Nokia 5140 Service Manual 07 npl 4_5.sysmo

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Nokia Customer Care

NPL-4/5 Series Transceivers

System Module and User

Interface

NPL-4/5

System Module and User Interface Nokia Customer Care

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NPL-4/5

Nokia Customer Care System Module and User Interface

Table of Contents

Page No

Glossary of Terms..................................................................................................................................... 7

Introduction ........................................................................................................................................... 10

Electrical modules ..............................................................................................................................10

Interconnection diagram ..................................................................................................................10

Temperature conditions ....................................................................................................................11

Humidity ...............................................................................................................................................11

System Module...................................................................................................................................... 12

Baseband module ...............................................................................................................................12

Technical summary ............................................................................................................................13

PWB .................................................................................................................................................... 15

DC characteristics ..............................................................................................................................15

External and internal signals and connections ..........................................................................18

UI board interface signals ................................................................................................................24

Display interface signals............................................................................................................... 25

System connector interface signals ..............................................................................................26

SIM interface signals .........................................................................................................................27

FCI interface signals ..........................................................................................................................28

Camera interface signals ..................................................................................................................28

FM radio interface signals ...............................................................................................................29

Compass interface signals ...............................................................................................................30

Functional Description ........................................................................................................................ 31

Modes of operation ............................................................................................................................31

No supply ..............................................................................................................................................31

Backup ...................................................................................................................................................31

Acting dead ..........................................................................................................................................31

Active .....................................................................................................................................................31

Sleep mode ...........................................................................................................................................32

Charging ................................................................................................................................................33

Power up and reset ............................................................................................................................33

Power up with PWR key ...................................................................................................................34

Power up when charger is connected ..........................................................................................34

Battery ...................................................................................................................................................34

A/D channels ........................................................................................................................................36

Digital camera .....................................................................................................................................36

FM radio ................................................................................................................................................37

Electrical compass ..............................................................................................................................38

Thermometer ........................................................................................................................................38

Backup battery ....................................................................................................................................39

SIM interface .......................................................................................................................................39

FCI (Functional Cover Interface) ...................................................................................................40

Memory .................................................................................................................................................41

External memory .................................................................................................................................42

Compass .................................................................................................................................................. 43

Earth magnetic field ..........................................................................................................................43

Heading angle or azimuth (a) .................................................................................................... 44

Inclination (d) .................................................................................................................................. 44

Declination (l) .................................................................................................................................. 44

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System Module and User Interface Nokia Customer Care

Tilt (s).................................................................................................................................................. 45

HW Block Diagram ............................................................................................................................... 46

HW block functions ...........................................................................................................................46

Magnetometer Sensor......................................................................................................................... 48

Main features ......................................................................................................................................48

Block diagram ......................................................................................................................................49

Magnetometer control interface ...................................................................................................49

Pin Assignment................................................................................................................................ 49

Test Circuitry.......................................................................................................................................... 51

MagIC ASIC....................................................................................................................................... 51

Main features ......................................................................................................................................52

Block diagram and functional descriptions ................................................................................52

MagIC control interface ...................................................................................................................53

Pin assignment ................................................................................................................................ 53

MagIC ASIC interface - Magnetometer sensor...................................................................... 53

MagIC ASIC – UPP interface........................................................................................................ 54

MagIC ASIC – UEME interface.................................................................................................... 55

MagIC ASIC – UPP - External power supply interface......................................................... 55

MagIC - magnetometer sensor interface for constant current driver............................. 56

Power supplies .....................................................................................................................................56

Introduction...................................................................................................................................... 56

Using VIO for DVDD supply.......................................................................................................... 56

Using external regulator for AVDD............................................................................................ 56

Compass and phone basics ..............................................................................................................57

Phone directions .................................................................................................................................57

General description ............................................................................................................................58

Operation modes............................................................................................................................. 58

Compass function main features ...................................................................................................58

Compass display menu.................................................................................................................. 58

Compass display results................................................................................................................ 58

Compass calibration SW ........................................................................................................

User assisted calibration............................................................................................................... 59

Compass declination menu ..............................................................................................................59

Testpoints................................................................................................................................................ 60

Set/Reset ...............................................................................................................................................60

VBRIDGE ................................................................................................................................................60

Channel output A ...............................................................................................................................60

Channel output B ...............................................................................................................................60

Service Software Interface (Phoenix) ............................................................................................. 61

Performance........................................................................................................................................... 62

Calibration basics ...............................................................................................................................62

Calibration process flow ...................................................................................................................63

Compass digital values, limit values .............................................................................................63

Clock distribution ...............................................................................................................................65

User Interface ........................................................................................................................................ 66

Display .......................................................................................................................

UI Board ................................................................................................................................................67

Power supply for LEDs .......................................................................................................................68

............................66

...........59

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Nokia Customer Care System Module and User Interface

Keyboard LEDs driver .........................................................................................................................68

Display and air bubble LED driver ..................................................................................................69

Flashlight LEDs driver ........................................................................................................................69

Internal microphone ..........................................................................................................................70

Internal speaker ..................................................................................................................................71

IHF ...........................................................................................................................................................71

Headset connections .........................................................................................................................72

Vibra .......................................................................................................................................................73

RF Module............................................................................................................................................... 74

RF frequency plan........................................................................................................................... 75

DC characteristics ..............................................................................................................................76

Regulators......................................................................................................................................... 76

Power distribution.......................................................................................................................... 77

RF characteristics ...............................................................................................................................78

RF block diagram ............................................................................................................................ 79

RF block diagram NPL-4/5 ........................................................................................................... 79

Frequency synthesizers ................................................................................................................. 80

Receiver ............................................................................................................................................. 80

Transmitter ....................................................................................................................................... 81

Antenna switch module................................................................................................................ 82

Power Amplifier............................................................................................................................... 83

RF ASIC Helgo.................................................................................................................................. 84

AFC function .................................................................................................................................... 84

Antenna............................................................................................................................................ 84

List of Figures

Page No

Fig 1 Interconnection diagram................................................................................................................... 10

Fig 2 Baseband blocks. ................................................................................................................................ 13

Fig 3 PWB vias ................................................................................................................................................ 15

Fig 4 Power Distribution Diagram............................................................................................................. 18

Fig 5 Battery Pack Contacts........................................................................................................................ 35

Fig 6 Camera Connections to Baseband.................................................................................................. 37

Fig 7 FM Radio Audio-, Antenna- and Digital Interface Connections............................................ 37

Fig 8 Baseband and Compass Interface................................................................................................... 38

Fig 9 Ambient Temperature Sensor Interface to BB ............................................................................ 39

Fig 10 UPP/UEMEK SIM Interface Connections ....................................................................................40

Fig 11 FCI Interface....................................................................................................................................... 41

Fig 12 FCI Connector Pin Order on PWB................................................................................................. 41

Fig 13 Earth’s Magnetic Field..................................................................................................................... 44

Fig 14 Earths’s Magnetic Field Components.......................................................................................... 45

Fig 15 Block Diagram.................................................................................................................................... 46

Fig 16 Magnetometer Sensor Block Diagram ........................................................................................ 49

Fig 17 Pin Assignment In Package............................................................................................................ 50

Fig 18 Test Circuitry ...................................................................................................................................... 51

Fig 19 Offset strap coil current effect ......................................................................................

Fig 20 Block Diagram.................................................................................................................................... 52

Fig 21 Directions Through Phone .............................................................................................................. 57

............... 51

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System Module and User Interface Nokia Customer Care

Fig 22 Timing and Voltage Level l ............................................................................................................. 60

Fig 23 What Happened on Calibration (Track on x/y Plane while rotating) ................................. 63

Fig 24 Clock Distribution Diagram............................................................................................................ 65

Fig 25 User Interface Connections............................................................................................................ 66

Fig 26 Display Block ...................................................................................................................................... 66

Fig 27 UI Board............................................................................................................................................... 67

Fig 28 VLED Voltage Supply........................................................................................................................ 68

Fig 29 Keyboard Led Driver and Control Diagram ................................................................................69

Fig 30 Display and Air Bubble LEDs driver and Control Diagram..................................................... 69

Fig 31 Flashlight Driver and Control ........................................................................................................ 70

Fig 32 Microphone Connection.................................................................................................................. 70

Fig 33 IEarpiece Connection....................................................................................................................... 71

Fig 34 IHF Connection.................................................................................................................................. 71

Fig 35 NPL-4/5 Audio Connections .......................................................................................................... 73

Fig 36 RF Frequency plan............................................................................................................................. 75

Fig 37 Power distribution diagram ......................................................................................................... 77

Fig 38 RF Block Diagram.............................................................................................................................. 79

Fig 39 Antenna Switch Module ................................................................................................................ 83

Fig 40 Power Amplifier ................................................................................................................................ 84

NPL-4/5

Nokia Customer Care System Module and User Interface

Glossary of Terms

ACI Accessory Control Interface

ADC Analog-Digital Converter

AEC Acoustic Echo Canceller

AFC Automatic Frequency Control

AGC Automatic Gain Control

AIF Application Interface

API Application Programming Interface

ARM Processor architecture

ASIC Application Specific Integrated Circuit

BB Baseband

CCI Camera Control Interface

CCP Compact Camera Port

CMT Cellular Mobile Telephone (MCU and DSP)

CPU Central Processing Unit

CTSI Clocking Timing Sleep Interrupt

CSP Chip Scale Package

DAC Digital-Analog Converter

DAI Digital Audio Interface

DB Dual band

DCT3 Digital Core Technology, 3rd generation

DCN Offset Cancellation control signal

DLL Dynamic Link Library

DRC Dynamic Range Controller

DSP Digital Signal Processor

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EGSM Extended – GSM

EFR Enhanced Full Rate

EGPRS Enhanced General Packet Radio Service

EMC Electromagnetic compatibility

EMI Electromagnetic Interference

EXT RF External RF

FBUS Asynchronous Full Duplex Serial Bus

GPRS General Packet Radio Service

GSM Global System for Mobile communications

HS Half Rate Speech

HSCSD High Speed Circuit Switched Data

IC Integrated Circuit

I/O Input/Output

IrDA Infrared Association

LCD Liquid Crystal Display

LNA Low Noise Amplifier

MBUS 1-wire half duplex serial bus

MCU Micro Controller Unit

MDI MCU-DSP Interface

MFI Modulator and Filter Interface

PA Transmit Power Amplifier

PC Personal Computer

PCM Pulse Code Modulation

PCM SIO Synchronous serial bus for PCM audio transferring

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PCMCIA PC Memory Card International Association

PIFA Planar Inverted F-antenna

PWB Printed Wiring Board

RF Radio Frequency

SIM Subscriber Identity Module

UEMEK Enhanced Universal Energy Management

UI User Interface

UPP Universal Phone Processor

VCXO Voltage Controlled Crystal Oscillator

VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.

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System Module and User Interface Nokia Customer Care

Introduction

Electrical modules

The system module consists of Radio Frequency (RF) and baseband (BB). User Interface (UI) contains display, keyboard, IR link, vibra, HF/HS connector and audio parts.

FM radio is located on the main PWB.

The electrical part of the keyboard is located in separate UI PWB. It is connected to radio PWB through spring connectors.

The Baseband blocks provide the MCU, DSP, external memory interface and digital control functions in the UPP ASIC. Power supply circuitry, charging, audio processing and RF control hard ware are in the UEMEK ASIC.

The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station.

The UI module is described in a dedicated section of the manual.

Interconnection diagram

Keyboard module

Flashlight

Antenna

Microphone

Figure 1: Interconnection diagram

Display

IHF

speaker

Radio

Module

NPL-4/5

NHL-4

IR Link

Earpiece

BatterySIM

Charger

omahawk

Accessories

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Nokia Customer Care System Module and User Interface

Temperature conditions

Specifications are met within range of -10...+55 deg. C ambient temperature Storage temperature range -40...+70 deg. C

Humidity

Relative humidity range is 5... 95%. This module is not protected against water. Condensated or splashed water might cause malfunction momentary. Long term wetness will cause permanent damage.

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System Module

The System module (or Engine) consists of Baseband and RF sub-modules, each described below.

