Nokia 30 Service manual

Customer Care Services

Technical Documentation

SERVICE MANUAL

[Issue 1 NMP Part No. 0275578] [Issue 2 NMP Part No. 0275684] [Issue 3 NMP Part No. 0275731] [Issue 4 NMP Part No. 0276061]

TME-3 GSM Connectivity

Terminal

-Nokia 30-

Company Confidential

Customer Care Services

Technical Documentation

Amendment Record Sheet

Amend

ment

Issue 2 11/2002 OJuntunen Front section p.1&2 updated

Issue 3 10/2003 OJ/ Front section pp.1-4 updated

Date

04/2002 OJuntunen

Inserted

Comments

General information: pp,1&2, 5 to 7, 1o to 12 updated

System module: pp 1, 5,12, 19, 29 to 40 updated

Variants: list on p. 4 updated Service Software: all updated , 44 pages Service Tools: all updated, 24 pages Accessories:XRM-1 and ACW-5 updated, pp. 1-8

General information: pp. 4 to 7 updated, repaginated

Variants: pp.4, 7 lists updated Service Software:pp.1-4, 40, 43 updated, pp. 44 to

47 SB-1 data added , repaginated Service Tools: pp. 1-4 updated,

p.6,7 JBV-1 pic added, p.12 CA-10DS pic added, p.14 SB-1 data, pp.18, 22 updated, pp. 24-28 test instructions added

Disassembly/Troubleshooting: p. 6 and 8 updated Accessories: p.4 XRM-1 code updated, p.7 DAU-12

pic updated Tuning , Flashing. Final Testing Instructions front

page updated p. 1

Issue 4 12/2003 OJ/ Front section pp.1-4 updated 4 System module:pp 1-4 updated 4 12/2003 OJ Schematic Diagrams: RL7_11 added,

Customer Care Services

Technical Documentation

Service Manual Structure

General Information

Modules Variants

Service Software Instructions

Service Tools

Disassembly / Troubleshooting

Accessories

Tuning. Flashing and Final T e sting Instructions

Schematic Diagra ms

This document is intended for use by qualified service personnel only.

Company Policy

Our policy is of continuous development; details of all technical modifications will be included with service bulletins.

While every endeavour has been m ade to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Ltd should be notified in writing.

Please state:

Customer Care Services

Technical Documentation

IMPORTANT

Title of the Document + Issue Number/Date of publication Latest Amendment Number (if applicable) Page(s) and/or Figure(s) in error

Please send to:Nokia Mobile Phones Ltd

PAMS Technical Documentation PO Box 86 FIN-24101 SALO Finland

Customer Care Services

Technical Documentation

Warnings and Cautions

Please refer to the phone's user guide for instruc tions relating to operation, care and maintenance including important safety information. Note also the following:

Warnings:

1. CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/ MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.

2. THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.

3. OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLU-

Cautions:

1. Servicing and alignment must be undertaken by qualified personnel only.

2. Ensure all work is carried out at an anti-static workstation and that an anti-

3. Ensure solder, wire, or foreign matter does not enter the telephone as dam-

4. Use only approved components as specified in the parts list.

5. Ensure all components, modules screws and insulator s are correctly re-fit-

LAR TELEPHONES, MAY INTERFERE WITH THE FUNCT IONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO BE SUBJECT TO INTERFERENCE.

static wrist strap is worn.

age may result.

ted after servicing and alignment. Ensure all c ables and wires are repositioned correctly.

Customer Care Services

Technical Documentation

ESD Protection

Nokia requires that phone repair places have sufficient ESD protection (against static electricity) when servicing cellular phones.

A cellular phone, w hich i s ready for use, can be handle d normall y without ESD protection. The SIM card and battery can be replaced in normal conditions of use.

To replace the color cover ESD protection must be applied, except for the phone covers which can be replaced by the customer.

All electronic par ts of the ph one , including the display, are susceptible to ESD. Resistors, too, can be damaged by static electricity discharge.

All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside any ESD Protecte d Area (EPA).

Every repair act io n involving opening the phone or handli ng the phone components must be done under ESD protection.

ESD protected spare part packages MUST NOT be opened/closed out of an EP A.

For more detailed information about ESD protection and EPA, contact your local Nokia After Market Services representative.

Programmes After Market Services

TME-3 Series Transceivers

General Information

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TME-3 Company confidential

General Information CCS Technical Documentation

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CCS Technical Documentation General Information

Table of Contents

Page No

Introduction to TME-3................................................................................................... 5

Product and Module List .............................................................................................5

TME-3 with accessories ..............................................................................................6

TME-3/Nokia 30 and accessories: ............................................................................ 7

Technical Specifications ................................................................................................ 8

Dimensions ..................................................................................................................8

Modes of Operation .....................................................................................................8

Data transmission .........................................................................................................8

User Interface Features ................................................................................................9

Environmental Conditions ...........................................................................................9

Free Fall .................................................................................................................9

User Interface Features ................................................................................................ 10

Start-up Operation .....................................................................................................10

Normal Operation ......................................................................................................11

Special Operation .......................................................................................................11

SW features ................................................................................................................11

Power supply .............................................................................................................12

Data cable connection ................................................................................................12

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General Information CCS Technical Documentation

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CCS Technical Documentation General Information

Introduction to TME-3

Nokia TME-3 (Nokia 30) is an enhanced GSM900 and GSM 1800 phase 2/2+ type GSM Connectivity Terminal. The maximum output power in GSM900 system is 2 W (power class 4 and in GSM1800 1 W (power class 1).

The Nokia 30 GSM Connectivity Terminal is a M2M (machine-to-machine) communications device with versatile interfaces and advanced functions. Connected to different machines and devices it provides wireless connectivity and remote management possibilities for customer applications. It offers GPRS, USSD, high-speed data, as well as other advanced services, over EGSM900/GSM1800 networks. It is a perfect fit for various application environments for its size, vers atility and reliability.

The TME-3 does not include keypad and display, TME-3 user interface comprises three leds. The leds indicate for example incoming calls and field strength signal level.

Figure 1: Nokia 30 GSM Connectivity Terminal

Product and Module List

Name of module Type code

Transceiver TME-3 0600344 Assembly parts MTME3 0262539 Assembly parts must be ordered as separate

Issue 3 10/03 Nokia Corporation. Page 5

Material code

Notes

spare parts

TME-3 Company confidential

General Information CCS Technical Documentation

TME-3 with accessories

Figure 2: Product with accessories

Nokia 30 and accessories:

Item Name Type code Material code

1 2 Power supply unit ACW-5 0630527

3 RS-232 Data adapter DAU-12 0630452 4 RS-232 Data c abl e AXS-3 07 3024 9 5 Nokia 30 installation kit TME-3 0262712 6 Nokia 30 Product Note 9357345 8 Power cable DC 0730244 9 Power cable AC (Eur o ) 0730248

Nokia 30 GSM Connectivity Terminal

TME-3 0600344

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CCS Technical Documentation General Information

TME-3/Nokia 30 and accessories:

Item Name Type Code Material code

1. Transceiver TME-3 0600344 Transceiver Amena TME-3 0600345 Transceiver Vodafone TME-3 0600346 Transceiver Movistar TME-3 0600347 Transceiver Czech TME-3 0600358 Transceiver Poland TME-3 0600359 Transceiver Russia TME-3 0600360 Transceiver China TME-3 0600361 Transceiver Turkey TME-3 0600362 Transceiver South Africa TME-3 0600374

Item Chargers Product code:

2. Power supply unit (ACW-5A) 0630527 Power supply unit (ACW-5A) 0675341 DC-power cable (3.0 mm plug) 0730244 AC-power cable (Euro) 0730248 AC-power cable (U.K) 0730247 AC-power cable (U.S.) 0730246 AC-power cable (AS) 0730245 AC-power cable (China) -

Accessories Product code:

3. Data adapter RS-232 (DAU-12) 0630452

4. Data cable RS-232 (AXS-3) 0730249

5 Installation Kit 0262712

6. Nokia 30 Product note (en-ge-fr -sp-r s-hu) 9357345 Nokia 30 Product note (en-tr-pl-ro-bg-uk) 9361026 Nokia 30 Product note (en-fi-sw-it-pr-du ) 9361027 Nokia 30 Product note (en) 9361028 Nokia 30 Product note (en-ch-ch-ch) 9354882 Nokia 30 Product note LSA (en-sp-pr) External antenna cable (XRM-1) 0730262

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TME-3 Company confidential

General Information CCS Technical Documentation

Technical Specifications

Dimensions

Unit Dimensions (mm) Weigh t (g) Notes

TME-3 terminal 84 x 53 x 26 65 Without Power supply, Data

adapter and Data cab l e

Modes of Ope ration

TME-3 terminal has three operating modes,

• M2M system mode

• AT command mode.

• User control mode

The M2M system mode offers many unique benefits such as wireless bearer selection (GPRS, USSD, HSCSD, CSD, SMS), ready made protocol stacks, separation of data transfer from the application and the possibility to introduce new technologies without changing the application. It offers an open interface for application developers as well as effective and reliable methods for controlling the terminal and the application.

In the AT command mode the Nokia 30 GSM Connectivity Terminal can be used as a wireless modem for data and fax communication when attached to a PC. In addition to a PC, the terminal can be controlled directly by AT commands by PCs and compatible devices and machines.

In the user control mode the Nokia 30 GSM Connectivity Terminal is controlled by a mobile phone. Text message templates that are sent from the mob ile to the Nokia 30 instruct the terminal, which in turn controls a device or machine attached to it through the M2M System connector.

Data transmission

The Nokia 30 GSM Connectivity Terminal supports five bearers for wireless data transfer, which can be used where GSM networks support them.

· General Packet Radio Service (GPRS)

· High speed circuit switched data (HSCSD)

· Circuit switched data (CSD)

· Short messages (SMS)

· Unstructured Supplementary Service Data (USSD)

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CCS Technical Documentation General Information

General Packet Switched Service (GPRS) utilizes packet switched technology where information is transmitted in small bursts of data. The GPRS mobile station class of the Nokia 30 is class B. This means that both GPRS connections and circuit switched connections are possible, although it has to be defined which one is used each time. The Nokia 30 supports GPRS multi-slot class 6, thus multiple timeslots can be used for data transfer at the same time: 3 + 1, 2 + 2 or 2 + 1 slots.

RS-232 connection: All wireless bearers can be controlled either with AT in the AT Command mode or with CORBA method calls when the terminal is working in the M2M System mode.

User Interface Features

User Interface consist of LED light indicators that show the state of the TME-3 that is used to remotely control the Nokia 30. Terminals can also be seen as a user interface.

The small SIM (Subscriber Identity Module) card interface supports 3V SIM cards.

Environmental Conditions

Parameter

Ambient temperature -10 to +55 20 to 75% Storage temperature -40 to +85 5 to 95%, non condensing

TME-3 is not protected against ingress of water.

Free Fall

TME-3 does not break mechanically after free fall from 100 cm height to concrete floor.

Ambient temperature (degrees Cels ius)

Ambient humidity (relative)

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TME-3 Company confidential

General Information CCS Technical Documentation

User Interface Features

Three light indicators (LEDs) form the user interface of the TME-3. LED 1 shows the terminal status, while the other two are reserved for the application

module following start-up. During start-up and special operations, all three light indicators are in terminal use. The

functionality of the light indicators in start-up, normal, and special situations is described below.

All three LEDs can also be configured so th at they will not show any status and will remain off during any operation.

Figure 3: UIF LEDs

Led user interface

Start-up Operation

Table 1: Start-up Operation:

LED 1 LED 2 Status LED Description

- - - Power off / silent mode Green scan Green scan Green scan Power on, connecting to network

- Red blink - PIN query / new PIN query

- Red blink Red blink PUK query Intensity of Field Strength:

Red blink - - Non-acceptable <- 105 dB m Green Blink - - -105 … -100 dBm Green - - Weak -100 … -95 dBm Green Green Blink - -95 … -90 dBm Green Green - Moderate -90 … -85 dBm Green Green Green Blink -85 … -80 dBm Green Green Green Good >-80 dBm

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Normal Operation

Table 2: Normal Operation:

LED 1 LED 2 Status LED Description

* * Green In service * * Green blink Call on * * Green blink Incoming call * * Green/Red blink Message received / Voice mail in box * * Red blink Message arriving and memory is full

*) Application module controllable in M2M System mode

Special Operation

Table 3: Special Operation:

LED 1 LED 2 Status LED Description

Green/Red blink Green/Red blink Green/Red blink Insert SIM card Red blink Red blink Red blink Failure, contact service Yellow Yellow Yellow Initialising

SW features

Basic functionality:

Data features:

GSM supplementary services:

Audio features:

Operation modes

Voice, data, fax, SMS

GPRS Class B, ETSI GSM phase 2+ Network Digital/analog audios M2M System mode

AT Command mode User Control mode

HSCSD, SMS, USSD

M2M system port

Serial Interfaces

PC software

RS232 system port WIOP sw Phoenix service software product specific module Configurator fo r No kia GSM Connectivity Termi nals

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TME-3 Company confidential

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Power supply

Power supply cord connected to TME-3:

Figure 4: Power to TME-3

With DAU-12 connected the power supply cord is always connected to TME-3

Figure 5: Power supply with DAU-12 connected

Data cable connection

Figure 6: Data cable to DAU-12

Page 12 Nokia Corporation. Issue 3 10/03

Programmes After Market Services

TME-3 Series Transceivers

Data Module RL7

Issue 4 12/03 Nokia Corporation.

TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

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Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table of Contents

Page No

Glossary of Terms.......................................................................................................... 5

Functional Description of TME-3.................................................................................. 7

Circuit Description .......................................................................................................7

GSM Data Module RL7................................................................................................. 7

Baseband Module........................................................................................................... 7

Technical Summary .....................................................................................................7

Technical Summary................................................................................................... 8

Modes of Operation .....................................................................................................9

RS232 mode.............................................................................................................. 9

Application mode.................................................................................................... 10

User Control mode.................................................................................................. 10

Internal operation modes......................................................................................... 11

Nominal and maximum ratings .................................................................................12

DC Characteristics................................................................................................... 12

External signals and connectors .................................................................................12

M2M system connector ........................................................................................13

DC connector ........................................................................................................14

SIM connector .......................................................................................................15

External antenna connector ...................................................................................15

Functional Description ...............................................................................................16

POWER................................................................................................................... 16

Power Distribution ................................................................................................16

UEM ......................................................................................................................16

User Interface ........................................................................................................16

UPP Processor .......................................................................................................17

M2M system .........................................................................................................17

SIM .......................................................................................................................17

Audio .........................................................................................................................17

Audio Interfaces...................................................................................................... 18

Earpiece electrical interface .................................................................................... 18

Microphone electrical interface............................................................................... 18

RF Module ................................................................................................................... 19

Normal and extreme voltages for RF block ...............................................................19

DC characteristics ......................................................................................................20

Regulators................................................................................................................ 20

RF characteristics .......................................................................................................22

RF Block Diagram .....................................................................................................23

Frequency synthesizers ........................................................................................... 24

Receiver .....................................................................................................................24

Transmitter .................................................................................................................25

AFC function........................................................................................................... 26

DC-compensation.................................................................................................... 26

Interfaces and Connectors............................................................................................ 27

Antenna ................................................................................................................... 27

User Interface Features............................................................................................ 27

Start-up Operation:.................................................................................................. 27

Normal Operation:................................................................................................... 28

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TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

Special Operation:................................................................................................... 28

Data Module RL7 Parts List ........................................................................................ 29

Table of figures

Page No

Fig 1 Block diagram of RL7 module...................................................................................8

Fig 2 TME-3 RS-232 mode .................................................................................................9

Fig 3 TME-3 in Application mode ......................................................................................10

Fig 4 Internal operation modes............................................................................................11

Fig 5 M2M system connector X101 ....................................................................................13

Fig 6 SIM connector X200 .................................................................................................15

Fig 7 External antenna connector X502 ..............................................................................15

Fig 8 TME-3 power distribution..........................................................................................16

Fig 9 Audio control diagram................................................................................................18

Fig 10 RF frequency plan ....................................................................................................19

Fig 11 Power Distribution....................................................................................................21

Fig 12 Phase Locked Loop, PLL .........................................................................................24

List of Schematics, A3 pages

Page No

Block diagram v.RB5.0 ed.76 1 Block Diagram System v.RB5.0 ed.128 2 Schematic diagram RF-BB v.RB5.0 ed.20 3 Schematic Diagram UPP v.RB5.0 ed.26 4 Schematic Diagram UEM v. RB5.0 ed. 77 5 Schematic diagram M2M, PWR, LED v. RB5.0 ed.132 6 Schematic Diagram Memories v. RB5.0 ed.24 7 Schematic Diagram RF, v. RB5.0 ed. 163 8 Diagram of RF ground points, V. RB5.0 ed.34 9 Parts Placement 1/2 RL7_11 10 Parts Placement 2/2 RL7_11 11

Block diagram v.RB6.0 ed.79 12 Block Diagram System v.RB6.0 ed.131 13 Schematic diagram RF-BB v.RB6.0 ed.22 14 Schematic Diagram UPP v.RB6.0 ed.29 15 Schematic Diagram UEM v. RB6.0 ed. 80 16 Schematic diagram AIF, PWR, LED v. RB6.0 ed.135 17 Schematic Diagram Memories v. RB6.0 ed.32 18 Schematic Diagram R FGround points, v. RB6.0 ed. 168 19 Parts placement diagram, RL7_11a top 21 Parts Placement bottom RL7_11a Bottom 22

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PAMS Technical Documentation Data Module RL7

Glossary of Terms

ASIC Application Specific Integrated Circuit BB Baseband CSP Chip Scale Package DB Dual band DCS1800 Digital Cellular system at 1800 MHz DSP Digital Signal Processor EMC Electromagnetic compatibility EMI Electromagnetic Interference FBUS Asynchronous Full Duplex Serial Bus GSM Global System for Mobile communica tions HSCSD High Speed Circuit Switched Data LNA Low Noise Amplifier M2M System Connector MBUS 1-wire half duplex serial bus MCU Micro Controller Unit MDI MCU-DSP Interface PA Transmit Power Amplifier PC Personal Computer PWB Printed Wiring Board PCM Pulse Code Modulation PCM SIO Synchronous serial bus for PCM audio transferring RF Radio Fr equency SIM Subscriber Identity Module SMART PCMCIA interface ASIC

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Data Module RL7 PAMS Technical Documentation

UEM Universal Ener gy Management UI User Interface UPP Universal Phone Processor VCXO Voltage Controlled Crystal Oscillator VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.

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PAMS Technical Documentation Data Module RL7

Functional Description of TME-3

Circuit Description

The Data module baseband blocks provide the MCU, DSP, external memory interface and digital control functions in the UPP ASIC . Power supply circuitry, charging, audio processing and RF control hard ware are in the UEM ASIC.

The purpose of the RF block is to receive and demodulate the radio frequency signal from the base station and to transmit a modulated RF signal to the base station.

GSM Data Module RL7

The description of the RL7 data module is divided into Baseband and RF sections.

Baseband Module

TME-3 baseband supports a power saving function called "sleep mode". As the M2M system protocol link must be active at all time, only so called "light sleep" is activated intermittently. In this mode the MCU has been shut down but peripherals are active.

TME-3 powered externally and does not have battery and thus there is no need for charger functions. The power supply is synchronous step down switching type.

Technical Summary

Main functionality of the baseband is implemented into two ASICs: UPP and UEM.

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Block Diagram

VBATRF

P O

Voltage

input

AIF_3V3

W E

VBAT

VCCAM VBB

Figure 1: Block diagram of RL7 module

Ostrich

Production test patte rn

TEST

R&D test structures

SIM

UEM

UPP

AIF

Internal

RF-

antenna

I N T E R

F L A S

F A C E

External antenna connecto

GENIO-

UART

UPP ASIC provides the MCU, DSP, external memory interface and digital control functions. UEM ASIC contains power supply circuitry, charging, audio processing and RF control hardware.

Technical Summary

Baseband is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core voltage Vcore can be lowered down to 1.0V, 1.3V and 1.5V. UEM includes 6 linear LDO (low drop-out) regulators for baseband and 7 regulators for RF. It also includes 4 cur rent sources for biasing purposes and internal usage. UEM also includes SIM interface which supports 3V SIM cards. TME-3 does not currently support 1.8 V SIMs.

The interface between the baseband and the RF section is handled by a UEM ASIC. The UEM provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the user interface. The UEM supplies the analog TXC and AFC signals to RF section according to the UPP DSP digital control.

Data transmission between the UEM and the UPP is implemented using two serial busses, DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP ASIC. UEM is a dual voltage circuit, the digital parts are running from the baseband supply 1.8V and the analog parts are running from the analog supply 2.78V. UEM uses also VBAT directly

FBUS

MBUS

NALOG

DIGITAL

UDIO

I/O

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The baseband supports external microphone inputs and speaker outputs. Input and output signal source selection and gain control is performed by the UEM according to control messages from the UPP. Analog and digital PCM audio are routed to M2M system connector.

EMC shielding for baseband is implemented using metal lids. On the other side the module is shielded with PWB grounding. Heat generated by the circuitry is conducted out via the PWB ground planes.

Modes of Ope ration

The TME-3 has three modes of operation:

• RS-232 Mode (M2M sy stem mo de)

• Application mode (AT command mode)

• User Control mode

Internally the RL7 module has the following operating modes:

• NO_SUPPLY

• POWER_OFF

•POWER_ON

• RESET

•SLEEP

• PROTECTION

RS232 mode

Fig. 2 shows TME-3 in RS-232 mode. TME-3 enters RS-232 mode in powerup when it detects a 68k 1% pull-down resistor at M2M system connector pin 21.

In RS-232 mode TME-3 is connected to DAU-12 RS-232 adapter. The adapter provides a standard RS-232 interface. Power for TME-3 and the adapter is fed through TME-3 DC jack.

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Figure 2: TME-3 RS-232 mode

Voltage input

Application mode

In application mode TME-3 is connected to a user specific application. The mechanical and electrical interface between application and TME-3 is the M2M system connector. The application can be powered through M2M system or the application can deliver power to TME-3.

Voltage input

TME-3

M2M

RS-232 adapter DAU-12

Figure 3: TME-3 in Application mode

TME-3

M2M

RS-232

Alternative voltage input

User Control mode

An example of a device attached to the Nokia 30 for wireless control would be a refrigerator. You might want to check the temperature of the refrigerator when out of town. The temperature of the refrigerator could be altered with the mobile as well.

You could also turn off the lights of the apartment that you had accidentally left on by sending a text message template.

There are three levels of access control for the User control mode. Firstly, a message identifier entered when the terminal is used for the first time with the

Nokia 30 Configurator is only known by the person who entered it. This identifier begins every text message template aimed to control the Nokia 30 and the application attached to it.

User specific application

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Secondly, it can be specified from which phone number the text message templates are allowed.

Thirdly, a password can be used that is entered whenever a text message template is sent to the Nokia 30.

Internal operation modes

A simplified flow chart of the internal operation modes of TME-3 below.

Figure 4: Internal operation modes

NO_SUPPLY

VBAT

appears

RESET

Thermal

shutdown

POWER_ONPROTECTION SLEEP

Watchdog

bites

Watchdog

bites

POWER_OFF

Always

(forced by HW)

In NO_SUPPLY mode the phone has no supply voltage. When battery voltage appears, TME-3 enters RESET mode. In TME-3, RESET mode leads

always to POWER_ON mode. During low activity TME-3 can switch f rom POWER_ON to SLEEP mode. PROTECTION mode happens if the thermal shutdown of UEM regulators triggers. PROTECTION mode leads immediately to POWER_OFF mode. TME-3 can enter POWER_OFF mode also from POWER_ON or SLEEP modes if the UEM internal watchdog elapses. POWER_OFF mode is not stationary.

In TME-3 there is a special power-up hardware, which essentially presses automatically the power key as soon as it detects the POWER_OFF mode.

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Nominal and maximum ratings

Table 1: s

Parameter Absolute Maximum Rating

Supply voltage maximum VBB 15 V DC input voltage (any signal pin *) -0.5 to 5.5V* DC output source or sink current

(any signal pin) Operating temperature range -10...+55 °C Storage temperature range -40...+85 °C

+/- 10 mA

DC Characteristics

Table 2: Supply volt a ge

Pin / Conn. Line Symbol Minimum

X100 VBB 6.2 V 12.0 V 14.0 V Power feed through

X101/1,3,5,7,9 VBB 4.75 V 12.0 V 15.0 V Power feed trough

Table 3: Power consumption

Mode

Current / mA @

6.7V

Power / W Notes

Typical / Nominal

Maximum Notes

DC jack

M2M system

POWER_ON, idle < 10 mA < 120mW

POWER_ON, full load, 900MHz

POWER_ON, full load, 1800MHz

< 430 mA < 5.2 W Transmitting 2 slots at full power +

< 350 mA < 4.2 W Transmitting 2 slots at full power +

External signals and connectors

This section describes the external and internal electrical connection and interface levels on the baseband. The electrical interface specifications are collected into tables that covers a connector or a defined interface.

