Nokia 30 Service Manual 03 tme3 systm

Programmes After Market Services

TME-3 Series Transceivers

Data Module RL7

Issue 4 12/03 Nokia Corporation.

TME-3 Company Confidenti al

Data Module RL7 PAMS Technical Documentation

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Page 2 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table of Contents

Page No

Glossary of Terms.......................................................................................................... 5

Functional Description of TME-3.................................................................................. 7

Circuit Description .......................................................................................................7

GSM Data Module RL7................................................................................................. 7

Baseband Module........................................................................................................... 7

Technical Summary .....................................................................................................7

Technical Summary................................................................................................... 8

Modes of Operation .....................................................................................................9

RS232 mode.............................................................................................................. 9

Application mode.................................................................................................... 10

User Control mode.................................................................................................. 10

Internal operation modes......................................................................................... 11

Nominal and maximum ratings .................................................................................12

DC Characteristics................................................................................................... 12

External signals and connectors .................................................................................12

M2M system connector ........................................................................................13

DC connector ........................................................................................................14

SIM connector .......................................................................................................15

External antenna connector ...................................................................................15

Functional Description ...............................................................................................16

POWER................................................................................................................... 16

Power Distribution ................................................................................................16

UEM ......................................................................................................................16

User Interface ........................................................................................................16

UPP Processor .......................................................................................................17

M2M system .........................................................................................................17

SIM .......................................................................................................................17

Audio .........................................................................................................................17

Audio Interfaces...................................................................................................... 18

Earpiece electrical interface .................................................................................... 18

Microphone electrical interface............................................................................... 18

RF Module ................................................................................................................... 19

Normal and extreme voltages for RF block ...............................................................19

DC characteristics ......................................................................................................20

Regulators................................................................................................................ 20

RF characteristics .......................................................................................................22

RF Block Diagram .....................................................................................................23

Frequency synthesizers ........................................................................................... 24

Receiver .....................................................................................................................24

Transmitter .................................................................................................................25

AFC function........................................................................................................... 26

DC-compensation.................................................................................................... 26

Interfaces and Connectors............................................................................................ 27

Antenna ................................................................................................................... 27

User Interface Features............................................................................................ 27

Start-up Operation:.................................................................................................. 27

Normal Operation:................................................................................................... 28

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Data Module RL7 PAMS Techn i cal Documentation

Special Operation:................................................................................................... 28

Data Module RL7 Parts List ........................................................................................ 29

Table of figures

Page No

Fig 1 Block diagram of RL7 module...................................................................................8

Fig 2 TME-3 RS-232 mode .................................................................................................9

Fig 3 TME-3 in Application mode ......................................................................................10

Fig 4 Internal operation modes............................................................................................11

Fig 5 M2M system connector X101 ....................................................................................13

Fig 6 SIM connector X200 .................................................................................................15

Fig 7 External antenna connector X502 ..............................................................................15

Fig 8 TME-3 power distribution..........................................................................................16

Fig 9 Audio control diagram................................................................................................18

Fig 10 RF frequency plan ....................................................................................................19

Fig 11 Power Distribution....................................................................................................21

Fig 12 Phase Locked Loop, PLL .........................................................................................24

List of Schematics, A3 pages

Page No

Block diagram v.RB5.0 ed.76 1
Block Diagram System v.RB5.0 ed.128 2
Schematic diagram RF-BB v.RB5.0 ed.20 3
Schematic Diagram UPP v.RB5.0 ed.26 4
Schematic Diagram UEM v. RB5.0 ed. 77 5
Schematic diagram M2M, PWR, LED v. RB5.0 ed.132 6
Schematic Diagram Memories v. RB5.0 ed.24 7
Schematic Diagram RF, v. RB5.0 ed. 163 8
Diagram of RF ground points, V. RB5.0 ed.34 9
Parts Placement 1/2 RL7_11 10
Parts Placement 2/2 RL7_11 11

Block diagram v.RB6.0 ed.79 12
Block Diagram System v.RB6.0 ed.131 13
Schematic diagram RF-BB v.RB6.0 ed.22 14
Schematic Diagram UPP v.RB6.0 ed.29 15
Schematic Diagram UEM v. RB6.0 ed. 80 16
Schematic diagram AIF, PWR, LED v. RB6.0 ed.135 17
Schematic Diagram Memories v. RB6.0 ed.32 18
Schematic Diagram R FGround points, v. RB6.0 ed. 168 19
Parts placement diagram, RL7_11a top 21
Parts Placement bottom RL7_11a Bottom 22

Page 4 Nokia Corporation. Issue 4 12/03

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PAMS Technical Documentation Data Module RL7

Glossary of Terms

ASIC Application Specific Integrated Circuit
BB Baseband
CSP Chip Scale Package
DB Dual band
DCS1800 Digital Cellular system at 1800 MHz
DSP Digital Signal Processor
EMC Electromagnetic compatibility
EMI Electromagnetic Interference
FBUS Asynchronous Full Duplex Serial Bus
GSM Global System for Mobile communications
HSCSD High Speed Circuit Switched Data
LNA Low Noise Amplifier
M2M System Connector
MBUS 1-wire half duplex serial bus
MCU Micro Controller Unit
MDI MCU-DSP Interface
PA Transmit Power Amplifier
PC Personal Computer
PWB Printed Wiring Board
PCM Pulse Code Modulation
PCM SIO Synchronous serial bus for PCM audio transferring
RF Radio Frequency
SIM Subscriber Identity Module
SMART PCMCIA interface ASIC

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UEM Universal Ener gy Management
UI User Interface
UPP Universal Phone Processor
VCXO Voltage Controlled Crystal Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal Oscillator.

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Functional Description of TME-3

Circuit Description

The Data module baseband blocks provide the MCU, DSP, external memory interface and
digital control functions in the UPP ASIC . Power supply circuitry, charging, audio pro­cessing and RF control hard ware are in the UEM ASIC.

The purpose of the RF block is to receive and demodulate the radio frequency signal from
the base station and to transmit a modulated RF signal to the base station.

GSM Data Module RL7

The description of the RL7 data module is divided into Baseband and RF sections.

Baseband Module

TME-3 baseband supports a power saving function called "sleep mode". As the M2M sys­tem protocol link must be active at all time, only so called "light sleep" is activated inter­mittently. In this mode the MCU has been shut down but peripherals are active.

TME-3 powered externally and does not have battery and thus there is no need for
charger functions. The power supply is synchronous step down switching type.

Technical Summary

Main functionality of the baseband is implemented into two ASICs: UPP and UEM.

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A

/

A

r

Data Module RL7 PAMS Techn i cal Documentation

Block Diagram

VBATRF

P
O

Voltage

input

AIF_3V3

W
E

VBAT

R

VCCAM VBB

Figure 1: Block diagram of RL7 module

Ostrich

Production
test patte rn

TEST

R&D test
structures

SIM

UI

UEM

UPP

AIF

Internal

RF-

antenna

BB

I
N
T
E
R

F
L
A
S

F
A
C
E

RF

External
antenna
connecto

H

GENIO-

UART

UPP ASIC provides the MCU, DSP, external memory interface and digital control func­tions. UEM ASIC contains power supply circuitry, charging, audio processing and RF con­trol hardware.

Technical Summary

Baseband is running from power rails 2.8V analog voltage and 1.8V I/O voltage. UPP core
voltage Vcore can be lowered down to 1.0V, 1.3V and 1.5V. UEM includes 6 linear LDO
(low drop-out) regulators for baseband and 7 regulators for R F. It also includes 4 current
sources for biasing purposes and internal usage. UEM also includes SIM interface which
supports 3V SIM cards. TME-3 does not currently support 1.8 V SIMs.

The interface between the baseband and the RF section is handled by a UEM ASIC. The
UEM provides A/D and D/A conversion of the in-phase and quadrature receive and trans­mit signal paths and also A/D and D/A conversions of received and transmitted audio sig­nals to and from the user interface. The UEM supplies the analog TXC and AFC signals to
RF section according to the UPP DSP digital control.

Data transmission between the UEM and the UPP is implemented using two serial bus­ses, DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded
audio. Digital speech processing is handled by the DSP inside UPP ASIC. UEM is a dual
voltage circuit, the digital parts are running from the baseband supply 1.8V and the ana­log parts are running from the analog supply 2.78V. UEM uses also VBAT directly

FBUS

MBUS

NALOG

DIGITAL

UDIO

I/O

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PAMS Technical Documentation Data Module RL7

The baseband supports external microphone inputs and speaker outputs. Input and out­put signal source selection and gain control is performed by the UEM according to con­trol messages from the UPP. Analog and digital PCM audio are routed to M2M system
connector.

EMC shielding for baseband is implemented using metal lids. On the other side the mod­ule is shielded with PWB grounding. Heat generated by the circuitry is conducted out via
the PWB ground planes.