Baseband module

Product NPL-4/5 is a DCT4 Active segment phone. There are two variants: An EGSM900 / GSM1800 / GSM1900 phone and a US variant with GSM850/1800/1900.

The HW has the following features:

• HSCSD, GPRS (MSC10) and EGPRS (MSC6)

• DCT4 engine with UPP8M v3.5 and UEMEk v1.1

• AMR and 16 MIDI tones

• 128/16 Mbit Psram Combo memory

• Passive display with 4k colours

• Battery BL-5B

• Pop-Port interface

• 5-way navigation key with select

• Electrical compass

• FCI on bottom cover

• VGA Camera

•Vibra

•IHF

•FM Radio

•IrDA

•Torch

• PTT key

•Sidekeys

The NPL-4/5 BB is based on the DCT4 engine and is compatible to the Pop-Port accessories. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Enhanced Universal Energy Management) IC including voltage regulators, charge control and audio circuits, audio IFH amplifier from DCT4.5) and the UPP (Universal Phone Processor including MCU, DSP and RAM from DCT4).

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Nokia Customer Care System Module and User Interface

Technical summary

The picture below shows the main Baseband function blocks

Figure 2: Baseband blocks.

LCD

Passive colour

STN

SIM

RF Interface

Compass

PSRAM COMBO

128Mbit Flash 16Mbit PSRAM

Vibra

Keyboard

Illumination

Display

Illumination

Flashlight

UEMEk

D-class

mplifier

IHF

UPP8M

Keyboard

1.8 V

DC/

FM radio

TEA5767

VGA VV6450

BATTERY BL-5B

Charge

ack

System connector

Tomahaw

FCI

HWA

STV0900

Baseband is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core voltages can be lowered down to 1.0V, 1.3V and 1.5V. UEMEK includes 7 linear LDO (Low Drop-Out) regulator for baseband and 7 regulators for RF. It also includes 4 current sources for biasing purposes and internal usage. UEMEK also includes SIM interface

which has supports both 1.8V and 3V SIM cards. Note: 5V SIM cards are no longer sup-

ported by DCT-4 generation baseband.

A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz clock supply as the sleep clock. A backup power supply is provided for the RTC-battery, which keeps the real time clock running when the main battery is removed. The backup power supply is a rechargeable surface mounted Li-Ion battery. The backup time with the battery is 30 minutes minimum.

A UEMEK ASIC handles the analog interface between the baseband and the RF section.

UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface.

The UEMEK supplies the analog TXC and AFC signals to RF section according to the UPP DSP digital control. Data transmission between the UEMEK and the UPP is implemented using two serial busses, DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC.

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UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply

1.8V and the analog parts are running from the analog supply 2.78V.

VBAT is directly used for Vibra, LED-driver, Audio amplifier and FCI (Functional Cover Interface).

The baseband architecture supports a power saving function called ”sleep mode”. This sleep mode shuts off the VCTCXO, which is used as system clock source for both RF and baseband. During the sleep mode the system runs from a 32 kHz crystal. The phone is waken up by a timer running from this 32 kHz clock supply. The sleep time is determined by network parameters. Sleep mode is entered when both the MCU and the DSP are in standby mode and the normal VCTCXO clock is switched off.

The baseband supports both internal and external microphone inputs and speaker outputs. UEMEK also includes third microphone input. This input is used for FM-radio. Input and output signal source selection and gain control is done by the UEMEK according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to the UEMEK for decoding. An external vibra alert control signals are generated by the UEMEK with separate PWM outputs.

The NPL-4/5 uses D-class amplifier to amplifying IHF speaker audios. It gives more sound pressure from speaker and efficiency is in good level to improve thermal performance compared to AB-class.

VGA Camera is connected to baseband (UPP) through HW accelerator IC. The camera data bus is common with display bus. The HWA is taking care of camera control and it is compressing the pictures.

NPL-4/5 has 2-axes electrical compass. It is implemented with magnetoresistive sensor and MagIC ASIC.

NPL-4/5 has two serial control interfaces: FBUS and MBUS. FBUS and MBUS can be accessed through production test pattern and FBUS can be also accessed thought Tomahawk System Connector.

The FCI interface is located to front bottom side area of the phone. This means that only B-cover can be an active cover.

EMC shielding is implemented using a metal body profile, RF cans and PWB grounding. Some components are outside of shielding. Heat generated by the circuitry is conducted out via the PWB ground planes and by using buried vias between PWB layers.

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PWB

Characteristics of the PWB

8 layer board

Double side assembled

Figure 3: PWB vias

Buried via through

internal layers

TOP

RCC

Blind vias

BOTTOM

DC characteristics

RCC

Table 1: Battery voltage range

Signal

Battery Voltage (Idle)

Note

-0.3…5.5V

ia through all

ers

Battery Voltage (Call)

Charger Input Voltage

Max 4.8V

-0.3V …16V

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Table 2: UEMEK Regulators

Name Voltage (V) Current (mA)

Min Nom Max Max Sleep Max

VANA 2.7 2.78 2.86 80

VFLASH1 2.61 2.78 2.95 70 1.5 VIO 1.72 1.8 1.88 150 0.5 VCORE 1.48 1.57 1.66 200 0.2

VAUX1 50 0.5

VAUX2 2.7 2.78 2.86 70 0.5 VAUX3 2.7 2.78 2.86 10 0.5 VSIM 25 0.5

VR1A/B 4.6 4.75 4.9 10 VR2 100 -

VR3 2.7 2.78 2.86 20 VR4 2.7 2.78 2.86 50 0.1 VR5 2.7 2.78 2.86 50 0.1 VR6 2.7 2.78 2.86 50 0.1 VR7 2.7 2.78 2.86 45 -

1.745 1.8 1.855

2.91 3 3.09

1.745 1.8 1.855

2.91 3 3.09

2.7 2.78 2.86

-2.61 -2.78 -2.95

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Table 3: 1-3 External Regulators

Signal

name

VCAMDIG 1.755 1.8 1.845 0.0015 150 Power

VANA_EXT 2.72 2.8 2.88 0.0015 150 Power

Min Nom Max Sleep Iq Max

Voltage (V) Current (mA) Note

supply for camera digital parts. Imax = 150mA. Cam and HWA max current 60mA

supply for camera, compass and FMradio analog parts. Imax = 150mA.

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Figure 4: Power Distribution Diagram

BATRF

Charger

POPPORT

Tomahawk / Vout

VR1A VR1B VR2 VR3 VR4 VR5 VR6 VR7 IPA1 IPA2 IPA3

UEMEk

AUX2

BL-5B Battery

SIM

CORE

ANA

UEME analog parts

AUX1 AUX3

FLASH1

UEME digital parts

COMPASS

BATRF

UPP v3.5

SIM

Ext. 1.8V regulator

IHF PA D-class

COMBO 128/16M

FMRadio

VIBRA

Ext. 2.8V regulator

HWA and Camera

FCI Interfac

BAT

LCD CSTN

IR module

DC/DC

External and internal signals and connections

This section describes the external and internal electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that covers a connector or a defined interface.

Flashlight

Disp and keypad Illumination

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Table 4: AC and DC Characteristics of DCT4 RF-Baseband Voltage Supplies

Signal

name

VBAT Battery PA &

VR1A Voltage 4.6 4.75 4.9 V

VR1B Current 2 10 MA

VR2 UEMEK HELGO85 Supply for

VR3 UEMEK VCTCXO,

VR4 UEMEK HELGO85 Supply for

VR5 UEMEK HELGO85 Supply for

From To Parameter Min Typ Max Unit Function

Voltage 2.95 3.6 4.2 V

UEMEK

Current 2000 MA Current drawn by PA when ”off”

UEMEK HELGO85 Supply for

Noise density Voltage 2.7 2.78 2.86 V Current 65 100 MA Noise density f=100Hz 120 nVrms/

f>300Hz Voltage 2.7 2.78 2.86 V

HELGO85

Current 1 20 MA Noise density Voltage 2.7 2.78 2.86 V

Current 50 MA Noise density f=6Hz 5500 nVrms/

f=60Hz 550 f>600Hz 55 Voltage 2.7 2.78 2.86 V

Current 50 MA Noise density BW=100Hz. .. 100kHZ

0.8 2

240 nVrms/

µA

sqrt(Hz)

Battery supply. Cutoff level of DCT4 regulators is 3.2V. Losses in PWB tracks and ferrites are taken account to minimum battery voltage level.

charge pump for SHF VCO tuning.

I/Qmodulators, buffers, ALS

Supply for VCTCXO, PLL digital parts

HELGO85R X; PA bias blocks. Noise density decades 20dB/deg from 6Hz to 600 Hz. From f>600Hz max. noise density nVrms/ sqrt(Hz)

HELGO85PL L; dividers, LO- buffers, prescaler,

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Table 5: AC and DC Characteristics of DCT4 RF-Baseband Voltage Supplies

VR6 UEMEK HELGO85 Supply for

VR7 UEMEK SHF VCO Supply for

VrefRF01 UEMEK HELGO85

VrefRF02 UEMEK VB_EXT Voltage 1.334 1.35 1.366

Voltage 2.7 2.78 2.86 V Current 50 MA Noise density BW=100Hz. .. 100kHz Voltage 2.7 2.78 2.86 V Current 30 MA Noise density 100Hz<f<2 kHz 2kHz<f<10 kHz 10kHz<f<3 0kHz 30kHz<f<9 0kHz 90kHz<f<3 MHz Voltage 1.334 1.35 1.366 V Voltage

Current 100

Temp Coef -65 65 Noise density BW=600Hz. .. 100kHz

240 nVrms/

sqrt(Hz)

70 nVrms/

sqrt(Hz)

µA

60 nVrms/

sqrt(Hz)

HELGO85 BB and LNAs

SHF VCO

Reference for HELGO85 DCN2 op.amps.

Note

Below 600Hz noise density is allowed to increase 20 dB/oct

Note

Voltage reference for HELGO85 bias block.

Not used for HELGO85

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Table 6: AC and DC Characteristics of DCT4 RF-Baseband Digital Signals

Signal

name

TXP ”1” 1.38 1.88 V (RFGenOut3 )

TXA UPP HELGO85 Power

RFBusEna1XUPP HELGO85 RFbus

From To Parameter Input Characteristics

Min

UPP HELGO85 Power

”0” 0 0.4 V

Load Resistance Load Capacitanc e

Timing Accuracy

”1” 1.38 1.88 V ”0” 0 0.4 V Load Resistance Load Capacitanc e Timing Accuracy ”1” 1.38 1.88 V ”0” 0 0.4 V Current 50 Load resistance Load capacitance

yp Max Unit

10 220

20 pF

¼ Symbol

10 220

20 pF

¼ symbol

10 220

20 pF

kΩ

Ω

Function

amplifier enable

control loop enable

enable

RFBusData UPP HELGO85 RFbus

RFBusClk UPP HELGO85 RFBus clock

RESET ”1” 1.38 1.85 V (GENIO06) ”0” 0 0.4 V

UPP HELGO85 Reset to

”1” 1.38 1.88 V ”0” 0 0.4 V Load resistance Load capacitance

Data frequency ”1” 1.38 1.88 V ”0” 0 0.4 V Load resistance Load capacitance

Data frequency

Load capacitance

Load resistance

Timing accuracy

10 220

20 pF

10 MHz

10 220

20 pF

10 MHz

20 pF

10 220

¼ symbol

data;

Ω

read/write

HELGO85

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Table 7: AC and DC Characteristics of DCT4 RF-Baseband Analogue Signals

Signal

name

VCTCXO VCTCXO UPP High

VCTCXOGnd VCTCXO UPP DC Level 0 V Ground for

RXI/RXQ HELGO85 UEMEK Received

TXIP / TXIN UEMEK HELGO88

TXQP / TXQN AFC UEMEK VCTCXO

From To Parameter Min Typ Max Unit Function

Frequency 13 26 MHz

stability clock signal for the logic circuits, AC coupled. Distorted sinewave e.g. sawtooth.

reference clock

demodulate d IQ signals

ble voltage swing.

ble common mode voltage.