External connectors comprise the following: M2M system., DC, SIM, external antenna.

With one green led on; 65 mW with all leds off.

300 mA @ 3.6 V power feed to M2M system

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M2M system connector

M2M system connector X101 is described below:

Figure 5: M2M system connector X101

The M2M system connector is 50 pin male connector. Connect or connects the TME-3 to an external applications, for example to the data-adapter. Connection can be made by female type socket or ribbon cable connector.

Table 4: M2M system connector pinout

Alternate Name Pin Pin Name Alternate

VBB 1 2 GND VBB 3 4 GND VBB 5 6 GND VBB 7 8 GND VBB 9 10 GND VCCAM 11 12 Reset GND 13 14 GENTXD GENRXD 15 16 GND RTSAM 17 18 CTSAM GND 19 20 MBUS

Service 21 22 GND MIC+ PCMDCLK 23 24 GND MIC- PCMSCLK 25 26 PCMTX EAR+

GND 27 28 PCMRX EAR-

GND 29 30 FBUSRX INPUT1 Reserved 31 32 GND INPUT2 DTR 33 34 FBUSTX

GND 35 36 RTS INPUT3 OUTPUT1 Reserved 37 38 GND OUTPUT2 DCD 39 40 DSR OUTPUT3

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GND 41 42 CTS OUTPUT4 OUTPUT5 RI 43 44 GND

Reserved 45 46 Reserved

GND 47 48 Reserved

Reserved 49 50 GND

in numbering of the M2M system connection Odd pins are on the left side of the connector, i.e. 1, 3, 5, 7, etc. Even numbers on the

right side of the connector, i.e. 2, 4, 6, 8, etc. Pin 1 is at left top, pin 50 right bottom. In ribbon cable connection the red stripe conductor of the cable marks pin connection 1.

Conductor numbering is then subsequent from 1 to 50 in the cable

DC connector

DC connector X100, described below, is a 3.2 mm DC jack type connector. VIN is connected to the central pin and the jacket is GND.

Table 5: DC connector pin

Signal Name Pin Notes

GND 3,4 VIN 2 6.2 V – 14.0 V power feed

The connector circuitry composes a 2.0 A fuse and transient protection components. Power jack tap is a positive (VIN) and border area is a ground (GND).

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SIM connector

SIM connector X200

cards are not supported.

SIM

C5 C6 C7

C1C2C3

From Battery Type

From SIM Card contact

interface supports both 1.8V and 3V SI M cards. Note t hat 5V SIM

The contacts are described below:

Figure 6: SIM connector X200

GND

UPP

SIMDATA

SIMCLK

SIMRST VSIM

BSI

SIMCardDet

GND

UEM

SIMIF register

SIMIO SIMClk

Data

UEM digital logic

SIMIO

SIMClk

Data

UIF Block

UEMInt

CBusDa

CBusEnX

CBusClk

Name Card pin Description

VSIM C1 SIM voltage supply 1.8/3.0V SIMRST C2 SIM reset SIMCLK C3 SIM clock SIMDATA C4 SIM bidirectional data VPP C5 Unconnected. GND C7

External antenna connector

External antenna connector X502 interface is used to get better RF sign al in bad

receiving conditions.

Table 6: SIM connector

Figure 7: External antenna connector X502

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Functional Description

POWER

TME-3 operates with external DC wall power supply without a battery. The DC voltage can be supplied either trough the DC jack or the M2M syste m connector. TME-3 has a wide supply range high efficiency synchronous switched mode step-down converter, which regulates the input voltage down to normal battery voltage level (3.6V).

Powe r Di st ri b ut i o n

Input voltage from DC connector or M2M system (VBB) is fed to step-down DC-DC converter, which regulates the voltage to 3.6V. The 3.6V is fed to DCT4 power management circuit UEM (VBAT), to a 3V3 LDO and to the RF power amplifier (VBATRF). UEM regulates VBAT further for baseband and RF. The 3V3 LDO is used for M2M system I/O buffers. VBAT is fed to M2M system connector through a switch controlled by UPP.

An application can also draw current directly from the fused input voltage (VBB). The available current depends on the input voltage and the power consumption of TME-3. Typical maximum power consumption of TME-3 is less than 5.5 W (including the 300 mA power feed to the application) in all circumstanc es. For example, if the input voltage is

12.0 V, the application can draw at most 2A - 5.5 W / 12 V = 1540 mA of current without blowing the fuse. However, it is advisable to derate the fuse current to 75% or 1.5 A, which in the example above leaves ~1000 mA current for the application.

UEM

Figure 8: TME-3 power distribution.

VIN

6.5 V - 8.2 V

Jack

4.75 V - 15.0 V power feed from AIF

VBB

Power fail indicator

DC/DC

Step-down

converter

680u

RFC

60R/100M

RFC

60R/100M

To UPP

Power feed/indication to AIF

3 x 680u

VBAT

3 x 680u

Control from UPP

VBATRF

LDO

Load switch

3V3

UEM

AIF_3V3

BB regulators

RF regulators

300mA power feed to AIF

AIF

I/O buffers

VCCAM

UEM is an energy management IC. In addition to energy management functionality the UEM performs all the baseband mixed-signal functions.

User Interface

The TME-3 user interface consist of three two-coloured ( green/red) leds.

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Six I/O pins from UPP port1, which is normally used for keyboard, are used for led control. Leds are buffered with digital transistors. shows the allocation of led control pins.

Table 7: UI LEDs

BitIO pin # Function Description

P10 LED1 – Green LED Control: 1 = ON, 0 = OFF P11 LED1 – Red LED Control: 1 = ON, 0 = OFF P12 LED2 – Green LED Control: 1 = ON, 0 = OFF P13 LED2 – Red LED Control: 1 = ON, 0 = OFF P14 LED3 – Green LED Control: 1 = ON, 0 = OFF P15 LED3 – Red LED Control: 1 = ON, 0 = OFF

The leds are connected between VBAT and ground, and there is a current limiting resistor and a transistor switch in series with every le d. An 1.8V level active high control signal from UPP KEYB(10:0) switches the leds on and off. The current through a green led is ~15mA, and the current through a red led is ~5mA. This unsymmetry in led drive currents ensures that the brightnesses of leds are equal.

UPP Processor

UPP contains ARM7 and LEAD3 MCU & DSP cores, RAM memory and custom logic. The UPP block contains also an external flash memory. TME-3 flash size is 32Mbit.

M2M system

The M2M system block contains the M2M system connector and the glue logic needed to make connections between application and the TME-3. The application interface of TME3 is the standard M2M application interfac e. The M2M system interface includes FBUS, MBUS, GENIOUSART, analog and digital audios (multiplexed to same pins), DC input voltage, regulated 3.6V battery voltage and some general purpose I/Os.

All signal pins of M2M system are 5V tolerant. The 5V input voltage level is translated down to 2.78V and 1.8V logic levels for UEM and UPP. The outputs of M2M system are translated from UPP/UEM 1.8V and 2.78V levels to 3.3V level.

M2M system connector is a 50-pin male connector.

SIM

The SIM block contains a SIM card reader, which is connected to UEM SIM interface.

Audio

TME-3 does not have any built-in audio equipment, such as microphone or earpiece. All audio signals are routed outside of TME-3 via M2M system connector to an external

audio accessory. The RAE-3 does not include or support vibra and buzzer.

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The audio control and processing is done by the UEM, which contains the audio codec. The UPP contains MCU and DSP blocks, handling and processing the audio data signals. The baseband supports one external microphone input and one external earphone output or alternatively digital PCM lines.

Audio Interfaces

TME-3 has two different audio types, digital and analog audios. Those lines are multiplexed in M2M system connector, so there is only one physical audio interface.

Figure 9: Audio control diagram

AUDIOSELECT

Audio type selection is made by the audioselect signal from UPP genio pin 28. Audio lines are multiplexed and demuxed by using NC7SB3157 and these components are controlled by the audioselect signal

Earpiece electrical interface

Earpiece circuit includes two ferrite beads, two capacitors (27 pF -> 900 MHz cut-off filter) and two varistors for EMC protection. Earphone lines from the M2M system is connected to the differential output (EARP and EARN) in the UEM audio codec.

EARPCMRX EAR+ PCMTX

AUDIOSELECT

MICPCMSCLK

MIC+ PCMDCLK

AIF 26

AIF 28

MUX 4/2

AIF 23

AIF 25

DEMUX 2/4

Microphone electrical interface

The microphone electrical circuit incl udes EMI/ESD protections which is placed near the M2M system connector. MICB1 is connected to MIC1P via 1kΩ resistor.

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RF Module

This RF module executes all RF functions of the module. RF circuitry is located on one side (B-side) of the PCB.

EMC leakage is prevented by three m etal shields. The first one includes the Bluetooth module. The second block includes the PA, antenna switch, LNAs and dual RX SAW. The last block include the Hagar RF IC, VCO, VCTCXO, baluns and balanced filters.

Maximum height inside on RF-shields is 3 mm. Heat generated by t he circuitry will be conducted out via the PWB ground planes.

Heat generated by the circuitry is conducted out via the PWB ground planes.

Normal and extreme voltages for RF block

There is no extreme voltage due of the internal power block and no battery use.

Parameter Rating

Nominal voltage: 3.6 V (generated in PWR block) Lower extreme voltage same as nominal Higher extreme voltage same as nomin al

RF Frequency Plan

Figure 10: RF frequency plan

925-960 MHz

1805-1880 MHz

f/4

HAGAR

f/2f/4

f/2

PLL

34203840 MHz

I-signal

I-signalI-signalI-signal Q-signal

1710-1785 MHz

880-915 MHz

26 MHz

VCTCXO

I-signal

Q-signal

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DC characteristics

Regulators

The transceiver comprises a multif unction power management IC on baseband section, which contains among other functions; 7 pcs of 2.78 V regulators and 4.8V up-switcher for charge pump.

Use of the regulators can be seen in the Power Distribution Diagram. VrefRF01and VrefRF02 are used as the reference voltages for HAGAR RF-IC, VrefRF01 (1.35V) for bias reference and VrfeRF02 (1.35V) for RX ADC's reference.

Regulators (except VR2 and VR7) are connected to HAGAR. Different modes were switched on by the aid of serial bus.

List of the supply voltages:

Volt. sou rce Load VR1 PLL charge pump (4,8 V) VR2 TX modulator VR3 VCTCXO + buffer VR4 HAGAR IC (LNAs+mixer+DTOS) VR5 HAGAR IC (div+LO-buff+prescaler), VR6 HAGAR (Vdd_bb) VR7 VCO VrefRF01 ref. voltage for HAGAR VrefRF02 ref. voltage for HAGAR VbattRF PA

Typical current consumption:

Operation mode Current consumption Notes

Pow er OFF < 10 uA Leakage current (d ua l PA) RX 81 mA, p eak Includes synthesizer current

(28 mA) TX, without PA 138 mA, peak TX, power level 5, EGSM900 1700 mA, peak TX, power level 0, DCS1800 1200 mA, peak

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Power Distribution Diagram

SOURCE

VR1

VR2

VR3

VR4

VR5

Figure 11: Power Distribution

4.75 V +/- 3.2 % 10 mA

2.78 V +/- 3 %

100 mA

2.78 V +/- 3 %

20 mA

2.78 V +/- 3 %

50 mA

2.78 V +/- 3 %

50 mA

LOAD

Charge pump in HAGAR

TX IQ modulator, pow er control opamp in

Hagar VCTCXO

VCTCXO buffer in Haga r

E-GSM & DCS LNA RX mixer in Hagar DTOS in Hagar

PLL in Hagar

UEM

VR6

VR7

VrefRF01

VrefRF02

VBATT

2.78 V +/- 3 %

50 mA

2.78 V +/- 3 %

50 mA

1.35 v +/- 1.15 %

< 100 ua

1.35 V +/- 2 %

< 100 ua

3.2 - 4.5 V

1700 mA (max)

Dividers in Hagar LO buffers in Hagar Prescaler in Hagar Power detector

BB section in Hagar

SHF VCO Module

Ref. volt. for Hagar RX

Ref. volt. for Hagar

Dual PA module

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RF characteristics

Main RF characteristics are listed in the table below:

