This document contains the Nokia 1100 troubleshooting diagrams.
Test points are described and listed in the A3 schematic diagrams.
Troubleshooting diagrams
In this section, Troubleshooting diagrams is provided for the most common problems of
the Nokia 1100
NOTE : Since both D200 (UEM) and D400(UPP) are underfilled, they can not be replaced.
If either D200 or D400 is defective, the whole PWB has be discarded.
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Phone is dead
This means that the phone do not draw any current at all when supply is connected and/
or powerkey is pressed.
It is assumed that the voltage supplied is 3.6 VDC. The UEM will prevent any functionality what so ever at battery/supply levels below 2.9 VDC.
Phone is dead
Yes
CCS Technical Documentation
X105
VBAT = 3,6VDC
Yes
L260,L261,L262,L263,L264,L265
C260,C261,C262,C263,C264,C265
Voltage = 3,6VDC
Yes
J404
Sleep-clock is
32.768 kHz, 1,8Vpp
Yes
J402
PURX = 1,8VDC,
1 sec. after power-key
is pressed
Yes
C227
VR3 = 2,78VDC
No
No
No
No
No
Check :
X105
Check :
L260,L261,L262,L263,L264,L265
C260,C261,C262,C263,C264,C265
Check :
B200, C209, C210, PW B. Else
defective D200*
Check :
PWB.
Else defective D200*
Check :
C227, PWB.
Else defective D200*
Yes
26 MHz clock min. 300mVACpp,
R426
probe Cin=10-13 pF/10M
Yes
No
Check :
C227, PWB.
Else defective D200*
Check :
D450 (Flash).
Else defective D200*
Figure 1: Phone is dead troubleshooting
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CCS Technical Documentation
Flash programming do not work
The flash programming can only be done via the pads on the PWB (J396).
In case of Flash failure in FLALI station, problem is most likely related to SMD problems.
Possible failures could be short-circuit of balls under µBGAs (UEM, UPP, FLASH). Missing
or misaligned components.
In flash programming error cases the flash prommer can give some information about a
fault.
The fault information messages could be:
- Phone doesn't set FBUS_TX line low
Because of the use of uBGA components it is not possible to verify if there is a short cir-
cuit in control- and address lines of MCU (UPP) and memory (flash).
Flash prgramming
do not work
Error fro m prom mer:
"Phone doesn't set
FBUS_T X line low"
Yes
J396, R108
Check connection between
pad 1,2 & 3 on J396
and R108
Yes
J409, J410, J411, J412
Voltage level at 1,8VDC
Yes
Try re a d in g MCU ID
with Phoenix.
Reading OK?
Yes
Try reading Flash ID
with Phoenix.
Reading OK?
No
No
No
No
Check :
R108, PW B
Check :
PWB.
Else defective D200*
Check :
PWB.
Else defictive D4 00*
Check :
Replace D450
Yes
Reflash phone
Figure 2: Flash programming fault
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Power does not stay on or phone is jammed
If this kind of failure is presenting itself immediately after FLALI, it is most likely caused
by ASICs missing contact with PWB.
If for some reason the MCU does not service the watchdog register within the UEM, the
operations watchdog will run out after approximately 32 seconds. Unfortunately, the
service routine can not be measured.
Power doesn't stay on,
or phone is jammed
CCS Technical Documentation
J404
Sleep clock = 32.768 kHz,
1.8Vpp
Yes
J402
PURX = 1,8VDC,
1 sec. after power-key is
pressed
Yes
UI functionality,
and keys react
to pressure?
Yes
R426
26 MHz clock min.
300mVACpp,
probe Cin=10-13 pF/10M
No
No
No
No
Check :
B200, C209, C210, PW B.
Else defective D200*
Check :
PWB.
Else defictive D200*
Check :
D450, Keymat,
Lightguide, PWB .
Else defective D400*
Check :
C420, C426, R420,
R426, N600(Mjoelner)
Yes
Reflash phone
Figure 3: Phone jammed troubleshooting
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CCS Technical Documentation
Display information : "Contact Service"
This error can only happen at power up where several self-tests is run. If any of these test
cases fails the display will show the message: "Contact Service".
It's individual test cases so the below lineup of error hunting's has no chronological
order. Use common sense and experience to decide which test case to start error hunting
at.
Display shows
"Contact Service"
Yes
EarDa & MicDa
between
UPP and UEM?
MBUS interface
between
UPP and UEM?
AuxDa & UEMInt
between
UPP and UEM?
SleepX & SleepClk
between UPP & UEM?
TXI/QD & RXI/QD?
SIM interface between
UPP & UEM
No
Check :
PWB.
