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Consumer Solutions & Support
US Competency Center
600 North US Highway 45
Libertyville, Illinois 60048
Website: gs.mot.com
FIELD SERVICE BULLETIN
FSB Number: LVCCFSB2005-15
Author: Tony Bryan
Date: January 27, 2005
Total No. of Pages: 3
Subject: GSM Triplets Refresh (V600R) – Flip Detect Switch
Phone Models: GSM V620, V600i
Level of Repair: 2
Problem
Service is aware of an issue, identified during the NPI Analysis on GSM
V620/V600i. Some units, returned with customer complaints related to improper
operation of the “Secondary/External Display” were found to have an intermittent
problem were the flip detection switch would not activate when the flip was
closed. Analysis revealed the issue to be caused by a poor or uneven
compression force between the keypad gold puck and the flip switch contacts on
the PCB. See Fig. 1.0 below.
Note: V620/V600i hardware included a fix for an issue where the main display
lens would be scratched by the keypad. This fix combined a thinner main display
lens and added height to the rubber base bumpers. This is a factor which is
contributing to this failure mode.
The failure rate for this issue was much higher on units built with ITT keypads
versus units built with TeeHwa keypads. Analysis of the keypads found, although
no keypads were found to be out of specification, some of the keypads were at
the low end of the tolerance and that was the reason for the higher failure rate.
Fig. 1.0 – Cross-Section showing uneven compression force on flip detect switch, concentrates contact
area on a small portion (right side) of the PCB contact area.
MOTOROLA INTERNAL USE ONLY Page 1
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Consumer Solutions & Support
US Competency Center
600 North US Highway 45
Libertyville, Illinois 60048
Website: gs.mot.com
Solution
Short-Term: (1) Factory took immediate action. A shim was added to the
functional testing for flip switch operation. The shim holds the flip open an
additional 1mm higher than in normal use to screen out units with potentially
weak compression on the flip switch. – WW43 ‘04.
(2) All ITT keypads were purged from the factory as well as TeeHwa keypads
that were found to be on the low end of the tolerance for gold puck height. Only
TeeHwa keypads, measuring on the high end of the tolerance, are used. –
WW48 ’04.
Clear for TeeHwa Black for ITT
Week Year Year Week
Good after WW48 ‘04
Long-Term: (1) Keypad 3888470Yxx Rev. B - Modify keypad plunger to create
chamfered surface to allow for more uniform compression. - February ‘05
(2) Flip Front Housing 0188382N03 Rev. G - Modify flip inside housing flip detect
protrusion to account for flip bias due to hinge spring. This will better align the flip
detect protrusion with the keypad plunger/gold puck. - April ’05
(3) Side-Key Flex 8489088N04 Rev. D - Modify side-key flex to pull back
adhesive from around flip detect switch opening to reduce opportunity from
foreign material to collect around the PCB contacts. – March ’05
MOTOROLA INTERNAL USE ONLY Page 2