Item Values (E-GSM / GSM180 0)

Receive frequency range 925... 960 MHz / 1805...1880 MHz Transmit frequency range 880... 915 MHz / 1710...1785 MHz Duplex spacing 45 MHz / 95 MHz Channel spacing 200 kHz Number of RF channels 174 / 374 Power class 4 (2 W) / 1 (1 W) Number of power levels 15 / 16

Transmitter characteristics

Item Values (E-GSM/GSM1800)

Type Dire ct co n ve rs i on, nonlinear, FDMA/TDMA LO frequency range 3520...3660 MHz / 3420...3570 MHz Output power 2 W / 1 W peak Gain control range min. 30 dB Maximum phase error (RMS/peak) max 5 deg./20 deg. peak

Receiver characteristics

Item Values, E-GSM/GSM1800

Type Direct conversion, Linear, FDMA/TDMA LO frequencies 3700...3840 MHz / 3610...3760 MHz Typical 3 dB bandwidth +/- 91 kHz Sensitivity min. - 102 dBm (GSM1800 norm.cond. only) Total typical receiver voltage gain

(from antenna to RX ADC)

86 dB

Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX

ADCs Typical AGC dynamic range 83 dB Accurate AGC co ntrol range 60 dB Usable input dynamic range -102... -10 dBm RSSI dynamic range -110... -48 dBm

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RF Block Diagram

26 MHz

RXI

INP_G_RX

INM_G_RX

Balanced SAW

RXQ

VCP

VPP

VRF_RX

VLO/VPRE

INP_P_RX

VB_EXT

VREF_RX

SLE

SCLK

RESET

HAGAR

LNAB_P

LNAB_G

SDATA

LNA_D

LNA_P

VANT_2

VANT_1

LNA_G

Balanced SAW

TXP

TXC

DET

VTXLO_P

VPCTRL_P

OUTP_P_TX

OUTM_P_TX

GND

TXIM

RF_TEMP

VTX_B_P

VP_D_SEL

TXIP

VTXLO_G

VPCTRL_G

OUTP_G_TX

OUTM_G_TX

TOUT

TXOP

TXOM

VCTCXO

VTX_B_G

VB_DET

VC_1

VC_2

INP_LO

INM_LO

OUT_CP

Balanced SAW

MMIC

LNA

MMIC

LNA

Dual SAW

Dual PA module

Dual coupler

RX/TX switch

3420 - 3840 MHz

Internal

antenna

RF B l ock Diagram

EGSM900/ GSM1800

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Frequency synthesizers

VCO frequency is locked with PLL into stable frequency source, which is a VCTCXO-module. VCTCXO is running at 26 MHz. Temperature drifting is con trolled with AFC voltage. VCTCXO is locked into frequency of the base station. AFC is generated by baseband with a 11 bit conventional DAC. 13MHz VCTCXO can also be used if multislot operations is not needed.

Figure 12: Phase Locked Loop, PLL

26 MHz frequency reference

ref

f_out /

PHASE

DET.

CHARGE

PUMP

AFC-controlled VCTCXO

f_out

VCO

Kvco

M = A(P+1) + (N-A)P=

= NP+A

PLL is located in HAGAR RF-IC and is controlled via serial RFBus. There is 64/65 (P/P+1) prescaler, N- and A-divider, reference divider, ph ase detector and charge pump for the external loop filter. SHF local signal, generated by a VCO-module, is fed through a 180deg balanced phase shifter to prescaler. Output of the prescaler is fed to N- and Adivider, which produces the input to phase detector.

Phase detector compares this signal to reference signal (400kHz), which is divided with reference divider from VCTCXO output. Output of the phase detector is connected into charge pump, which charges or discharges integrator capacitor in the loop filter depending on the phase of the measured frequency compared to reference frequency.

Loop filter filters out comparison pulses of phase detector and generates DC control voltage to VCO.

Dividers are controlled via serial bus. RFBus Data is for data, RFBusClk is serial clock for the bus and RFBusEna1X is a latch enable, which stores new data into dividers.

LO-signal is generated by SHF VCO module. VCO has double frequency in GSM1800 and x 4 frequency in EGSM compared to actual RF channel frequency. LO signal is divided by two or four in HAGAR (depending on system mode).

Receiver

Receiver is a direct conversion, dual band linear receiver. Receiv ed RF-signal from the antenna is fed via a RF-antenna switch module to the 1st RX bandpass RF-SAW filters and MMIC LNAs. RF-antenna switch module contains upperband and lowerband opera-

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tion. The LNA amplified signal is fed to 2nd RX bandpass RF-SAW filters. Both 2nd RX bandpass RF-SAW filters comprise un-bal/bal configuration to get the balanced (balanced) feed for Hagar.

Discrete LNAs have three gain levels. The first one is max. gain, the second one is about 30dB(GSM1800) and -25dB(EGSM900) below max. gain and the last one is off state. The gain selection control of LNAs comes from HAGAR IC.

Differential RX signal is amplified and mixed directly down to BB frequency in HAGAR. Local signal is generated with external VCO. The VCO signal is divided by 2 (GSM1800) or by 4 (E-GSM900). PLL and dividers are in HAGAR-IC.

From the mixer output to ADC input RX signal is divided into I- and Q-signals. Accurate phasing is generated in LO dividers. After the mixer DTOS amplifiers convert the differential signals to single ended. DTOS has two gain stages. The first one has constant gain of 12dB and 85kHz cut off frequency. The gain of second stage is controlled wit h contro l signal g10. If g10 is high (1) the gain is 6dB and if g10 is low (0) the gain of the stage is

-4dB. The active channel filters in HAGAR provides selectivity for channels (-3dB @ +/-91 kHz

typ.). Integrated base band filter is active-RC-filter with two off-chip capacitors. Baseband filter consists of two stages, DTOS and BIQUAD. DTOS is differential to single-ended converter having 8dB or 18dB gain. BIQUAD is modified Sallen-Key Biquad.

Integrated resistors and capacitors are tunable. These are controlled with a digital control word. The correct control words that compensate for the process variations of integrated resistors and capacitors and of tolerance of off-chip capacitors are found with the calibration circuit.

Next stage i n the r eceiv er cha in is a A GC-am plifier, also integrated into HAGAR. AGC has digital gain control via serial mode bus. AGC-stage provi d es gain control range (40 dB, 10 dB steps) for the receiver and also the necessary DC compensation. Additional 10 dB AGC step is implemented in DTOS stages.

DC compensation is made during DCN1 and DCN2 operations (controlled via serial bus). DCN1 is carried out by charging the large external capacitors in AGC stages to a voltage which cause a zero dc-offset. DCN2 set the signal offset to constant value (VrefRF_02

1.35 V). The VrefRF_02 signal is used as a zero level to RX ADCs. Single ended filtered I/Q-signal is then fed to ADCs in BB. Input level for ADC is 1.45 Vpp

max.

Transmitter

Transmitter chain consists of two final frequency IQ-modulators fo r upper and lower band, a dual power amplifier and a power control loop.

I- and Q-signals are generated by baseband. After post filtering (RC-net work) they go into IQ-modulator in HAGAR. LO-signal for modulator is generated by VCO and is divided

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by 2 or by 4 depending on system mode. There are separate outputs one for EGSM and one for GSM1800.

In EGSM branch there is a SAW filter before PA to attenuate unwanted signals and wideband noise from the Hagar IC.

The final amplification is realized with dual band power amplifier. It has two different power chains one for EGSM and one for GSM1800. PA is able to produce over 2 W (0 dBm input level) in EGSM band and over 1 W (0 dBm input level) in upperband band into 50 ohm output. Gain control range is over 45 dB to get desired power levels and power ramping up and down.

Any harmonics generated by the PA are filtered out with filtering in side the antenna switch -module.

Power control circuitry consists of discrete power detector (common for lower and upperband) and error amplifier in HAGAR. There is a direction al coupler connected between PA output and antenna switch. It is a dual band type and has input and outputs for both systems. Directional coupler takes a sample from the forward going power with certain ratio. This signal is rectified in a schottky-diode and it produces a DC-signal after filtering.

The possibility to improve efficiency in low power levels has been specified in power amplifier module. The improved efficien cy will take place on power level 7 and lower in EGSM. For this option there is control input line in PA module.

AFC function

AFC is used to lock the transceivers clock to frequency of the base station. AFC-voltage is generated in BB with 11 bit DA-converter. There is a RC-filter in AFC control line to reduce the noise from the converter. Settling time requirement for the RC-network comes from signalling, how often PSW (pure sine wave) slots occur. AFC tracks base station frequency continuously, so transceiver has a stable frequency, because changes in VCTCXO-output don't occur so fast (temperature).

Settling time requirement comes also from the start up-time allowed. When transceiver is in sleep mode and "wakes" up to receive mode, there is only about 5 ms for the AFCvoltage to settle. When the first burst comes in system clock has to be settled into +/-

0.1 ppm frequency accuracy. The VCTCXO-module requires also 5 ms to settle into final frequency. Amplitude rises into full swing in 1... 2 ms, but frequency settling time is higher so this oscillator must be powered up early enough.

DC-compensation

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Interfaces and Connectors

Antenna

The TME-3 uses an internal or external dual band antenna.

User Interface Features

The TME-3 does not include a display. All UI functions are performed by Leds located in the A-cover.

*) Application module controllable

Start-up Operation:

Table 8: Start-up Operation:

LED 1 LED 2 Status LED Description

- - - Power off / silent mode Green scan Green scan Green scan Power on, connecting to network

- Red blink - PIN query / new PIN query

- Red blink Red blink PUK query

Intensity of Field Strength: Red blink - - Non-acceptable <- 105 dB m Green Blink - - -105 … -100 dBm Green - - Weak -100 … -95 dBm Green Green Blink - -95 … -90 dBm Green Green - Moderate -90 … -85 dBm Green Green Green Blink -85 … -80 dBm Green Green Green Good >-80 dBm

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Normal Operation:

Table 9: Normal Operation:

LED 1 LED 2 Status LED Description

* * Green In service * * Green blink Call on * * Green blink Incoming call * * Green/Red blink Message received / Voice mail in box * * Red blink Message arriving and mem ory is full

*) Application module controllable in M2M System mode

Special Operation:

Table 10: Special Operation:

LED 1 LED 2 Status LED Description

Green/Red blink Green/Red blink Green/Red blink Insert SIM card Red blink Red blink Red blink Failure, contact service Yellow Yellow Yellow Initialising

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Data Module RL7 Parts List

0201802 RL7 RF/Syst Module EDMS Issue: 5.0

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

A1 9517089 Top C 7 RF-SHIELD SHIELD_DMC04003 A3 9517138 Top H 8 RF-SHIELD SHIELD_DMC04002 A4 9517137 Bottom N 5 RF-SHIELD 3 SHIELD_DMC04001 A5 9510791 Top I 4 RF-SHIELD 2 SHIELD_DMC04000 A3 9510729 Top H 8 Lid 4 d md07543 A4 9510728 Bottom N 5 Lid 3 dmd07542 A5 9519722 Top I 1 Lid 2 dmd07511 B200 4510219 Top I 5 32.768KHZ+-30PPM 9PF CRYSTAL_CX_4V C100 2320805 Bottom J 3 Chipcap X5R 100 N K 10V 0402 0402C C101 2320805 Bottom L 3 Chipcap X5R 100N K 10V 0402 0402C C10 2 2320805 Bottom H 3 Chipcap X5R 100N K 10V 0402 0402C C103 2320805 Top E 1 Chipcap X5R 100N K 10V 040 2 0402C C104 2320805 Top H 1 Chipcap X5R 100 N K 10V 0402 0402C C105 2320805 Top H 2 Chipcap X5R 100 N K 10V 0402 0402C C107 2610039 Bottom M 2 CHIPTCAP 68U M 25V 7.3X4.3X4.1 TANT_TPSE C109 2320783 Top I 4 Chipcap X7R 33N K 10V 0402 0402C C110 2320783 Top I 4 Chipcap X7R 33N K 10V 0402 0402C C111 2320744 Top G 2 Chipcap X7R 10% 50V 0402 0402C C112 2320744 Top G 1 Chipcap X7R 10% 50V 0402 0402C C113 232048 1 Bottom L 3 Chipcap X5R 1U K 6V3 0603 0603C C114 2312243 Bottom K 2 Chipcap X5R 4U7 K 6V3 0805 0805C C115 2610043 Bottom E 4 CHIPTCAP 680U R 4V0 7.3X4.3X3.8 TA NTAL_D4 C116 2610043 Bottom F 4 CHIPTCAP 680U R 4V0 7.3X4. 3X 3.8 TANT A L_D4 C117 2610043 Bottom F 5 CHIPTCAP 680U R 4V0 7.3X4. 3X 3.8 TANT A L_D4 C118 2320546 Bottom G 3 Chipcap 5% NP0 0402C C119 2320546 Bottom H 3 Chipcap 5% NP0 0402C C120 2320 744 Top O 4 Chipcap X7R 10% 50V 0402 0402C C121 2320805 Top M 4 Chipcap X5R 1 00N K 10V 0402 0402C C123 2610043 Bottom M 6 CHIPTCAP 680U R 4V0 7.3X4.3X 3.8 TANT A L_D4