Modes of Ope ration

The TME-3 has three modes of operation:

• RS-232 Mode (M2M system mode)

• Application mode (AT command mode)

• User Control mode

Internally the RL7 module has the following operating modes:

• NO_SUPPLY

• POWER_OFF

•POWER_ON

• RESET

•SLEEP

• PROTECTION

RS232 mode

Fig. 2 shows TME-3 in RS-232 mode. TME-3 enters RS-232 mode in powerup when it
detects a 68k 1% pull-down resistor at M2M system connector pin 21.

In RS-232 mode TME-3 is connected to DAU-12 RS-232 adapter. The adapter provides a
standard RS-232 interface. Power for TME-3 and the adapter is fed through TME-3 DC
jack.

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Figure 2: TME-3 RS-232 mode

Voltage input

Application mode

In application mode TME-3 is connected to a user specific application. The mechanical
and electrical interface between application and TME-3 is the M2M system connector.
The application can be powered through M2M system or the application can deliver
power to TME-3.

Voltage input

TME-3

M2M

RS-232 adapter DAU-12

Figure 3: TME-3 in Application mode

TME-3

M2M

RS-232

Alternative voltage
input

User Control mode

In the user control mode the Nokia 30 GSM Connectivity Terminal is controlled by a
mobile phone. Text message templates that are sent from the mob ile to the Nokia 30
instruct the terminal, which in turn controls a device or machine attached to it through
the M2M System connector.

An example of a device attached to the Nokia 30 for wireless control would be a refrig­erator. You might want to check the temperature of the refrigerator when out of town.
The temperature of the refrigerator could be altered with the mobile as well.

You could also turn off the lights of the apartment that you had accidentally left on by
sending a text message template.

There are three levels of access control for the User control mode.
Firstly, a message identifier entered when the terminal is used for the first time with the

Nokia 30 Configurator is only known by the person who entered it. This identifier begins
every text message template aimed to control the Nokia 30 and the application attached
to it.

User specific
application

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PAMS Technical Documentation Data Module RL7

Secondly, it can be specified from which phone number the text message templates are
allowed.

Thirdly, a password can be used that is entered whenever a text message template is sent
to the Nokia 30.

Internal operation modes

A simplified flow chart of the internal operation modes of TME-3 below.

Figure 4: Internal operation modes

NO_SUPPLY

VBAT

appears

RESET

Thermal

shutdown

POWER_ONPROTECTION SLEEP

Watchdog

bites

Watchdog

bites

POWER_OFF

Always

(forced by HW)

In NO_SUPPLY mode the phone has no supply voltage.
When battery voltage appears, TME-3 enters RESET mode. In TME-3, RESET mode leads

always to POWER_ON mode. During low activity TME-3 can switch f rom POWER_ON to
SLEEP mode. PROTECTION mode happens if the thermal shutdown of UEM regulators
triggers. PROTECTION mode leads immediately to POWER_OFF mode. TME-3 can enter
POWER_OFF mode also from POWER_ON or SLEEP modes if the UEM internal watchdog
elapses. POWER_OFF mode is not stationary.

In TME-3 there is a special power-up hardware, which essentially presses automatically
the power key as soon as it detects the POWER_OFF mode.

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Nominal and maximum ratings

Table 1: s

Parameter Absolute Maximum Rating

Supply voltage maximum VBB 15 V
DC input voltage (any signal pin *) -0.5 to 5.5V*
DC output source or sink current

(any signal pin)
Operating temperature range -10...+55 °C
Storage temperature range -40...+85 °C

+/- 10 mA

DC Characteristics

Table 2: Supply volt a ge

Pin / Conn. Line Symbol Minimum

X100 VBB 6.2 V 12.0 V 14.0 V Power feed through

X101/1,3,5,7,9 VBB 4.75 V 12.0 V 15.0 V Power feed trough

Table 3: Power consumption

Mode

Current / mA @

6.7V

Power / W Notes

Typical /
Nominal

Maximum Notes

DC jack

M2M system

POWER_ON, idle < 10 mA < 120mW

POWER_ON, full
load, 900MHz

POWER_ON, full
load, 1800MHz

< 430 mA < 5.2 W Transmitting 2 slots at full power +

< 350 mA < 4.2 W Transmitting 2 slots at full power +

External signals and connectors

This section describes the external and internal electrical connection and interface levels
on the baseband. The electrical interface specifications are collected into tables that
covers a connector or a defined interface.

External connectors comprise the following:
M2M system., DC, SIM, external antenna.

With one green led on; 65 mW
with all leds off.

300 mA @ 3.6 V power feed to M2M
system

300 mA @ 3.6 V power feed to M2M
system

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M2M system connector

M2M system connector X101 is described below:

Figure 5: M2M system connector X101

The M2M system connector is 50 pin male connector. Connector connects the TME-3 to
an external applications, for example to the data-adapter. Connection can be made by
female type socket or ribbon cable connector.

Table 4: M2M system connector pinout

Alternate Name Pin Pin Name Alternate

VBB 1 2 GND
VBB 3 4 GND
VBB 5 6 GND
VBB 7 8 GND
VBB 9 10 GND
VCCAM 11 12 Reset
GND 13 14 GENTXD
GENRXD 15 16 GND
RTSAM 17 18 CTSAM
GND 19 20 MBUS

Service 21 22 GND
MIC+ PCMDCLK 23 24 GND
MIC- PCMSCLK 25 26 PCMTX EAR+

GND 27 28 PCMRX EAR-

GND 29 30 FBUSRX
INPUT1 Reserved 31 32 GND
INPUT2 DTR 33 34 FBUSTX

GND 35 36 RTS INPUT3
OUTPUT1 Reserved 37 38 GND
OUTPUT2 DCD 39 40 DSR OUTPUT3

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GND 41 42 CTS OUTPUT4
OUTPUT5 RI 43 44 GND

Reserved 45 46 Reserved

GND 47 48 Reserved

Reserved 49 50 GND

in numbering of the M2M system connection
Odd pins are on the left side of the connector, i.e. 1, 3, 5, 7, etc. Even numbers on the

right side of the connector, i.e. 2, 4, 6, 8, etc. Pin 1 is at left top, pin 50 right bottom.
In ribbon cable connection the red stripe conductor of the cable marks pin connection 1.

Conductor numbering is then subsequent from 1 to 50 in the cable

DC connector

DC connector X100, described below, is a 3.2 mm DC jack type connector. VIN is con­nected to the central pin and the jacket is GND.

Table 5: DC connector pin

Signal Name Pin Notes

GND 3,4
VIN 2 6.2 V – 14.0 V power feed

The connector circuitry composes a 2.0 A fuse and transient protection components.
Power jack tap is a positive (VIN) and border area is a ground (GND).

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SIM connector

SIM connector X200

cards are not supported.

SIM

C5 C6 C7

C1C2C3

From Battery Type

From SIM Card contact

C8

C4

interface supports both 1.8V and 3V SI M cards. Note t hat 5V SIM

The contacts are described below:

Figure 6: SIM connector X200

GND

UPP

SIMDATA

SIMCLK

SIMRST
VSIM

BSI

SIMCardDet

GND

UEM

SIMIF
register

SIMIO
SIMClk

Data

UEM
digital
logic

SIMIO

SIMClk

Data

UIF Block

UEMInt

CBusDa

CBusEnX

CBusClk

Name Card pin Description

VSIM C1 SIM voltage supply 1.8/3.0V
SIMRST C2 SIM reset
SIMCLK C3 SIM clock
SIMDATA C4 SIM bidirectional data
VPP C5 Unconnected.
GND C7

External antenna connector

External antenna connector X502 interface is used to get better RF sign al in bad

receiving conditions.

Table 6: SIM connector

Figure 7: External antenna connector X502

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Functional Description

POWER

TME-3 operates with external DC wall power supply without a battery. The DC voltage
can be supplied either trough the DC jack or the M2M syste m connector. TME-3 has a
wide supply range high efficiency synchronous switched mode step-down converter,
which regulates the input voltage down to normal battery voltage level (3.6V).

Powe r Di st ri b ut i o n

Input voltage from DC connector or M2M system (VBB) is fed to step-down DC-DC con­verter, which regulates the voltage to 3.6V. The 3.6V is fed to DCT4 power management
circuit UEM (VBAT), to a 3V3 LDO and to the RF power amplifier (VBATRF). UEM regulates
VBAT further for baseband and RF. The 3V3 LDO is used for M2M system I/O buffers.
VBAT is fed to M2M system connector through a switch controlled by UPP.

