National Semiconductor MM54HC51, MM54HC58, MM74HC51, MM74HC58 Service Manual

Page 1
MM54HC51/MM74HC51 Dual AND-OR-Invert Gate MM54HC58/MM74HC58 Dual AND-OR Gate
January 1988
MM54HC51/MM74HC51 Dual AND-OR-Invert Gate
MM54HC58/MM74HC58 Dual AND-OR Gate
General Description
These gates utilize advanced silicon-gate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low power consumption of standard CMOS integrated circuits. All gates have buffered outputs, providing high noise immunity and the ability to drive 10 LS-TTL loads. The 54HC/74HC logic family is functionally as well as pin-out compatible with the standard 54LS/74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to V
and ground.
CC
Connection Diagrams
Dual-In-Line Package
Top View
Order Number MM54HC51 or MM74HC51
Features
Y
Typical propagation delay: 10 ns
Y
Wide power supply range: 2 –6V
Y
Low quiescent supply current: 20 mA maximum (74 Series)
Y
Low input current: 1 mA maximum
Y
High output current: 4 mA minimum
TL/F/5302– 1
Dual-In-Line Package
Top View
Order Number MM54HC58 or MM74HC58
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
TL/F/5302
TL/F/5302– 2
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Power Dissipation (PD)
(Note 3) 600 mW
Supply Voltage (V
)26V
CC
DC Input or Output Voltage 0 V
(V
IN,VOUT
)
Operating Temp. Range (T
MM74HC MM54HC
Input Rise or Fall Times
e
2.0V(tr,tf) 1000 ns
V
CC
e
V
4.5V 500 ns
CC
e
V
6.0V 400 ns
CC
S.O. Package only 500 mW
Lead Temp. (T
) (Soldering 10 seconds) 260§C
L
DC Electrical Characteristics (Note 4)
Symbol Parameter Conditions V
CC
A
e
T
25§C
Typ Guaranteed Limits
V
IH
Minimum High Level 2.0V 1.5 1.5 1.5 V Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
V
IL
Maximum Low Level 2.0V 0.5 0.5 0.5 V Input Voltage** 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
V
OH
Minimum High Level V Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA 2.0V 2.0 1.9 1.9 1.9 V
l
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
OL
Maximum Low Level V Output Voltage
IL
s
4.0 mA 4.5V 4.2 3.98 3.84 3.7 V
l
s
5.2 mA 6.0V 5.7 5.48 5.34 5.2 V
l
VIHor V
IL
s
20 mA 2.0V 0 0.1 0.1 0.1 V
l
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V I
**V
Maximum Input V Current
Maximum Quiescent V Supply Current I
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA 4.5V 0.2 0.26 0.33 0.4 V
l
s
5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
l
VCCor GND 6.0V
g
0.1
VCCor GND 6.0V 2.0 20 40 m A
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC 54HC
eb
T
40 to 85§CT
A
g
1.0
Min Max Units
)
A
b b
40 55
eb
A
55 to 125§C
g
a
a
1.0 mA
CC
85
125
V
C
§
C
§
Units
2
Page 3
AC Electrical Characteristics V
CC
e
Symbol Parameter Conditions Typ
t
PHL,tPLH
Maximum Propagation 10 20 ns Delay
5V, T
e
A
25§C, C
Guaranteed
e
L
Limit
15 pF, t
e
r
e
t
f
Units
6ns
AC Electrical Characteristics V
e
2.0V to 6.0V, C
CC
Symbol Parameter Conditions V
t
PHL,tPLH
t
TLH,tTHL
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Propagation 2.0V 63 125 158 186 ns Delay 4.5V 13 25 32 37 ns
Maximum Output Rise 2.0V 30 75 95 110 ns and Fall Time 4.5V 8 15 19 22 ns
Power Dissipation (per AND-OR-Gate) 20 pF Capacitance (Note 5)
Maximum Input 5 10 10 10 pF Capacitance
e
D
CC
e
L
e
T
25§C
A
50 pF, t
e
e
t
6 ns (unless otherwise specified)
r
f
74HC 54HC
eb
T
40 to 85§CT
A
A
eb
55 to 125§C
Typ Guaranteed Limits
6.0V 11 21 27 32 ns
6.0V 7 13 16 19 ns
2
CPDV
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
Units
3
Page 4
Physical Dimensions inches (millimeters)
Order Numbers MM54HC51J, MM54HC58J, MM74HC51J, MM74HC58J
NS Package J14A
MM54HC58/MM74HC58 Dual AND-OR Gate
MM54HC51/MM74HC51 Dual AND-OR-Invert Gate
Order Numbers MM74HC51N, MM74HC58N
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user.
NS Package N14A
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