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Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

C124 2610043 Bottom M 8 CHIPTCAP 680U R 4V0 7.3X4.3X 3.8 TANT A L_D4 C126 2360001 Top O 4 Chipcap X5R 330N K 10V 0603 0603C C127 2320568 Bottom N 7 Chipcap 5% X7R 0402C C128 2320 744 Bottom N 7 Chipcap X7R 1 0% 50V 0402 0402C C129 2320 744 Top J 1 Chipcap X7R 10% 50V 0402 0402C C130 2320 744 Top J 1 Chipcap X7R 10% 50V 0402 0402C C131 2312243 Top M 5 Chipcap X5R 4U7 K 6V3 0805 0805C C133 2320568 Top M 1 Chipcap 5% X7R 0402C C134 2320 744 Top M 1 Chipcap X7R 1 0% 50V 0402 0402C C135 2320568 Top J 1 Chipcap 5% X7R 0402C C136 2320 744 Bottom N 2 Chipcap X7R 1 0% 50V 0402 0402C C137 2610039 Bottom O 2 CHIPTCAP 68U M 25V 7.3X4.3X4.1 TANT_TPSE C138 2320 744 Bottom M 3 Chipcap X7R 1 0% 50V 0402 0402C C139 2320568 Bottom I 5 Chipcap 5% X7R 0402 C C200 2320481 Top H 5 Chipcap X5R 1U K 6V3 0603 0603C C201 2320 778 Top H 5 Chipcap X7R 10% 16V 0402 0402C C202 2320481 Top H 5 Chipcap X5R 1U K 6V3 0603 0603C C203 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C C204 2320481 Top I 5 Chipcap X5R 1U K 6V3 0603 0603C C205 2320536 Top I 5 Chipcap 5% NP0 0402C C206 2320536 Top I 4 Chipcap 5% NP0 0402C C20 7 2320481 Top I 3 Chipcap X5R 1U K 6V3 0603 0603C C208 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C C209 2320805 Bottom I 5 Chipcap X5R 100N K 10V 040 2 0402C C210 232048 1 Bottom I 5 Chipcap X5R 1U K 6V3 0603 0603C C211 2320805 T o p I 4 Chipcap X5R 100N K 10V 0402 040 2C C212 2320481 Bottom H 5 Chipcap X5R 1U K 6V3 0603 0603C C213 2320805 Bottom H 4 Chipcap X5R 100N K 10V 0402 0402C C214 2320481 Top I 4 Chipcap X5R 1U K 6V3 0603 0603C C215 2320805 Bottom E 5 Chipcap X5R 100N K 10V 0402 0402C C216 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C C217 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C

Page 30 Nokia Corporation. Issue 4 12/03

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PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

C218 2320805 Top H 2 Chipcap X5R 100 N K 10V 0402 0402C C219 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C C220 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C C221 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C C222 2320481 Top F 5 Chipcap X5R 1U K 6V3 0603 0603C C223 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C C224 2320481 Bottom F 4 Chipcap X5R 1U K 6V3 0603 0603C C225 2320491 Bottom G 5 Chipcap X7R 220N K 10V 060 3 0603C C226 2320481 Bottom H 6 Chipcap X5R 1U K 6V3 0603 0603C C227 2320481 Top F 3 Chipcap X5R 1U K 6V3 0603 0603C C228 2320481 Bottom G 3 Chipcap X5R 1U K 6V3 0603 0603C C229 2320481 Bottom F 4 Chipcap X5R 1U K 6V3 0603 0603C C230 2320481 Top F 3 Chipcap X5R 1U K 6V3 0603 0603C C231 2320481 Bottom G 3 Chipcap X5R 1U K 6V3 0603 0603C C232 2320 744 Top I 3 Chipcap X7R 10% 50V 0402 0402C C233 2320 744 Top I 3 Chipcap X7R 10% 50V 0402 0402C C234 2320 744 Bottom H 3 Chipcap X7R 10% 50V 0402 0402C C235 2320 744 Top I 3 Chipcap X7R 10% 50V 0402 0402C C236 2320481 Bottom G 4 Chipcap X5R 1U K 6V3 0603 0603C C237 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C C238 2320481 Bottom H 4 Chipcap X5R 1U K 6V3 0603 0603C C239 2320481 Top F 5 Chipcap X5R 1U K 6V3 0603 0603C C240 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C C241 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C C242 2320481 Bottom G 4 Chipcap X5R 1U K 6V3 0603 0603C C243 2320481 Bottom G 4 Chipcap X5R 1U K 6V3 0603 0603C C244 2320481 Top F 3 Chipcap X5R 1U K 6V3 0603 0603C C246 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C C247 2320481 Top H 2 Chipcap X5R 1U K 6V3 0603 0603C C300 2320805 Top J 3 Chipcap X5R 1 00N K 10V 0402 0402C C301 2320805 Top J 4 Chipcap X5R 1 00N K 10V 0402 0402C C302 2320805 Top K 5 Chipcap X5R 100 N K 10V 0402 0402C

Issue 4 12/03 Nokia Corporation. Page 31

TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

C303 2320805 Top K 5 Chipcap X5R 100 N K 10V 0402 0402C C305 2320805 Top K 2 Chipcap X5R 100 N K 10V 0402 0402C C320 2320 778 Bottom J 5 Chipcap X7R 10% 16V 0402 0402C C321 2320 778 Bottom J 4 Chipcap X7R 10% 16V 0402C C322 2320 778 Top I 5 Chipcap X7R 10% 16V 0402C C323 2320805 Top H 2 Chipcap X5R 100N K 10V 0402C C324 2320 779 Bottom L 6 Chipcap X7R 100N K 16V 0603_BLM C400 2320560 Top F 2 Chipcap 5% NP0 0402C C401 2320560 Top F 2 Chipcap 5% NP0 0402C C403 2320560 Top H 7 Chipcap 5% NP0 0402C C500 2320548 Top C 9 Chipcap 5% NP0 0402C C501 2320546 Top D 9 Chipcap 5% NP0 0402C C502 2320526 Top E 8 Chipcap +-0.25pF NP0 0402C C503 2320560 Top E 9 Chipcap 5% NP0 0402C C504 2320805 Top E 9 Chipcap X5R 100N K 10V 0402C C505 2320560 Top G 9 Chipcap 5% NP0 0402C C506 2320560 Top G 9 Chipcap 5% NP0 0402C C50 7 2320778 Top D 9 Chipcap X7R 10% 16V 0402C C550 2320536 Top C 8 Chipcap 5% NP0 0402C C551 2320524 Top D 8 Chipcap +-0.25pF NP0 0402C C552 2320516 Top E 8 Chipcap +-0.25pF NP0 0402C C553 2320536 Top E 8 Chipcap 5% NP0 0402C C554 2320805 Top E 7 Chipcap X5R 100N K 10V 0402C C555 2320560 Top G 8 Chipcap 5% NP0 0402C C556 2320560 Top G 8 Chipcap 5% NP0 0402C C557 2320536 Top D 8 Chipcap 5% NP0 0402C C600 2320548 Top H 7 Chipcap 5% NP0 0402C C601 2320554 Top G 8 Chipcap 5% NP0 0402C C602 2320 778 Top I 7 Chipcap X7R 10% 16V 0402C C603 2320 778 Top I 8 Chipcap X7R 10% 16V 0402C C604 2320536 Top I 7 Chipcap 5% NP0 0402C C605 2320805 Top H 9 Chipcap X5R 100N K 10V 0402C

Page 32 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

C60 7 2314001 Top G 9 Chipcap NP0 470P J 6V3 0402C C608 2320783 Top I 8 Chipcap X7R 33N K 10V 0402C C609 2320562 Top I 8 Chipcap 5% NP0 0402C C610 2320562 T o p I 8 Chipcap 5% NP0 0402C C611 2320783 Top I 8 Chipcap X7R 33N K 10V 0402C C612 2320 778 Top I 9 Chipcap X7R 10% 16V 0402C C613 2320805 Top H 9 Chipcap X5R 100N K 10V 0402C C614 2320 778 Top I 8 Chipcap X7R 10% 16V 0402C C615 2320558 Top H 9 Chipcap 5% NP0 0402C C616 2320552 Top I 7 Chipcap 5% NP0 0402C C617 2320552 Top I 7 Chipcap 5% NP0 0402C C620 2320481 Top I 9 Chipcap X5R 1U K 6V3 0603C C621 2320481 Top I 9 Chipcap X5R 1U K 6V3 0603C C622 2320481 Top I 9 Chipcap X5R 1U K 6V3 0603C C623 2320481 Top H 9 Chipcap X5R 1U K 6V3 0603C C624 2314001 Top H 9 Chipcap NP0 470P J 6V3 0402C C625 2314001 Top H 9 Chipcap NP0 470P J 6V3 0402C C626 2314001 Top H 9 Chipcap NP0 470P J 6V3 0402C C650 2320554 Top K 7 Chipcap 5% NP0 0402C C652 2320564 Top J 7 Chipcap 5% NP0 0402C C653 2322015 Top J 6 Chipcap NP0 2N2 G 16V 060 3C C654 2320564 Top J 6 Chipcap 5% NP0 0402C C655 2320481 Top K 6 Chipcap X5R 1U K 6V3 0603C C657 2320520 Top K 7 Chipcap +-0.25pF NP0 0402C C660 2320560 Top J 8 Chipcap 5% NP0 0402C C661 2320 779 Top K 8 Chipcap X7R 100 N K 16V 0603_BLM C662 2320536 Top K 8 Chipcap 5% NP0 0402C C699 2320518 Top F 7 Chipcap +-0.25pF NP0 0402C C701 2320548 T o p F 6 Chipcap 5% NP0 0402C C70 2 2320548 Top F 7 Chipcap 5% NP0 0402C C703 2320554 Top F 7 Chipcap 5% NP0 0402C C704 2320516 Top C 4 Chipcap +-0.25pF NP0 0402C

Issue 4 12/03 Nokia Corporation. Page 33

TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

C705 2320548 Top F 7 Chipcap 5% NP0 0402C C706 2320604 Top F 7 Chipcap 5% NP0 0402C C707 23205 18 To p F 8 Chipcap +-0.25pF NP0 0402C C709 2312243 Top E 6 Chipcap X5R 4U7 K 6V3 0805C C710 2320778 Top B 4 Chipcap X7R 10% 16V 0402 0402C C711 2320548 T o p D 4 Chipcap 5% NP0 0402C C712 2320778 Top D 4 Chipcap X7R 1 0% 16V 0402 0402C C713 2320540 T o p E 6 Chipcap 5% NP0 0402C C714 2320778 Top D 5 Chipcap X7R 1 0% 16V 0402 0402C C715 2320548 T o p B 5 Chipcap 5% NP0 0402C C716 2320548 T o p C 7 Chipcap 5% NP0 0402C C717 2320536 T o p C 8 Chipcap 5% NP0 0402C C718 2320778 Top C 7 Chipcap X7R 10% 16V 0402C C719 2320778 Top C 7 Chipcap X7R 10% 16V 0402C C720 2320 744 Top B 5 Chipcap X7R 10% 50V 0402C C721 2320536 Top G 9 Chipcap 5% NP0 0402C C722 2320536 Top G 8 Chipcap 5% NP0 0402C C723 2320 744 Top G 6 Chipcap X7R 10% 50V 0402C C724 2320548 Top B 7 Chipcap 5% NP0 0402C C726 2320508 Top G 7 Chipcap +-0.25pF NP0 0402C C727 2320546 Top E 5 Chipcap 5% NP0 0402C C728 2320 778 Top D 5 Chipcap X7R 10% 16V 0402C C730 2320560 Top I 7 Chipcap 5% NP0 0402C C731 2320524 Top E 7 Chipcap +-0.25pF NP0 0402C C751 2320560 Top G 7 Chipcap 5% NP0 0402C C752 2322023 Top G 7 Chipcap NP0 2N2 J 16V 0603C C753 2320538 Top D 8 Chipcap 5% NP0 0402C C754 2320538 Top D 7 Chipcap 5% NP0 0402C C756 2320546 Top D 8 Chipcap 5% NP0 0402C C759 2320546 Top C 7 Chipcap 5% NP0 0402C C780 2320548 Top C 9 Chipcap 5% NP0 0402C C781 2320548 Top B 9 Chipcap 5% NP0 0402C