Between TXIP-TXIN

frequency control signal for VCTCXO

UEMEK HELGO85

Signal amplitude Input Impedance Input Capacitanc e

Harmonic Content Clear signal window (no glitch)

Duty Cycle 40 60 %

Voltage swing (static)

DC level 1.3 1.35 1.4 V I/Q amplitude mismatch I/Q phase mismatch Differential voltage swing (static)

DC level 1.17 1.2 1.23 V Programma

Source Impedance Same spec as for TXIP / TXIN

Voltage Min

Max Resolution 11 Bits Load resistance and capacitance

0.2 0.8 2 Vpp

300 mVpp

1.35 1.4 1.45 Vpp

-5 5 Deg

2.15 2.2 2.25 Vpp Programma

00.1

2.4 2.6

Ω

10 pF

-8 dBc

0.2 DB

200

Ω

V Automatic

Ω

100 nF

Source Impedance

200

Ω

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TxC UEMEK HELGO85

RFTemp HELGO85 UEMEK Temperatur

DC_sense PA UEMEK Voltage 0.6 V PA final

IPA1 / IPA2 UEMEK PA PA final

VCTCXOTEMPPA sheet UEMEK A/D Voltage

Voltage Min

Max Source Impedance Resolution 10 Bits Voltage at 20oC Voltage at +25oC Voltage at +60oC

Output Voltage

Current range Resolution 4 Bits Current tolerance Noise density f=100 Hz- 800kHz f=800kHz- 100MHz

2.4

1,57 V

1,7

1,79

02.7V

05MA

-6 6 %

0.1 V Transmitter power level and ramping

200

110

Ω

nVrms/ sqrt(Hz)

control

e sensor of RF in HELGO ASIC.

stage quiescent current level information .

stage quiescent current adjustment

PA manufactur er identifier signal

1.2 1.6 V Agilent

0.7 1.1 V RFMD

00.1VHitachi

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UI board interface signals

Table 8: UI board interface signals

Pin Signal Min Nom Ma

1ROW(0)

2COL(0)

3 ROW(1) Keyboard matrix

4 COL(1) Keyboard matrix

5 ROW(2) Keyboard matrix

6 COL(2) Keyboard matrix

7 ROW(3) Keyboard matrix

8 COL(3) Keyboard matrix

9 COL(4) Keyboard matrix

10 ROW(4) Keyboard matrix

11 Temp Ambient

12 GND 0V 13 VLED- 0V Separate GND for

0.7xVIO VIO High Keyboard matrix

0 0.3xVIO Low row 0

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

0.7xVIO VIO High

00.3xVIO Low

Condition Note

Keyboard matrix col 0

row 1

col 1

row 2

col 2

row 3

col 3

col 4

row 4

temperature sensor

keypad LEDs

14 VLED+ 7.2V 8.2V

15 GND 0V 16 FCI Vout

17 FCI GND 0V 18 FCI Da

19 Fci Clk

20 FCIInt

2.8V 5.5V On 0V 0V Off

1.19V 1.9V high 0V 0.51V low

7.7V LED on

0V LED off

Supply Voltage for Keyboard LED [note1]

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Display interface signals

Table 9: LCD connector

Pin Signal Min Nom Max Condition Note

1 VDDI 1.72V 1.8V

2 RESX

3 SDA Serial data

4 SCLK Serial clock

5CSX

6 VDD 2.70V 2.78V

7 NC Not Connected 8 GND 0V Ground

VLED-

90V

0.7*VDDI VDDI Logic ’1’ Reset 0 0.3*VDDI Logic ’0’ Active low

1us trw Reset active

0.7*VDDI VDDI Logic ’1’ 0 0.3*VDDI Logic ’0’

100ns tsds Data setup time

100ns tsdh Data hold time

0.7*VDDI VDDI Logic ’1’ 0 0.3*VDDI Logic ’0’

250ns tscyc Clock cycle 100ns tshw Clock high 100ns tslw Clock low

0.7*VDDI VDDI Logic ’1’ Chip select 0 0.3*VDDI Logic ’0’ Active low

60ns tcss CXS low before

100ns tcsh CXS low after

1.88V

6.5MHz Max frequency

2.86V

Logic voltage supply Connected to VIO

input

SCLK rising edge

SCLK rising edge Supply Voltage. Connected to VFLASH1

Return current

(GND) VLED 0V LED off

10 Supply Voltage

Display 7.7V LED on

7.2V 8.4V

for LEDs

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System connector interface signals

Table 10: DC Connector

Pin Signal Min Nom Max Condition Note

1 VCHAR 11.1Vpeak Standard charger Charger positive

7.0 VRMS

8.4 VRMS Fast charger

2 CHGND 0 Charger ground

Table 11: POPPORT System Connector/Bottom Connector

Pin Signal Description Spectral

Ran

1 CHARGE V Charge DC 0-9 V / 0.85

2GND Charge

GND

3 ACI ACI 1 kbit/s Dig 0 /

16.9 Vpeak

7.9 VRMS

1.0 Apeak

9.2 VRMS 850 mA

U/I levels Impedance Notes

47 Ω

2.78V

input

Insertion & removal detection

4VOUT DC out DC 2.78V /

70mA

USB VBUS

(Not connected)

6FBUS TX FBUS

115kbit

7FBUS RX FBUS

115kbit 8 SGND Data GND 0.85 A 9 XMIC N Audio in 300 - 8k 1Vpp &

10 XMIC P Audio in 300 - 8k 1Vpp &

11 HSEAR N Audio out 20 - 20k 1Vpp

12 HSEAR P Audio out 20 - 20k 1Vpp

13 HSEAR R P Audio out 20 - 20k 1Vpp 14 HSEAR R N Audio out 20 - 20k 1Vpp

0 / 2.78V

2.78V

100 mΩ

33 Ω

100 m

10 Ω

10 10

(PWB + conn.) 200mW

(PWB + conn.) Ext. Mic Input

Ext. Mic Input

Ext. audio out (left) Ext. audio out (left)

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SIM interface signals

Table 12: SIM Connector

Pin Name Parameter Min

1VSIM Supply

2SIMRST1.8V SIM

3 SIMCLK SIM clock

4DATA V

5NC Not

6GNDGND0 0 VGround

1.8V SIM Card

3V SIM

Card

3V SIM

Card

Frequency 3.25 MHz

Trise/Tfall 50 ns

1.8V Voh 0.9xVSIM

1.8V Vol 0 3V Voh 0.9xVSIM

3V Vol 0

1.8V Voh 0.9xVSIM VSIM

1.8V Vol 0 0.15xVSIM 3V Voh 0.9xVSIM VSIM

3V Vol 0 0.15xVSIM

1.8V Vih 0.7xVSIM VSIM SIM data

1.8V Vil 0 0.15xVSIM Trise/Tfall

3V Vil 0.7xVSIM VSIM 3V Vil 0 0.15xVSIM

1.6 1.8 1.9 V

2.8 3 3.2 V

0.9xVSIM VSIM

00.15xVSIM

0.9xVSIM VSIM

00.15xVSIM

yp Max Unit Notes

voltage

VSIM reset

(output)

VSIM V

SIM data (output)

(input)

max 1us

connected

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FCI interface signals

Table 13: FCI Interface

BB Signal FCI Signal Min Nom Max Condition Note

VBATT VOUT

GND GND 0.5

GenIO(22) 1.19V 1.9V High

In/Out 0 0.51V Low

GenIO(2) 1.19V 1.9V High

Out 0 0.51V Low

GenIO(25) 1.19V 1.9V High

In 0 0.51V Low

GenIO(18) 1.19V 1.9V High

In 0 0.51V Low

VIO VCC 1.72V 1.80V 1.88V V Power supply for

FCI SDA

FCI SCL

FCI INT

CTRL FCI ASIP power

2.80V 5.5V V 0 110 mA

0.5

1uF

1.4 2 2.6

120 pF Capacitance

1.4 2 2.6

120 pF Capacitance

70 100 130

120 pF Capacitance

impedance

kΩ

Pull-up in

terminal

Pull-up in

terminal

Pull-up in

terminal

control

pull up resistors

Camera interface signals

BB Signal Camera

nal

VANA_EXT AVDD 2.72V 2.80V 2.88V V I

VCAMDIG DVDD 1.72V 1.80V 1.88V V I

GenIO(3) 1.4V 1.88V High

Out 0 0.4V Low

GenIO(27) 1.4V 1.88V High

Out 0V 0.4V Low

GenIO(28) 1.4V 1.88V High

Out 0 0.6V Low

GenIO(26) 1.4V 1.88V High

Out 0 0.4V Low

GenIO(1) 1.4V 1.88V High

Out 0 0.4V Low

CLK 1.8V Clock signal for

TXDA 1.8V Control data for

CSX 1.8V CSX signal for

CE 1.8V CE signal for HWA

Reg_en 1.8V 1.8V and 2.8V

Table 14: Camera Interface

Min Nom Max Condition Note

= 16mA

max

= 100mA,

max

Common for camera and HWA

Camera and HWA. Common with

13 MHz

compass

HWA

and camera

regulators

enable/disable

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LCDUI(1) RXDA 1.4V 1.88V High

In/Out LCDCamTxD

LCDUI(0) DACLK 1.4V 1.88V High

Out LCDCamClk 0 0.4V Low

FM radio interface signals

BB Signal FM Radio

Signal

VANA_EXT

GenIO(24) FMClk 1.8V Reference clock

GenIO(8) FMWrEn 1.8V Write/Read

Vcca 2.7V 2.78V 2.86V I

Vcc(vco) 2.7V 2.78V 2.86V I

Vccd 2.7V 2.78V 2.86V I

1.8V Camera data

00.4VLow

1.8V Camera data clock

Table 15: FM-radio Interface

Min Nom Max Condition Note

10.5mA

Max

940uA

Max

3.9mA

Max

1.4V 1.88V High for FM radio

00.4VLow 32768Hz Frequency

30ppm Stability

1.4V 1.88V High 0V 0.4V Low

module

enable

signal

GenIO(11) FMCtrlClk 1.8V

GenIO(12) FMCtrlDa 1.8V Bi-directional

FM Antenna RF1,RF2 76MHz 108MHz FM input

FM Radio L FM Audio L 100mV Audio level

FM Radio R FM Audio R 24dB 30dB Channel

1.4V 1.88V High

00.4VLow

1 MHz Frequency

1.4V 1.88V High

00.6VLow

separation

54dB 60dB S/N

2% Harmonic

distortion

data

frequency

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Compass interface signals

Table 16: Compass Interface

BB Signal MagIC Signal Min Nom Max Condition Note

VANA_EXT AVDD 2.72V 2.80V

VIO DVDD 1.72V 1.80V 1.88V V I

GenIO(3) 1.4V 1.88V High

Out 0 0.4V Low

CBUSCLK 1.4V 1.88V High

Out 0V 0.4V Low

CBUSDA 1.4V 1.88V High

In/Out 0 0.6V Low

CBUSENX 1.4V 1.88V High

Out 0 0.4V Low

PURX ClrX 1.8V

CLK 1.8V Clock signal for

13 MHz

CBUSCLK 1.8V Data clock for

CBUSDA 1.8V Data for MagIC

CBUSENX 1.8V CBUS enable

1.4V 1.88V High General reset from

2.88V V I

= 10mA and <

max

10uA in sleep.

= 2mA and

max

<10uA in sleep.

MagIC. Common with camera

MagIC CBUS

and UPP

UEMEK. 0=Reset

0 0.4V Low and 1 = No Reset

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Functional Description

Modes of operation

Wv1 baseband engine has six different functional modes:

1. No supply

2. Backup

3. Acting Dead

4. Active

5. Sleep

6. Charging

No supply

In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to disconnection of main battery and backup battery or low battery voltage level in both of the batteries.

Phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is detected. Battery voltage can rise either by connecting a new battery with VBAT > VMSTR+ or by connecting charger and charging the battery above VMSTR+.

Backup

In BACKUP mode the backup battery has sufficient charge but the main battery can be disconnected or empty (VBAT < VMSTR and VBACK > VBUCOFF).