An application can also draw current directly from the fused input voltage (VBB). The
available current depends on the input voltage and the power consumption of TME-3.
Typical maximum power consumption of TME-3 is less than 5.5 W (including the 300 mA
power feed to the application) in all circumstanc es. For example, if the input voltage is

12.0 V, the application can draw at most 2A - 5.5 W / 12 V = 1540 mA of current with­out blowing the fuse. However, it is advisable to derate the fuse current to 75% or 1.5 A,
which in the example above leaves ~1000 mA current for the application.

UEM

Figure 8: TME-3 power distribution.

VIN

6.5 V - 8.2 V

DC

Jack

4.75 V - 15.0 V power feed
from AIF

VBB

Power fail
indicator

DC/DC

Step-down

converter

680u

RFC

60R/100M

RFC

60R/100M

To UPP

Power feed/indication
to AIF

3 x 680u

VBAT

3 x 680u

Control
from UPP

VBATRF

LDO

Load switch

3V3

UEM

PA

AIF_3V3

BB
regulators

RF
regulators

300mA power
feed to AIF

AIF

I/O buffers

VCCAM

A

I

F

UEM is an energy management IC. In addition to energy management functionality the
UEM performs all the baseband mixed-signal functions.

User Interface

The TME-3 user interface consist of three two-coloured ( green/red) leds.

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Six I/O pins from UPP port1, which is normally used for keyboard, are used for led con­trol. Leds are buffered with digital transistors. shows the allocation of led control pins.

Table 7: UI LEDs

BitIO pin # Function Description

P10 LED1 – Green LED Control: 1 = ON, 0 = OFF
P11 LED1 – Red LED Control: 1 = ON, 0 = OFF
P12 LED2 – Green LED Control: 1 = ON, 0 = OFF
P13 LED2 – Red LED Control: 1 = ON, 0 = OFF
P14 LED3 – Green LED Control: 1 = ON, 0 = OFF
P15 LED3 – Red LED Control: 1 = ON, 0 = OFF

The leds are connected between VBAT and ground, and there is a current limiting resistor
and a transistor switch in series with every le d. An 1.8V level active high control signal
from UPP KEYB(10:0) switches the leds on and off. The current through a green led is
~15mA, and the current through a red led is ~5mA. This unsymmetry in led drive currents
ensures that the brightnesses of leds are equal.

UPP Processor

UPP contains ARM7 and LEAD3 MCU & DSP cores, RAM memory and custom logic.
The UPP block contains also an external flash memory. TME-3 flash size is 32Mbit.

M2M system

The M2M system block contains the M2M system connector and the glue logic needed to
make connections between application and the TME-3. The application interface of TME­3 is the standard M2M application interfac e. The M2M system interface includes FBUS,
MBUS, GENIOUSART, analog and digital audios (multiplexed to same pins), DC input volt­age, regulated 3.6V battery voltage and some general purpose I/Os.

All signal pins of M2M system are 5V tolerant. The 5V input voltage level is translated
down to 2.78V and 1.8V logic levels for UEM and UPP. The outputs of M2M system are
translated from UPP/UEM 1.8V and 2.78V levels to 3.3V level.

M2M system connector is a 50-pin male connector.

SIM

The SIM block contains a SIM card reader, which is connected to UEM SIM interface.

Audio

TME-3 does not have any built-in audio equipment, such as microphone or earpiece.
All audio signals are routed outside of TME-3 via M2M system connector to an external

audio accessory. The RAE-3 does not include or support vibra and buzzer.

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The audio control and processing is done by the UEM, which contains the audio codec.
The UPP contains MCU and DSP blocks, handling and processing the audio data signals.
The baseband supports one external microphone input and one external earphone output
or alternatively digital PCM lines.

Audio Interfaces

TME-3 has two different audio types, digital and analog audios. Those lines are multi­plexed in M2M system connector, so there is only one physical audio interface.

Figure 9: Audio control diagram

AUDIOSELECT

Audio type selection is made by the audioselect signal from UPP genio pin 28. Audio lines
are multiplexed and demuxed by using NC7SB3157 and these components are controlled
by the audioselect signal

Earpiece electrical interface

Earpiece circuit includes two ferrite beads, two capacitors (27 pF -> 900 MHz cut-off fil­ter) and two varistors for EMC protection. Earphone lines from the M2M system is con­nected to the differential output (EARP and EARN) in the UEM audio codec.

EAR­PCMRX
EAR+
PCMTX

AUDIOSELECT

MIC­PCMSCLK

MIC+
PCMDCLK

AIF 26

AIF 28

MUX 4/2

AIF 23

AIF 25

DEMUX 2/4

Microphone electrical interface

The microphone electrical circuit incl udes EMI/ESD protections which is placed near
the M2M system connector. MICB1 is connected to MIC1P via 1kΩ resistor.

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RF Module

This RF module executes all RF functions of the module. RF circuitry is located on one
side (B-side) of the PCB.

EMC leakage is prevented by three m etal shields. The first one includes the Bluetooth
module. The second block includes the PA, antenna switch, LNAs and dual RX SAW. The
last block include the Hagar RF IC, VCO, VCTCXO, baluns and balanced filters.

Maximum height inside on RF-shields is 3 mm. Heat generated by t he circuitry will be
conducted out via the PWB ground planes.

Heat generated by the circuitry is conducted out via the PWB ground planes.

Normal and extreme voltages for RF block

There is no extreme voltage due of the internal power block and no battery use.

Parameter Rating

Nominal voltage: 3.6 V (generated in PWR block)
Lower extreme voltage same as nominal
Higher extreme voltage same as nomina l

RF Frequency Plan

Figure 10: RF frequency plan

925-960
MHz

1805-1880
MHz

f

f

f/4

HAGAR

f

f/2f/4

f

f/2

PLL

3420­3840
MHz

I-signal

I-signalI-signalI-signal
Q-signal

RX

1710-1785
MHz

880-915
MHz

26 MHz

VCTCXO

I-signal

Q-signal

TX

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DC characteristics

Regulators

The transceiver comprises a multif unction power management IC on baseband section,
which contains among other functions; 7 pcs of 2.78 V regulators and 4.8V up-switcher
for charge pump.

Use of the regulators can be seen in the Power Distribution Diagram. VrefRF01and
VrefRF02 are used as the reference voltages for HAGAR RF-IC, VrefRF01 (1.35V) for bias
reference and VrfeRF02 (1.35V) for RX ADC's reference.

Regulators (except VR2 and VR7) are connected to HAGAR. Different modes were
switched on by the aid of ser i a l bu s.

List of the supply voltages:

Volt. source Load
VR1 PLL charge pump (4,8 V)
VR2 TX modulator
VR3 VCTCXO + buffer
VR4 HAGAR IC (LNAs+mixer+DTOS)
VR5 HAGAR IC (div+LO-buff+prescaler),
VR6 HAGAR (Vdd_bb)
VR7 VCO
VrefRF01 ref. voltage for HAGAR
VrefRF02 ref. voltage for HAGAR
VbattRF PA

Typical current consumption:

Operation mode Current consumption Notes

Pow er OFF < 10 uA Leakage current (dual PA)
RX 81 mA, peak Includes synthesizer current

(28 mA)
TX, without PA 138 mA, peak
TX, power level 5, EGSM900 1700 mA, peak
TX, power level 0, DCS1800 1200 mA, peak

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Power Distribution Diagram

SOURCE

VR1

VR2

VR3

VR4

VR5

Figure 11: Power Distribution

4.75 V +/- 3.2 %
10 mA

2.78 V +/- 3 %

100 mA

2.78 V +/- 3 %

20 mA

2.78 V +/- 3 %

50 mA

2.78 V +/- 3 %

50 mA

LOAD

Charge pump in HAGAR

TX IQ modulator, pow er
control opamp in

Hagar
VCTCXO

VCTCXO buffer in Haga r

E-GSM & DCS LNA
RX mixer in Hagar
DTOS in Hagar

PLL in Hagar

UEM

VR6

VR7

VrefRF01

VrefRF02

VBATT

2.78 V +/- 3 %

50 mA

2.78 V +/- 3 %

50 mA

1.35 v +/- 1.15 %

< 100 ua

1.35 V +/- 2 %

< 100 ua

3.2 - 4.5 V

1700 mA (max)

Dividers in Hagar
LO buffers in Hagar
Prescaler in Hagar
Power detector

BB section in Hagar

SHF VCO Module

Ref. volt. for Hagar RX

Ref. volt. for Hagar

Dual PA module

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Data Module RL7 PAMS Techn i cal Documentation

RF characteristics

Main RF characteristics are listed in the table below:

Item Values (E-GSM / GSM1800)

Receive frequency range 925... 960 MHz / 1805...1880 MHz
Transmit frequency range 880... 915 MHz / 1710...1785 MHz
Duplex spacing 45 MHz / 95 MHz
Channel spacing 200 kHz
Number of RF channels 174 / 374
Power class 4 (2 W) / 1 (1 W)
Number of power levels 15 / 16

