Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 8
1 Publication Order Number:
MC74HC161A/D
MC74HC161A,
MC74HC163A
Presettable Counters
High–Performance Silicon–Gate CMOS
The MC74HC161A and HC163A are identical in pinout to the
LS161 and LS163. The device inputs are compatible with standard
CMOS outputs; with pullup resistors, they are compatible with
LSTTL outputs.
The HC161A and HC163A are programmable 4–bit binary counters
with asynchronous and synchronous reset, respectively.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
• Low Input Current: 1.0 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 192 FETs or 48 Equivalent Gates
Synchronous
LOGIC DIAGRAM
PIN 16 = V
CC
PIN 8 = GND
11
12
13
14
Q0
Q1
Q2
Q3
15
RIPPLE
CARRY
OUT
BCD OR
BINARY
OUTPUT
3
4
5
6
P0
P1
P2
P3
2
CLOCK
RESET
LOAD
ENABLE P
ENABLE T
COUNT
ENABLES
PRESET
DATA
INPUTS
1
9
7
10
Inputs Output
Clock Reset* Load Enable P Enable T Q
L X X X Reset
H L X X Load Preset Data
H H H H Count
H H L X No Count
H H X L No Count
FUNCTION TABLE
*HC163A only. HC161A is an Asynchronous Reset Device
H = high level, L = low level, X = don’t care
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
RESET
P0
CLOCK
GND
Q1
Q0
RIPPLE
CARRY OUT
V
CC
P1
P2
P3
ENABLE P
Q2
Q3
ENABLE T
LOAD
SO–16
D SUFFIX
CASE 751B
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1
16
PDIP–16
N SUFFIX
CASE 648
1
16
MARKING
DIAGRAMS
1
16
MC74HC16xAN
AWLYYWW
1
16
HC16xA
AWLYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
Device Package Shipping
ORDERING INFORMATION
MC74HC16xAN PDIP–16 2000 / Box
MC74HC16xAD SOIC–16
48 / Rail
MC74HC16xADR2 SOIC–16 2500 / Reel
MC74HC161A, MC74HC163A
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2
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air, Plastic DIP†
SOIC Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1) VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
ns
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC161A, MC74HC163A
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum High–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 3.6 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
Maximum Low–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 3.6 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
Maximum Input Leakage
Current
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
MC74HC161A, MC74HC163A
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4
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6.0 ns)
Maximum Clock Frequency (50% Duty Cycle)*
Maximum Propagation Delay, Clock to Q
Maximum Propagation Delay, Reset to Q (HC161A Only)
Maximum Propagation Delay, Enable T to Ripple Carry Out
Maximum Propagation Delay, Clock to Ripple Carry Out
Maximum Propagation Delay, Reset to Ripple Carry Out
(HC161A Only)
Maximum Output Transition Time, Any Output
Maximum Input Capacitance
pF
*Applies to noncascaded/nonsynchronous clocked configurations only with synchronously cascaded counters. (1) Clock to Ripple Carry Out
propagation delays. (2) Enable T or Enable P to Clock setup times and (3) Clock to Enable T or Enable P hold times determine f
max
. However,
if Ripple Carry out of each stage is tied to the Clock of the next stage (nonsynchronously clocked) the f
max
in the table above is applicable.
See Applications information in this data sheet.
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Gate)*
45
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
MC74HC161A, MC74HC163A
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5
TIMING REQUIREMENTS (C
L
= 50 pF, Input tr = tf = 6.0 ns)
Minimum Setup Time,
Preset Data Inputs to Clock
Minimum Setup Time,
Load to Clock
Minimum Setup Time,
Reset to Clock (HC163A Only)
Minimum Setup Time,
Enable T or Enable P to Clock
Minimum Hold Time,
Clock to Load or Preset Data Inputs
Minimum Hold Time,
Clock to Reset (HC163A Only)
Minimum Hold Time,
Clock to Enable T or Enable P
Minimum Recovery Time,
Reset Inactive to Clock (HC161A Only)
Minimum Recovery Time,
Load Inactive to Clock
Minimum Pulse Width,
Clock
Minimum Pulse Width,
Reset (HC161A Only)
Maximum Input Rise and Fall Times