Two types of measurements are used in this chapter. It will be specified if the measurement type is RF or LF.
•Use a spectrum analyzer with a high impedance probe for RF measurements.
PAPower amplifier
PLLPhase-locked loop
PWBPrinted wiring board
RCTRadio communication tester
RFRadio Frequency
RxReceiver
TxTransmitter
UHFUltra-high frequency
VCOVoltage-controlled oscillator
Also, it is recommended that you use a good phone as a benchmark for the
measurement technique because signal levels can vary depending on the
measurement setup. Measurements stated in this section were done with an
HP85024 high-impedance probe.
Note: The test jigs have some losses which must be taken into consideration when calibrating
the test system.
•Use a 10:1 probe and an oscilloscope to measure the LF (low frequency) and DC
(direct current). The probe used in this chapter is an 10MΩ/8pF passive probe.
If using another probe, keep in mind that the voltages displayed may be slightly
different.
Always make sure the measurement set-up is calibrated when measuring RF parameters
on the antenna pad. Remember to include the loss in the module test jig when realigning
the phone.
Most RF semiconductors are static-discharge sensitive. Use ESD protection during
repair (ground straps and ESD soldering irons). Mjoelner is moisture-sensitive, so parts
must be pre-baked prior to soldering.
Apart from key components described in this section, there are a lot of discrete components (resistors, inductors, and capacitors) for which troubleshooting is done by checking
whether the soldering of the component is done properly, and whether the component is
missing from the PWB. Capacitors can be checked for short-circuits and resistors for
value by means of an ohmmeter, but be aware that in-circuit measurements should be
evaluated carefully.
In this chapter, both GSM and GSM 850 will be used for the lower band and both PCS
and GSM 1900 will be used for the upper band.
General Description of the RF Circuits
Figure 1 and Figure 2 include different colors in the block diagrams. The GSM 850 signal
route is red, the GSM 1900 route is green, and the common signal lines are blue. Control,
supply voltage, and unused lines are shown in black.
Receiver Signal Path
The signal from the antenna pad is routed to the front end module (N700). The GSM 850
signal passes through the switch inside the FEM to TGSM_Rxout, and the GSM 1900
signal passes through the switch inside the FEM to PCS_Rxout.
R
XSUPPL
FEM
N700
SAW
R
X
GSM
T
X
R
X
PC
SAW
S
T
X
3
VANTL / VANTM/ VANTH
Z60
Z60
LN
A
BIA
L
INP
INM
INP
INM
S
LN
A
L
M
LN
A
M
H
LN
A
H
R
FCONTROL
S
INP
2
RX85
0
INM
RX190
0
1
RX180
0
3
YFILTE
R
X
R
F
D
D
V
PRE
-GAI
N
PRE
-GAI
N
VDDDI
G
VR
X
DCN
DCN
VR
6
RXI
2
P
RXI
M
RXQ
P
RXQ
2
M
B
X
R
B
D
D
V
DCN
LPF
BBAM
P
LPF
BBAM
P
2
222
1/
1/
2
4
1
1
DCN
1
1
AG
C
AG
C
Mjoelner
LPF
LPF
2
BIQUA
D
2BIQUA
D
N600
Figure 1: Receiver signal path
From the FEM PA, the GSM 850 signal is routed to the SAW filter (Z602). The purpose of
the SAW filter is to provide out-of-band blocking immunity and to provide the LNA in
Mjoelner (N600) with a balanced signal. The front end of Mjoelner is divided into an LNA
and a pre-gain amplifier before the mixers.
The output from the mixer is fed to the Mjoelner BB where the signal is amplified in the
BBAMP, and the low pass is filtered in LPF1 before the DC compensation circuits in
DCN1. The DCN1 output is followed by a controlled attenuator and a second low pass
filter (LPF2). The output from LPF2 is DC centered in DCN2 before being fed to the BB for
demodulation.
The GSM 1900 signal chain is similar to GSM 850, but the signal is routed through the
SAW filter (Z601).
Transmitter Signal Path
The I/Q signal from the BB is routed to the modulators for both 850 MHz and 1900 MHz.
