National Semiconductor MM54HC173, MM74HC173 Service Manual

MM54HC173/MM74HC173 TRI-STATE
General Description
The four D TYPE FLIP-FLOPS operate synchronously from a common clock. The TRI-STATE outputs allow the device to be used in bus organized systems. The outputs are placed in the TRI-STATE mode when either of the two out­put disable pins are in the logic ‘‘1’’ level. The input disable allows the flip-flops to remain in their present states without having to disrupt the clock. If either of the 2 input disables are taken to a logic ‘‘1’’ level, the Q outputs are fed back to
Quad D Flip-Flop
É
January 1988
the inputs, forcing the flip flops to remain in the same state. Clearing is enabled by taking the CLEAR input to a logic ‘‘1’’ level. The data outputs change state on the positive going edge of the clock.
The 54HC/74HC logic family is functionally as well as pin­out compatible with the standard 54LS/74LS logic family. All inputs are protected from damage due to static dis­charge by internal diode clamps to V
and ground.
CC
Features
Y
Typical propagation delay: 18 ns
Y
Wide operating supply voltage range: 2 –6V
Y
TRI-STATE outputs
Y
Low input current: 1 mA maximum
Y
Low quiescent supply current: 80 mA maximum (74HC)
Y
High output drive current: 6 mA minimum
MM54HC173/MM74HC173 TRI-STATE Quad D Flip-Flop
Connection Diagram
Dual-In-Line Package
Top View
Order Number MM54HC173 or MM74HC173
TL/F/5317– 1
Truth Table
Inputs
Clear Clock
HX X X X L LL X XXQ L L L
L When either M or N (or both) is (are) high the out­put is disabled to the high-impedance state: how­ever, sequential operation of the flip-flops is not affected.
Hehigh level (steady state)
e
L
low level (steady state)
e
low-to-high level transition
u
e
X
don’t care (any input including transitions)
e
Q
the level of Q before the indicated steady state input condi-
O
tions were established
Data Enable Data
G1 G2 D
HXXQ
u
XHXQ
u
LLLL
u
LLHH
u
Output
Q
0
0
0
TRI-STATE
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
is a registered trademark of National Semiconductor Corp.
É
TL/F/5317
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
)
b
0.5 toa7.0V
b
1.5 to V
b
CC
0.5 to V
CC
b
65§Ctoa150§C
a
a
g
g
g
1.5V
0.5V
20 mA
35 mA
70 mA
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
Supply Voltage (V
)26V
CC
DC Input or Output Voltage 0 V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf) 1000 ns
CC
e
V
4.5V 500 ns
CC
e
V
6.0V 400 ns
CC
Power Dissipation (PD)
(Note 3) 600 mW S.O. Package only 500 mW
Lead Temperature (T
(Soldering 10 seconds) 260
)
L
C
§
DC Electrical Characteristics (Note 4)
Symbol Parameter Conditions V
CC
A
e
T
25§C
Typ Guaranteed Limits
V
Minimum High Level 2.0V 1.5 1.5 1.5 V
IH
Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
V
Maximum Low Level 2.0V 0.5 0.5 0.5 V
IL
Input Voltage** 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
V
Minimum High Level V
OH
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA 2.0V 2.0 1.9 1.9 1.9 V
l
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
Maximum Low Level V
OL
Output Voltage
IL
s
6.0 mA 4.5V 3.98 3.84 3.7 V
l
s
7.8 mA 6.0V 5.48 5.34 5.2 V
l
VIHor V
IL
s
20 mA 2.0V 0 0.1 0.1 0.1 V
l
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
OZ
I
CC
Maximum Input V Current
Maximum TRI-STATE V Output Leakage EnableeV
Maximum Quiescent V Supply Current I
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
I
OZ
**V
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
g
and VILoccur at V
IH
e
IN
OUT
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
6.0 mA 4.5V 0.26 0.33 0.4 V
l
s
7.8 mA 6.0V 0.26 0.33 0.4 V
l
VCCor GND 6.0V
e
VCCor GND 6.0V
IH
g
0.1
g
0.5
VCCor GND 6.0V 8.0 80 160 mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC 54HC
eb
T
40 to 85§CT
A
g
1.0
g
5.0
Min Max Units
V
§
§
Units
b b
40 55
A
eb
55 to 125§C
g
g
CC
a
85
a
125
1.0 mA
10 mA
C C
2
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