Nokia 5190 Service Manual 03sys
PAMS Technical Documentation
NSB–1 Series Transceivers
Chapter 3
System Module
Original 06/98
NSB–1
PAMS
System Module
CONTENTS
Transceiver NSB–1 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 3 – 5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interconnection Diagram 3 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Module 3 – 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External and Internal Connectors 3 – 7. . . . . . . . . . . . . . . . . . . . .
System Connector Signals 3 – 8. . . . . . . . . . . . . . . . . . . . . . . .
RF–Connector 3 – 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Battery Contacts 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM Reader 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Description 3 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of Operation 3 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Cellular Mode 3 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power off 3 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Locals Mode 3 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baseband Module 3 – 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram 3 – 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Diagram 3 – 13. . . . . . . . . . . . . . . . . . . . . . . . . .
External interfaces 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Programming connector 3 – 14. . . . . . . . . . . . . . . . . . . . . . .
Battery connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SIM card connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real time clock 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Signals between baseband and User Interface section 3 – 16. .
User Interface module connection 3 – 16. . . . . . . . . . . . . . . . . . . .
Earphone 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Buzzer 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power up 3 – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acting Dead 3 – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Active Mode 3 – 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep Mode 3 – 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Charging 3 – 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–wire charging 3 – 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–wire charging 3 – 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Off 3 – 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio control 3 – 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Microphone and Earphone 3 – 21. . . . . . . . . . . . . . . . . . . . . . . . . .
Speech processing 3 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alert Signal Generation 3 – 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital control 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MAD 3 – 23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Technical Documentation
Page 3 – 2
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Technical Documentation
Memories 3 – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Program Memory 3 – 24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SRAM Memory 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EEPROM Memory 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MCU Memory Map 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Module 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Frequency Plan 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Characteristics 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution Diagram 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . .
Power Distribution – Maximum Currents 3 – 27. . . . . . . . . . . . . . .
Power Distribution – Typical Currents 3 – 28. . . . . . . . . . . . . . . . .
Functional Description 3 – 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver 3 – 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Transmitter 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Detection Circuit 3 – 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Frequency Synthesizers 3 – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . .
AGC 3 – 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AFC 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Software Compensations 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Levels (TXC) vs. Channel 3 – 36. . . . . . . . . . . . . . . . . . .
Modulator Output Level 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Levels vs temperature 3 – 36. . . . . . . . . . . . . . . . . . . . . .
RSSI 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TX power range 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Block Specifications 3 – 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1900 Receive Interstage Filter 3 – 37. . . . . . . . . . . . . . . . . . .
First Mixer (UHF) in CRFU2a 3 – 37. . . . . . . . . . . . . . . . . . . . . . . .
First IF Filter 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1900 TX SAW filter 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1900 TX Ceramic Filter 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . .
Power Amplifier MMIC 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizers Blocks 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VHF VCO and Lowpass Filter 3 – 38. . . . . . . . . . . . . . . . . . . . . . . .
UHF PLL 3 – 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DCS1900 UHF VCO module 3 – 39. . . . . . . . . . . . . . . . . . . . . . . . .
UHF LO signal into CRFU_2a 3 – 39. . . . . . . . . . . . . . . . . . . . . . . .
Connections 3 – 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF connector and antenna switch 3 – 40. . . . . . . . . . . . . . . . . . . .
RF–Baseband signals 3 – 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Interface and Timing 3 – 45. . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesizer Timing Control 3 – 45. . . . . . . . . . . . . . . . . . . . . . . . . .
Transmit Power Timing 3 – 47. . . . . . . . . . . . . . . . . . . . . . . . . . .
System Module
Parts list of UR4U (EDMS Issue 16.4) Code: 0200962 3 – 48. . . . . .
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PAMS
System Module
Schematic Diagrams: UR4U – layout version 22
Block Diagram of Baseband Blocks (Version 22.30 Edit 202) layout 22 3/A3–1
Block Diagram of System/RF Blocks 3/A3–2. . . . . . . . . . . . . . . . . . . . . .
Circuit Diagram of Power Supply (Version 22.30 Edit 351) layout 22 3/A3–3. .
Circuit Diagram of UI Connector (Version 22.30 Edit 87) layout 22 3/A3–4. . . .
Circuit Diagram of CTRLU Block (Version 22.30 Edit 232) layout 22 3/A3–5. . .
Circuit Diagram of Audio (Version 22.30 Edit 156) for layout 22 3/A3–6
Circuit Diagram of RF–BB Interface (Version 22.30 Edit 113) layout 22 3/A3–7
Circuit Diagram of RF Block (Version 22.30 Edit 467) layout 22 3/A3–8
Layout Diagram of UR4U (Version 22) 3/A3–9. . . . . . . . . . . . . . . . . . . .