Page 34 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

D100 4341053 Bottom I 4 6*BUFFER 1.65V 74LVC07A TSSOP_14 D101 4341053 Bottom F 3 6*BUFFER 1.65V 74LVC07A TSSOP_14 D102 4341307 Bottom I 3 74LVC244 8XBUFFER TSSOP_20 D103 4341243 Top E 1 NC7WZ16 2XBUFFER SC70 -6 SC7 0_6_FAIR D104 4341307 Bottom J 3 74LVC244 8XBU FFER TSSOP_20 D105 4341245 Top G 1 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR D106 4341245 Top G 1 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR D107 4341245 Bottom H 2 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR D108 4341245 Bottom G 2 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR D200 4370825 Top H 4 UEMK W-DOG ENA TO21 TFBGA168 D300 4370873 Top K 4 UPP8M V2.6 F751986E C035 uBGA144 D320 4340831 Bottom K 4 FLASH 2MX16 1,8V FBGA40 F100 5119002 Top M 2 Fuse 2A 32V SMD 1206_FUSE F101 5119002 Top K 1 Fuse 2A 32V SMD 1206_FUSE G650 4350243 Top J 7 VCO 3420-3840MHZ 2.7V 20MA VCO_GK_601MNA_2 G660 4510261 Top J 9 VCTCXO 26MHZ+-5PPM 2.7V GSM VCTCXO_KT16 L100 3203743 Bottom N 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L101 3203743 Bottom M 5 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L102 3203715 Bottom H 2 FERRITE BEAD 0R35 240R/100M FERRITE_BK100 5 L103 3203715 Bottom G 2 FERRITE BEAD 0R35 240R/100M FERRITE_BK1005 L104 3203743 Bottom N 7 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L105 3640109 Bottom N 5 CHIP COIL 15U M 2.0A 12.95X9.4X3 COIL_DO3308 L106 3203743 Top N 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L107 3203743 Top M 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L108 3203743 Top J 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L109 3203743 Top J 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L110 3640475 Bottom O 3 CHOKE 10U M 0R16 1.1A 6.6X4.45 DT1608 L200 3203741 Top F 5 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM L201 3203741 Top H 5 FERRITE BEAD 0R5 600R/ 100MHZ 0603_BLM L202 3203741 Top G 5 FERRITE BEAD 0R5 600R/100MHZ 0 0603_BLM L203 3203741 Top F 5 FERRITE BEAD 0R5 600R/100MHZ 0 0603_BLM L204 3203741 Top F 4 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM

Issue 4 12/03 Nokia Corporation. Page 35

TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

L205 3203741 Top I 2 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM L500 3646091 Top E 9 CHIP COIL 6N8 J Q27/800M 0402 0402L L501 3646067 Top G 9 CHIP COIL 18N J Q29/800M 040 2 0402L L502 3646091 Top D 9 CHIP COIL 6N8 J Q27/800M 0402 0402L L503 3646065 Top D 9 CHIP COIL 12N J Q31/800M 0402 0402L L550 3646053 Top E 8 CHIP COIL 4N7 +-0N3 Q28/800M 0402L L551 3646091 Top G 8 CHIP COIL 6N8 J Q27/800M 040 2 0402L L552 3646047 Top D 8 CHIP COIL 3N3 +-0N3 Q28/800M 0402L L700 3646053 Top G 7 CHIP COIL 4N7 +-0N3 Q28/800M 0402L L701 3646053 Top G 6 CHIP COIL 4N7 +-0N3 Q28/800M 0402L L702 3646051 Top G 7 CHIP COIL 3N9 +-0N3 Q28/800M 0402L L703 3203743 Top E 5 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21 L704 3203715 Top B 4 FERRITE BEAD 0R35 240R/100M FERRITE_BK1005 L705 3646059 Top B 4 CHIP COIL 5N6 +-0N3 Q28/800M 0402L L708 3645065 Top B 6 CHIP COIL 5N6 K Q98/1.5GHZ 0805 0805HQ L750 4551015 Top C 7 DIR.COUP 897.5/1747.5/1880MHZ COUPLER_LDC15D N100 4340663 Bottom L 2 LP2985 REG 3.3V 150A SOT23-5 SOT23_5_H1.45 N101 4341217 Top N 4 DC/DC CONTROL (MAX1653) QSOP16_H1.73 N10 2 4341215 Bottom J 5 1XCOMP VREF=1.245 MAX918 SOT23_5_ H1. 45 N600 4370781 Top H 8 HAGAR 5 LFBGA80 uBGA80_H1.7 N700 4350297 Top C 6 PW AMP RF9203E10.1 900/1800

3.5V R100 1430770 Bottom H 4 Resistor 5% 63mW 0402R R101 1430770 Bottom H 4 Resistor 5% 63mW 0402R R10 2 1430770 Bottom H 4 Resistor 5% 63mW 0402R

E5_H1.65

R103 1430770 Bottom I 5 Resistor 5% 63mW 0402R R104 1430770 Bottom J 4 Resistor 5% 63mW 0402R R105 1430770 Bottom J 4 Resistor 5% 63mW 0402R R106 1430770 Bottom G 3 Resistor 5% 63mW 0402R R107 1430770 Bottom G 3 Resistor 5% 63mW 0402R R108 1430770 Bottom E 2 Resistor 5% 63mW 0402R R109 1430770 Bottom G 2 Resistor 5% 63mW 0402R

Page 36 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

R110 1430726 Bottom A 4 Resistor 5% 63mW 0402R R111 1430740 Bottom A 4 Resistor 5% 63mW 0402R R112 1430726 Bottom C 4 Resistor 5% 63mW 0402R R113 1430740 Bottom C 4 Resistor 5% 63mW 0402R R114 1430726 Bottom B 4 Resistor 5% 63mW 0402R R115 1430740 Bottom B 4 Resistor 5% 63mW 0402R R116 1430754 Bottom E 3 Resistor 5% 63mW 0402R R117 1430770 Bottom J 5 Resistor 5% 63mW 0402R R118 1430873 Bottom I 5 CHIPRES 0W06 27K F 0402 0402R R119 1430907 Bottom I 5 CHIPRES 0W06 11K F 0402 0402R R125 1430 762 Top G 2 Resistor 5% 63mW 0402R R129 1430 762 Top G 1 Resistor 5% 63mW 0402R R131 1430 714 Bottom G 3 Resistor 5% 63mW 0402R R132 1430 714 Bottom G 3 Resistor 5% 63mW 0402R R134 1414655 Bottom N 7 CHIPRES 0W125 0R10 J 0805 0805R R135 1430796 Bottom E 2 Resistor 5% 63mW 0402R R137 1414655 Bottom O 7 CHIPRES 0W125 0R1 0 J 0805 0805R R141 1430804 To p K 2 Resistor 5% 63mW 0402R R142 1430 796 Top K 2 Resistor 5% 63mW 0402R R143 1430 770 Top J 1 Resistor 5% 63mW 0402R R144 1430121 Top N 5 Chipres 0W06 22k F 200ppm 0402 0402R R145 1430187 Top N 5 Chipres 0W06 47k F 200ppm 0402 0402R R146 1825005 Bottom N 1 CHIP VARISTOR VWM14V VC30V 0805_VARISTOR_SIOV R147 1825033 Bottom H 2 CHIP VARISTOR VW14V VC46V 0402 0402_VAR R148 1825033 Bottom G 2 CHIP VARISTOR VW14V VC46V 0402 0402_VAR R149 1430 778 Top E 2 Resistor 5% 63mW 0402R R150 1430 796 Top O 5 Resistor 5% 63mW 0402R R151 1430690 Top J 2 Chipres 0W06 jumper 0402 0402R R153 1430 770 Top I 3 Resistor 5% 63mW 0402R R154 1430 796 Top I 3 Resistor 5% 63mW 0402R R155 1430770 Bottom K 3 Resistor 5% 63mW 0402R R156 1430911 Top I 2 Resistor 1% 63mW 0402R

Issue 4 12/03 Nokia Corporation. Page 37

TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

R157 1430911 Top I 2 Resistor 1% 63mW 0402R R158 1430911 Top J 3 Resistor 1% 63mW 0402R R159 1430911 Top I 2 Resistor 1% 63mW 0402R R160 1430911 Top I 3 Resistor 1% 63mW 0402R R161 1430911 Top I 3 Resistor 1% 63mW 0402R R162 1430726 Bottom H 2 Resistor 5% 63mW 0402R R163 1430726 Bottom G 2 Resistor 5% 63mW 0402R R164 1430690 Top O 4 Chipres 0W06 jumper 0402 0402R R202 1620067 Top I 3 RES NETWORK 0W06 4X1 00K J MNR0804 R204 14302 15 Top J 3 CHIPRES 0W06 68K F 200PPM 0402R R205 1430790 Bottom G 3 Resistor 5% 63mW 0402R R206 4120071 Bottom A 6 ASIP EMIF03-SIM01 SIM FILTER uBGA8 R20 7 1430778 Bottom H 6 Resistor 5% 63mW 0402R R320 1430770 Bottom L 6 Resistor 5% 63mW 0402R R400 1430 778 Top F 2 Resistor 5% 63mW 0402R R401 1430 778 Top F 2 Resistor 5% 63mW 0402R R403 1430 726 Top H 7 Resistor 5% 63mW 0402R R500 1430 726 Top E 9 Resistor 5% 63mW 0402R R501 1430 700 Top E 9 Resistor 5% 63mW 0402R R502 1430832 To p D 9 Resistor 5% 63mW 0402R R520 1430830 Bottom D 2 Resistor 5% 63mW 0402R R551 1430 700 Top E 7 Resistor 5% 63mW 0402R R558 1430832 To p D 8 Resistor 5% 63mW 0402R R600 1620081 Top I 9 RES NETWORK 0W03 4X22R J 0804 MNR04 R602 1430 770 Top I 9 Resistor 5% 63mW 0402R R603 1430846 To p G 8 Resistor 1% 63mW 0402R R604 1430 770 Top H 9 Resistor 5% 63mW 0402R R606 1430 784 Top H 9 Resistor 5% 63mW 0402R R60 7 1620033 Top I 7 RES NETWORK 0W06 2X5K6 J 0404 0404_R R608 1620033 To p I 7 RES NETWORK 0W06 2X5K6 J 0404 0404_R R610 1430700 Top I 7 Resistor 5% 63mW 0402R R650 1430137 Top J 6 CHIPRES 0W06 1K0 F 200PPM 0402 0402R

Page 38 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

R651 1430907 Top J 6 CHIPRES 0W06 11K F 0402 0402R R652 1430 700 Top K 7 Resistor 5% 63mW 0402R R660 1430 762 Top J 8 Resistor 5% 63mW 0402R R661 1430 774 Top K 8 Resistor 5% 63mW 0402R R700 1620121 Top G 7 RES NETWORK 0W06 2X220R J MNR02_SR 0404 R701 1620121 Top F 7 RES NETWORK 0W06 2X22 0R J MNR02_SR 0404 R703 1430 714 Top D 7 Resistor 5% 63mW 0402R R704 1430 718 Top C 7 Resistor 5% 63mW 0402R R705 1620515 Top C 4 RES NETWORK 0W04 1DB ATT 0404_RAC10 R706 1430693 Top G 6 Chipres 0W06 5R6 J 0402 0402R R707 1430693 Top G 7 Chipres 0W06 5R6 J 0402 0402R R709 1430 734 Top B 7 Resistor 5% 63mW 0402R R751 1430 770 Top D 7 Resistor 5% 63mW 0402R R752 1430 788 Top H 7 Resistor 5% 63mW 0402R R753 1430 770 Top D 8 Resistor 5% 63mW 0402R R754 1430 726 Top D 7 Resistor 5% 63mW 0402R R755 1430 718 Top C 8 Resistor 5% 63mW 0402R R756 1430 770 Top H 6 Resistor 5% 63mW 0402R R757 1430 778 Top D 7 Resistor 5% 63mW 0402R R780 1430 700 Top B 9 Resistor 5% 63mW 0402R R781 1430 700 Top B 9 Resistor 5% 63mW 0402R T650 3640423 Top I 8 BALUN TRANS 3.7GHZ+/-300MHZ TRANS_LDB15 0805 T700 4550137 Top F 7 TRANSF BALUN 1.8GHZ+-100MHZ TRANS_LDB15 2x1.3 V100 4864511 Top A 7 LED MUW GRN/RED 570/620NM LED_SML_521 V101 4864511 Top A 5 LED MUW GRN/RED 570/620NM LED_SML_521 V102 4864511 Top A 4 LED MUW GRN/RED 570/620NM LED_SML_521 V103 4210043 Bottom B 4 TR DTC1 43ZE RB=4K 7 RBE=47K EM3 V104 4210043 Bottom C 4 TR DTC1 43ZE RB=4K 7 RBE=47K EM3 V105 4210043 Bottom C 4 TR DTC1 43ZE RB=4K 7 RBE=47K EM3 V106 4210043 Bottom A 4 TR DTC143ZE RB=4K7 RBE=47K EM3 V107 4210043 Bottom B 4 TR DTC143ZE RB=4K7 RBE=47K EM3 V108 4210043 Bottom A 4 TR DTC143ZE RB=4K7 RBE=47K EM3

