MOTOROLA MC14521BFEL, MC14521BF, MC14521BDR2, MC14521BD, MC14521BCP Datasheet

...
Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1 Publication Order Number:
MC14521B/D
MC14521B
24-Stage Frequency Divider
The MC14521B consists of a chain of 24 flip–flops with an input circuit that allows three modes of operation. The input will function as a crystal oscillator, an RC oscillator, or as an input buffer for an external oscillator. Each flip–flop divides the frequency of the previous flip–flop by two, consequently this part will count up to 2
24
= 16,777,216. The count advances on the negative going edge of the clock. The outputs of the last seven–stages are available for added flexibility.
All Stages are Resettable
Reset Disables the RC Oscillator for Low Standby Power Drain
RC and Crystal Oscillator Outputs Are Capable of Driving External
Loads
Test Mode to Reduce Test Time
V
DD
and VSS′ Pins Brought Out on Crystal Oscillator Inverter to
Allow the Connection of External Resistors for Low–Power Operation
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load over the Rated Temperature Range.
MAXIMUM RATINGS (Voltages Referenced to V
SS
) (Note 2.)
Symbol
Parameter Value Unit
V
DD
DC Supply Voltage Range –0.5 to +18.0 V
Vin, V
out
Input or Output Voltage Range
(DC or Transient)
–0.5 to VDD + 0.5 V
Iin, I
out
Input or Output Current
(DC or Transient) per Pin
±10 mA
P
D
Power Dissipation,
per Package (Note 3.)
500 mW
T
A
Ambient Temperature Range –55 to +125 °C
T
stg
Storage Temperature Range –65 to +150 °C
T
L
Lead Temperature
(8–Second Soldering)
260 °C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C T o 125_C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, V
in
and V
out
should be constrained
to the range V
SS
v (Vin or V
out
) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V
SS
or VDD). Unused outputs must be left open.
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A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14521BCP PDIP–16 2000/Box MC14521BD SOIC–16 48/Rail MC14521BDR2 SOIC–16 2500/Tape & Reel
1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative.
MARKING
DIAGRAMS
1
16
PDIP–16
P SUFFIX
CASE 648
MC14521BCP
AWLYYWW
SOIC–16
D SUFFIX
CASE 751B
1
16
14521B
AWLYWW
SOEIAJ–16
F SUFFIX
CASE 966
1
16
MC14521B
AWLYWW
MC14521BFEL SOEIAJ–16 See Note 1. MC14521BFR2 SOEIAJ–16 See Note 1.
MC14521BF SOEIAJ–16 See Note 1.
MC14521B
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2
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Q20
Q21
Q22
V
DD
IN 1
Q18
Q19
OUT 2
V
SS
RESET
Q24
V
SS
IN 2
V
DD
Q23
BLOCK DIAGRAM
Output Count Capacity
Q18 2
18
= 262,144
Q19 2
19
= 524,288
Q20 2
20
= 1,048,576
Q21 2
21
= 2,097,152
Q22 2
22
= 4,194,304
Q23 2
23
= 8,388,608
Q24 2
24
= 16,777,216
STAGES
18 THRU 24
STAGES
1 THRU 17
Q18 Q19 Q20 Q21 Q22 Q23 Q24
10 11 12 13 14 15 1
2
6
IN 2
9
IN 1
7
RESET
V
DD
= PIN 16
VSS = PIN 8
5
3
4
OUT 1
V
DD
V
SS
OUT2
MC14521B
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3
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V
SS
)
V
– 55_C 25_C 125_C
Characteristic Symbol
V
DD
Vdc
Min Max Min Typ
(4.)