Transmitter characteristics

Item Values (E-GSM/GSM1800)

Type Direct conversion , nonlinear, FDMA/TDMA
LO frequency range 3520...3660 MHz / 3420...3570 MHz
Output power 2 W / 1 W peak
Gain control range min. 30 dB
Maximum phase error (RMS/peak) max 5 deg./20 deg. peak

Receiver characteristics

Item Values, E-GSM/GSM1800

Type Direct conversion, Linear, FDMA/TDMA
LO frequencies 3700...3840 MHz / 3610...3760 MHz
Typical 3 dB bandwidth +/- 91 kHz
Sensitivity min. - 102 dBm (GSM1800 norm.cond. only)
Total typical receiver voltage gain

(from antenna to RX ADC)

86 dB

Receiver output level (RF level -95 dBm) 230 mVpp, single-ended I/Q signals to RX

ADCs
Typical AGC dynamic range 83 dB
Accurate AGC co ntrol range 60 dB
Usable input dynamic range -102... -10 dBm
RSSI dynamic range -110... -48 dBm

Page 22 Nokia Corporation. Issue 4 12/03

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PAMS Technical Documentation Data Module RL7

RF Block Diagram

26 MHz

RXI

INP_G_RX

INM_G_RX

Balanced
SAW

RXQ

VCP

VPP

VRF_RX

VLO/VPRE

INP_P_RX

INP_P_RX

VB_EXT

VREF_RX

SLE

SCLK

RESET

HAGAR

LNAB_P

LNAB_G

SDATA

LNA_D

LNA_P

VANT_2

VANT_1

LNA_G

Balanced
SAW

TXP

TXC

DET

VTXLO_P

VPCTRL_P

OUTP_P_TX

OUTM_P_TX

GND

TXIM

RF_TEMP

VTX_B_P

VP_D_SEL

TXIP

VTXLO_G

VPCTRL_G

OUTP_G_TX

OUTM_G_TX

TOUT

TXOP

TXOM

VCTCXO

VTX_B_G

VB_DET

VC_1

VC_2

INP_LO

INM_LO

OUT_CP

Balanced
SAW

MMIC

LNA

MMIC
LNA

Dual SAW

Dual PA
module

Dual
coupler

RX/TX switch

3420 - 3840 MHz

Internal

antenna

RF B l oc k Di agram

EGS M900/
GSM1800

Issue 4 12/03 Nokia Corporation. Page 23

TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Frequency synthesizers

VCO frequency is locked with PLL into stable frequency source, which is a VCTCXO-mod­ule. VCTCXO is running at 26 MHz. Temperature drifting is con trolled with AFC voltage.
VCTCXO is locked into frequency of the base station. AFC is generated by baseband with
a 11 bit conventional DAC. 13MHz VCTC XO can also be used if multislot operations is not
needed.

Figure 12: Phase Locked Loop, PLL

26 MHz frequency reference

R

f

ref

f_out /

PHASE

M

DET.

CHARGE

PUMP

AFC-controlled VCTCXO

LP

f_out

VCO

Kd

M

Kvco

M = A(P+1) + (N-A)P=

= NP+A

PLL is located in HAGAR RF-IC and is controlled via serial RFBus. There is 64/65 (P/P+1)
prescaler, N- and A-divider, reference divider, phase detector and charge pump for the
external loop filter. SHF local signal, generated by a VCO-module, is fed through a
180deg balanced phase shifter to prescaler. Output of the prescaler is fed to N- and A­divider, which produces the input to phase detector.

Phase detector compares this signal to reference signal (400kHz), which is divided with
reference divider from VCTCXO output. Output of the phase detector is connected into
charge pump, which charges or discharges integrator capacitor in the loop filter depend­ing on the phase of the measured frequency compared to reference frequency.

Loop filter filters out comparison pulses of phase detector and generates DC control volt­age to VCO.

Dividers are controlled via serial bus. RFBus Data is for data, RFBusClk is serial clock for
the bus and RFBusEna1X is a latch enable, which stores new data into dividers.

LO-signal is generated by SHF VCO module. VCO has double frequency in GSM1800 and x
4 frequency in EGSM compared to actual RF channel frequency. LO signal is divided by
two or four in HAGAR (depending on system mode).

Receiver

Receiver is a direct conversion, dual band linear receiver. Received RF-signal from the
antenna is fed via a RF-antenna switch module to the 1st RX bandpass RF-SAW filters
and MMIC LNAs. RF-antenna switch module contains upperband and lowerband opera-

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PAMS Technical Documentation Data Module RL7

tion. The LNA amplified signal is fed to 2nd RX bandpass RF-SAW filters. Both 2nd RX
bandpass RF-SAW filters comprise un-bal/bal configuration to get the balanced (bal­anced) feed for Hagar.

Discrete LNAs have three gain levels. The first one is max. gain, the second one is about ­30dB(GSM1800) and -25dB(EGSM900) below max. gain and the last one is off state. The
gain selection control of LNAs comes from HAGAR IC.

Differential RX signal is amplified and mixed directly down to BB frequency in HAGAR.
Local signal is generated with external VCO. The VCO signal is divided by 2 (GSM1800) or
by 4 (E-GSM900). PLL and dividers are in HAGAR-IC.

From the mixer output to ADC input RX signal is divided into I- and Q-signals. Accurate
phasing is generated in LO dividers. After the mixer DTOS amplifiers convert the differen­tial signals to single ended. DTOS has two gain stages. The first one has constant gain of
12dB and 85kHz cut off frequency. The gain of second stage is controlled wit h contro l
signal g10. If g10 is high (1) the gain is 6dB and if g10 is low (0) the gain of the stage is

-4dB.
The active channel filters in HAGAR provides selectivity for channels (-3dB @ +/-91 kHz

typ.). Integrated base band filter is active-RC-filter with two off-chip capacitors. Base­band filter consists of two stages, DTOS and BIQUAD. DTOS is differential to single-ended
converter having 8dB or 18dB gain. BIQUAD is modified Sallen-Key Biquad.

Integrated resistors and capacitors are tunable. These are controlled with a digital con­trol word. The correct control words that compensate for the process variations of inte­grated resistors and capacitors and of tolerance of off-chip capacitors are found with the
calibration circuit.

Next stage i n the r eceiv er cha in is a A GC-am plifier, also integrated into HAGAR. AGC has
digital gain control via serial mode bus. AGC-stage provi d es gain control range (40 dB,
10 dB steps) for the receiver and also the necessary DC compensation. Additional 10 dB
AGC step is implemented in DTOS stages.

DC compensation is made during DCN1 and DCN2 operations (controlled via serial bus).
DCN1 is carried out by charging the large external capacitors in AGC stages to a voltage
which cause a zero dc-offset. DCN2 set the signal offset to constant value (VrefRF_02

1.35 V). The VrefRF_02 signal is used as a zero level to RX ADCs.
Single ended filtered I/Q-signal is then fed to ADCs in BB. Input level for ADC is 1.45 Vpp

max.

Transmitter

Transmitter chain consists of two final frequency IQ-modulators fo r upper and lower
band, a dual power amplifier and a power control loop.

I- and Q-signals are generated by baseband. After post filtering (RC-net work) they go
into IQ-modulator in HAGAR. LO-signal for modulator is generated by VCO and is divided

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TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

by 2 or by 4 depending on system mode. There are separate outputs one for EGSM and
one for GSM1800.

In EGSM branch there is a SAW filter before PA to attenuate unwanted signals and wide­band noise from the Hagar IC.

The final amplification is realized with dual band power amplifier. It has two different
power chains one for EGSM and one for GSM1800. PA is able to produce over 2 W (0
dBm input level) in EGSM band and over 1 W (0 dBm input level) in upperband band into
50 ohm output. Gain control range is over 45 dB to get desired power levels and power
ramping up and down.

Any harmonics generated by the PA are filtered out with filtering in side the antenna
switch -module.

Power control circuitry consists of discrete power detector (common for lower and
upperband) and error amplifier in HAGAR. There is a direction al coupler connected
between PA output and antenna switch. It is a dual band type and has input and outputs
for both systems. Directional coupler takes a sample from the forward going power with
certain ratio. This signal is rectified in a schottky-diode and it produces a DC-signal after
filtering.

The possibility to improve efficiency in low power levels has been specified in power
amplifier module. The improved efficien cy will take place on power level 7 and lower in
EGSM. For this option there is control input line in PA module.

AFC function

AFC is used to lock the transceivers clock to frequency of the base station. AFC-voltage is
generated in BB with 11 bit DA-converter. There is a RC-filter in AFC control line to
reduce the noise from the converter. Settling time requirement for the RC-network
comes from signalling, how often PSW (pure sine wave) slots occur. AFC tracks base sta­tion frequency continuously, so transceiver has a stable frequency, because changes in
VCTCXO-output don't occur so fast (temperature).