Technical Documentation
Page 3 – 4
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NSB–1
Technical Documentation
Transceiver NSB–1
Introduction
The NSB–1 is a radio transceiver unit for the GSM1900 network. It is a
GSM phase 2 power class 4 transceiver providing 16 power levels with a
maximum output power of 1W. The transceiver is true 3 V transceiver.
The transceiver consists of System/RF module ( UR4U ), User interface
module ( UE4S ) and assembly parts.
The antenna is a fixed helix. External antenna connection is provided by
rear RF connector
The small SIM ( Subscriber Identity Module ) card is located inside the
phone, under the battery pack.
Functional Description
System Module
There are five different operation modes:
– power off mode
– idle mode
– active mode
– charge mode
– local mode
In the power off mode only the circuits needed for power up are supplied.
In the idle mode circuits are powered down and only sleep clock is run-
ning.
In the active mode all the circuits are supplied with power although some
parts might be in the idle state part of the time.
The charge mode is effective in parallel with all previous modes. The
charge mode itself consists of two different states, i.e. the charge and the
maintenance mode.
The local mode is used for alignment and testing.
Original 06/98
Page 3 – 5
NSB–1
PAMS
System Module
Interconnection Diagram
10
User Interface
Keypad
6
SIM
System/RF
Module
UE4S
28
Module
Technical Documentation
9
Display
2
Earpiece
4
Battery
Antenna
1
System
Connector
(including Mic)
Connector
UR4U
3 + 36+2
2
Charger
RF
Page 3 – 6
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NSB–1
Technical Documentation
System Module
External and Internal Connectors
B side view
Fixing pads (2 pcs)
System Module
IBI connector
(6 pads)
8
1
7
14
Engine PCB
A side view
DC Jack
acoustic ports
Charger pads (3 pcs)
Microphone
Bottom
connector (6 pads)
Cable locking holes (3 pcs)
Cavity for microphone
Original 06/98
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NSB–1
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System Module
Technical Documentation
System Connector Signals
Pin Name Function Description
1 V_IN Bottom charger contacts Charging voltage.
2 L_GND DC Jack Logic and charging ground.
3 V_IN DC Jack Charging voltage.
4 CHRG_CTRL DC Jack Charger control.
5 CHRG_CTRL Bottom charger contacts Charger control.
6 MICP Microphone Microphone signal, positive node.
7 MICN Microphone Microphone signal, negative node.
8 XMIC Bottom & IBI connectors Analog audio input.
9 SGND Bottom & IBI connectors Audio signal ground.
10 XEAR Bottom & IBI connectors Analog audio output.
11 MBUS Bottom & IBI connectors Bidirectional serial bus.
12 FBUS_RX Bottom & IBI connectors Serial data in.
13 FBUS_TX Bottom & IBI connectors Serial data out.
14 L_GND Bottom charger contacts Logic and charging ground.
RF–Connector
The RF–connector is needed to utilize the external antenna with Car
Cradle. The RF–connector is located on the back side of the transceiver
on the top section. The connector is plug type connector with special mechanical switching.
Accessory side of connector
Part will be floating in
car holder
Phone side of connector
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Technical Documentation
Battery Contacts
Pin Name Function Description
1 BVOLT Battery voltage Battery voltage
2 BSI Battery Size Indicator Input voltage
3 BTEMP Battery temperature indication
Phone power up
Battery power up
PWM to VIBRA BA TTERY
4 BGND Ground
Input voltage
Input voltage
Output voltage
PWM output signal frequency
SIM Reader
System Module
Operating Conditions
Environmental condition Ambient temperature Notes
Normal operation conditions +7 oC ... +40 oC Specifications fulfilled and fast
charging possible
Extreme operation conditions –10 oC ... +55 oC Specifications fulfilled
Reduced performance condi-
tions
Intermittent operation condi-
tions
Cessation of operation <–25 oC and >80 oC No storage or operation at-
Long term storage conditions 0 oC ... +40 oC Battery only up to +30 oC !
Short term storage, max. 96 h –25 oC ... +70 oC Cumulative for life–time of bat-
Original 06/98
+55 oC ... +65 oC Operational only for short peri-
ods
–25 oC ... –10 oC and
+65 oC ... +80 oC
Operation maybe not possible
but attempt to operate will
not damage the phone
tempt possible without per-
manent dam– age
tery
Page 3 – 9
NSB–1
PAMS
System Module
Short term storage, max. 12 h –25 oC ... +80 oC Cumulative for life–time of bat-
–25 oC ... +75 oC LCD operation
Short term operation > +70 oC Maximum value for SIM card,
Technical Documentation
NotesAmbient temperatureEnvironmental condition
tery
GSM spec. 11.11
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Technical Documentation
Functional Description
The DCS 1900 engine consist of a Baseband/RF module with connections to a separate user interface module. Baseband and RF modules
are interconnected with PCB wiring. The engine can be connected to accessories via the bottom system connector, the Intelligent Battery Interface (IBI) connector.