VRTC regulator is disabled in BACKUP mode. VRTC output is supplied without regulation from backup

Acting dead

If the phone is off when the charger is connected, the phone is powered on but enters a state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A battery-charging alert is given and/or a battery charging indication on the display is shown to acknowledge the user that the battery is being charged.

Active

In the Active mode the phone is in normal operation, scanning for channels, listening to a base station, transmitting and processing information. There are several sub-states in the active mode depending on if the phone is in burst reception, burst transmission, if DSP is working etc.

In Active mode the RF regulators are controlled by SW writing into UEMEK’s registers wanted settings:

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VR1A can be enabled or disabled. VR2 can be enabled or disabled and its output voltage can be programmed to be 2.78V or 3.3V. VR4 -VR7 can be enabled, disabled, or forced into low quiescent current mode. VR3 is always enabled in Active mode.

Table 17: Regulator Controls

Regulator NOTE

VFLASH1 Enabled VAUX2

VAUX1

VAUX3 Controlled by register writing.

Controlled by register writing

Default state is off. Controlled by register writing.

Defaul start up setting 1.8V

VANA

VIO Enabled VCORE Enabled VSIM Controlled by register writing.

VR1A/VR1B

VR2

VR3

VR4

VR5

VR6

VR7

IPA1 Controlled by register writing.

Enabled Disabled in sleep mode

Controlled by register writing Disabled in sleep mode

Controlled by register writing Disabled in sleep mode Enabled Disabled in sleep mode

Enabled Disabled in sleep mode

IPA2 Controlled by register writing.

IPA3 Controlled by register writing

VCAMDIG and VANA_EXT

External regulators are controlled by GenIO(01)

Sleep mode

Sleep mode is entered when both MCU and DSP are in stand–by mode. Both processors control sleepmode.

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When SLEEPX signal (low) is detected UEMEK enters SLEEP mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All the RF regulators are disabled in SLEEP. When SLEEPX=1 detected UEMEK enters ACTIVE mode and all functions are activated.

The sleep mode is exited either by the expiration of a sleep clock counter in the UEMEK or by some external interrupt, generated by a charger connection, key press, headset connection etc.

In sleep mode VCTCXO is shut down and 32 kHz sleep clock oscillator is used as reference clock for the baseband.

Charging

Charging can be performed in parallel with any operating mode. In NPL-4/5 the battery type/size is indicated by a 75kOhm BSI-resistor, which is in battery back. The resistor value corresponds to a specific battery capacity. NTC resistor, which is measuring battery temperature is located on an engine board.

The battery voltage, temperature, size and current are measured by the UEMEK controlled by the charging software running in the UPP.

The charging control circuitry (CHACON) inside the UEMEK controls the charging current delivered from the charger to the battery. The battery voltage rise is limited by turning the UEMEK switch off when the battery voltage has reached 4.2 V. Charging current is monitored by measuring the voltage drop across a 220 mOhm. resistor.

Power up and reset

Power up and reset is controlled by the UEMEK ASIC. NPL-4/5 baseband can be powered up in following ways:

1 Press power button which means grounding the PWRONX pin on UEMEK

2 Connect the charger to the charger input

3 Supply battery voltage to the battery pin.

4 RTC Alarm, the RTC has been programmed to give an alarm

After receiving one of the above signals, the UEMEK counts a 20ms delay and then enters its reset mode. The watchdog starts up, and if the battery voltage is greater than Vcoff+ a 200ms delay is started tp allow references etc. to settle. After this delay elapses the VFLASH1 regulator is enabled. 500us later VR3, VANA, VIO and VCORE are enabled. Finally the PURX line is held low for 20 ms. This reset, PURX, is fed to the baseband ASIC UPP, resets are generated for the DSP and the MCU. During this reset phase the UEMEK forces the VCXO regulator on regardless of the status of the sleep control input signal to the UEMEK. The sleep signal from the ASIC is used to reset the flash during power up and to put the flash in power down during sleep. All baseband regulators are switched on at the UEMEK power on except for the SIM regulator that is controlled by the MCU. The

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UEMEK internal watchdog is running during the UEMEK reset state, with the longest watchdog time selected. If the watchdog expires, the UEMEK returns to power off state. The UEMEK watchdog is internally acknowledged at the rising edge of the PURX signal in order to always give the same watchdog response time to the MCU.

Power up with PWR key

When the Power on key is pressed the UEMEK enters the power up sequence. Pressing the power keycauses the PWRONX pin on the UEMEK to be grounded. The UEMEK PWRONX signal is not part of the keypad matrix. The power key is only connected to the UEMEK. This means that when pressing the power key an interrupt is generated to the UPP that starts the MCU. The MCU then reads the UEMEK interrupt register and notice that it is a PWRONX interrupt. The MCU now reads the status of the PWRONX signal using the UEMEK control bus, CBUS. If the PWRONX signal stays low for a certain time the MCU accepts this as a valid power on state and continues with the SW initialization of the baseband. If the power on key does not indicate a valid power on situation, the MCU powers off the baseband.

Power up when charger is connected

In order to be able to detect and start charging in a case where the main battery is fully discharged (empty) and hence UEMEK has no supply (NO_SUPPLY or BACKUP mode of UEMEK) charging is controlled by START-UP CHARGING circuitry.

Whenever VBAT level is detected to be below master reset threshold (VMSTR-) charging is controlled by START_UP charge circuitry. Connecting a charger forces VCHAR input to rise above charger detection threshold, VCHDET+. By detection start-up charging is started. UEMEK generates 100mA constant output current from the connected charger’s output voltage. As battery charges its voltage rises, and when VBAT voltage level higher than master reset threshold limit (VMSTR+) is detected START_UP charge is terminated.

Monitoring the VBAT voltage level is done by charge control block (CHACON). MSTRX=‘1’ output reset signal (internal to UEMEK) is given to UEMEK’s RESET block when VBAT>VMSTR+ and UEMEK enters into reset sequence.

If VBAT is detected to fall below VMSTR- during start-up charging, charging is cancelled. It will restart if new rising edge on VCHAR input is detected (VCHAR rising above VCHDET+).

Battery

NPL-4/5 uses BL-5B 760 mAh Lithium Polymer battery pack. The battery size is

5.7x34x46mm. Other battery packs aren’t supported.

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Table 18: BL-5B Characteristics

Description

Nominal discharge cut-off voltage 3.1V

Nominal battery voltage 3.7V

Nominal charging voltage 4.2V

Maximum charger output current 850 mA

Minimum charger output current 200 mA

Table 19: Pin Numbering of Battery Pack

Signal

Pin number Function

alue

name

VBAT 1 Positive battery terminal

BSI 2 Battery capacity

measurement (fixed resistor inside the battery pack)

GND 3 Ground/negative/comm

on battery terminal

Figure 5: Battery Pack Contacts

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A/D channels

The UEMEK contains the following A/D converter channels that are used for several measurement purposes. The general slow A/D converter is a 10-bit converter using the UEMEK interface clock for the conversion. An interrupt will be given at the end of the measurement.

The UEMEK’s 11-channel analog to digital converter is used to monitor charging functions, battery functions, user interface and RF functions.

The monitored battery functions are battery voltage (VBATADC), battery type (BSI) and battery temperature (BTEMP) indication.

The battery type is recognized through a resistive voltage divider. In phone there is a 100k. pull up resistor and a 75kohm BSI pull down resistor in the same line. Regardless of the battery type the pull down resistor is always same. The battery temperature is measured equivalently from engine board by NTC pull down resistor in the BTEMP line.

The monitored RF functions are PATEMP and VCXOTEMP measurements. PATEMP input is used to measure temperature of the RF-IC HELGO. VCXOTEMP input is used for RF PA manufacturer identification in NPL-4/5.

AUXDET and HEADINT2 inputs can be used for keyboard scanning purposes. These inputs are routed internally from the miscellaneous block. These lines are used for thermometer in NPL-4/5.

The output of the backup battery, VBACK, is connected to the converter using a NMOS switch. There is also a pulldown switch in the VBACK input, which can be used to discharge the back up battery line. The pulldown switch should be disabled during the measurement of the voltage level of the VBACK.

Digital camera

VGA camera module is used in NPL-4/5. Camera is connected to baseband (UPP) through HW Accelerator IC. The camera data bus is common with display bus. External 1.8V and

2.8V regulators are used as a power supply (VDIG and VANA) for camera module and HW accelerator. The 2.8V regulator is common for camera, compass and FM-radio.

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Figure 6: Camera Connections to Baseband

GenIO(01)

REG

2.8V

REG

1.8V

VANA_EXT

VDIG

VGA camera has a resolution of 640 x 480. Pixel size is 5.6um x 5.6um. Both camera and HW accelerator support sleep functionality in order to minimize the current consumption.

FM radio

FM radio circuitry is implemented using highly integrated radio IC, TEA5767. The MCU SW controls FM radio circuitry through serial bus interface. The FM radio power supply is VANA_EXT, which is common with camera and compass.

UPP

LCDUI(1)

LCDUI(0)

GenIO(27)

GenIO(28)

GenIO(26)

GenIO(3)

LCDCamTxDa

LCDCamClk

CamRxDa

CamCSX

CamSDX

CamClk

ccelerato

CCISCL

CCIDA

CCPCLKN

CCPCLKP

CCPDATAN

CCPDATAP

Camera

Figure 7: FM Radio Audio-, Antenna- and Digital Interface Connections

GENIO11

GENIO12

GENIO8

GENI24

VIO

GND

TEA5767

SDA SCL W/R

Clk

VAFL

VAFR

VDIG/ VANA

Ant

FMCtrlDa FMCtrlClk FMWrEn

FMClk

UEMEUPP

Filter

VANA_EXT

GND

MIC3NR

MIC3PR

MIC3N

MIC3P

Tomahawk

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Electrical compass

The compass will have two magnetometer channels and it uses anisotropic magnetoresistive (AMR) magnetometer component (containing both X- and Y-axes). Each measurement axis is configured as a 4-element Whetstone bridge converting the magnetic field into differential output voltage. This sensor element is capable of sensing fields in milligauss range. In order to achieve the measurement resolution, the sensor must be frequently reset by a current pulse run through the set/reset coil of the sensor element. The MagIC ASIC will interface the phone engine through the CBUS interface. The calculation of the compass heading and the calibration of the magnetometer are carried out in the phone engine.

NPL-4/5 will have an air-bubble for the user to level the device.

The heading is shown by compass rose in phone display.

Figure 8: Baseband and Compass Interface

Vbridge

x-axes

y-axes

Magneto

meter

UEMEK

UEME

VIO

PURX

CBUS

MagIC

DVdd

Clr

UPP

Thermometer

The 1% accuracy NTC-resistor is used for ambient temperature measurement. NTC resistor sensor is located on UI-board under the keypad shield. It is connected with two A/D – lines (AuxDet and Headint2) to UEMEK.

Voltages are measured over 1% accuracy resistor that is connected series with temperature sensor. This gives sufficient accuracy for temperature measurement without calibration.

GenIO3

GenIO1

S/R

Clk

AVdd

2.8V

Regulator

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Figure 9: Ambient Temperature Sensor Interface to BB

VANA

Backup battery

Backup battery is used in case when main battery is either removed or dis-charged. Backup battery is used for keeping realtime clock running for minimum of 30 minutes.

Rechargeable backup battery is connected between UEMEK VBACK and GND. In UEMEK backup battery charging high limit is set to 3.2V. The cut–off limit voltage (V BUCoff– ) for backup battery is 2.0V.

R211, 12k 5%

R212, 68k 1%

R101,10k NTC 1%

uxDet

Headint2

UI board

MUX

UEMEk

Slow

Backup battery charging is controlled by MCU by writing into UEM register. Li-Ion SMD battery type is used. The nominal capacity of the battery is 0.01 mAh.

Parameter Test conditions

Back-up battery voltage

Back-up battery cut-off limit

Charging voltage (VBAT 3.4V)

Charging current I

SIM interface

The UEMEK contains the SIM interface logic level shifting. The SIM interface can be programmed to support 3V and 1.8V SIM. A register in the UEMEK selects SIM supply volt-

Table 20: Backup Battery Circuitry

Symbol Min

Typ Max Units

VBACK 2.43 3.3 V

V_BU

COFF+

COFF-

2.04 2.1 2.16 V

1.94 2 2.06 V

VBU 3.1 3.2 3.3 V

LIMVBU

150 500 uA

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age. It is only allowed to change the SIM supply voltage when the SIM IF is powered down.

