Motorola V525 Service Manual
`
Con
sumer Solutions & Support
US Competency Center
600 North US Highway 45
Libertyville, Illinois 60048
Website: gs.mot.com
FSB Number: LVCCFSB2003-100
Author: Tony Bryan
Date: October 17, 2003
Total No. of Pages: 3
Subject: Triplets Desense Improvement
Model Affected: V300, V303, V400, V500, V525
Level of Repair: 2
Problem
Service is aware of an issue with Desense on GSM Triplets Products. Factory
and ALT Testing has seen some fallout for poor RF Performance related to
Desense.
Solution
SHORT-TERM:
Manufacturing has implemented the placement of a conductive 2mm Moon Pad
(3289229N02)
makes contact with the PCB Shielding and grounds the SIM Chassis to improve
Desense performance. Please see Diagram 1.0 below for proper placement of
the Moon Pad
LONG-TERM:
A re-design of the original metal SIM Chassis
by Hardware Development and will be implemented in manufacturing as soon as
material with the new design is available. The new design will include three metal
fingers that extend into the housing and make contact with the PCB Shielding
adequately grounding the SIM Chassis. Diagram 2.0 below shows a sample of
the SIM Chassis with the improved design.
centered on the SIM Chassis. The added conductive Moon Pad
(3289229N02)
.
(0188940N01)
has been requested
MOTOROLA INTERNAL USE ONLY Page 1
`
Con
sumer Solutions & Support
US Competency Center
600 North US Highway 45
Libertyville, Illinois 60048
Website: gs.mot.com
Special Note:
Place grounding pad as shown
on Base Chassis, approx. 2
mm from the lower part of the
battery contact opening;
approx.centered between the
sides.
Diagram 1.0 Moon Pad Placement
Diagram 2.0 New SIM Chassis Design
NOTE: Image shown is a V600 SIM Chassis and the Part Number is not valid!!
Special Note:
New Design with Three Metal
Fingers to GND Chassis
MOTOROLA INTERNAL USE ONLY Page 2
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