The RF submodule receives and demodulates radio frequency signals
from the base station and transmits modulated RF signals to the base
station. It consists of functional submodules Receiver, Frequency Synthesizer and Transmitter.
The Baseband module comprises audio, control, signal processing and
power supply functions. It consists of functional submodules CTRLU
(Control Unit; MCU, DSP, logic and memories), PWRU (Power Supply;
regulators and charging) and AUDIO_RF (audio coding, RF–BB interface).
System Module
Modes of Operation
UR4 operates in cellular mode and a local mode for service:
– Cellular mode, phone controlled by OS and partly by base station
– Locals mode, used by Production and After Sales.
– Acting Dead mode
– Power Off mode
– Flash mode
Cellular Mode
In cellular mode phone performs all the tasks to place and release calls.
Also charging and communication between accessories and phone are
done during this mode by OS. Signaling and handover functions are supported by base station.
Power off
In the power–off mode only CCONT is active. Power–off mode can be left
by pushing the PWR–key, connecting charger to the phone, real time
clock interrupt or intelligent battery interrupt.
Locals Mode
Locals mode is used for testing purposes by Product Development, Production and After Sales. The Cellular Software is stopped (no signalling
to base station), and the phone is controlled by MBUS/FBUS messages
by the controlling PC.
Original 06/98
Page 3 – 11
NSB–1
PAMS
System Module
Baseband Module
Block Diagram
TX/RX SIGNALS
COBBA
UI
COBBA SUPPLY
RF SUPPLIES
CCONT
BB SUPPLY
Technical Documentation
PA SUPPLY
32kHz
CLK
SLEEP CLOCK
SIM
13MHz
CLK
SYSTEM CLOCK
AUDIOLINES
BASEBAND
MAD
+
MEMORIES
VBAT
BATTERY
CHAPS
SYSCON
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Technical Documentation
Power Distribution Diagram
Charger
Charge
control
UR4 engine
CCONT
System Module
VBAT
TX PA
RF
1900
VR1
VR2
VR3
VR4
VR5
VR6
VR7
VREF
Battery
VSIM
VBB
V5V
UI Module
Baseband
COBBA
analog
Flash
ROM
Original 06/98
Page 3 – 13
NSB–1
PAMS
System Module
External interfaces
4
Battery
Pack
3
Charger
IBI
Connector Name Code Notes
Antenna
UR4
ENGINE
6
Bottom
connectorconnector
SIM
6
Mic
28
Technical Documentation
User
Interface
Module
Display
Keyboard
Backlights
Speaker
Buzzer
Bottom & IBI connector 5469061 Includes DC plug, external audio, and data
lines.
User Interface Module connector 5460021 28 pins, spring contacts.
Battery connector 5469069 2 pieces, 2 connections each.
SIM connector 5400085 Supports 3V/5V SIM cards.
RF connector 5429007
Flash Programming connector
The system connector can be used as a flash prom programming interface for
flash memories for updating (i.e. re–programming) the flash program memory.
The phone has to be switched off, when the flash prommer is connected to the
phone system connector. The baseband is powered up as the supply voltage
is connected to the charger contacts, or by pressing the PWR button, or by an
IBI device..
The program execution starts from the BOOT ROM and the MCU investigates
in the early start–up sequence if the flash prommer is connected. This is done
by checking the status of the MBUS–line. Normally this line is high but when
the flash prommer is connected the line is forced low by the prommer. The
flash prommer serial data receive line is in receive mode waiting for an acknowledgement from the phone. The data transmit line from the baseband to
the prommer is initially high. When the baseband has recognized the flash
prommer, the TX–line is pulled low. This acknowledgement is used to start the
data transfer of the first two bytes from the flash prommer to the baseband on
the RX–line. The data transmission begins by starting the serial transmission
clock (MBUS–line) at the prommer.
The 3V programming voltage is supplied inside the transceiver from the battery
voltage with a switch mode regulator (3V/30mA) of the CCONT. The voltage is
Page 3 – 14
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Technical Documentation
System Module
fed via UI connector to avoid damage of the CCONT during production line
flashing ( 12V fed to FLASH Vpp from the production tester ).