Settling time requirement comes also from the start up-time allowed. When transceiver
is in sleep mode and "wakes" up to receive mode, there is only about 5 ms for the AFC­voltage to settle. When the first burst comes in system clock has to be settled into +/-

0.1 ppm frequency accuracy. The VCTCXO-module requires also 5 ms to settle into final
frequency. Amplitude rises into full swing in 1... 2 ms, but frequency settling time is
higher so this oscillator must be powered up early enough.

DC-compensation

DC compensation is made during DCN1 and DCN2 operations (controlled via serial bus).
DCN1 is carried out by charging the large external capacitors in AGC stages to a voltage
which cause a zero dc-offset. DCN2 set the signal offset to constant value (RXREF 1.35
V). The RXREF signal is used as a zero level to RX ADCs.

Page 26 Nokia Corporation. Issue 4 12/03

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PAMS Technical Documentation Data Module RL7

Interfaces and Connectors

Antenna

The TME-3 uses an internal or external dual band antenna.

User Interface Features

The TME-3 does not include a display. All UI functions are performed by Leds located in
the A-cover.

*) Application module controllable

Start-up Operation:

Table 8: Start-up Operation:

LED 1 LED 2 Status LED Description

- - - Power off / silent mode
Green scan Green scan Green scan Power on, connecting to network

- Red blink - PIN query / new PIN query

- Red blink Red blink PUK query

Intensity of Field Strength:
Red blink - - Non-acceptable <-105 dBm
Green Blink - - -105 … -100 dBm
Green - - Weak -100 … -95 dBm
Green Green Blink - -95 … -90 dBm
Green Green - Moderate -90 … -85 dBm
Green Green Green Blink -85 … -80 dBm
Green Green Green Good >-80 dBm

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TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Normal Operation:

Table 9: Normal Oper ation:

LED 1 LED 2 Status LED Description

* * Green In service
* * Green blink Call on
* * Green blink Inc o mi n g call
* * Green/Red blink Message received / Voice mail in box
* * Red blink Message arriving and memory is full

*) Application module controllable in M2M System mode

Special Operation:

Table 10: Special Operation:

LED 1 LED 2 Status LED Description

Green/Red blink Green/Red blink Green/Red blink Insert SIM card
Red blink Red blink Red blink Failure, contact service
Yellow Yellow Yellow Initialising

Page 28 Nokia Corporation. Issue 4 12/03

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PAMS Technical Documentation Data Module RL7

Data Module RL7 Parts List

0201802 RL7 RF/Syst Module EDMS Issue: 5.0

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

A1 9517089 Top C 7 RF-SHIELD SHIELD_DMC04003
A3 9517138 Top H 8 RF-SHIELD SHIELD_DMC04002
A4 9517137 Bottom N 5 RF-SHIELD 3 SHIELD_DMC04001
A5 9510791 Top I 4 RF-SHIELD 2 SHIELD_DMC04000
A3 9510729 Top H 8 Lid 4 dmd07543
A4 9510728 Bottom N 5 Lid 3 dmd07542
A5 9519722 Top I 1 Lid 2 dmd07511
B200 4510219 Top I 5 32.768KHZ+-30PPM 9PF CRYSTAL_CX_4V
C100 2320805 Bottom J 3 Chipcap X5R 100N K 10V 0402 0402C
C101 2320805 Bottom L 3 Chipcap X5R 100N K 10V 0402 0402C
C10 2 2320805 Bottom H 3 Chipcap X5R 100N K 10V 0402 0402C
C103 2320805 Top E 1 Chipcap X5R 100N K 10V 040 2 0402C
C104 2320805 Top H 1 Chipcap X5R 100N K 10V 040 2 0402C
C105 2320805 Top H 2 Chipcap X5R 100N K 10V 040 2 0402C
C107 2610039 Bottom M 2 CHIPTCAP 68U M 25V 7.3X4.3X4.1 TANT_TPSE
C109 2320783 Top I 4 Chipcap X7R 33N K 10V 0402 0402C
C110 2320783 Top I 4 Chipcap X7R 33N K 10V 0402 0402C
C111 2320744 T op G 2 Chipcap X7R 10% 50V 0402 0402C
C112 2320744 T op G 1 Chipcap X7R 10% 50V 0402 0402C
C113 2320481 Bottom L 3 Chipcap X5R 1U K 6V3 0603 0603C
C114 2312243 Bottom K 2 Chipcap X5R 4U7 K 6V3 0805 0805C
C115 2610043 Bottom E 4 CHIPTCAP 680U R 4V0 7.3X4.3X3.8 TANTAL_D4
C116 2610043 Bottom F 4 CHIPTCAP 680U R 4V0 7.3X4.3X3.8 TANTAL_D4
C117 2610043 Bottom F 5 CHIPTCAP 680U R 4V0 7.3X4.3X3.8 TANTAL_D4
C118 23205 46 Bottom G 3 Chipcap 5% NP0 0402C
C119 23205 46 Bottom H 3 Chipcap 5% NP0 0402C
C120 2320 744 Top O 4 Chipcap X7R 10% 50V 0402 0402C
C121 2320805 Top M 4 Chipcap X5R 100N K 10V 0402 0402C
C123 2610043 Bottom M 6 CHIPTCAP 680U R 4V0 7.3X4.3X3.8 TANTAL_D4

Issue 4 12/03 Nokia Corporation. Page 29

TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

C124 2610043 Bottom M 8 CHIPTCAP 680U R 4V0 7.3X4.3X3.8 TANTAL_D4
C126 2360001 Top O 4 Chipcap X5R 330N K 10V 0603 0603C
C127 2320568 Bottom N 7 Chipcap 5% X7R 0402C
C128 2320 744 Bottom N 7 Chipcap X7R 10% 50V 0402 0402C
C129 2320 744 Top J 1 Chipcap X7R 10% 50V 0402 0402C
C130 2320 744 Top J 1 Chipcap X7R 10% 50V 0402 0402C
C131 2312243 Top M 5 Chipcap X5R 4U7 K 6V3 0805 0805C
C133 2320568 Top M 1 Chipcap 5% X7R 0402C
C134 2320 744 Top M 1 Chipcap X7R 10% 50V 0402 0402C
C135 2320568 Top J 1 Chipcap 5% X7R 0402C
C136 2320 744 Bottom N 2 Chipcap X7R 10% 50V 0402 0402C
C137 2610039 Bottom O 2 CHIPTCAP 68U M 25V 7.3X4.3X4.1 TANT_TPSE
C138 2320 744 Bottom M 3 Chipcap X7R 10% 50V 0402 0402C
C139 2320568 Bottom I 5 Chipcap 5% X7R 0402C
C200 2320481 Top H 5 Chipcap X5R 1U K 6V3 0603 0603C
C201 2320 778 Top H 5 Chipcap X7R 10% 16V 0402 0402C
C202 2320481 Top H 5 Chipcap X5R 1U K 6V3 0603 0603C
C203 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C
C204 2320481 Top I 5 Chipcap X5R 1U K 6V3 0603 0603C
C205 2320536 Top I 5 Chipcap 5% NP0 0402C
C206 2320536 Top I 4 Chipcap 5% NP0 0402C
C20 7 2320481 Top I 3 Chipcap X5R 1U K 6V3 0603 0603C
C208 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C
C209 2320805 Bottom I 5 Chipcap X5R 100N K 10V 0402 0402C
C210 2320481 Bottom I 5 Chipcap X5R 1U K 6V3 0603 0603C
C211 2320805 Top I 4 Chipcap X5R 100N K 1 0V 0402 0402C
C212 2320481 Bottom H 5 Chipcap X5R 1U K 6V3 0603 0603C
C213 2320805 Bottom H 4 Chipcap X5R 100N K 10V 0402 0402C
C214 2320481 Top I 4 Chipcap X5R 1U K 6V3 0603 0603C
C215 2320805 Bottom E 5 Chipcap X5R 100N K 10V 0402 0402C
C216 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C
C217 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C

Page 30 Nokia Corporation. Issue 4 12/03

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PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