The output of the modulators is either terminated in a SAW filter (Z603) for GSM 850 or
a balun (T602) for GSM 1900. The amplitude’s limited signal is then amplified in the PA
of the FEM (N700). The internal FEM detector, some discrete components, and the
Mjoelner IC (N600) make up the transmitter gain control circuitry. In order to establish
the right Tx output power level, a sample of the signal is taken from the FEM detector
and used in the gain control loop. The Tx signal from the FEM is routed to the antenna,
which depends on the internal switch setting of the FEM.
VANTL / VANTM / VANTH
3
Controls
VTXLOL
3
FEM N700
RX
S
w
GSM
i
t
TX
c
RX
h
PCN
TX
DET
PA
SAW Z603
VBATTRF
Balun
Loop
filter
VTXBH
VTX
PLFB1
PLFB2
2
Controls
OUTHP
OUTHM
OUTLP
OUTLM
DET
VPCH/VPCL
VDDDIG
RF
VDDRXBB
RF
PWC
1/2
2
1/4
2
2
2
Mjoelner
N600
TXP
TXP
TXC
VDDT
Suppl
y
filter
VTX
VR2
X
TXC
2
2
TXIM
TXIP/
TXQM
TXQP/
Figure 2: Transmitter signal path
PLL
The phase-locked loop (PLL) supplies local oscillator (LO) signals for the Rx and Tx mixers.
In order to generate LO frequencies for the required GSM and PCS channels, a regular
synthesizer circuit is used. All PLL blocks (except for the VCO, reference X-tal, and loop
filter) are located in the Mjoelner IC.
The reference frequency is generated by a 26 MHz, voltage-controlled X-tal oscillator
(VCXO), which is located in Mjoelner. Only the X-tal is external. Twenty-six MHz is
supplied to the BB, where a divide-by-2 circuit (located in the UPP IC) generates the BB
clock at 13 MHz. The reference frequency is supplied to the reference divider (RDIV)
where the frequency is divided by 65. The output of RDIV (400 kHz) is used as the
reference clock for the phase detector (ϕ).
The PLL is a feedback control system, which controls the phase and frequency of the LO
signal. Building blocks for the PLL include:
•Phase detector
•Charge pump
•Voltage-controlled oscillator (VCO)
•N-divider
•Loop filter
Note: As mentioned earlier, only the VCO, reference X-tal, and loop filter are external to the
Mjoelner IC.
The VCO (G600) is the component that actually generates the LO frequency. The VCO
generates a differential RF output based on the control voltage input. This signal is fed to
the prescaler and N-divider in Mjoelner. Together, these two blocks divide the frequency
by a ratio based on the selected channel. The divider output is supplied to the phase
detector, which compares the frequency and phase to the 400 kHz reference clock. Based
on this comparison, the phase detector controls the charge pump to either charge or
discharge the capacitors in the loop filter. By charging/discharging the loop filter, the
control voltage to the VCO changes and the LO frequency changes. Therefore, the PLL
keeps the LO frequency locked to the 26 MHz VCXO frequency.
The loop filter consists of the following components: C639-C641 and R618-R619.
The PLL is operating at twice the channel center frequency when transmitting or
receiving in the PCS band. For the GSM band, the PLL is operating at four times the
channel frequency. Therefore, divide-by-2 and divide-by-4 circuits are inserted between
the PLL output and LO inputs to the PCS and GSM mixers.
All power supplies for the RF unit are generated in the UEM IC (D200). All power outputs
from this IC have a decoupling capacitor at which the supply voltage can be checked.
Figure 5 shows the power supply configuration used in the NPM-10 (3595) phone.
PA
UEM
Battery
VR2
VR3
VR5
VR1A
VR6
VIO
MJOELNER
Vtx
VXO
VPLL
VCP
Vrx
Vbb
Vref1
VddXO
Vddbbb
VddRXF
VddRXBB
Vbext
VddTX
Vdddig
VddPLL
VddLO
VddPre
VddCP
Sel_addr
VddDL
Vref01
VR7
Vvco
VCO
module
Figure 5: Power supply configuration
The names in bold are signal names, which are used in the RF schematics. The names in
the boxes within the Mjoelner and VCO refer to pin names on the respective ICs (N600,
G600).