The whole SIM interface locates in two chips UPP and UEMEK.

The SIM interface in the UEMEK contains power up/down, port gating, card detect, data receiving, ATRcounter, registers and level shifting buffers logic. The SIM interface is the electrical interface between the Subscriber Identity Module Card (SIM Card) and mobile phone (via UEMEK device).

Table 21: SIMCARDet Detection

Parameter

SIMCARDet, BSI

ariable Min

yp Max Unit

Vkey 1.94 2.1 2.26 V comparator Threshold

SIMCARDet, BSI

Vsimhyst 50 75 100 mV comparator Hysteresis (1)

The data communication between the card and the phone is asynchronous half duplex. The clock supplied to the card is in GSM system 1.083 MHz or 3.25 MHz.

Figure 10: UPP/UEMEK SIM Interface Connections

SIM

C5 C6 C7

SIM

ASIP

SIMIO

SIMClk

SIMRst

SIM

UEME

SIMIO

SIMClk

SIMRst

SIMIF

UPP

SIMIO

SIMClk

SIMR

UIF Block

From Battery

ype contact

BSI

UEME K digital lo

UEMEKI

CBusDa CBusEnX

CBusClk

FCI (Functional Cover Interface)

NPL-4/5 has functional cover interface for changeable functional B-cover. The functional cover interface consists of FCI ASIP chip and five contact pads on UI PWB. HW does not support the I2C in BB4.0 engine whereupon interface uses SW emulated I2C protocol. The FCI ASIP chip includes switch for power supply control and EMC filters for data lines.

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Figure 11: FCI Interface

GenIO_18

VBAT

VIO

FCI ASIP

Switch

Short Circuit

protection

Terminal Functional Cover

ferrite

FC_Vout

Cout

ferrite

Reg.

Cin

GenIO_22

UPP

GenIO_2

GenIO_25

Bottom View

Keypad-side FC conn.

Pad layout

ferrite

FC_SDA

FC_SCL

FC_INT

ferrite

MCU

Figure 12: FCI Connector Pin Order on PWB

1. Vout

2. GND

3. SDA

4. SCL

5. FCIInt

Memory

For the MCU UPP includes ROM, 2 Kbytes, that is used mainly for boot code of MCU. To speed up the

MCU operation small 64-byte cache is also integrated as a part of the MCU memory interface. For program memory 8Mbit (512 x 16bit) PDRAM is integrated. RAM block can

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also be used as data memory and it is byte addressable. RAM is mainly for MCU purposes but also DSP has also access to it if needed.

MCU code is stored into external flash memory. Size of the flash is 128Mbit (8M x 16bit). The NPL-4/5 baseband supports a burst mode flash with multiplexed address/data bus. Access to the flash memory is performed as 16-bit access. The flash has Read While Write capabilities, which makes the emulation of EEPROM within the flash easy.

External memory

NPL-4/5 uses Multi Chip Package Memory, which combines 128Mbit Muxed Burst MultiBank NOR Flash and 16Mbit Muxed PSRAM.

The 128Mbit Flash memory is organized as 8M x16 bit and 16Mbit PSRAM is organized as 1M x16 bit.

The memory architecture of flash memory is designed to divide its memory arrays into 263 blocks and this provides highly flexible erase and program capability.

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Compass

This chapter describes electronic compass function integration to baseband. Measurement is based on magnetoresistive sensor and controlled with baseband ASICs, UPP and UEME via MagIC ASIC.

The electronic compass will have two magnetometer channels for detecting x and y direction components of earth magnetic field and it uses Honeywell’s anisotropic magnetoresistive (AMR) magnetometer component HMC1052 (containing both x- and y- axes). Both channel rely on the magnetoresistive effect and provide the required sensitivity and linearity to measure the weak magnetic field of the earth.

Each measurement axis is configured as a 4-element Whetstone bridge converting the magnetic field into differential output voltage. This sensor element is capable of sensing fields in milligauss range. In order to achieve the measurement resolution, a current pulse to run through the set/reset coil of the sensor element must frequently reset the sensor. This means basicly compensation of linear offset.

The MagIC ASIC will interface the phone engine through the CBUS. The calculation of the compass heading and the calibration of the magnetometer are carried out in the phone engine.

Earth magnetic field

The magnetic field of the earth is the physical quantity to be evaluated by a compass.

The magnetic field strength on the earth varies with location and covers the range from about 200 to 700 mGauss. Earth magnetic field is assumed to be like as generated by a bar magnet (in the earth). The magnetic field lines point from the earth´s south pole to its north pole. Exactly, 2-dimensional magnetometer measures earth magnetic horizontal field component.

The field lines are perpendicular to the earth surface at the poles and parallel at the equator. Thus, the earth field points downwards in the northern hemisphere and upwards in the southern hemisphere.

An important fact is, that the magnetic poles do not coincide with the geographical poles, which are defined by the earth´s axis of rotation. The angle between the magnetic and the rotation axis is about 11.5°. As a consequence, the magnetic field lines do not exactly point to geographic or “true” north.

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Figure 13: Earth’s Magnetic Field

Heading angle or azimuth (α)

The angle between magnetic north and the heading direction. Magnetic north is the direction of xhyh the earth´s field component perpendicular to gravity. Throughout this

paper, xhyh will be referred to as “horizontal” component of the earth´s field.

The compass heading is defined by:

The azimuth is the reading quantity of a compass. Throughout this paper, α is counted clockwise from magnetic north, i.e. north is 360° or 0°, east is 90°, south is 180°, west is 270°.

Inclination (δ)

Also known dip. The angle between the earth´s field vector and the horizontal plane. As already pointed out, the inclination varies with the actual location on earth, being zero at the equator and approaching ±90° near the poles.

Heading arctan)(

⎞

⎛

⎟

⎜

⎟

⎜

⎠

⎝

Declination (λ)

The angle between geographic or true north and magnetic north. Declination is dependent on the actual position on earth. It also has a long-term drift. Declination can be to the east or to the west and can reach values of about ±25°. The azimuth measured by a compass has to be corrected by the declination in order to find the heading direction

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with respect to geographic north.

Figure 14: Earths’s Magnetic Field Components

x (heading direction)

heading

hyh

azimuth

magnetic north

declination

True geographic north x

inclination δ

y (right)

heading (xyz) = real earth magnetic field direction

z (down)

Tilt (σ)

Tilt angle is angle between horizontal level and equipment level. If a compass is tilt, then this inclination has to be considered.

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HW Block Diagram

Functionally NPL-4/5 electronic compass consists some main blocks.

Figure 15: Block Diagram

GenIO01

UPP

DCT 4 Engine

VBAT

UEME

GenIO03 also camera

GenIO I2C interFace

Ext. power supply, also for other functions

10nF

PURX

CBUSENX

CBUSCLK

CBUSDA

CBUS IF

I2CCLK I2CDA

AVss

ClrX

CBUS

interfaces

I2C

interface

UART interface

MagIC ASIC

bridge

InXp

InXm

InYp

InYm

SROp SROm

SRVdd

SRVss

Reg_Ctrl

AVss

1uF

100nF

VBAT

-Direction

GND

SET/RESET Circuit

Offset Circuit

Constant current source

MAGNETOMETER

Not used functionality and features of MagIC ASIC on NPL-4/5 compass implementation.

•I2BUS (additional communication channel)

• UART (additional communication channel)

• z - channel A/D converter

HW block functions

Magnetometer sensor (2-axis)

• x and y direction magnetic field sensitivity sensors

• set/reset circuitry for

i -improving performance and linearity

-differential outputs to MagIC ASIC

-compensating offset effect

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• offset strap

-self test capability for magnetometer

-used for production testing

MagIC ASIC

• A/D converter input interface and for magnetometer sensors

-Differential inputs

-40 dB amplifier for signal

• Control for Set/Reset circuitry

-Positive and negative pulses for S/R strap

• CBUS interface for UPP

-MagIC have dedicated address

• System clock from GenIO3

• Main reset from UEME (PURX)

• Control of offset strap (RegCtrl)

UPP

• MCU SW controls for compass function

• GenIO3System clock generator, MCUclock /2 = 13MHz

-Common with camera function

• CBUS master for MagIC

• Controls external voltage source (VANA_EXT) GenIO1

UEME

• Voltage supply (VIO, 1.8V) for MagIC, digital logic supply voltage and reference

• Controls main reset, PURX

VANA_EXT, analog (external) power supply,

• 2.8V for MagIC analog parts

• Controlled via GenIO01

• Common with camera and FM/Radio function

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Magnetometer Sensor

The magnetometer will be implemented with anisotropic magnetoresistive (AMR) magnetometer component. Two-axis linear magnetic sensors are designed as a Wheatstone bridges formed by a magnetoresistive metal film. Sensor acts as resistor which resistance depends on magnetic field strength and direction. This bridge element is capable of sensing fields in milligauss range.

In order to achieve the measurement resolution, a magnetic pulse must frequently reset the sensor. Eliminating and compensating external disturbances will be done via coil strip near of sensor elements with current pulse.

Offset coil strap is used for production level testing and self-testing.

Main features

• Two magnetometer channel blocks (containing X- and Y-axes).

-Measurement with 4-element Wheastone bridge /axes

-Convert magnetic earth field X and Y components to differential outputs

• Set / Reset coil element

-Current pulse to coil for set and reset sensor

• Offset strap coil

-For testing purposes

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Block diagram

Figure 16: Magnetometer Sensor Block Diagram

Y-axis

X-axis

Magnetometer control interface

Pin Assignment

Table 22: Table 1 Connector pin assignment

Pin Number

1 GND2 (A) Ground Measurement bridge A ground

2 Offset+ Input Offset coil positive pin

3 Vo+(A) Output Positive A measurement brigde output

4 Vcc Supply Bias voltage for both measurement bridges

5 NC

6 Offset- Output Offset coil negative pin

7 GND2 (B) Ground Measurement bridge B ground

8 S/R+ Input Set /reset coil negative pin

9 NC

Symbol I/O Description

10 Vo- (B) Output Negative B measurement brigde output

11 S/R- Ouput Set /reset coil positive pin

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12 NC

13 GND1 (A) Ground Measurement bridge A ground

14 Vo- (A) Output Negative A measurement bridge output

15 GND1(B) Ground Bridge B ground

16 Vo+ (B) Output Positive B measurement bridge output

Figure 17: Pin Assignment In Package

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Test Circuitry

Based on constant current generator, which drives internal coil on magnetometer chip. Circuit is controlled via general IO –pin on MagIC/RegCtrl. On current is 2.0mA, off current is 0.00mA.

Figure 18: Test Circuitry

Vana_Ext

RegCtrl

Constant

current

driver

Figure 19: Offset strap coil current effect

sensor

Offset strap current will produce 320 to 420digit offset to raw x and y values.

MagIC ASIC

The electronic compass will have two magnetometer channels and it uses anisotropic magnetoresistive (AMR) magnetometer component (containing both X- and Y-axes). Each measurement axis is configured as a 4-element Wheatstone bridge converting the magnetic field into a differential output voltage. This sensor element is capable of sensing fields in milligauss range. In order to achieve the measurement resolution, the sensor must be frequently reset by a current pulse that is driven through the set/reset coil of the sensor element. The ASIC will interface the phone engine through either the CBUS or I2C interface. The calculation of the compass heading and the calibration of the magnetometer are carried out in the phone engine. The ASIC has a third magnetometer channel, but it is not used in this project.