C218 2320805 Top H 2 Chipcap X5R 100N K 10V 0402 0402C
C219 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C
C220 2320481 Top G 5 Chipcap X5R 1U K 6V3 0603 0603C
C221 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C
C222 2320481 Top F 5 Chipcap X5R 1U K 6V3 0603 0603C
C223 2320805 Top G 2 Chipcap X5R 100N K 10V 0402 0402C
C224 2320481 Bottom F 4 Chipcap X5R 1U K 6V3 0603 0603C
C225 2320491 Bottom G 5 Chipcap X7R 220N K 10V 0603 0603C
C226 2320481 Bottom H 6 Chipcap X5R 1U K 6V3 0603 0603C
C227 2320481 Top F 3 Chipcap X5R 1U K 6V3 0603 0603C
C228 2320481 Bottom G 3 Chipcap X5R 1U K 6V3 0603 0603C
C229 2320481 Bottom F 4 Chipcap X5R 1U K 6V3 0603 0603C
C230 2320481 Top F 3 Chipcap X5R 1U K 6V3 0603 0603C
C231 2320481 Bottom G 3 Chipcap X5R 1U K 6V3 0603 0603C
C232 2320 744 Top I 3 Chipcap X7R 10% 50V 0402 0402C
C233 2320 744 Top I 3 Chipcap X7R 10% 50V 0402 0402C
C234 2320 744 Bottom H 3 Chipcap X7R 10% 50V 0402 0402C
C235 2320 744 Top I 3 Chipcap X7R 10% 50V 0402 0402C
C236 2320481 Bottom G 4 Chipcap X5R 1U K 6V3 0603 0603C
C237 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C
C238 2320481 Bottom H 4 Chipcap X5R 1U K 6V3 0603 0603C
C239 2320481 Top F 5 Chipcap X5R 1U K 6V3 0603 0603C
C240 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C
C241 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C
C242 2320481 Bottom G 4 Chipcap X5R 1U K 6V3 0603 0603C
C243 2320481 Bottom G 4 Chipcap X5R 1U K 6V3 0603 0603C
C244 2320481 Top F 3 Chipcap X5R 1U K 6V3 0603 0603C
C246 2320481 Top F 4 Chipcap X5R 1U K 6V3 0603 0603C
C247 2320481 Top H 2 Chipcap X5R 1U K 6V3 0603 0603C
C300 2320805 Top J 3 Chipcap X5R 100N K 10V 0402 0402C
C301 2320805 Top J 4 Chipcap X5R 100N K 10V 0402 0402C
C302 2320805 Top K 5 Chipcap X5R 100N K 1 0V 0402 0402C

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TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

C303 2320805 Top K 5 Chipcap X5R 100N K 1 0V 0402 0402C
C305 2320805 Top K 2 Chipcap X5R 100N K 1 0V 0402 0402C
C320 2320 778 Bottom J 5 Chipcap X7R 10% 16V 0402 0402C
C321 2320 778 Bottom J 4 Chipcap X7R 10% 16V 0402C
C322 2320 778 Top I 5 Chipcap X7R 10% 16V 0402C
C323 2320805 Top H 2 Chipcap X5R 100N K 10V 0402C
C324 2320 779 Bottom L 6 Chipcap X7R 100N K 16V 0603_BLM
C400 2320560 Top F 2 Chipcap 5% NP0 0402C
C401 2320560 Top F 2 Chipcap 5% NP0 0402C
C403 2320560 Top H 7 Chipcap 5% NP0 0402C
C500 2320548 Top C 9 Chipcap 5% NP0 0402 C
C501 2320546 Top D 9 Chipcap 5% NP0 0402C
C502 2320526 Top E 8 Chipcap +-0.25pF NP0 0402C
C503 2320560 Top E 9 Chipcap 5% NP0 0402C
C504 2320805 Top E 9 Chipcap X5R 100N K 10V 0402C
C505 2320560 Top G 9 Chipcap 5% NP0 0402C
C506 2320560 Top G 9 Chipcap 5% NP0 0402C
C50 7 2320778 Top D 9 Chipcap X7R 10% 16V 0402C
C550 2320536 Top C 8 Chipcap 5% NP0 0402 C
C551 2320524 Top D 8 Chipcap +-0.25pF NP0 0402C
C552 2320516 Top E 8 Chipcap +-0.25pF NP0 0402C
C553 2320536 Top E 8 Chipcap 5% NP0 0402C
C554 2320805 Top E 7 Chipcap X5R 100N K 10V 0402C
C555 2320560 Top G 8 Chipcap 5% NP0 0402C
C556 2320560 Top G 8 Chipcap 5% NP0 0402C
C557 2320536 Top D 8 Chipcap 5% NP0 0402C
C600 2320548 Top H 7 Chipcap 5% NP0 0402C
C601 2320554 Top G 8 Chipcap 5% NP0 0402C
C602 2320 778 Top I 7 Chipcap X7R 10% 16V 0402C
C603 2320 778 Top I 8 Chipcap X7R 10% 16V 0402C
C604 2320536 Top I 7 Chipcap 5% NP0 0402C
C605 2320805 Top H 9 Chipcap X5R 100N K 10V 0402C

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PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

C60 7 2314001 Top G 9 Chipcap NP0 470P J 6V3 0402C
C608 2320783 Top I 8 Chipcap X7R 33N K 10V 0402C
C609 2320562 Top I 8 Chipcap 5% NP0 0402C
C610 2320562 Top I 8 Chipcap 5% NP0 0402C
C611 2320783 Top I 8 Chipcap X7R 33N K 10V 0402C
C612 2320 778 Top I 9 Chipcap X7R 10% 16V 0402C
C613 2320805 Top H 9 Chipcap X5R 100N K 10V 0402C
C614 2320 778 Top I 8 Chipcap X7R 10% 16V 0402C
C615 2320558 Top H 9 Chipcap 5% NP0 0402C
C616 2320552 Top I 7 Chipcap 5% NP0 0402C
C617 2320552 Top I 7 Chipcap 5% NP0 0402C
C620 2320481 Top I 9 Chipcap X5R 1U K 6V3 0603C
C621 2320481 Top I 9 Chipcap X5R 1U K 6V3 0603C
C622 2320481 Top I 9 Chipcap X5R 1U K 6V3 0603C
C623 2320481 Top H 9 Chipcap X5R 1U K 6V3 0603C
C624 2314001 Top H 9 Chipcap NP0 470P J 6V3 040 2C
C625 2314001 Top H 9 Chipcap NP0 470P J 6V3 040 2C
C626 2314001 Top H 9 Chipcap NP0 470P J 6V3 040 2C
C650 2320554 Top K 7 Chipcap 5% NP0 0402C
C652 2320564 Top J 7 Chipcap 5% NP0 0402C
C653 2322015 Top J 6 Chipcap NP0 2N2 G 16V 0603C
C654 2320564 Top J 6 Chipcap 5% NP0 0402C
C655 2320481 Top K 6 Chipcap X5R 1U K 6V3 0603C
C657 2320520 Top K 7 Chipcap +-0.25pF NP0 0402C
C660 2320560 Top J 8 Chipcap 5% NP0 0402C
C661 2320 779 Top K 8 Chipcap X7R 100N K 16V 0603_BLM
C662 2320536 Top K 8 Chipcap 5% NP0 0402C
C699 2320518 Top F 7 Chipcap +-0.25pF NP0 0402C
C701 2320548 Top F 6 Chipcap 5% NP0 0402C
C70 2 2320548 Top F 7 Chipcap 5% NP0 0402 C
C703 2320554 Top F 7 Chipcap 5% NP0 0402C
C704 2320516 Top C 4 Chipcap +-0.25pF NP0 0402C

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Data Module RL7 PAMS Techn i cal Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

C705 2320548 Top F 7 Chipcap 5% NP0 0402C
C706 2320604 Top F 7 Chipcap 5% NP0 0402C
C707 2320518 Top F 8 Chipcap +-0.25pF NP0 0402C
C709 2312243 Top E 6 Chipcap X5R 4U7 K 6V3 0805C
C710 2320 778 Top B 4 Chipcap X7R 10% 16V 0402 0402C
C711 2320548 Top D 4 Chipcap 5% NP0 0402C
C712 2320778 Top D 4 Chipcap X7R 10% 16V 040 2 0402C
C713 2320540 Top E 6 Chipcap 5% NP0 0402C
C714 2320778 Top D 5 Chipcap X7R 10% 16V 040 2 0402C
C715 2320548 Top B 5 Chipcap 5% NP0 0402C
C716 2320548 Top C 7 Chipcap 5% NP0 0402C
C717 2320536 Top C 8 Chipcap 5% NP0 0402C
C718 2320778 Top C 7 Chipcap X7R 10% 16V 0402C
C719 2320778 Top C 7 Chipcap X7R 10% 16V 0402C
C720 2320 744 Top B 5 Chipcap X7R 10% 50V 0402C
C721 2320536 Top G 9 Chipcap 5% NP0 0402C
C722 2320536 Top G 8 Chipcap 5% NP0 0402C
C723 2320 744 Top G 6 Chipcap X7R 10% 50V 0402C
C724 2320548 Top B 7 Chipcap 5% NP0 0402 C
C726 2320508 Top G 7 Chipcap +-0.25pF NP0 0402C
C727 2320546 Top E 5 Chipcap 5% NP0 0402C
C728 2320 778 Top D 5 Chipcap X7R 10% 16V 0402C
C730 2320560 Top I 7 Chipcap 5% NP0 0402C
C731 2320524 Top E 7 Chipcap +-0.25pF NP0 0402C
C751 2320560 Top G 7 Chipcap 5% NP0 0402C
C752 2322023 Top G 7 Chipcap NP0 2N2 J 16V 0603C
C753 2320538 Top D 8 Chipcap 5% NP0 0402C
C754 2320538 Top D 7 Chipcap 5% NP0 0402C
C756 2320546 Top D 8 Chipcap 5% NP0 0402C
C759 2320546 Top C 7 Chipcap 5% NP0 0402 C
C780 2320548 Top C 9 Chipcap 5% NP0 0402 C
C781 2320548 Top B 9 Chipcap 5% NP0 0402C

