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Table of Contents
Page No
Electronics of Nokia 1100.............................................................................................. 8
Environmental Specifications .....................................................................................8
Baseband HW Introduction ........................................................................................8
Technical Summary .....................................................................................................8
Modes of Operation ...................................................................................................10
No supply ................................................................................................................ 10
Power_off................................................................................................................ 10
Acting Dead............................................................................................................. 11
Active...................................................................................................................... 11
Sleep mode.............................................................................................................. 12
Charging.................................................................................................................. 12
DC Characteristics .....................................................................................................13
Supply Voltage Ranges........................................................................................... 13
Regulators’ Voltage Ranges.................................................................................... 14
Interconnection Diagram ...........................................................................................15
External Signals and Connections .............................................................................15
System connector (X102)........................................................................................ 15
Battery connector .................................................................................................... 16
Baseband – RF interface ......................................................................................... 17
Internal Signals and Connections ..............................................................................17
Audio....................................................................................................................... 17
Baseband board clocks............................................................................................ 18
Functional Description................................................................................................. 19
Audio External ...........................................................................................................19
Audio Internal ......................................................................................................... 19
Earpiece................................................................................................................... 19
Microphone ............................................................................................................. 20
Buzzer...................................................................................................................... 21
Flashlight................................................................................................................. 21
Batteries .....................................................................................................................22
Keyboard...................................................................................................................... 23
Display & Keyboard Backlight............................................................................... 24
Keyboard light......................................................................................................... 24
Display .......................................................................................................................24
Memory Module ........................................................................................................25
SIM Interface .............................................................................................................25
Vibra........................................................................................................................ 25
Test Interfaces ............................................................................................................26
Connections to Baseband ...........................................................................................26
FBUS Interface........................................................................................................ 26
MBUS Interface ...................................................................................................... 26
General description of the RF circuits ......................................................................... 27
Receiver signal path ...................................................................................................27
Transmitter signal path ..............................................................................................28
PLL ............................................................................................................................28
Power Supply .............................................................................................................30
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Abbreviations
Abbr. Description
ACI Accessory Control Interface
ADC Analog Digital Connector
ARM Advanced RISC Machines
ASIC Application Specific Integrated Circuit
ATR Answer To Reset
BB Baseband
BL-5C Battery type.
BSI Battery Size Indicator
Cbus Control bus (internal phone interface between UPP-UEM)
CCS Customer Care Service
CPH Copenhagen, Denmark
CTI Cover Type Indicator
CTSI Clock Timing Sleep and Interr up t
Dbus DSP controlled bus (Internal phone interface between UPP-UEM)
DC Direct Current
DCT4.0 Digital Core Technology, generation 4.0
DSP Digital Signal Processor
DUT Device under test
EAD External Accessory Detection
EMC Electro Magnetic Compatibility
ESD Electro Static Discharge
Fbus Fast Bus, asynchronous message bus connected to DSP (communications bus)
FCI Functional cover interface
FPC Flexible printed circuit
FR Full Rate
GENIO General Purpose Input/Output
GSM Global System Mobile
HW Hardware
IF Interface
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IHF Integrated Hands Free
IMEI International Mobile Equipment Identity
Jannette DCT3.x accessory program
LCD Liquid Crystal Display
LDO Low Drop Out
LED Light Emitting Diode
Li-Ion Lithium Ion battery
Lion Battery program
LN Lotus Notes
LPRF Low Power Radio Frequency
Lynx Battery type, Lion program, Salo – Finland
MALT Medium And Loud Transducer
Maxwell GSM phone program
Mbus Asynchronous message bus connected to MCU (phone control interface). Slow
message bus for control data.
MCU Micro Controller Unit
NO_SUPPLY UEM state where UEM has no supply what so ever
NRT Nokia Ringing Tones
NTC Negative temperature Coefficient, temperature sensitive resistor used as a tem-
perature sensor.