Pin Name Parameter Min Typ Max Unit Remark
1 VIN Charging 6.8 7.8 8.8 V Supply Voltage,Current
limited to 850 mA
11 MBUS Serial clock
from the
Prommer
12 FBUS_RX Serial data
from the
Prommer
13 FBUS_TX Data ac-
knowledge to
the Prommer
14 GND GND 0 0 V Supply ground
2.0
0
2.0
0
2.0
0
2.8
0.8
2.8
0.8
2.8
0.8
V Prommer detection and
Serial Clock for synchro-
nous communication
V Receive Data from
Prommer to Baseband
V Transmit Data from Base-
band to Prommer
Battery connector
The BSI contact on the battery connector is used to detect when the battery is to be removed to be able to shut down the operations of the SIM
card before the power is lost if the battery is removed with power on. The
BSI contact in the battery pack should be shorter than the supply power
contacts to give enough time for the SIM shut down.
A vibra alerting device is used for giving silent signal to the user of an incoming call. The device is not placed in the phone but it will be added to a
special battery pack. The vibra is controlled with a PWM signal by the
MAD via the BTEMP battery terminal.
SIM card connector
Pin Name Parameter Min Typ Max Unit Notes
1 GND GND 0 0 V Ground
2 VSIM 5V SIM Card
3V SIM Card
3 DATA 5V Vin/Vout
3V Vin/Vout
4.8
2.8
4.0
0
2.8
0
5.0
3.0
”1”
”0”
”1”
”0”
5.2
3.2
VSIM
0.5
VSIM
0.5
V Supply voltage
V SIM data
Trise/Tfall max 1us
4 SIMRST 5V SIM Card
3V SIM Card
5 SIMCLK Frequency
Trise/Tfall
Original 06/98
4.0
2.8
1.625 3.25 5.0
”1”
”1”
VSIM
VSIM
25
V SIM reset
MHz
ns
SIM clock
Page 3 – 15
NSB–1
PAMS
System Module
Real time clock
Requirements for a real time clock implementation are a basic clock
(hours and minutes), a calender and a timer with alarm and power on/off
–function and miscellaneous calls. The RTC will contain only the time
base and the alarm timer but all other functions (e.g. calendar) will be implemented with the MCU software. The RTC needs a power backup to
keep the clock running when the phone battery is disconnected. The
backup power is supplied from a rechargable polyacene battery that can
keep the clock running some ten minutes. If the backup has expired, the
RTC clock restarts after the main battery is connected. The CCONT
keeps MCU in reset until the 32kHz source is settled (1s max).
The CCONT is an ideal place for an integrated real time clock as the asic
already contains the power up/down functions and a sleep control with
the 32kHz sleep clock, which is running always when the phone battery is
connected. This sleep clock is used for a time source to a RTC block.
Technical Documentation
Signals between baseband and User Interface section
The User interface section is implemented on separate UI board, which
connects to the engine board with a board to board spring connector.
User Interface module connection
The User interface section comprises the keyboard with keyboard lights,
display module with display lights, an earphone and a buzzer.
Earphone
The internal earphone is connected to the UI board by means of mounting springs for automatic assembly. The low impedance, dynamic type
earphone is connected to a differential output in the COBBA audio codec.
The voltage level at each output is given as reference to ground. Earphone levels are given to 32 ohm load.
Buzzer
Alerting tones and/or melodies as a signal of an incoming call are generated with a buzzer that is controlled with a PWM signal by the MAD. Also
key press and user function response beeps are generated with the buzzer. The buzzer is a SMT device and is placed on the UI board.
Page 3 – 16
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Technical Documentation
Power Distribution
In normal operation the baseband is powered from the phone‘s battery.
The battery consists of one Lithium–cell. There is also a possibility to use
batteries consisting of three Nickel–cells. An external charger can be
used for recharging the battery and supplying power to the phone. The
charger can be either so called fast charger, which can deliver supply current up to 850 mA or a standard charger that can deliver around 300 mA.
The baseband contains components that control power distribution to
whole phone excluding the power amplifier, which have a continuous
power rail direct from the battery. The battery feeds power directly to
three parts of the system: CCONT, power amplifier, and UI (buzzer and
display and keyboard lights).
The power management circuitry provides protection against overvoltages, charger failures and pirate chargers etc. that would otherwise
cause damage to the phone. The circuitry is implemented in the beginning with discrete components, but it will be partly or fully integrated on
later phase.
System Module
PA SUPPLY
VCOBBA
COBBA
UI
VBAT
VBB
MAD
+
MEMORIES
BASEBAND
RF SUPPLIES
CCONT
PWRONX
CNTVR
VBB
PURX
V2V
CONNECTOR
POWER
MGMT
VIN
VSIM
VBAT
PWM
SIM
RTC
BACKUP
BATTERY
The heart of the power distribution is the CCONT. It includes all the voltage regulators and feeds the power to the whole system. The whole
baseband is powered from the same regulator which provides 2.8V baseband supply VBB. The baseband regulator is active always when the
phone is powered on. The baseband regulator feeds MAD and memories,
COBBA digital parts and the LCD driver in the UI section. There is a separate regulator for a SIM card.
Original 06/98
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