Page 34 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

D100 4341053 Bottom I 4 6*BUFFER 1.65V 74LVC07A TSSOP_14
D101 4341053 Bottom F 3 6*BUFFER 1.65V 74LVC07A TSSOP_14
D102 4341307 Bottom I 3 74LVC244 8XBUFFER TSSOP_20
D103 4341243 Top E 1 NC7WZ16 2XBUFFER SC7 0-6 SC70_6_FAIR
D104 4341307 Bottom J 3 74LVC244 8XBUFFER TSSOP_20
D105 4341245 Top G 1 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR
D106 4341245 Top G 1 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR
D107 4341245 Bottom H 2 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR
D108 4341245 Bottom G 2 1XMUX/DEMUX 2:1 NC7SB3157 SC70_6_FAIR
D200 4370825 Top H 4 UEMK W-DOG ENA TO21 TFBGA168
D300 4370873 Top K 4 UPP8M V2.6 F751986E C035 uBGA144
D320 4340831 Bottom K 4 FLASH 2MX16 1,8V FBGA40
F100 5119002 Top M 2 Fuse 2A 32V SMD 1206_FUSE
F101 5119002 Top K 1 Fuse 2A 32V SMD 1206_FUSE
G650 4350243 Top J 7 VCO 3420-3840MHZ 2.7V 20MA VCO_GK_601MNA_2
G660 4510261 Top J 9 VCTCXO 26MHZ+-5PPM 2.7V GSM VCTCXO_KT16
L100 3203743 Bottom N 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L101 3203743 Bottom M 5 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L102 3203715 Bottom H 2 FERRITE BEAD 0R35 240R/100M FERRITE_BK1005
L103 3203715 Bottom G 2 FERRITE BEAD 0R35 240R/100M FERRITE_BK1005
L104 3203743 Bottom N 7 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L105 3640109 Bottom N 5 CHIP COIL 15U M 2.0A 12.95X9.4X3 COIL_DO3308
L106 3203743 Top N 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L107 3203743 Top M 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L108 3203743 Top J 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L109 3203743 Top J 1 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L110 3640475 Bottom O 3 CHOKE 10U M 0R16 1.1A 6.6X4.45 DT1608
L200 3203741 Top F 5 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM
L201 3203741 Top H 5 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM
L202 3203741 Top G 5 FERRITE BEAD 0R5 600R/100MHZ 0 0603_BLM
L203 3203741 Top F 5 FERRITE BEAD 0R5 600R/100MHZ 0 0603_BLM
L204 3203741 Top F 4 FERRITE BEAD 0R5 600R/100MHZ 0603_BLM

Issue 4 12/03 Nokia Corporation. Page 35

TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

L205 3203741 Top I 2 FERRITE BEAD 0R5 600R/10 0M HZ 0603_BLM
L500 3646091 Top E 9 CHIP COIL 6N8 J Q27/800M 0402 0402L
L501 3646067 Top G 9 CHIP COIL 18N J Q29/800M 0402 0402L
L502 3646091 Top D 9 CHIP COIL 6N8 J Q27/800M 0402 0402L
L503 3646065 Top D 9 CHIP COIL 12N J Q31/800M 0402 0402L
L550 3646053 Top E 8 CHIP COIL 4N7 +-0N3 Q28/800M 0402L
L551 3646091 Top G 8 CHIP COIL 6N8 J Q27/800M 0402 0402L
L552 3646047 Top D 8 CHIP COIL 3N3 +-0N3 Q28/800M 0402L
L700 3646053 Top G 7 CHIP COIL 4N7 +-0N3 Q28/800M 0402L
L701 3646053 Top G 6 CHIP COIL 4N7 +-0N3 Q28/800M 0402L
L702 3646051 Top G 7 CHIP COIL 3N9 +-0N3 Q28/800M 0402L
L703 3203743 Top E 5 FERR.BEAD 0R03 42R/100MHZ 3A 0805_BLM21
L704 3203715 Top B 4 FERRITE BEAD 0R35 240R/100M FERRITE_BK1005
L705 3646059 Top B 4 CHIP COIL 5N6 +-0N3 Q28/800M 0402L
L708 3645065 Top B 6 CHIP COIL 5N6 K Q98/1.5GHZ 0805 0805HQ
L750 4551015 Top C 7 DIR.COUP 897.5/1747.5/1880MHZ COUPLER_LDC15D
N100 4340663 Bottom L 2 LP2985 REG 3.3V 150A SOT23-5 SOT23_5_H1.45
N101 4341217 Top N 4 DC/DC CONTROL (MAX1653) QSOP16_H1.73
N10 2 434 1215 Bottom J 5 1XCOMP VREF=1.245 MAX9 1 8 SOT23_5_H1.45
N600 4370 781 Top H 8 HAGAR 5 LFBGA80 uBGA80_H1.7
N700 4350 297 Top C 6 PW AMP RF9203E10.1 900/1800

3.5V
R100 1430770 Bottom H 4 Resistor 5% 63mW 0402R
R101 1430770 Bottom H 4 Resistor 5% 63mW 0402R
R10 2 1430770 Bottom H 4 Resistor 5% 63mW 0402R

E5_H1.65

R103 1430770 Bottom I 5 Resistor 5% 63mW 0402R
R104 1430770 Bottom J 4 Resistor 5% 63mW 0402R
R105 1430770 Bottom J 4 Resistor 5% 63mW 0402R
R106 1430770 Bottom G 3 Resistor 5% 63mW 0402R
R107 1430770 Bottom G 3 Resistor 5% 63mW 0402R
R108 1430770 Bottom E 2 Resistor 5% 63mW 0402R
R109 1430770 Bottom G 2 Resistor 5% 63mW 0402R

Page 36 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

R110 1430726 Bottom A 4 Resistor 5% 63mW 0402R
R111 1430740 Bottom A 4 Resistor 5% 63mW 0402R
R112 1430726 Bottom C 4 Resistor 5% 63mW 0402R
R113 1430740 Bottom C 4 Resistor 5% 63mW 0402R
R114 1430726 Bottom B 4 Resistor 5% 63mW 0402R
R115 1430740 Bottom B 4 Resistor 5% 63mW 0402R
R116 1430754 Bottom E 3 Resistor 5% 63mW 0402R
R117 1430770 Bottom J 5 Resistor 5% 63mW 0402R
R118 1430873 Bottom I 5 CHIPRES 0W06 27K F 0402 0402R
R119 1430907 Bottom I 5 CHIPRES 0W06 11K F 0402 0402R
R125 1430 762 Top G 2 Resistor 5% 63mW 0402R
R129 1430 762 Top G 1 Resistor 5% 63mW 0402R
R131 1430 714 Bottom G 3 Resistor 5% 63mW 0402R
R132 1430714 Bottom G 3 Resistor 5% 63mW 0402R
R134 1414655 Bottom N 7 CHIPRES 0W125 0R10 J 0805 0805R
R135 1430796 Bottom E 2 Resistor 5% 63mW 0402R
R137 1414655 Bottom O 7 CHIPRES 0W125 0R10 J 0805 0805R
R141 1430804 Top K 2 Resistor 5% 63mW 0402R
R142 1430 796 Top K 2 Resistor 5% 63mW 0402R
R143 1430 770 Top J 1 Resistor 5% 63mW 0402R
R144 1430121 Top N 5 Chipres 0W06 22k F 200ppm 0402 0402R
R145 1430187 Top N 5 Chipres 0W06 47k F 200ppm 0402 0402R
R146 1825005 Bottom N 1 CHIP VARISTOR VWM14V VC30V 0805_VARISTOR_SIOV
R147 1825033 Bottom H 2 CHIP VARISTOR VW14V VC46V 0402 0402_VAR
R148 1825033 Bottom G 2 CHIP VARISTOR VW14V VC46V 0402 0402_VAR
R149 1430 778 Top E 2 Resistor 5% 63mW 0402R
R150 1430 796 Top O 5 Resistor 5% 63mW 0402R
R151 1430690 Top J 2 Chipres 0W06 jumper 0402 0402R
R153 1430 770 Top I 3 Resistor 5% 63mW 0402R
R154 1430 796 Top I 3 Resistor 5% 63mW 0402R
R155 1430770 Bottom K 3 Resistor 5% 63mW 0402R
R156 1430911 T o p I 2 Resistor 1% 63mW 0402R