PA Power Amplifier (RF)
PDA Personal Digital Assistant
PDM Pulse Density Modulation
PDRAM Program/Data RAM
Phoenix SW tool of DCT4.x
Pippi Hdb12, Phone program (3510)
PLL Phase locked loop
PnPHF Plug and Play Handsfree
PUP General Purpose IO (PIO), USARTS and Pulse Width Modulators
PWB Printed Wired Board
PWR_OFF UEM state where phone is off
PWRONX Signal from power on key.
R&D Research and development
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RESET UEM state where regulators are enabled
RTC UEM internal Real Time Clock
SARAM Single Access RAM
SIM Subscriber Identification Module
SLEEP UEM power saving state controlled by UPP
SPR Standard Product Requirements
SRAM Static RAM
STI Serial Trace Interface
SW Software
TBSF Through the Board Side Firing
TDB To Be Defined
TI Texas Instruments
UEM Universal Energy Management
UI User Interface
UPP Universal Phone Processor
VBAT Main battery voltage
VCHAR Charger input voltage
VCHARDET Charger detection threshold level
VMSTR+,
VMSTR
Master Reset threshold level
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Electronics of Nokia 1100
Environmental Specifications
Table 1: Environmental specifications
Parameter Ambient temperature Remarks
Normal operation -25 ° C … +55 °C Specifications fulfilled
Reduced performance -40 °C ..-25 °C
and +55 °C … +85 °C
No operation and/or storage
Humidity Relative humidity
< -40 °C or > +85 °C No storage or operation. An attempt to operate may
5...95%.
Baseband HW Introduction
This document specifies the baseband module for the Nokia 1100. The baseband module
includes the baseband engine chipset, the UI components and the acoustical parts for
the transceiver.
Nokia 1100 is a hand-portable dualband 900/1800MHz or 850/1900MHz phone, featuring the DCT4 generation baseband (UEM/UPP) and RF (MJOELNER) circuitry.
Technical Summary
The baseband module contains 2 main ASICs named the UEM and UPP. The baseband
module furthermore contains a Flash IC of 16Mbit. The baseband is based on the DCT4
damage the phone permanently
The module is not protected against water. Con-
densed or splashed water might cause malfunction.
Any submerge of the phone will cause permanent
damage. Long-term high humidity, with condensation, will cause permanent damage because of corrosion.
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engine program.
PA Supply
RF Supplies
RF RX/TX
SIM
Flashlight
EAR
MIC
speaker
Buzzer
UI
Battery
Baseband
UEM
External Audio
Charger connection
DLIGHT
SLEEPCLK
32kHz
CBUS/
DBUS
BB
Supplies
Mjoelner
26MHz
UPP
RFBUS
FLASH
MEMADDA
M
VIBRA
DCT4 Janette connector
MBus/FBus
Figure 1: Baseband block diagram
The UEM supplies both the baseband module as well as the RF module with a series of
voltage regulators. Both the RF and Baseband modules are supplied with regulated voltages of 2.78 V and 1.8V. UEM includes 6 linear LDO (low drop-out) regulators for baseband and 7 regulators for RF. The UEM is furthermore supplying the baseband SIM
interface with a programmable voltage of either 1.8 V or 3.0 V. The core of the UPP is
supplied with a programmable voltage of 1.0 V, 1.3 V, 1.5 V or 1.8 V.
UPP operates from a 26MHz clock, coming from the RF ASIC MJOELNER, the 26 MHz
clock is internally divided by two, to the nominal system clock of 13MHz. DSP and MCU
contain phase locked loop (PLL) clock multipliers, which can multiply the system.
The UEM contains a real-time clock, sliced down from the 32768 Hz crystal oscillator.
The 32768 Hz clock is fed to the UPP as a sleep clock.
The communication between the UEM and the UPP is done via the bi-directional serial
busses CBUS and DBUS. The CBUS is controlled by the MCU and operates at a speed of 1
MHz set by SW. The DBUS is controlled by the DSP and operates at a speed of 13 MHz.
Both processors are located in the UPP.
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