Nokia 8810 Service Manual DISTRO
PAMS Technical Documentation
NSE–6 Series Transceivers
Disassembly &
Troubleshooting
Instructions
Original 08/98
NSE–6
PAMS
Disassembly & Troubleshooting Instructions
Technical Documentation
CONTENTS
Disassembly 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Testing 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alignments 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trouble Shooting 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phone is totally dead 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash programming doesn’t work 7. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (1) 9. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (2) 10. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (3) 11. . . . . . . . . . . . . . . . . . . . . . .
Flash Programming failure (4) 12. . . . . . . . . . . . . . . . . . . . . . .
Power doesn’t stay on, or phone is jammed 13. . . . . . . . . . . . . .
Display Information: Contact Service 14. . . . . . . . . . . . . . . . . . . .
The phone doesn’t register to the network or phone doesn’t make a call 15.
Phone register failure 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM card related failures 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Card failure 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio failure 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charger failure 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (1) 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (2) 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (3) 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (4) 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (5) 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver Fault (6) 27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Fault (1) 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Fault (2) 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter Fault (3) 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix A 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix B 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix C 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Appendix D 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test points 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Page No
Page 2
Original 08/98
PAMS
NSE–6
Technical Documentation
Disassembly
Remove battery
Disassembly & Troubleshooting Instructions
Step 1. Open slide cover.
Step 2. Push slide edge outwards.
Step 3. Lift slide up from the edge
and slide will be released.
Remove a–cover
screws (2 pcs)
NOTE: When assembling the
screws, use 17 Ncm torque.
Turn the phone around and remove C–cover screws (2 pcs)
Step 1. Push c–cover edge outwards to release it behind locking snap
Step 2. Lift up the edge to release c–cover.
Step 3. Repeat the operation on both sides.
Original 08/98
Remove c–cover by
lifting up rear and
pulling cover out.
Page 3
NSE–6
PAMS
Disassembly & Troubleshooting Instructions
Remove shield
screws (2 pcs).
Step 1. Push slide detector
switch to the bottom and hold.
Step 2. Release main pcb by
lifting rear up and pulling.
Technical Documentation
Remove shield.
Step 1. Lift slide frame from botttom and loosen it from a–cover.
Step 2. Remove slide frame, UI–
board will follow.
Remove main pcb.
Page 4
Parts can be separated.
Original 08/98
PAMS
NSE–6
Technical Documentation
Baseband Testing
The MCU software enters a local mode at start–up if suitable resistors are
connected to the BTEMP and BSI lines. NOTE! Baseband doesn’t wake up
automatically when the battery voltage is connected. Power must be
switched on via:
1. Pwr key or
2. BTEMP line or
3. Charger
In the local mode the baseband can be controlled through MBUS or FBUS
connections by a PC–locals software. Baseband internal connections are
tested with self tests if possible. By connecting MAD2 pin ROW5 to ground,
MAD2 pins are toggled as a daisy chain, which can be used for detecting
short circuits in MAD2 pins. Test pads are placed on engine pcb for service
and production troubleshooting purposes in some supply voltage and signal
lines.
Disassembly & Troubleshooting Instructions
Alignments
Within alignment those parameters are adjusted, that cannot be set accurate
enough by design because of component tolerances. Due to use of 5% resistor values, the channels of the CCONT A/D converters need to be aligned
in the production phase. Within battery voltage tuning the MCU software
reads the A/D reading from CCONT at 4.1V and stores this reading to EEPROM memory as a reference point. Another reference point is created by
assuming that while the input voltage is zero, A/D reading is also zero. Now
the slope is known and A/D readings can be calibrated. Calibration is included in VBAT A/D reading task.
Battery charging voltage VCHAR and current ICHAR are calibrated using
one test setting. T est jig in production/service must have a connection to battery terminals. ICHAR and VCHAR are supplied fron the jig and service software calculates values, which are then stored to EEPROM.
Original 08/98
Page 5
NSE–6
PAMS
Disassembly & Troubleshooting Instructions
Trouble Shooting
The following hints should facility finding the cause of the problem when
the circuitry seems to be faulty. This trouble shooting instruction is divided following section.