Else defecti v e D20 0*
or D400*
Key is stucked
Flash checksum
!ASIC version vs. compilation flag, PMM checksum
!PMM validity
!Warrenty Information State
!SIM-Lock
Check :
A-cover, Keymat, Lightguide,
PWB.
Reflash phone
Check :
PWB.
Else defective D450 (FLASH)
Figure 4: Troubleshooting when Contact Service message seen
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CCS Technical Documentation
The phone do not register to the network, or the phone cannot make a call
If the phone doesn't register to the network, the fault can be in either BB or RF. Only few
signals can be tested since several signals is 'burried' in one or more of the inner layers of
the PWB.
First of all check that SIM LOCK is not causing the error by using a Test-SIM card and
connect the phone to a tester.
Phone do not register to
network
or phone cannot make a ca ll
C222, C223, C224, C225,
C226, C227
Voltage = ~2,78VDC
All during GSM frame-
call mode.
Use TXP on C646 as trigger
Yes
C230, C231
Voltage = ~1,35VDC
All during GSM frame (call mode)
Use TXP on C646 as trigger
Yes
J421, J422, J423
Check RF serial bus during
GSM-frame :
Logic HIGH = 1,8VDC
Logic LOW = 0V DC
RFBUSC LK (J421),
RFBUSD A (J422),
RFBUSEN1X (J423)
Yes
R601, R603
Check analog signals during
GSM-frame (RX slot):
RXIP/N (R601) = 0-1,45VDC
RXQP/N (R603) = 0-1,45VDC
Check :
No
C222,C223, C224, C225,
C226, C 227 , P WB .
Else defective D200 or D400*
Check :
No
C230, C 231 , P WB .
Else defective
D200* or D400*
Check :
No
Else defective D200*
Check :
No
Else defective D200*
PWB.
or D400*
PWB.
or D400*
Yes
R610, R611
Check analog signals during
GSM-frame (TX slot):
TXIP/N (R610) = 1-1,75VDC
TXQP/N (R611) = 1-1,75VDC
Yes
No
Check :
R610, R 611 ,P WB .
Else defective D200*
or D400*
Check RF
Figure 5: No call troubleshooting
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CCS Technical Documentation
SIM related faults
Insert SIM card fault
The hardware of the SIM interface from UEM (D200) to the SIM connector (X387) can be
tested without a SIM card. When the power is switched on the phone first check for a
1,8V SIM card and then a 3V SIM card. The phone will try this four times, whereafter it
will display ”Insert SIM card”.
Display shows :
"Insert SIM Card"
Yes
Verify that phone checks for
1,8V-SIM, and then 3V-SIM
Check for SIM voltage during power-up
Ch1 : VSIM
Ch2 : RESET
X387
during power-up.
(See illustration below)
Yes
SIM Interface OK
Figure 6: SIM troubleshooting
No
Ch3 : CLOCK
Ch4 : DATA
Check :
X387, R386, PWB.
Else defective D200*
Figure 7: Signal diagram
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SIM-Card rejected
The error ”SIM card rejected” means that the ATR message received from SIM card is corrupted, e.g. data signal levels are wrong. The first data is always ATR and it is sent from
card to phone.
For reference a picture with normal SIM power-up is shown below.
Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or "LF".
•RF measurements are done with a Spectrum Analyser and a high-frequency 500
ohm passive probe, for example HP54006A. (Note that when measuring with the
500 ohm probe the signal will be around 20 dB attenuated. The values in the following will have these 20 dB subtracted and represent the real value seen on the
spectrum analyser).
Note that the testjig have some losses which must be taken into consideration when calibrating the
test system.
•LF (Low frequency) and DC measurements should be done with a 10:1 probe and
an oscilloscope. The probe used in the following is 10MW/8pF passive probe. If
using another probe then bear in mind that the voltages displayed may be
slightly different.
Always make sure the measurement set-up is calibrated when measuring RF parameters
on the antenna pad. Remember to include the loss in the module repair jig when
realigning the phone.
Most RF semiconductors are static discharge sensitive. So ESD protection must be
applied during repair (ground straps and ESD soldering irons). Mjoelner and Bifrost is
moisture sensitive so parts must be pre-baked prior to soldering.
Apart from key-components described in this document there are a lot of discrete components (resistors, inductors and capacitors) for which troubleshooting is done by checking if soldering of the component is done properly and checking if the component is
missing from PWB. Capacitors can be checked for short-circuiting and resistors for value
by means of an ohmmeter, but be aware in-circuit measurements should be evaluated
carefully.
In the following both the name EGSM and GSM850 will be used for the lower band and
both PCN and GSM1900 will be used for the upper band.