100dB (A) at 5cm.
NSB–6
UI Description
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NSB–6 UI Description
Speaker
Speaker circuit includes pads for speaker and 2 capacitors, 2 ferrites for EMC protection.
Speaker is sealed to A–cover with gasket and UI PCB with supporting ring. With that the frequency response is more constant. Speaker does not need holes for PCB. This gives reliable sound quality for the phone and it can be estimated in several environments. Arrangement is not a leak tolerant speaker.
The low impedance, dynamic type earphone is connected to a differential output in the COBBA audio codec. The electrical specifications for the earphone output are shown below. The voltage level at each output is giv­en as reference to ground. Earphone levels are given to 32 ohm load.
PAMS Technical Documentation
Nominal Maximum Notes
COBBA output, differ­ential, 6dB gain
Earpiece sound pres­sure (sensitivity +28dBPa/V 1kHz)
17.6mV 788mV ENGINE – UI Interface; Esti­mate, must be checked with final earpiece construction
–7dBPa +26dBPa Measured as shielded (in brack-
ets with leak ring)
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NSB–6
PAMS Technical Documentation
UI Description
Microphone
The internal microphone is placed to slide. Microphone is OMNI direction­al. The microphone requires a bias current to operate. The bias current is generated from VCOBBA supply with a transistor. EMC protection parts are implemented partly in slide and partly on motherboard.
Pin Name Min Typ Max Unit Notes
X300/2 MICP 0.55 4.1 mV Connected to COBBA MIC2N input.
The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical val­ue is maximum value – 16 dB.
X300/1 MICN 0.55 4.1 mV Connected to COBBA MIC2P input.
The maximum value corresponds to1 kHz, 0 dBmO network level with input amplifier gain set to 32 dB. typical val­ue is maximum value – 16 dB.
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NSB–6 UI Description
PAMS Technical Documentation
Vibra Alerting Device
A vibra alerting device is used for giving silent signal to the user of an in­coming call. Vibra is located in the phone. The vibra is controlled with a PWM signal by the MAD via UISWITCH.
Signal Parameter Min Typ Max Unit Notes
M300 / 1 1.0 1.1 1.2 V Measured against
M300/2
I
vibra
Rated load current 115 140 mA Rated load speed 7000 8000 12000 rpm
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NSB–6
PAMS Technical Documentation
UI Description
IR Module
An infrared transceiver module is designed to substitute an electrical cable between the phone and a PC. The infrared transceiver module is a stand alone component capable to perform infrared transmitting and re­ceiving functions by transforming signals transmitted in infrared light from and to electrical data pulses running in two wire asynchronous databus. IR is located left bottom corner of the product.
Signal Parameter Min Typ Max Unit Notes
IRONX IR–module on/off 0.7 x VBB VBB V Iout@2mA, IR is
at off state
0 0.3 x VBB IR, is at on state
FBUS_RX
FBUS_TX
IR receive no pulse 0.7 x VBB VBB IR receive pulse 0 0.3 x VBB IR transmit pulse 0.7 x VBB VBB Iout@2mA IR transmit no pulse 0 0.3 x VBB
The module is activated with an IRONX signal by the MAD, which sup­plies power to the module. The IR datalines are connected to the MAD accessory interface AccIf via FBUS. The AccIf in MAD performs pulse en­coding and shaping for transmitted data and detection and decoding for received data pulses.
The data is transferred over the IR link using serial data at speeds 9.6,
19.2, 38.4, 57.6 or 115.2 kbits/s, which leads to maximum throughput of
92.160 kbits/s. The IR module used does not comply with the IrDA 1.0 specification (Infra Red Data Association), which is based on the HP SIR (Hewlett–Packard‘s Serial Infra Red) concept. Maximum transmission dis­tance is set to 60cm.
In IR transmission a light pulse corresponds to 0–bit and a ”dark pulse” corresponds to 1–bit.
IR TX
UART TX
constant pulse
startbit stopbit1 0100110
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NSB–6 UI Description
The FBUS cannot be used for external accessory communication, when the infrared mode is selected. Infrared communication reserves the FBUS completely.
PAMS Technical Documentation
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