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Main features

The ASIC supports three magnetometer axis. The ASIC features are:

• Pre-amplifier followed by a single-shot sigma delta type of ADC for each measurement channel

• H-bridge for driving the SET/RESET coil inside the magnetometer element

• Internal voltage reference for the ADC and the magnetometer bridge

• Digital control interfaces (I2C, CBUS, UART)

• Control registers

• One-bit digital control output signal to turn on/off the external linear regulator

Block diagram and functional descriptions

Figure 20: Block Diagram

Clk

I2CClk

I2CDa

CBusClk

CBusEnX

CBusDa

UARTRx

UARTTx

VBridge

TankCharge

SRVdd

SROp

SROm

SRVss

InX

InY

InZ

write cmd,addr

I2C slave interface

CBUS interface

UART interface

Bandgap

reference

Magnetometer

SET/RESET

generator

Pre - amplifier

amplifier

Pre

Pre - amplifier

write data (8)

write cmd,addr

write data (16)

write cmd,addr

write data (8)

read addr

read data (8)

read addr

read data (16)

read addr

read data (8)

REGISTERS CONTROL

Sigma-delta ADC

data

Single shot

measurement

counters

CLOCK

DIVIDER

internal clocks

reset

DVdd

DVss

ClrX

RegCtrl

SMC

TMC

DTest1

DTest2

DTest3

Vdd

Vss

The magnetometer interface has three differential inputs for X-, Y- and Z-bridge respectively. The measurement path for each axis can be enabled/disabled separately and the power consumption of any unused path is minimized. The magneto-resistive bridges of all axes are biased by a single reference voltage (2.2 V) provided by the internal bandgap reference.

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The voltage from the magneto-resistive bridge is first amplified with a slow, continuoustime stage. This stage has a passive RC-filter at its input. After that, there is a dedicated, second-order sigma-delta ADC for each measurement channel. The sigma delta ADC is making DC-type of instantaneous measurements and thus it is operated in a single-shot mode and the digital conversion result is obtained by using a simple counter only. The measurement path does not have any analog offset-compensation or gain adjustment functions. If needed, the magnetic field measurement range (±2 gauss) of the measurement chain can be extended by reducing the voltage over the sensor bridge by adding resistors to both sides of the sensor bridge. In this case though, the measurement resolution will be reduced accordingly.

MagIC control interface

Pin assignment

MagIC ASIC interface - Magnetometer sensor

Table 23: MagIC-magnetometer interface

MagIC

Pad

Pin Name

C1 SRVss1 GND GND Ground for S/R tank

D2 SROm1 Analog

D1 SROm2 Analog

E1 SRVss2 GND GND Ground for S/R tank

F1 SROp1 Analog

F2 SROp2 Analog

G2 SRVss3 GND GND Ground for S/R tank

MagIC Pin Type

Output

Sensor Pad

8 SR-

11 SR+

Sensor Pin Name

(A,B)

Connection Function

charge capacitor circuit

to magnetic sensor S/R- negative output for S/

charge capacitor circuit

to magnetic sensor S/R+ (between pins is 100nF capacitor)

positive output for S/R (two power pads on die, double bonding)

charge capacitor circuit

G3 SRVdd1 Power

supply

from UEME via MagIC to tank charge capacitor 1uF)

Vdd supply for S/R (two power pads on die, double bonding to one pin)

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H3 SRVdd2 Power

supply

G4 InXm Analog

Input

H4 InXp Analog

Input

H5 InYm Analog

Input

G5 InYp Analog

Input

G7 Vbridge Analog

Output

F7 Tank-

Charge

Analog Output

from UEME via MagIC to tank charge capacitor (1uf)

14 Vo-

(A)

3 Vo+

(A)

10 Vo-

(B)

16 Vo+

(B)

4 Vcc Magnetic sensor Vbridge voltage Common voltage bias

to magnetic sensor XOUT(A)

to magnetic sensor XOUT+ (A)

Magnetic sensor YOUT(B)

Magnetic sensor YOUT+ (B)

to tank charge (external) capacitor Charges the SR tank

Vdd supply for S/R (two power pads on die, double bonding to one pin)

x-axis negative input for A/ converter

x-axis positive input for A/ converter

y-axis negative input for A/ converter

y-axis positive input for A/ converter

for all sensor bridges (2.2V) trought MagIC ASIC

cap during power-up only (Vdda can go up/ down during PD)

F8 Avdd Power

supply

E7 GndShield Ground GND Dedicated pin to cre-

E8 Avss Analog

ground

UEME Positive Analog Power

supply

ate a clean substrate supply (guard ring between analog and digital)

GND Negative Analog

Power supply

MagIC ASIC – UPP interface

Table 24: MagIC-UPP interface

MagIC

Pad

Pin Name

B2 CbusClk Digital

MagIC Pin Type

input

UPP Pin Name

CBUSCLK UPP – UEME - MagIC

Connection Function

bidirectional bus

C bus clock, alternatively system clock for MagIC

C3 Clk Digital

Input

A4 CbusDa Digital I/

GenIO3 from UPP general I/O

generated from system clock

CBUSDA UPP - UEME – MagIC

bidirectional bus

MagIC ASIC system clock = 13MHz

CBUS data

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B4 CbusEnX Digital

Input

MagIC ASIC – UEME interface

MagIC

Pad

Pin Name

A6 ClrX Digital

A3 DVdd Power

C2 DVss Digital

MagIC Pin Type

Input

supply

ground

CBUSENX UPP - UEME – MagIC

bidirectional bus

Table 25: MagIC - UEME interface

UEME Pin Name

PURX General reset generated by UEME Main reset

VIO Digital power supply / voltage reference Positive Digital Power

GND Ground level Negative Digital Power

Connection Function

CBUS enable

supply (1.8V)

supply

MagIC ASIC – UPP - External power supply interface

Table 26: External power supply interface

Pad Pin Name Pin Type

VBAT Battery

supply

F8 Avdd

(MagIC)

GenIO01 (UPP)

E8 Avss

(MagIC)

Power supply

Analog ground

Regulator Pin Name

Input Battery supply

Output Analog power supply for compass, FM-

SD Used as control signal On/ off (shutdown)

GND Ground level Negative Analog

Connection Function

Positive Analog Power

radio and camera

supply (2.8V)

control of external power supply

Power supply

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MagIC - magnetometer sensor interface for constant current driver

Table 27: Offset strap supply interface

Pad Pin Name Pin Type Pad Pin Name Connection Function

D8 RegCtrl

(MagIC)

GND Power

VBAT Power

Power supplies

Introduction

Digital output

Current output

Current input

supply

Ioff+ to magnetometer sensor offset strap Offset strap current,

Ioff- Offset strap return current (-) from

for magnetometer offset strap constant current driver

magnetometer offset strap

GND

Power supply for constant current driver

On/off control

positive

Offset strap current, negative

Power supply from battery

The MagIC ASIC has two separate voltage supplies. DVDD is supplying digital functions and AVDD analogue functions. The digital supply is capable of running at a voltage of

1.8V for compatibility with the BB I/O levels.

After the phone is started, the DVDD voltage is always on, since it is supplied from VIO regulator.

AVDD can be off or on at power up depending which regulator is used for it.

Using VIO for DVDD supply

VIO is available on UEME. The digital supply is capable of running at a voltage of 1.8V for compatibility with the BB I/O levels.

Using external regulator for AVDD

External AVDD regulation voltage level is 2.8V

The analogue supply is fed from the external regulator whose output is enabled by the GenIa signal.

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Compass and phone basics

Phone directions

Directions with phone on this document is mentioned on Figure 23 Directions through phone.

Sensible use of compass function means that phone (and 2-axis magnetometer) is accurately in horizontal level. This is done with internal builder level (air bubble) on phone.

Measured and displayed numerical compass heading is angle between TOP direction and geographical north direction. Numerical values are part of 1/360 of full round circle.

Compass rose point graphical difference of TOP direction and geographical north direction (with declination angle). TOP direction is direction on users motion.

Figure 21: Directions Through Phone

Builder level (air bubble)

Magnetic north

Geographical no r th

BOTT

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General description

Operation modes

•Shutdown

-MagIC is set to stand-by mode

-Logic voltage VIO is always on

Analog voltage supply is normally off, but other functions can switch voltage on

• Active compass function

-External power supply is on

-MagIC is set to active mode

-System clock is activated

• Production test mode

-As active mode but also offset strap current is activated

Compass function main features

Compass display menu

Compass function is controlled via UI SW menu structures. When compass display menu is selected, it starts compass function.

Compass display results

Compass azimuth result is displayed with heading angle with numerical mode and with (compass rose) pointer. Measurement is always continuous, only user action can stop actions.

Other functionality during active compass function:

• Minimal TX RF

-Location update via network

• No charging

• Keyboard lights always on (also during calibration)

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Compass calibration SW

Calibration is needed for compensate external magnetic field and improve performance of compass reading accuracy.

User assisted calibration

UI SW menu structure

• User select checked horizontal plane with no disturbance near of phone

• With very slow rotating (about 10s / round) MCU SW will find values for compensation during one round.

• SW calculates calibration values

Compass declination menu

Used for setting compensated declination angle. Declination values is accessible from special maps or lists of places. Declination angle value varies about ±25° depending geographical place on earth.

Supply interface for manual calibration, used also for resetting calibration values

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Testpoints

Set/Reset

Set/Reset pulse after DC separation capacitor C314

Testpoint J327

Figure 22: Timing and Voltage Level l

2.2V

Vbridge

Vbridge (J326)

(J326)

2.8V

Voltage levels and wave shapes on Testpoint J326 and J327

set pulse

2.2V

Vbridge

2.8V

Timings on Vbridge and over S/R coil

>40ms

Duration 2µs

1ms

set pulse

Duration 2µs

S/R (J327)

VBRIDGE

Vbridge supply voltage for magnetometer’s measurement bridges. Vbridge voltage is always on during measuring session.

Testpoint J326

• Nominal voltage level 2.2V ±2%

Channel output A

Channel A output from measurement bridge A. Signal is differential type.

Testpoints J331(+), J332(-)

reset pulse

S/R (general)

In current scale S/R pulses nominal values are 1A

In current scale S/R pulses nominal values are 1A pulses over S/R coil

pulses over S/R coil

>20ms

reset pulse

Nominal voltage level is 1.1V to ground. Differential voltage level is 0.0V

Channel output B

Channel B output from measurement bridge B. Signal is differential type.

Testpoints J329(+), J328(-)

Nominal voltage level is 1.1V to ground. Differential voltage level is 0.0V

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Service Software Interface (Phoenix)

AMS functions can use some internal parameters for compass functions. Those controls and values are available from Phoenix PCSW /Compass Control.

• Compass function on and off

• Heading angle result

• x, y results

• calibration values, read and set

- min x (circle)

- max x (circle)

- min y (circle)

- max y (circle)

- scorra (ellipse)

- scorrb (ellipse)

• Offset strap coil on and off

• Calibration routine must be capable to start from Phoenix menu

Manual calibration

Manual calibration is mainly used for resetting calibration values to zero values but also it is sensible for making small changes to calibration values.

• Values of basic correction: min x, max x, min y, max y,

• Values of sloped ellipse correction: scorra , scorrb

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Performance

Calibration basics

Calibration process target is to normalize measured x and y value before calculation to heading angle, exactly: calibration removes harmful effects of phone own

Calibration is needed because every phone has different magnetic behaviour and also the geographical places are different

Recalibration is needed because phone has drift on magnetization level depending user actions and geographical place changes

Basically in phone levels are two type of normalization,

• offset drift

• ellipse correction

User action: rotate phone

• one to two round needed (360 to 720 degree)

Phone actions

• Measures x and y values during rotating

• Judges calibration success

• Calculates calibration output values

Calibration outputs (parameter values)

• offset drift values: xmin, xmax, ymin, ymax

² 1 ellipse correction: scorra and scorrb

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Figure 23: What Happened on Calibration (Track on x/y Plane while rotating)

Calibration process flow

Set phone to flat surface, far away from metals and magnetic fields

Set calibration mode on

Gently rotate phone until SW says “success or not”

• Speed 10s/ round

• Phone must be in all the time on same horizontal level

• Check compass functionality after calibration

If calibration is not successfully, try again

If calibration fails again, change place

• Try to find more magnetically undisturbed place

Compass digital values, limit values

Note: Sensitivity

• 0.5mGauss /digit (raw digit on x and y channels)

Limits:

Min x and min y

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• typical range –2100 to 1000

Max x and max y

• typical range –1000 to 2100

Scorra

• typical range 1.0 to 1.5 (and –1.5 to –1.0)

Scorrb

• typical range 0.0 to 0.5 (and –0.5 to 0.0)

•Gain

- 0.1 Gauss field, gain min. 300 digit (tilt angle 0 degree)

- 0.4 Gauss field, gain max. 2300 digit (tilt ange 0 degree)

Offset value, calculated as (max-gain2), not normalized

• typical range –1200 to 1200 for both channels

Gain ratio of x and y channels

• max. range 0.75 to 1.33, typical range 0.95 to 1.05

Offset strap coil difference (with and without offset strap coil current)

• 320 to 420 for both channels

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Clock distribution

Figure 24: Clock Distribution Diagram

32 kHz

UEM

VR3

VCTCXO

26MHz

32 kHz

SLEEPX

UPP

MCU

DSP

26 MHz

PLL

CTSI

SLICER

HELGA

26 MHz

RFBUSCLK 13MHz

CBUSCLK 1MHz

DBUSCLK 13MHz

LCDCLK max. 6.5MHz

SIMCLK max. 3.25MHz

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User Interface

Figure 25: User Interface Connections

Display

NPL-4/5 has 130 x130 pixel 12bpp (bits per pixel) passive matrix color STN display. LCD is connected to transceiver PWB by 10-pin board to board connector. Interface is using 9-bit data transfer. Partial display function is implemented in the module.

