The following hints should help to find the cause of the problem when the circuitry
seems to be faulty. This trouble shooting instruction is divided into sections.
1Phone is totally dead
2Power does not stay on or the phone is jammed
3Flash programming does not work
4Display is not working
5Plug in SIM card is out of order (insert SIM card).
6Audio fault
7Charging fault
The first thing to do is carry out a through visual check of the module. Ensure in particular that:
a) there are no mechanical damages
b) soldered joints are OK.
General instructions
Most semiconductors are static discharge sensitive! ESD protection must be taken care
of during repair (ground straps and ESD soldering irons). Mjoelner, PA, UEM, UPP, and
Flash are moisture sensitive and must be pre-baked prior to soldering, if they have been
out of their vacuum package longer than the specified time.
•Connect test jig (MJS-37) to computer with DAU-9S cable or to FPS-8 Flash
Prommer with AXS-4 serial cable.
•Make sure that you have PKD-1 dongle connected to computer’s parallel port.
•Connect DC power supply to module test jig (MJS-37) with FLC-2 cable.
•Set the MJS-37 supply voltage to 8-12VDC. If the input-voltage exceeds 12VDC,
the MJS-37 jig may be damaged.
Note: By default the MJS-37 supplies the phone with 4.1VDC. If other output voltages is
needed, it is possible to modify MJS-37 to support this by removing R110 and mount S104.
See MJS-37 schematic for more info.
•When doing BB energy management (EM) calibrations use JBV-1 jig and DC supply voltage 12 – 15 V.
• JBV-1’s current consumption is ~ 40 mA with 3.9 V supply voltage and ~ 80
•Set the phone module to test jig (MJS-37) and start Phoenix service software.
Initialize connection to phone (use FBUS driver when using DAU-9S and COMBOX driver when using FPS-8).
The flash programming can only be done via the pads on the PWB (J100).
In case of Flash failure in FLALI station, problem is most likely related to SMD problems.
Possible failures could be short-circuit of balls under µBGAs (UEM, UPP, FLASH). Missing
or misaligned components.
In flash programming error cases the flash prommer can give some information about a
fault.
The fault information messages could be:
- Phone doesn't set FBUS_TX line low
Because of the use of uBGA components it is not possible to verify if there is a short circuit in control- and address lines of MCU (UPP) and memory (flash).
If this kind of failure is presenting itself immediately after FLALI, it is most likely caused
by ASICs missing contact with PWB.
If for some reason the MCU does not service the watchdog register within the UEM, the
operations watchdog will run out after approximately 32 seconds. Unfortunately, the
service routine can not be measured.
This error can only happen at power up where several self-tests is run. If any of these test
cases fails the display will show the message: "Contact Service".
It's individual test cases so the below lineup of error hunting's has no chronological
order. Use common sense and experience to decide which test case to start error hunting
at.
Phone does not register onto the network, or the phone cannot make a call
If the phone doesn't register to the network, the fault can be in either BB or RF. Only few
signals can be tested since several signals is 'burried' in one or more of the inner layers of
the PWB.
First of all check that SIM LOCK is not causing the error by using a Test-SIM card and
connect the phone to a tester.
The hardware of the SIM interface from UEM (D200) to the SIM connector (X387) can be
tested without a SIM card. When the power is switched on the phone first check for a
1,8V SIM card and then a 3V SIM card. The phone will try this four times, whereafter it
will display ”Insert SIM card”.
Display shows :
"Insert SIM Card"
Yes
Check for SIM voltage during power-up
Ch1 : VSIM
Ch2 : RESET
X387
Verify that phone checks for
1,8V-SIM, and then 3V-SIM
The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data signal levels are wrong. The first data is always ATR and it is sent from
card to phone.
Display shows :
"SIM Card Rejected"
Yes
VSIM = min. 1,6V(1,8V Card)
X387
VSIM = min. 2,8V(3V Card)
(See illustration below)
Yes
X387
ATR data can be seen at
SIM data pin.
Yes
SIM Interface OK
No
No
Check :
R386, PWB.
Else defective D200*
Check :
X387, R386, PWB.
For reference a picture with normal SIM power-up is shown below.
Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or "LF".
•RF measurements should be done with a Spectrum Analyser and a high-frequency 500 ohm passive probe, for example HP54006A. (Note that when measuring with the 500 ohm probe the signal will be around 20 dB attenuated. The
values in the following will have these 20 dB subtracted and represent the real
value seen on the spectrum analyser).
Note that the testjig have some losses which must be taken into consideration when
calibrating the test system.
•LF (Low frequency) and DC measurements should be done with a 10:1 probe and
an oscilloscope. The probe used in the following is 10MW/8pF passive probe. If
using another probe then bear in mind that the voltages displayed may be
slightly different.
Always make sure the measurement set-up is calibrated when measuring RF parameters
on the antenna pad. Remember to include the loss in the module repair jig when
realigning the phone.
Most RF semiconductors are static discharge sensitive. So ESD protection must be
taken during repair (ground straps and ESD soldering irons). Mjoelner and Bifrost is moisture sensitive so parts must be pre-baked prior to soldering.
Apart from key-components described in this document there are a lot of discrete components (resistors, inductors and capacitors) for which troubleshooting is done by checking if soldering of the component is done properly and checking if the component is
missing from PWB. Capacitors can be checked for short-circuiting and resistors for value
by means of an ohmmeter, but be aware in-circuit measurements should be evaluated
carefully.
In the following both the name EGSM and GSM900 will be used for the lower band and
both PCN and GSM1800 will be used for the upper band.
General description of the RF circuits
In the following general descriptions different colours are used in the block diagram. The
GSM 900 signal route is shown in red, the GSM1800 route in green and the common signal lines are shown in blue. Signal lines which is common for both
Receiver signal path
The signal from the antenna pad is routed to the RX/TX switch ( Z700). If no control voltage is present at VANT2 and VANT1 the switch works as a diplexer and the GSM900 signal is passed through the RX/TX switch to GSM-RX and the GSM1800 signal is passed to
DCS-RX.
From the RX/TX switch the GSM900 signal is routed to the SAW filter (Z602). The purpose of the SAW filter is to provide out-of band blocking immunity and to provide the
LNA in Mjoelner (N600) with a balanced signal. The front end of Mjoelner is divided into
a LNA and Pre-Gain amplifier before the mixers.
DCN2
DCN2
VRX
VR6
RXIP
RXIM
RXQP
RXQM
The output from the mixer is feed to Baseband part of Mjoelner where the signals amplified in the BBAMP and low pass filtered in LPF1 before the DC compensation circuits in
DCN1. The DCN1 output is followed by a controlled attenuator and a second lowpass filter LPF2. The output from LPF2 is DC centered in DCN2 before being feed to the BB for
demodulation.
The GSM1800 signal chain is similar to GSM900, the SAW filter numbered Z601.
Transmitter signal path
The I/Q signal from the BB is routed two the modulators for both 900 and 1800 MHz. The
output of the modulators is either terminated in a SAW filter ( Z603 ) for GSM 900 or a
balun for GSM1800. Both signals are amplified in buffers whereby a limiting effect takes
place to suppress some of the AM contents of the signal. The amplitude limited signal is
then amplified in the PA (N700) where the gain control takes place. In order to control
the TX level a sample of the signal is taken in a directional coupler ( L709 for GSM900
and L704 for GSM1800) and used in the power loop amplifier in Mjoelner to establish
the right output power. The TX signal from the couplers is feed to the RX/TX switch, used
to select which signal to route to the antenna.
Issue 1 05/02ãNokia CorporationPage 19
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