1. Phone is totally dead
2. Flash programming doesn‘t work
3. Power doesn‘t stay on or the phone is jammed
4. Display information: Contact Service
5. Phone doesn‘t register to the network or phone doesn‘t make a call.
6. SIM card related failures ( insert SIM card or card rejected).
7. Audio fault.
8. Charging fault
The first thing to do is carry out a thorough visual check of the module.
Ensure in particular that:
a) there are not any mechanical damages
b) soldered joints are OK
Technical Documentation
Page 6
Original 08/98
PAMS
NSE–6
Technical Documentation
Phone is totally dead
This means that the phone doesn’t take current at all when the power
switch is pressed or when the watchdog disable pin (X001 pin 11, J111) is
grounded. Used battery voltage must be higher than 3.1 V. Otherwise the
hardware of CCONT (N100) prevents totally power switch–on.
Phone is totally dead
Yes
J232 VBAT is 3.6 V
Yes
Voltage at J111 is 3.6V
Disassembly & Troubleshooting Instructions
No
Failure in VBA T line
Check L103
No
Faulty CCONT (N100)
Yes
VBB 2.8 V (R115, C107..)
VXO 2.8 V (C149..)
When PWR switch is pressed or
WDDIS is grounded (J111)
Yes
See section ”Power doesn’t stay on”
No
WDDIS (J111)) is
0V, when PWR switch
is pressed
Faulty CCONT (N100)
Flash programming doesn’t work
The flash programming can be done via panel connector X001 or via dedicated PCB pads. In production, the first programming is done via panel
connector. After this, the panel connector is cut away, thus the programming must be done via PCB pads visible through the shield under the battery. The main difference between these is that FLASH programming voltage is produced differently.
Yes
No
Check PWR switch
to CCONT line: R341,
R1 18
In flash programming error cases the flash prommer can give some information about a fault. The fault information messages could be:
– MCU doesn’t boot
– Serial clock line failure
– Serial data line failure
– External RAM fault
– Algorithm file or alias ID don’t find
– MCU flash Vpp error
Original 08/98
Page 7
NSE–6
PAMS
Disassembly & Troubleshooting Instructions
In cases of unsuccesful flash programming there is a possibility to check
short circuits between the memories and the MCU (MAD2). It is useful to
do this test, when the fault information is: MCU doesn’t boot, Serial clock
line failure or Serial data line failure. The test procedure is following:
1. Connect testpoint J229 to ground.
2. Switch the power on.
3. If the voltage level in testpoint J225 is 2.8 V (”1”), the interface is OK. If
there is a short circuit, the voltage level in testpoint J225 stays low and 32kHz
square wave signal can be seen in the lines which are already tested.
It must be remembered that this test can only find short circuits, not open
pins. In addition upper data lines (15:8) of flash memory D220 are not included in this test.
CCONT pin 54
Technical Documentation
( PURX )
passed
MAD pin 38
MAD pin 134
J225
( MCUAD0)
( ExtSysResX))selftest
Page 8
Original 08/98
PAMS
NSE–6
Technical Documentation
Flash Programming failure (1)
Flash programming doesn’t work
via panel connector
YES
If the fault information from prommer is:
a) MCU doesn’t boot
b) Serial data line failure
c) Serial clock line failure
connect watchdog disable (WDDIS, J111)
line to the ground
OK
VBB (R115, C107 upper side) 2.8 V
VXO (C149 upper side ) 2.8 V
YES
Check C213, R213
YES
NO
RFC (C664) 13 MHz
800 mV min
NO
J227 master reset (Purx) = ”1” (2.8 V)
YES
RfClk (R213 lower side) 13 MHz sine wave
clock signal: 500 mV
pp
YES
Disassembly & Troubleshooting Instructions
NO
See section ”Phone is totally dead”
NO
J228 sleep clock (SCLK)
square wave 32 kHz
YES
min
Faulty circuit N100
or overloaded PurX line
NO
Check sleep
clock circuitry
(B101, R154..)