Issue 4 12/03 Nokia Corporation. Page 37

TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

R157 1430911 T o p I 2 Resistor 1% 63mW 0402R
R158 1430911 T o p J 3 Resistor 1% 63mW 0402R
R159 1430911 T o p I 2 Resistor 1% 63mW 0402R
R160 1430911 T o p I 3 Resistor 1% 63mW 0402R
R161 1430911 T o p I 3 Resistor 1% 63mW 0402R
R162 1430726 Bottom H 2 Resistor 5% 63mW 0402R
R163 1430726 Bottom G 2 Resistor 5% 63mW 0402R
R164 1430690 Top O 4 Chipres 0W06 jumper 0402 0402R
R202 1620067 Top I 3 RES NETWORK 0W06 4X100K J MNR0804
R204 1430215 Top J 3 CHIPRES 0W06 68K F 200PPM 0402R
R205 1430790 Bottom G 3 Resistor 5% 63mW 0402R
R206 4120071 Bottom A 6 ASIP EMIF03-SIM01 SIM FILTER uBGA8
R20 7 1430778 Bottom H 6 Resistor 5% 63mW 0402R
R320 1430770 Bottom L 6 Resistor 5% 63mW 0402R
R400 1430 778 Top F 2 Resistor 5% 63mW 0402R
R401 1430 778 Top F 2 Resistor 5% 63mW 0402R
R403 1430 726 Top H 7 Resistor 5% 63mW 0402R
R500 1430 726 Top E 9 Resistor 5% 63mW 0402R
R501 1430 700 Top E 9 Resistor 5% 63mW 0402R
R502 1430832 Top D 9 Resistor 5% 63mW 0402R
R520 1430830 Bottom D 2 Resistor 5% 63mW 0402R
R551 1430 700 Top E 7 Resistor 5% 63mW 0402R
R558 1430832 Top D 8 Resistor 5% 63mW 0402R
R600 1620081 Top I 9 RES NETWORK 0W03 4X22R J 0804 MNR04
R602 1430 770 Top I 9 Resistor 5% 63mW 0402R
R603 1430846 Top G 8 Resistor 1% 63mW 0402R
R604 1430 770 Top H 9 Resistor 5% 63mW 0402R
R606 1430 784 Top H 9 Resistor 5% 63mW 0402R
R60 7 1620033 Top I 7 RES NETWORK 0W06 2X5K6 J 0404 0404_R
R608 1620033 Top I 7 RES NETWORK 0W06 2X5K6 J 0404 0404_R
R610 1430 700 Top I 7 Resistor 5% 63mW 0402R
R650 1430137 Top J 6 CHIPRES 0W06 1K0 F 200PPM 0402 0402R

Page 38 Nokia Corporation. Issue 4 12/03

Company Confidential TME-3

PAMS Technical Documentation Data Module RL7

Table 11: Parts list RL7_11

Item Code Side Coordinates Part data Part name, t ype

R651 1430907 Top J 6 CHIPRES 0W06 11K F 0402 0402R
R652 1430 700 Top K 7 Resistor 5% 63mW 0402R
R660 1430 762 Top J 8 Resistor 5% 63mW 0402R
R661 1430 774 Top K 8 Resistor 5% 63mW 0402R
R700 1620121 Top G 7 RES NETWORK 0W06 2X220R J MNR02_SR 0404
R701 1620121 Top F 7 RES NETWORK 0W06 2X220R J MNR02_SR 0404
R703 1430 714 Top D 7 Resistor 5% 63mW 0402R
R704 1430 718 Top C 7 Resistor 5% 63mW 0402R
R705 1620515 Top C 4 RES NETWORK 0W04 1DB ATT 0404_RAC10
R706 1430693 Top G 6 Chipres 0W06 5R6 J 0402 0402R
R707 1430693 Top G 7 Chipres 0W06 5R6 J 0402 0402R
R709 1430 734 Top B 7 Resistor 5% 63mW 0402R
R751 1430 770 Top D 7 Resistor 5% 63mW 0402R
R752 1430 788 Top H 7 Resistor 5% 63mW 0402R
R753 1430 770 Top D 8 Resistor 5% 63mW 0402R
R754 1430 726 Top D 7 Resistor 5% 63mW 0402R
R755 1430 718 Top C 8 Resistor 5% 63mW 0402R
R756 1430 770 Top H 6 Resistor 5% 63mW 0402R
R757 1430 778 Top D 7 Resistor 5% 63mW 0402R
R780 1430 700 Top B 9 Resistor 5% 63mW 0402R
R781 1430 700 Top B 9 Resistor 5% 63mW 0402R
T650 3640423 Top I 8 BALUN TRANS 3.7GHZ+/-300MHZ TRANS_LDB15 0805
T700 4550137 Top F 7 TRANSF BALUN 1.8GHZ+-100MHZ TRANS_LDB15 2x1.3
V100 4864511 Top A 7 LED MUW GRN/RED 570/620NM LED_SML_521
V101 4864511 Top A 5 LED MUW GRN/RED 570/620NM LED_SML_521
V102 4864511 Top A 4 LED MUW GRN/RED 570/620NM LED_SML_521
V103 4210043 Bottom B 4 TR DTC143ZE RB=4K7 RBE=47K EM3
V104 4210043 Bottom C 4 TR DTC143ZE RB=4K7 RBE=47K EM3
V105 4210043 Bottom C 4 TR DTC143ZE RB=4K7 RBE=47K EM3
V106 4210043 Bottom A 4 TR DTC143ZE RB=4K7 RBE=47K EM3
V107 4210043 Bottom B 4 TR DTC143ZE RB=4K7 RBE=47K EM3
V108 4210043 Bottom A 4 TR DTC143ZE RB=4K7 RBE=47K EM3

Issue 4 12/03 Nokia Corporation. Page 39

TME-3 Company Confidenti al

Data Module RL7 PAMS Techn i cal Documentation

Table 11: Parts list RL7_11

Item Code Side Coordinates Pa rt data Part name, type

V109 4110074 Bottom O 1 SCH DI 40V 3A SOD6
V110 411007 8 Top M 4 S LHDIx 2 70mA SOT323
V111 4211321 Bottom M 3 MFET FDS6912A N 30V 6A 0R035 SO8N2
V112 4211391 Top K 1 MFET P FDC6323L SWITCH 3-8V TSOP_6
V114 4110074 Bottom M 5 SCH DI 40V 3A SOD6
V115 4110078 Top E 2 SLHDIx2 70mA SOT323
V120 4110078 Bottom K 3 SLHDIx2 70mA SOT323
V200 4219926 Bottom I 5 TR+RX2 RN1302 N 50V 50MA 10K SOT323
V201 4219926 Bottom H 5 TR+RX2 RN1302 N 50V 50MA 10K SOT323
V500 4210277 Top D 9 TR BGB420 MIRROR ADJ BIAS SOT343_R
V550 421026 1 Top D 8 TR BGA428 LNA1.8GHZ 19.5DB SOT_363
V750 4110079 Top D 7 SCH DIX2 HSMS282C 15V <1PF SOT323
X100 5409003 Top N 2 SMD JACK 3.0MM F DC 9V 1A SMK_JACK_SWITCH
X101 5400225 Bottom H 1 SM PIN HEADER 2X25M P1.27MM

STR
X200 5409201 Bottom C 6 SM SIM CONN 2X3POL SK51002_001
X502 5429017 Bottom C 3 SM CONN RF PLUG+SW 3GHZ 1W

90DEG
Z100 4120051 Top I 1 EMI ESD FILT10CH IP4026CX25 uBGA_25_P0.75
Z101 4120051 Top F 1 EMI ESD FILT10CH IP4026CX25 uBGA_25_P0.75
Z500 4512133 Top B 8 ANT.SWIT.880-960/1710-1990MHZ 7x5 UM_0318C1
Z501 4511235 Top F 9 SAW FILT 942.5+-17.5MHZ/3.8DB 3x3 DCC6D_H1.15
Z520 4511181 Top D 9 Filter SAW 925-960/1805-1880

MHZ
Z551 4511241 Top F 8 SAW FILT 1842.5+-37.5MHZ/3.5DB 3x3 DCC6D_H1.15
Z700 4511237 Top F 7 SAW FILT 897.5+-17.5MHZ/4.2DB 3x3 DCC6D_H1.15

SAMTEC_ASP_67923_0
2

SWITCH_SHALTER

QCC8B_4.0X4.0

Page 40 Nokia Corporation. Issue 4 12/03