Issue 4 12/03 Nokia Corporation. Page 39

TME-3 Company Confiden tial

Data Module RL7 PAMS Technical Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, type

V109 4110074 Bottom O 1 SCH DI 40V 3A SOD6 V110 411007 8 Top M 4 SLHDIx2 70mA SO T323 V111 4211321 Bottom M 3 MFET FDS6912A N 30V 6A 0R035 SO8N2 V112 4211391 Top K 1 MFET P FDC6323L SWITCH 3-8V TSOP_6 V114 4110074 Bottom M 5 SCH DI 40V 3A SOD6 V115 4110078 Top E 2 SLHDIx2 70mA SOT323 V120 4110078 Bottom K 3 SLHDIx2 70mA S OT323 V200 4219926 Bottom I 5 TR+RX2 RN1302 N 50V 50MA 10K SOT323 V201 4219926 Bottom H 5 TR+RX2 RN1302 N 50V 50MA 10K SOT323 V500 4210277 Top D 9 TR BGB420 MIRROR ADJ BIAS SOT343_R V550 4210261 Top D 8 TR BGA428 LNA1.8GHZ 19.5DB SOT_363 V750 4110079 Top D 7 SCH DIX2 HSMS282C 15V <1PF SOT323 X100 5409003 Top N 2 SMD JACK 3.0MM F DC 9V 1A SMK_JACK_SWITCH X101 5400225 Bottom H 1 SM PIN HEADER 2X25M P1.27MM

STR X200 5409201 Bottom C 6 SM SIM CONN 2X3POL SK51002_001 X502 5429017 Bottom C 3 SM CONN RF PLUG+SW 3GHZ 1W

90DEG Z100 4120051 Top I 1 EMI ESD FILT10CH IP4026CX25 uBGA_25_P0.75 Z101 4120051 Top F 1 EMI ESD FILT10CH IP4026C X2 5 uBGA_25_P0.75 Z500 4512133 Top B 8 ANT.SWIT.880-960/1710-1990MHZ 7x5 UM_0318C1 Z501 4511235 Top F 9 SAW FILT 942.5+-17.5MHZ/3.8DB 3x3 DCC6D_H1.15 Z520 4511 181 Top D 9 Filter SAW 925-960/1 80 5-1880

MHZ Z551 4511241 Top F 8 SAW FILT 1842.5+-37.5MHZ/3.5DB 3x3 DCC6D_H1.15 Z700 4511237 Top F 7 SAW FILT 897.5+-17.5MHZ/4.2DB 3x3 DCC6D_H1.15

SAMTEC_ASP_67923_0 2

SWITCH_SHALTER

QCC8B_4.0X4.0

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Programmes After Market Services

TME-3 Series Transceivers

Variants

Issue 3 10/03 Nokia Corporation.

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Variants CCS Technical Documentation

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CCS Technical Documentation Variants

Table of Contents

Page No

Variants of TME-3......................................................................................................... 4

TME-3 Exploded Diagram............................................................................................. 6

TME-3 Assembly Parts List ........................................................................................7

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Variants CCS Technical Documentation

Variants of TME-3

Name Type des. Code

Transceiver TME-3 0600344 Transceiver Amena TME-3 0600345 Transceiver Vodafone TME-3 0600346 Transceiver Movistar TME-3 0600347 Transceiver Czech TME-3 0600358 Transceiver Poland TME-3 0600359 Transceiver Russia TME-3 0600360 Transceiver China TME-3 0600361 Transceiver Turkey TME-3 0600362 Transceiver South Africa TME-3 0600374 Transceiver PT-2 TME-3 0600381

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CCS Technical Documentation Variants

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Issue 3 10/03 Nokia Corporation. Page 5

TME-3 Company confidential

Variants CCS Technical Documentation

TME-3 Exploded Diagram

The following picture shows the exploded view of TME-3. The numbers in the followings sections refer to this picture.

For reassembly refer to the Troubleshooting section of this manual.

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CCS Technical Documentation Variants

TME-3 Assembly Parts List

More information in section Troubleshooting.

Part N umber in Exploded View

1 1 9452113 SIM card cover DMD08007 2 1 9452093 A-cover DMD08005 3 1 0660256 Antenna 5 1 9459140 B-cover DMC06617 6 2 6293005 PT-screw (not shown) k22x8

Pcst Material Code Part Name Type

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Variants CCS Technical Documentation

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Customer Care Solutions

TME-3 Series Transceivers

Service Software Instructions

TME-3 Company confidential

Service Software Instructio ns CCS Technical Documentation

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CCS Technical Documentation Service Software Instructions

Table of Contents

Page No

Service Software Instructions for TME-3...................................................................... 5

Before Installation .......................................................................................................5

Dongle driver installation and version check................................................................. 6

First time installation of Phoenix................................................................................... 8

TME-3 Service Software Installation procedure ......................................................... 11

Startup ........................................................................................................................12

Update Installation of Phoenix..................................................................................... 13

How to uninstall Phoenix ...........................................................................................14

Data package for Phoenix (product specific)............................................................... 16

Before installation ......................................................................................................16

Installation of Phoenix Data Package (Product Specific) ..........................................17

How to Uninstall Data Package .................................................................................20

How to Manage Connections .....................................................................................21

Manual Settings....................................................................................................... 22

A) For FLS-4S POS Flash Device choose following connection settings ...........22

B) For FPS-8 Flash Prommer choose following connection settings: ..................22

How to Update Flash Support Files for FPS-8* and FLS-4* ...................................... 24

Before Installation .....................................................................................................24

Installing the Flash Support Files ..............................................................................24

How to Update The FPS-8* Flash Prommer SW ......................................................27

FPS-8 Activation and Deactivation.............................................................................. 29

Activation ..................................................................................................................29

Deactivation ...............................................................................................................30

JBV-1 Docking Station SW......................................................................................... 31

Before Installation .....................................................................................................31

Installing SW Needed for the JBV-1 SW Update .....................................................32

Updating the JBV-1 Docking Station Software .........................................................36

TME-3 specific menus in Phoenix............................................................................... 38

Light Indicators ..........................................................................................................39

Main functionality .................................................................................................39

M2M System Connector ............................................................................................40

Remote I/O Control & Audio settings .......................................................................41

Hardware setup instructions......................................................................................... 42

Flash Concept ............................................................................................................42

Point of sale (POS) flashing concept .........................................................................43

Jig Concept ................................................................................................................44

JBV-1 Flash Concept .................................................................................................45

JBV-1 Service Concept ..............................................................................................46

Service Box SB-1 set-up ............................................................................................47

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Service Software Instructio ns CCS Technical Documentation

Service Software Instructions for TME-3

Phoenix is the Nokia Test and Service Software for mobile phones.

Figure 1: Phoenix

Before Installation

• Install the Phoenix Service SW A

• Install the TME-3 Phoenix Service SW

• Install the Data Package for Phoenix (product specific data and flash update

package)

• Manage connection settings (depends on the tools you are using)

• Update FPS-8 SW (if you use FPS-8).

•

Activate FPS-8

• Update JBV-1 Docking Station SW (only when needed

The flash update files are delivered with then Phoenix Data Package so unless you want

to use certain version of this package, separate installation package is not needed any-

more. If you want to use it, it should be installed after connection management, before

FPS-8 update.

Refer to Service Manual and Technical Bulletins for more information concerning phone

model specific tools and equipment setup.

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CCS Technical Documentation Service Software Instructions

Dongle driver installation and version check

If there is no previously installed Dongle driver, installation will take place….

Figure 2: Dongle driver installation window

If the Dongle driver is installed and it is older than the latest supported version, the latest

version will be installed when you choose “Yes”. The latest version is always included in

the latest Phoenix installation package.

Figure 3: Dongle driver update window

PC needs to be rebooted before installation can continue. Click “Yes” to reboot the PC

Setup is restarted automatically after reboot..

Figure 4: Dongle driver update completed window

If at any point during installation you get this message, the Dongle is not found and

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installation can’t continue..

Figure 5: Error message at pre-installation

Possible reasons may be defective or too old PKD-1Dongle (five digit serial number Don-

gle when used whit FPS-8 Prommer) or that the FLS-4S POS Flash Dongle is defective or

power to it is not supplied by external charger.

Check the COM/parallel ports used first! After correcting the problem Installation can be

restarted

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CCS Technical Documentation Service Software Instructions

First time installation of Phoenix

After Dongle driver installation / update (if needed) installation continues from this step.

If the Phoenix Service Software A is already installed proceed to p.11

Click “Next” in Welcome dialog to continue.

Figure 6: Welcome dialog

Choose the destination folder, it is recommended to use the default folder C:\Program

Files\Nokia\Phoenix.

Choose “Next” to continue. Y ou may choose another location by selecting “Browse” (not

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recommended)

Figure 7: File location window

Setup copies the components, please wa it.

Progress of the setup is shown. Please wait…

Figure 8: Setup status window

If restarting of your computer is needed the Install Shield Wizard will tell you about it.

Select “Yes…” to reboot the PC immediately and “No…” to reboot the PC manually.

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CCS Technical Documentation Service Software Instructions

Note that Phoenix doesn’t work, if components are not registered. Click “Finish” to con-

tinue. .

Figure 9: Installation complete -window

After the reboot components are registered and Phoenix is ready for use.

If reboot is not needed components are registered after copying them.

Figure 10: Registering window

Phoenix is now ready for use.

Now the installation of Phoenix Service SW is ready and it can be used for TME-3 after:

• Installing TME-3 specific Phoenix Service SW as follow the instructions “First Time Installation Of Phoenix”

• Installing Phone model specific Phone Data Package for Phoenix

• Configuring the connections

• Updating the Flash Update Package files used with FPS-8* tool

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TME-3 Service Software Installation procedure

• Check that a Dongle is attached to the parallel port of your computer.

• Download the latest installation package (e.g. phoenix_service_sw_a3_03_83_005.exe) to your comp uter (e.g.:\TEMP)

• Close all other programs

• Install Phoenix by executing the Phoenix installation package and follow the instructions on the screen.

• Download the latest release (e.g. TME-3_03_83_010.exe). Please contact your regional After Market Service point for information on where to download the latest release.

• Run the application file (e.g. TME-3_03_83_010.exe) and follow instructions on the screen

• Administrator rights may be required to be able to install Phoenix depending on the Operating System

• If the dongle driver is installed or updated, you need to reboot your PC before the installation can continue.

• If uninstalling or rebooting is needed at any point, you will be prompted by the install Shield program.

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Startup

Run the phoenix_service_sw_a3_03_83_005.exe to start installation. When you choose “Next” the files needed for installation will be extracted. Kindly wait.

Figure 11:

If the setup files are already extracted (left in the file system from previous installation) following dialog appears. Always click “Yes to All” to overwrite the existing setu p files

Figure 12: Overwrite protection

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Service Software Instructio ns CCS Technical Documentation

Update Installation of Phoenix

If you already have the Phoenix Service SW installed on your computer, sooner or later there will be need to update it when new versions are released.

Please note that very often the Phoenix Service SW and the Phone Specific Data Package for Phoenix come in pairs, meaning that certain version of Phoenix can only be used with certain version of Data Package. Always use the latest available versions of both. Instructions can be found in phone model specific Technical Bulletins.

To update the Phoenix you need to take exactly the same steps as when installing it for the first time.