Figure 26: Display Block

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UI Board

NPL-4/5 consists of separate UI board, type designate wk4, which includes contacts for the keypad domes, Functional cover interface pads, Thermoter thermistor and LED’s for keypad lighting. UI board is connected to main PWB through 20 pole board-to-board connector with springs.

5x5-matrix keyboard is used in NPL-4/5. Key pressing is detected by scanning procedure. Keypad signals are connected UPP keyboard interface.

Figure 27: UI Board

UPP

ROW 0 ROW 1 ROW 2 ROW 3 ROW 4

EMIF10 ASIP

EMC filter

vol

dow

lect

PTT

send

left

1 4

5 8

6 93 #

end

right

UEMEk

COL 0 COL 1 COL 2 COL 3 COL 4

PWRONX

EMC filter

Power Switch

When no key is pressed, row inputs are high due to UPP internal pull-up resistors. The columns are written zero. When key is pressed one row is pulled down and an interrupt is generated to MCU. After receiving interrupt, MCU starts scanning procedure. All columns are first written high and then one column at the time is written down. All other columns except one, which was written down, are set as inputs. Rows are read while column at the time is written down. If some row is down it indicates that key which is at the cross point of selected column and row was pressed. After detecting pressed key all register inside the UPP are reset and columns are written back to zero.

Table 28: Key mapping

COL0 COL1 COL2 COL3 COL4

ROW0 VOL+ LEFT SEND END RIGHT

ROW1 VOL- SOFT LEFT UP DOWN SOFT RIGHT

ROW2 1 4 7 *

ROW3 SELECT 2 5 8 0

ROW4 PTT 3 6 9 #

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Power supply for LEDs

DC/DC converter generates VLED supply voltage for white LEDs. There are two white LEDs connected series in display and on keypad PWB in four branches. The flashlight has one white LED. Feedback resistors R300, R302 and R310 set output voltage. The voltage reference is 0.515V inside the driver.

Driver is controlled by the UEMEK via CALLED1 output. This signal is connected to driver EN-pin (on/off). R317 is used to increase converter output current.

Figure 28: VLED Voltage Supply

CALLED

Keyboard LEDs driver

LEDs are supplied from VLED voltage throught current limiting circuit. Keyboard illumination is controlled by DLIGHT –line (UEMEK). BJT driver controls the constant current generator. DLIGHT line needs voltage matching for higher VLED voltage than battery voltage. Control line has capability to dimming. The DLIGHT line is common for display and keypad illumination driving.

Driver will work as constant current genertor increase or decrease the output voltage for LEDs to keep the current stable. This means that constant current flow through each branch. Serial resistance 39R is used to create the current limit with transistor Vbe voltage.

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Figure 29: Keyboard Led Driver and Control Diagram

VLED

DLIGHT

R=39Ω

UI Board

Display and air bubble LED driver

LEDs are supplied from VLED voltage throught current limiting circuit. Display and air bubble illumination is controlled by DLIGHT –line (UEMEK). BJT driver controls the constant current generator.

- Driver will work as constant current generator increase or decrease the output voltage for LEDs to keep the current stable. Serial resistance 33R is used to create the current limit with transistor Vbe voltage.

- Air bubble led is located under the air bubble. Its current consumption will be ~3.8mA.

Figure 30: Display and Air Bubble LEDs driver and Control Diagram

VLED

DLIGHT

R=27Ω

Display

Air bubble

led

R=1000

Flashlight LEDs driver

LED is supplied from VLED voltage throught current limiting circuit. Flashlight is controlled by CallLED2 line (UEMEK). BJT driver controls the constant current generator. CallLED2 line needs voltage matching for higher VLED voltage than battery voltage. Current consumption will be 20mA.

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Figure 31: Flashlight Driver and Control

VLED

CallLED2

R=33Ω

R=47Ω

Internal microphone

The internal microphone capsule is mounted into the system connector assy, which is connected to engine board with springs. Microphone is omni directional and it’s connected to the UEMEK microphone input MIC1P/N. The microphone input is symmetric and the UEMEK (MICB1) provides bias voltage.

UEMEk

MIC1B

MIC1N

MIC1P

Figure 32: Microphone Connection

220

2.2uF

33nF

2k2

1nF

2k2

1nF

27pF

1000Ω@100MHz

27pF

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Internal speaker

There is a dynamic earpiece with impedance of 32 ohms. The earpiece is low impedance one since the sound pressure is to be generated using current and not voltage as the supply voltage is restricted to 2.7V. The earpiece is driven directly by the UEMEK and the earpiece driver (EARP & EARN outputs) is a fully differential bridge amplifier with 6 dB gain.

Figure 33: IEarpiece Connection

UEMEk

IHF

EARP

1000Ω@100MHz

EARN

14V 14V

27pF

The NPL-4/5 uses the D-class amplifier to gain signal to IHF speaker. The integrated Hands Free Speaker is used to generate polyphonic ringing tones, FM radio, PoC and IHF audios. Speaker capsule is mounted under the antenna. Spring contacts are used to connect the IHF Speaker contacts to the system PWB.

Class-D amplifier, it produces high efficiency, which leads to the lower current consumption and makes the thermal issues negligible as well compared to the traditional solutions.

Figure 34: IHF Connection

UEMEk

PAOUTP

PAOUTN

UPP

VBatt

10n

10n GAINSEL SHUTDOWN

GenIO(14)

IN+

IN-

100n

LM4667

220ohm/100MHz

V01

V02

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Headset connections

NPL-4/5 is designed to support fully differential external audio accessory connection. A headset can be directly connected to Tomahawk system connector. Mono and stereo audios are supported to earpieces and mono for microphone audios.

Headset implementation uses separate microphone and earpiece signals. The accessory is detected by the HeadInt signal when the plug is inserted. Normally when no plug is present the internal pull-down on the HF pin pulls down the HeadInt signal. Due to that the comparator level is 1.9V the HeadInt signal will not change state even if the HF output is biased to 0.8V. When the plug is inserted the switch is opened and the HeadInt signal is pulled up by the internal pull-up. The 1.9V threshold level is reached and the comparator output changes to low state causing an interrupt.

The hook signal is generated by creating a short circuit between the headset microphone signals. When no accessory is present, the UEMEK internal resistor pulls up the HookInt signal. When the accessory is inserted and the microphone path is biased the HookInt signal decreases to 1.8V due to the microphone bias current flowing through the resistor. When the button is pressed the microphone signals are connected together, and the HookInt input will get half of micbias dc value 1.1 V. This change in DC level will cause the HookInt comparator output to change state, in this case from 0 to 1. The button can be used for answering incoming calls but not to initiate outgoing calls.

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Figure 35: NPL-4/5 Audio Connections

UEME

EARP EARN

GenIO(14)

PAOUTP

PAOUTN

HFR HFCMR

HF HFCM

MICB2

MIC2P

MIC2N

MICB1

MIC1N

MIC1P

IHF amplifier

Tomahawk

POPPORT

HSEAR R P

HSEAR R N

HSEAR P

HSEAR N

XMICP

XMICN

Vibra

A vibra alerting device is used to generate a vibration signal for an incoming call. Vibra is located in the left side of the phone just above the battery block and it is SMD component. Vibra interface is the same like other DCT4 projects. The vibra is controlled by a PWM signal from the UEMEK. Frequency can be set to 64, 129, 258 or 520 Hz and duty cycle can vary between 3% - 97%.

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RF Module

The RF module comprises all RF functions of the NPL-4/5 engine. The US variant NPL-4 includes GSM850/GSM1800/GSM1900 bands and the EU variant NPL-5 EGSM900 / GSM1800 and GSM1900 bands.

Both variants support GPRS (MSC10), EGPRS (MSC6) and HSCSD protocols and multislot classes 1to 6. The aim is to introduce Push to talk Over Cellular (PoC) feature in both variants.

The core of the RF is the Helgo RF ASIC. Other main components include:

- the power amplifier module which includes two amplifier chains, one for GSM850/ EGSM900 and the other for GSM1800/1900.

- 26 MHz VCTCXO for frequency reference

- 3296-3980 MHz SHF VCO (super high frequency voltage controlled oscillator)

- front end module with a RX/TX switch and four RF bandpass SAW filters

EGSM900 and GSM1800 LNAs (Low Noise Amplifier) for the receiver front-end are integrated in the Helgo while GSM1900 LNA is external.

NPL-4/5 is using lead free components and lead free SMD process.

The RF module includes two metal shields: one for the PA, antenna switch module and filters and one for Helgo, VCO and VCTCXO.

Internal antenna is based on the PIFA (Planar Inverted F-Antenna) concept.

The RF is controlled by the baseband section of the engine through a serial bus, referred later on as RFBus. This serial bus is used to pass the information about the frequency band, mode of operation, and synthesizer channel for the RF. In addition, exact timing information and receiver gain settings are transferred through the RFBus.

Physically, the bus is located between the baseband ASIC called UPP and the Helgo. Using the information obtained from UPP the Helgo controls itself to the required mode of operation and further sends control signals to the front end and power amplifier modules. In addition to the RFBus there are other interface signals for the power control loop and VCTCXO control and for the modulated waveforms.

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RF frequency plan

Figure 36: RF Frequency plan

GSM: 869-894 MHz 925-960 MHz

DCS: 1805-1880 MHz

PCS: 1930-1990 MHz

DCS: 1710-1785 MHz

PCS: 1850-1910 MHz

GSM: 824-849 MHz 880-915 MHz

f/4

Helgo

I-signal

Q-signal

f/4

f/2

32963980 MHz

f/2

PLL

26 MHz VCTCXO

Buffer

AFC

VCTCXO 26 MHz

I-signal

Q-signal

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DC characteristics

Regulators

The transceiver baseband section has a multi function analog ASIC, UEMEK, which contains among other functions six pieces of 2.78 V linear regulators and a 4.8 V switching regulator. All the regulators can be controlled individually by the 2.78 V logic directly or through a control register. Normally, direct control is needed because of switching speed requirement: the regulators are used to enable the RF-functions which means that the controls must be fast enough.

The seven regulators are named VR1 to VR7. VrefRF01 is used as the reference voltages for the Helgo, VrefRF01 (1.35V) for the bias reference and for the RX ADC (analog-todigital converter) reference.

The regulators (except for VR7) are connected to the Helgo. Different modes of operation can be selected inside the Helgo according to the control information coming through the RFBus.