Max Min Max
Unit
Output Voltage “0” Level
V
in
= VDD or 0
V
OL
5.0 10 15
— — —
0.05
0.05
0.05
— — —
0 0 0
0.05
0.05
0.05
— — —
0.05
0.05
0.05
Vdc
“1” Level
V
in
= 0 or V
DD
V
OH
5.0 10 15
4.95
9.95
14.95
— — —
4.95
9.95
14.95
5.0 10 15
— — —
4.95
9.95
14.95
— — —
Vdc
Input Voltage “0” Level
(V
O
= 4.5 or 0.5 Vdc)
(V
O
= 9.0 or 1.0 Vdc)
(V
O
= 13.5 or 1.5 Vdc)
V
IL
5.0 10 15
— — —
1.5
3.0
4.0
— — —
2.25
4.50
6.75
1.5
3.0
4.0
— — —
1.5
3.0
4.0
Vdc
“1” Level
(V
O
= 0.5 or 4.5 Vdc)
(V
O
= 1.0 or 9.0 Vdc)
(V
O
= 1.5 or 13.5 Vdc)
V
IH
5.0 10 15
3.5
7.0 11
— — —
3.5
7.0 11
2.75
5.50
8.25
— — —
3.5
7.0 11
— — —
Vdc
Output Drive Current
(V
OH
= 2.5 Vdc) Source
(V
OH
= 4.6 Vdc) Pins 4 & 7
(V
OH
= 9.5 Vdc)
(V
OH
= 13.5 Vdc)
I
OH
5.0
5.0 10 15
– 1.2 – 0.25 – 0.62
– 1.8
— — — —
– 1.0 – 0.2 – 0.5 – 1.5
– 1.7
– 0.36
– 0.9 – 3.5
— — — —
– 0.7 – 0.14 – 0.35
– 1.1
— — — —
mAdc
(VOH = 2.5 Vdc) Source (V
OH
= 4.6 Vdc) Pins 1, 10,
(V
OH
= 9.5 Vdc) 1 1, 12, 13, 14
(V
OH
= 13.5 Vdc) and 15
5.0
5.0 10 15
– 3.0
– 0.64
– 1.6 – 4.2
— — — —
– 2.4
– 0.51
– 1.3 – 3.4
– 4.2 – 0.88 – 2.25
– 8.8
— — — —
– 1.7
– 0.36
– 0.9 – 2.4
— — — —
mAdc
(VOL = 0.4 Vdc) Sink (V
OL
= 0.5 Vdc)
(V
OL
= 1.5 Vdc)
I
OL
5.0 10 15
0.64
1.6
4.2
— — —
0.51
1.3
3.4
0.88
2.25
8.8
— — —
0.36
0.9
2.4
— — —
mAdc
Input Current I
in
15 ± 0.1 ±0.00001 ± 0.1 ± 1.0 µAdc
Input Capacitance
(V
in
= 0)
C
in
5.0 7.5 pF
Quiescent Current
(Per Package)
I
DD
5.0 10 15
— — —
5.0 10 20
— — —
0.005
0.010
0.015
5.0 10 20
— — —
150 300 600
µAdc
Total Supply Current
(5.) (6.)
(Dynamic plus Quiescent, Per Package) (C
L
= 50 pF on all outputs, all
buffers switching)
I
T
5.0 10 15
IT = (0.42 µA/kHz) f + I
DD
IT = (0.85 µA/kHz) f + I
DD
IT = (1.40 µA/kHz) f + I
DD
µAdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF: I
T(CL
) = IT(50 pF) + (CL – 50) Vfk
where: I
T
is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.003.
MC14521B
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4
SWITCHING CHARACTERISTICS
(7.)
(C
L
= 50 pF, T
A
= 25_C)
Characteristic
Symbol
V
DD
Vdc
Min Typ
(8.)
Max Unit
Output Rise and Fall Time (Counter Outputs)
t
TLH
, t
THL
= (1.5 ns/pF) CL + 25 ns
t
TLH
, t
THL
= (0.75 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
= (0.55 ns/pF) CL + 12.5 ns
t
TLH
, t
THL
5.0 10 15
— — —
100
50 40
200 100
80
ns
Propagation Delay Time
Clock to Q18
t
PHL
, t
PLH
= (1.7 ns/pF) CL + 4415 ns
t
PHL
, t
PLH
= (0.66 ns/pF) CL + 1667 ns
t
PHL
, t
PLH
= (0.5 ns/pF) CL + 1275 ns
t
PHL
, t
PLH
5.0 10 15
— — —
4.5
1.7
1.3
9.0
3.5
2.7
µs
Clock to Q24
t
PHL
, t
PLH
= (1.7 ns/pF) CL + 5915 ns
t
PHL
, t
PLH
= (0.66 ns/pF) CL + 2167 ns
t
PHL
, t
PLH
= (0.5 ns/pF) CL + 1675 ns
5.0 10 15
— — —
6.0
2.2
1.7
12
4.5
3.5
Propagation Delay Time
Reset to Q
n
t
PHL
= (1.7 ns/pF) CL + 1215 ns
t
PHL
= (0.66 ns/pF) CL + 467 ns
t
PHL
= (0.5 ns/pF) CL + 350 ns
t
PHL
5.0 10 15
— — —
1300
500 375
2600 1000
750
ns
Clock Pulse Width t
WH(cl)
5.0 10 15
385 150 120
140
55 40
— — —
ns
Clock Pulse Frequency f
cl
5.0 10 15
— — —
3.5
9.0 12
2.0
5.0
6.5
MHz
Clock Rise and Fall Time t
TLH
, t
THL
5.0 10 15
— — —
— — —
15
5.0
4.0
µs
Reset Pulse Width t
WH(R)
5.0 10 15
1400
600 450
700 300 225
— — —
ns
Reset Removal Time t
rem
5.0 10 15
30
0
– 40
– 200 – 160 – 110
— — —
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Power Dissipation Test Circuit and Waveform
PULSE
GENERATOR
V
DD
V
DD
V
DD
V
SS
V
SS
Q18 Q19
Q20 Q21 Q22 Q23 Q24
C
L
C
L
C
L
C
L
C
L
C
L
C
L
I
D
IN 2
R
500 µF
0.01 µF CERAMIC
20 ns 20 ns
V
DD
0 V
V
in
50% DUTY CYCLE
90%
10%
50%
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