• Download the installation package to your computer hard disk

• Close all other programs

• Run the application file (

• Dongle driver version will be checked and if need be, updated

• After reboot installation starts automatically

• Newer version of Phoenix will be installed

phoenix_service_sw_a3_03_83-005.exe)

When you update the Phoenix from old to new version (e.g. update from 3.83.005 to

3.83.0055), the update will take place automatically without uninstallation If you try update the Phoenix with the same version that you already have (e.g. 3.55 to

3.55) you are asked if you want to uninstall the version of Phoenix you have on your PC. Answer “OK” to uninstall Phoenix, “Cancel” if you don’t want to uninstall..

Figure 13: Unistallation window

If you try to install an older version (e.g. downgrade from 3.83.005 to 3.83.000) installation will be interrupted.

Always follow the instructions on the screen.

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CCS Technical Documentation Service Software Instructions

How to uninstall Phoenix

Uninstallation can be done manually from Windows Control Panel – Add/Remove Programs.

Choose “Phoenix Service Software” and click “Add/Remove”. Choose “OK” to uninstall.

Figure 14: Uninstallation window

Progress of the uninstallation is shown.

Figure 15: Setup status window

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You may have to reboot the PC after uninstallation.

Figure 16:

If restarting is not needed, the following dialog will appear:

Figure 17:

Note! If you have different product packages installed, components are uninstalled only if they are not included in other product packages.

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CCS Technical Documentation Service Software Instructions

Data package for Phoenix (product specific)

Note! the following pages show the NHL-4 Data Package Installation/ uninstallation, the procedure is similar with TME-3.

Before installation

Product Data Package contains all product specific data to make the Phoenix Service Software and tools usable with a certain phone model.

It also includes the latest version of flash update package for FLS-4* and FPS-8*

• Check that the Dongle is attached to the parallel port of your computer.

• Install Phoenix Service SW

• Download the installation package (e.g. nhl-4_dp_1.00.exe) to your computer (e.g. C:\TEMP)

• Close all other programs

• Run the application file (e.g.nhl-4_dp_1.00.exe) and follow i nstruct ions on the screen

If you already have the Phoenix Service SW installed on your computer, sooner or later there will be need to update it when new versions are released.

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Service Software Instructio ns CCS Technical Documentation

Installa tion of Phoenix Data Package (Product Specific)

Run the When you choose “Next” the files needed for installation will be extracted. Please wait…

nhl-4_dp_v_1.00.exe

to start installation.

Choose “Next” to continue.

From this view you can see the contents of the Data Package. Read the text carefully.

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CCS Technical Documentation Service Software Instructions

There should be information about the Phoenix version nee d ed with this data package. Choose “Next”.

Confirm location and choose “Next” to continue. Install Shield checks where the Phoenix applicati on i s installed and the directory is

shown. Choose “Next” to continue.

Phone model specific files will be installed... kindly wait.

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Service Software Instructio ns CCS Technical Documentation

Choose “Finish” to complete installation.

You now have all phone model specific files installed in your Phoenix Service SW.

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CCS Technical Documentation Service Software Instructions

How to Uninstall Data Package

Uninstallation can also be done manually from Windows Control Panel / Add / Remove Programs/

If you try to install the same version of Phoenix Data Package that you already have, you are asked if you want to uninstall the version you have on your PC. Answer “OK” to uninstall, “Cancel” if you don’t want to uninstall. Older versions of data packages do not need to be uninstalled.

“NHL-4 Phone Data Package”.

Once the previously installed Data package is uninstalled, choose “Finish”.

Run the

nhl-4_dp_v_1.00.exe

again to continue installation from the beginning.

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Service Software Instructio ns CCS Technical Documentation

How to Manage Connections

Start Phoenix Service SW and Login.

Figure 18: Phoenix icon

Choose “Manage Connections” From “File” – Menu

Figure 19: File menu

Existing connections can be selected, edited, deleted and new ones created by using this dialog.

A connection can be created either manually or by using a Connection Wizard. To add new connection, choose “Add” and select if you want to create it manually or by

using the Wizard.

Figure 20: Manage connections window

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CCS Technical Documentation Service Software Instructions

Choose “Next” to continue. In the next dialogs you will be asked to select some settings for the connection

Figure 21: Connection settings window

Manual Settings A) For FLS-4S POS Flash Device choose following connection settings

Media: FBUS

B) For FPS-8 Flash Prommer choose following connection settings:

Media: FPS-8 Port Num: COM Port where FPS-8 is connected COMBOX_DEF_MEDIA: FBUS

Choose “Finish” to complete. If you use the Wizard, connect the tools and a phone to your PC and the wizard will

automatically try to configure the correct connection.

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Service Software Instructio ns CCS Technical Documentation

Activate the connection you want to use by clicking it and use up/down arrows to move it on top of the list. Choose “Apply”.

The connection is now selected and can be used after closing the “Manage Connections” window.

Figure 22: Managing connections window

Selected connection will be shown on the right hand bottom corner of the screen.

Figure 23: Sselected connection window

To use the selected connection, connect the phone to Phoenix with correct service tools, make sure that it is switched on and select “Scan Product”.

Figure 24: Scan product window

When the Product is found, Phoenix will load product support and when everything is ready, name of the loaded product support module and its version will be shown on the bottom of the screen.

Figure 25: Support module and ID window

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CCS Technical Documentation Service Software Instructions

How to Update Flash Support Files for FPS-8* and FLS-4*

Before Installation

• Install Phoenix Service SW and Phoenix data package.

• Install the phone model Specific Datapackage for Phoenix

• The flash support files are delivered in the same installation package with Phoenix data package.

• Normally it is enough to install the dat a p ackage onl y before upda ti ng the FPS-

• Separate installation package is for flash suppor t files are available, and the files can be updated according to this instruction.

Installing the Flash Support Files

Start by double clicking eg. flash_update_02_10_00.exe. Installation begins.

Figure 26: Installation window

If you already have the same Flash Update package files installed, you need to confirm if you want them to be reinstalled.

Figure 27: Uninstallation window

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Choose “Next” to continue installation

Figure 28: Welcome window

It is highly recommended to install the files to the default destination folder

Files\Nokia\Phoenix

C:\Program

Choose “Next” to continue. Y ou may choose another location by selecting “Browse” (not recommended).

Figure 29: File location window

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CCS Technical Documentation Service Software Instructions

Installation continues…

Figure 30: Setup status window

Choose “Finish” to complete procedure.

• FPS-8* must be updated by using Phoenix!

Figure 31: Maintenance complete window

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How to Update The FPS-8* Flash Prommer SW

Start Phoenix Service Software

Select”FPS-8 / FPS-8C maintenance” from”Flashing” menu.

Figure 32: Flashing menu

When new FPS-8 flash update package is installed to computer you will be asked to update the files to your FPS-8 Prommer. Select”Yes” to update files..

0200

Figure 33: Update selection window

Update procedure takes a couple of minutes.

Figure 34: Update in process window

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Figure 35: Maintenance window

FPS-8 sw can also be updated by pressing”Update” button and selecting appropriate

fps8upd.ini file under

C:\Program Files\Nokia\Phoenix

Figure 36: Update file window

\Flash - directory.

All files can be loaded separately to FPS-8. To do this, just press right mouse button in Flash box files” window and select file type to be loaded. More information and help can be found from the “Help” dialog.

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FPS-8 Activation and Deactivation

• Before the FPS-8 can be successfully used for phone programming, it must be first activate d.

• If there is a need to send FPS-8 box t o somewhere e.g. for rep air, box must be first deactivated.

Activation

Before FPS-8 can be successfully used for phone programming, it must be first activated. Fill in first “FPS-8 activation request” sheet, in the FPS-8 sales package and follow the

instructions in the sheet. When activation file is received (e.g. 00000.in), copy it to C:\Program-

Files\Nokia\Phoenix\BoxActivation - Directory on your computer

created when Phoenix is installed).

(This directory is

Start Phoenix Service Software . Select ”FPS-8 / FPS-8C maintenance” from ”Flashing” menu.

Figure 37: Flashing menu

Select “Activate” from the “FPS8/8C Maintenance” – UI.

Figure 38: FPS-8/8C maintenance window

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CCS Technical Documentation Service Software Instructions

The activation file you saved to C:\ProgramFiles\Nokia\Phoenix\BoxActivation - directory will be shown (e.g. 00000.in), check that it is correct.

Box will be activated when you choose “Open” Turn FPS-8 power off and on to complete activation

Deactivation

Start Phoenix Service Software . Select ”FPS-8 / FPS-8C maintenance” from ”Flashing” menu Select “Deactivate” from the “FPS8/8C Maintenance” – UI. Confirm Deactivation by choosing “Yes”, Box will be deactivated.

Figure 39: Box activation window

Figure 40: Box deactivation window

Turn FPS-8 power off and on to complete deactivation

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Service Software Instructio ns CCS Technical Documentation

JBV-1 Docking Station SW

The JBV-1 Docking Station is a common tool for all DCT-4 generation products. In order to make the JBV-1 usable with different phone models, a phone specific Docking Station Adapter is used for different service functions.

The JBV-1 Docking Station contains Software (Firmware) which can be updated. You need the following equipment to be able to update JBV-1 software:

• PC with USB connection

• Operating System supporting USB (Not Win 95 or NT)

• USB Cable (Can be purchased from shops or suppliers providing PC hardware and accessories)

• JBV-1 Docking Station

• External Power Supply 11-16V

Before Installation

• Download Jbv1_update.zip – file to your computer (e.g. C:\TEMP) from your download web site.

• Close all other programs

• Follow instructions on the screen

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CCS Technical Documentation Service Software Instructions

Installing SW Needed for the JBV-1 SW Update

Note: DO NOT CONNECT THE USB CABLE / JBV-1 TO YOUR COMPUTER YET!

Run

Jbv1_update.zip

Files needed for JBV-1 Package setup Program will be extracted.

file and start SW Installation by double clicking

Setup.exe

Figure 41: JBV-1 update installation window

Installation begins, please read the information shown and Choose “Next” to continue.

Figure 42: Welcome window

Use suggested destination folder where JBV-1 SW Package will be installed and choose

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“Next” to continue.

Figure 43: Select location window

Select “Full” Installation and choose “Next” to continue

Figure 44: Select components window

Program Folder will be created. Choose “Next” to continue, Software files will be

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CCS Technical Documentation Service Software Instructions

installed.

Figure 45: Select folder window

After successful installation, choose “Finish” to complete.

Figure 46: Setup complete window

NOW YOU CAN CONNECT THE USB CABLE / JBV-1 TO YOUR COM-

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PUTER!

Connect power to JBV-1 (11-16V DC) from external power supply, then connect USB Cable between JBV-1 USB connector and PC.

Windows will detect connected USB cable and detect drivers for new HW. Follow the instructions and allow Windows to search and install the best drivers avail-

able. After this procedure the actual JBV-1 SW update can begin.

Figure 47: Add new hardware window

Nokia 30 Service manual

Specifications and Main Features

Frequently Asked Questions

User Manual

SERVICE MANUAL

-Nokia 30-

Company Confidential

Amendment Record Sheet

Service Manual Structure

General Information

Service Software Instructions

Service Tools

Disassembly / Troubleshooting

Accessories

Tuning. Flashing and Final T e sting Instructions

Schematic Diagra ms

Company Policy

IMPORTANT

Warnings and Cautions

Warnings:

Cautions:

ESD Protection

General Information

Introduction to TME-3

Product and Module List

TME-3 with accessories

TME-3/Nokia 30 and accessories:

Technical Specifications

Dimensions

Modes of Ope ration

Data transmission

User Interface Features

Environmental Conditions

User Interface Features

Start-up Operation

Normal Operation

Special Operation

SW features

Power supply

Data cable connection

Variants

Variants of TME-3

TME-3 Exploded Diagram

TME-3 Assembly Parts List

Service Software Instructions

Service Software Instructions for TME-3

Before Installation

Dongle driver installation and version check

First time installation of Phoenix

TME-3 Service Software Installation procedure

Startup

Update Installation of Phoenix

How to uninstall Phoenix

Data package for Phoenix (product specific)

Before installation

Installa tion of Phoenix Data Package (Product Specific)

How to Uninstall Data Package

How to Manage Connections

How to Update Flash Support Files for FPS-8* and FLS-4*

Before Installation

Installing the Flash Support Files

How to Update The FPS-8* Flash Prommer SW

FPS-8 Activation and Deactivation

Activation

Deactivation

JBV-1 Docking Station SW

Before Installation

Installing SW Needed for the JBV-1 SW Update