List of the needed supply voltages

Volt. source Load

VR1 PLL charge pump (4.8 V)

VR2 TX modulators, ALCs, driver

VR3 VCTCXO, synthesizer digital parts

VR4 Helgo pre-amps, mixers, DtoS

VR5 dividers, LO-buffers, prescaler

VR6 LNAs, Helgo baseband (Vdd_bb)

VR7 VCO

VrefRF01 ref. voltage for Helgo

Vbatt PA

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Power distribution

Figure 37: Power distribution diagram

UEM

VR1

VR2

VR3

VR4

VR5

VR6

4.75 V [ 4.6V ... 4.9V ]

charge pump (VCP)

2.78 V [ 2.70V ... 2.86V ]

Tx modulator (Vcc_ModOut)

TX buffer & EDGE ALCs (VRF_TX)

2.78 V [ 2.70V ... 2.86V ]

VCTCXO (+VCC)

digital interface (VDIG)

2.78 V [ 2.70V ... 2.86V ]

Rx Front End (VRF_RX)

Bias & Rx CH filters (VF_RX)

RF controls (VPAB_VLNA)

2.78 V [ 2.70V ... 2.86V ]

PLL prescaler (VPRE)

phasing dividers of Rx (VLO)

2.78 V [ 2.70V ... 2.86V ]

BB buffer (VDIG)

VR7

refRF01

refRF02

VBAT

2.78 V [ 2.70V ... 2.86V ] 16 mA [max. 20 mA]

1.35 V [ 1.32V ... 1.38V ]

100 uA

1.35 V [ 1.32V ... 1.38V ] 100 uA

2.7 V [ 2.95V ... 4.7V ]

VCO (VCC_VCO)

bias reference (VB_EXT)

bias reference

Triple band PA

(RXIINN, RXQINN)

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RF characteristics

Parameter Unit and value

Cellular System GSM850/900, GSM1800 and GSM1900

Modulation schemes GMSK, 8-PSK

RX Frequency Band GSM850: 824- 849 MHz

GSM900: 925 - 960 MHz GSM1800: 1805 - 1880 MHz GSM1900: 1930 - 1990 MHz

TX Frequency Band GSM850: 869- 894 MHz

GSM900: 880 - 915 MHz GSM1800: 1710 - 1785 MHz GSM1900: 1850 - 1910 MHz

Output Power GMSK GSM850: +5...+33 dBm / 3.2 mW... 2 W

GSM900: +5...+33 dBm / 3.2 mW... 2 W GSM1800: +0...+30 dBm / 1.0 mW... 1 W GSM1900: +0...+30 dBm / 1.0 mW... 1 W

Output Power 8-PSK GSM850: +5...+27 dBm / 3.2 mW... 0.5 W

GSM900: +5...+27 dBm / 3.2 mW... 0.5 W GSM1800: +0...+26 dBm / 1.0 mW... 0.4 W GSM1900: +0...+26 dBm / 1.0 mW... 0.4 W

Duplex Spacing GSM850: 45MHz

GSM900: 45MHz GSM1800: 95MHz GSM1900:: 80MHz

Number of RF Channels GSM850: 124

GSM900: 174 GSM1800: 374 GSM1900: 300

Channel Spacing 200 kHz (each band)

Number of TX Power Levels GMSK GSM850: 15

GSM900 : 15 GSM1800: 16 GSM1900: 16

Number of TX Power Levels GMSK GSM850: 12

GSM900 : 12 GSM1800: 14 GSM1900: 14

Sensitivity, static channel (+25°C)

Frequency Error, static channel < 0.1 ppm

EGSM: -102dBm GSM900: -102dBm GSM1800: -102dBm GSM1900: -102dBm

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RMS Phase Error

Peak Phase Error

RF block diagram

The block diagram of the RF module can be seen below. The detailed functional description is given in the following sections.

RF block diagram NPL-4/5

< 5.0° < 20.0°

Figure 38: RF Block Diagram

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Frequency synthesizers

The VCO frequency is locked by a phase locked loop (PLL) and VCTCXO which is running at 26 MHz.

The frequency of the VCTCXO is in turn locked into the frequency of the base station with the help of an AFC voltage which is generated in UEMEK by an 11 bit D/A (digital-toanalog) converter.

The PLL is located in the Helgo and is controlled through the RFBus.

Loop filter filters out the comparison pulses of the phase detector and generates a DC control voltage to the VCO.

The dividers are controlled via the RFBus. RFBusData is for the data, RFBusClk is a serial clock for the bus and RFBusEna1X is a latch enable, which stores the new data into the dividers.

Receiver

Each receiver path is a direct conversion linear receiver.

From the antenna the received RF-signal is fed to the front end module where a diplexer first divides the signal to two separate paths according to the band of operation: either lower, GSM850/EGSM900 or upper, GSM1800/GSM1900 path.

At each of the paths a pin-diode switch is used to select either receive or transmit mode. At the upper band in receive mode either GSM1800 or GSM1900 path is further selected by another pin-diode switch.

The selections are controlled by the Helgo which obtains the mode/band and timing information through the RFBus. After the switches there is a bandpass filter at each of the receiver paths. These filters are included in the front end module, except for GSM1900 where it is external.

Then the signal is fed to the LNAs which are integrated in the Helgo in GSM850/ EGSM900 and GSM1800 while in GSM1900 the LNA is external.

In GSM1900 the amplified signal is fed to a balun and thereafter to a pregain stage of the mixer while in GSM850/EGSM900 and GSM1800 the LNA’s are directly connected to the pregain stages without having SAW filters in between. The pregain stages as well as all the following receiver blocks are integrated in the Helgo. The LNAs have three gain levels. The first one is the maximum gain, the second one is about 30 dB below the maximum, and the last one is the off state.

After the pregain stages there are demodulator mixers at each signal path to convert the RF signal directly down to baseband I and Q signals. Local oscillator signals for the mixers are generated by an external VCO the frequency of which is divided by two in GSM1800 and GSM1900 and by four in GSM850/EGSM900. Those frequency dividers are integrated in the Helgo and in addition to the division they also provide accurate phase

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shifting by 90 degrees which is needed for the demodulator mixers.

The demodulator output signals are all differential. After the demodulators the amplifiers convert the differential signals to single ended. Before that, they combine the signals from the three demodulators to a single path which means that from the output of the demodulators to the baseband interface there are just two signal paths (I and Q) which are common to all the frequency bands of operation.

In addition, the amplifiers perform the first part of the channel filtering and AGC: they have two gain stages, the first one with a constant gain of 12 dB and 85 kHz -3 dB bandwidth and the second one with a switchable gain of 6 dB and -4 dB. The filters in the amplifier blocks are active RC filters. The rest of the analog channel filtering is provided by blocks called BIQUAD.

After the amplifier and BIQUAD blocks there is another AGC-amplifier which provides a gain control range of 42 dB in 6 dB steps.

In addition to the AGC steps, the last AGC stage also performs the real time DC offset compensation which is needed in a direct conversion receiver.

After the last AGC and DC offset compensation stages the single ended and filtered Iand Q-signals are finally fed to the RX ADCs. The maximum peak-to-peak voltage swing for the ADCs is 1.45 V.

In the Helgo there is a port called RF-temp which can be used for compensation of RX SAW filters thermal behavior. The temperature information to the Helgo comes from a voltage over two diodes when the diodes are fed with temperature independent, constant current.

Transmitter

The transmitter consists of two final frequency IQ-modulators and power amplifiers, for the lower and upper bands separately, and a power control loop. The IQ-modulators are integrated in the Helgo, as well as the operational amplifiers of the power control loop. The two power amplifiers are located in a single module which also includes the power detector circuitry. Loop filter parts of the power control loop are implemented as discrete components on the PWB. In the GMSK mode the power is controlled by adjusting the DC bias levels of the power amplifiers.

The modulated waveforms, i.e. the I- and Q-signals, are generated by the baseband part of the engine module. After post filtering, implemented as RC-networks, they go into the IQ-modulator. Local oscillator signals for the modulator mixers are generated by an external VCO the frequency of which is divided by two in GSM1800 and in GSM1900 and by four in GSM850/EGSM900. Those frequency dividers are integrated in the Helgo and in addition to the division they also provide accurate phase shifting by 90 degrees which is needed for the modulator mixers.

At the upper band there is a dual mode buffer amplifier at the output of the IQ-modulator. The final amplification is realized by a three stage power amplifier.

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There are two different amplifier chains in a single amplifier module, one for GSM850/ EGSM900 and one for GSM1800/GSM1900. The lower band power amplifier is able to deliver over 2 W of RF power, while the capability of the upper band amplifier is over 1 W.

In the GMSK mode the gain control is implemented by adjusting the bias voltages of the first two transistor stages thereby reaching the dynamic range of over 70 dB.

After the power amplifier the signal goes through a low pass filter and a pin-diode switch which is used to select between the reception and transmission. Finally, the two signal paths, lower and upper band, are combined in a diplexer after which the signal is routed through the antenna.

Power control circuitry consists of a power amplifier and an error amplifier. The power amplifier produces a voltage level related to the value of the RF voltage. It is fed to the negative input of the error amplifier where it is compared to the level of the reference signal, TXC, obtained from UEMEK. Depending on the difference between the two signals the biases of the power amplifier stages are either increased or decreased to get the correct power level out of the power amplifier.

Antenna switch module

The antenna switch module includes:

- Antenna 50 ohm input

- RX GSM850/900/1800/1900 single ended outputs,

- TXs EGSM900 and GSM1800/GSM1900 single 50 ohm input

-3 control lines from the Helgo

NPL-4/5

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Figure 39: Antenna Switch Module

Ant

GSM850

EGSM

EGSM900

900

TX DCS/PCS

GSM1800/1900

GSM1900

PCS

GSM1800

DCS

RX EGSM

GSM850 EGSM900

900

Power Amplifier

The power amplifier includes:

- 50 ohm input and output, GSM850/EGSM900 and GSM1800/GSM1900

- internal power detector

- EDGE/GSM mode selector

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Figure 40: Power Amplifier

GSM850/EGSM900

EGSM out

DCS/

GSM1800/1900 GSM1800/1900

PCS out

EGSM900 GSM1800/1900

EGSM Power control

DCS/PCS Power control

GSM850/EGSM900

Power detector

Mode

EGSM in

DCS/ PCS in

900900

RF ASIC Helgo

The RF ASIC module includes:

- TFBGA88

- Balanced I/Q demodulator and balanced I/Q modulator

- Power control operational amplifier, acts as an error amplifier

- The signal from VCO is balanced, frequencies 3296 to 3980 MHz

- GSM850/EGSM900 and GSM1800 low noise amplifier (LNA) are integrated.

The Helgo can be tested by test points only.

AFC function

AFC is used to lock the transceiver’s clock to the frequency of the base station.

Antenna

The NPL-4 (GSM850/GSM1800/GSM1900) and NPL-5 (EGSM900/GSM1800/GSM1900) transceivers have their own internal antennas.

Nokia 5140 Service Manual 07 npl 4_5.sysmo

Specifications and Main Features

Frequently Asked Questions

User Manual

Glossary of Terms

Introduction

Electrical modules

Interconnection diagram

Temperature conditions

Humidity

System Module

Baseband module

Technical summary

DC characteristics

External and internal signals and connections

UI board interface signals

Display interface signals

System connector interface signals

SIM interface signals

FCI interface signals

Camera interface signals

FM radio interface signals

Compass interface signals

Functional Description

Modes of operation

No supply

Backup

Acting dead

Active

Sleep mode

Charging

Power up and reset

Power up with PWR key

Power up when charger is connected

Battery

A/D channels

Digital camera

FM radio

Electrical compass

Thermometer

Backup battery

SIM interface

FCI (Functional Cover Interface)

Memory

External memory

Compass

Earth magnetic field

HW Block Diagram

HW block functions

Magnetometer Sensor

Main features

Block diagram

Magnetometer control interface

Pin Assignment

Test Circuitry

MagIC ASIC

Main features

Block diagram and functional descriptions

MagIC control interface

Pin assignment

MagIC ASIC interface - Magnetometer sensor

MagIC ASIC – UPP interface

MagIC ASIC – UEME interface

MagIC ASIC – UPP - External power supply interface

MagIC - magnetometer sensor interface for constant current driver

Power supplies

Introduction

Using VIO for DVDD supply

Using external regulator for AVDD

Compass and phone basics

Phone directions

General description

Operation modes

Compass function main features

Compass display menu

Compass display results

Compass calibration SW

User assisted calibration

Compass declination menu

Testpoints