Check buffer V660 and
VCTCXO G660
Check that following lines are correct:
FTX (fbus_tx) line: X001 pin 1 ––> R215
FRX (fbus_rx) line: X001 pin 2 ––> R201
FCLK (MBUS) line: X001 pin 3 ––> R115
Check also pullup and pulldown resistors R115, R201, R215
GND: X001 pin 7 ––> GND
OK
Enable the selftest function of D200 by connecting
J229 to ground
Connect oscilloscope to testpoint J225
(ExtSysResetX) and switch power on
Voltage level rises to ”1” after power on at testpoint J225
YES
There could be open pins in circuits D200 (D220, D240)
(open joints may be detectable with microscope)
If not, the PCB or D200 (D220, D240) is faulty.
There is a shortcircuit
NO
somewhere in memory control
lines or MCU address lines or
MCU lower (7:0) data lines
Original 08/98
Page 9
NSE–6
PAMS
Disassembly & Troubleshooting Instructions
Flash Programming failure (2)
Flash programming doesn’t work
via panel connector
If the fault information is:
External RAM fault
Check control lines of SRAM (D230):
RamSelX (J235)..
There could be open joints in SRAM
Technical Documentation
Flash programming doesn’t work
via panel connector
If the fault information is:
Algorithm file or alias ID don’t find,
ID is unknown etc.
Check control lines of Flash (D220):
ROM1SelX (J234)..
Fault could be open joints in Flash or
In upper data lines (15:8)
Flash programming doesn’t work
via panel connector
If the fault information is:
MCU flash Vpp error
Check connections between X001;10
––> R21 1 upper side
Check components C212, R211
Faulty component D220
Page 10
Original 08/98
PAMS
NSE–6
Technical Documentation
Flash Programming failure (3)
Flash programming doesn’t work
If the fault information from prommer is:
a) MCU doesn’t boot
b) Serial data line failure
c) Serial clock line failure
connect watchdog disable (WDDIS, J111)
line to the ground
VBB (R115, C107 upper side) 2.8 V
VXO (C149 upper side ) 2.8 V
Check C213, R213
YES
RFC (C664) 13 MHz
800 mV min
NO
NO
J227 master reset (Purx) = ”1” (2.8 V)
RfClk (R213 lower side) 13 MHz sine wave
clock signal: 500 mV
YES
OK
YES
YES
pp
YES
min
Disassembly & Troubleshooting Instructions
NO
VBAT is correct 3.6 V
NO
J228 sleep clock (SCLK)
square wave 32 kHz
YES
Faulty circuit N100
or overloaded PurX line
YES
Faulty circuit N100
NO
Check sleep
clock circuitry
(B101, R154..)
Check buffer V660 and
VCTCXO G660
Check that following lines are correct:
FTX (fbus_tx) line: X001 pin 1 ––> R215
FRX (fbus_rx) line: X001 pin 2 ––> R201
FCLK (MBUS) line: X001 pin 3 ––> R115
Check also pullup and pulldown resistors R115, R201, R215
GND: X001 pin 7 ––> GND
OK
Enable the selftest function of D200 by connecting
testpoint J229 to ground
Connect oscilloscope to testpoint J225
(ExtSysResetX) and switch power on
Voltage level rises to ”1” after power on at testpoint J225
YES
There could be open pins in circuits D200 (D220, D240)
(open joints may be detectable with microscope)
If not, the PCB or D200 (D220, D240) is faulty.
There is a shortcircuit
NO
somewhere in memory control
lines or MCU address lines or
MCU lower (7:0) data lines
Original 08/98
Page 11
NSE–6
PAMS
Disassembly & Troubleshooting Instructions
Flash Programming failure (4)
Flash programming doesn’t work
If the fault information is:
External RAM fault
Check control lines of SRAM (D230):
RamSelX..
There could be open joints in SRAM
Technical Documentation
Flash programming doesn’t work
If the fault information is:
Algorithm file or alias ID not found,
ID is unknown etc.
Check control lines of Flash (D220):
ROM1SelX (J234)..
Fault could be open joints in Flash or
In upper data lines (15:8)
Flash programming doesn’t work
YES
If the fault information is:
MCU flash Vpp error
YES
Vpp > 2.8 V (C212)
YES
Check components C212, R211
OK
Faulty component D220
NO
Vpp > 2.8 V in J221
YES
Check UI connector X303
NO
Check regulator N202
Page 12
Original 08/98
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