MOTOROLA MC10H351FNR2, MC10H351M, MC10H351MEL, MC10H351ML1, MC10H351MR1 Datasheet

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SEMICONDUCTOR TECHNICAL DATA

2–77

REV 5

 Motorola, Inc. 1996

3/93

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

The MC10H351 is a quad translator for interfacing data between a
saturated logic section and the PECL section of digital systems when only
a +5.0 Vdc power supply is available. The MC10H351 has TTL/NMOS
compatible inputs and PECL complementary open–emitter outputs that
allow use as an inverting/non–inverting translator or as a differential line
driver. When the common strobe input is at a low logic level, it forces all
true outputs to the PECL low logic state (≈ +3.2 V) and all inverting
outputs to the PECL high logic state (≈ +4.1 V).

The MC10H351 can also be used with the MC10H350 to transmit and
receive TTL/NMOS information differentially via balanced twisted pair
lines.

• Single +5.0 Power Supply

• All VCC Pins Isolated On Chip

• Differentially Drive Balanced Lines

• tpd = 1.3 nsec Typical

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply V

CC

0 to +7.0 Vdc

Input Voltage (VCC = 5.0 V) V

I

0 to V

CC

Vdc

Output Current— Continuous

— Surge

I

out

50

100

mA

Operating Temperature Range T

A

0 to +75 °C

Storage Temperature Range— Plastic

— Ceramic

T

stg

–55 to +150
–55 to +165

°C

ELECTRICAL CHARACTERISTICS (VCC = V

CC1

= V

CC2

= 5.0 V ± 5.0%)

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Power Supply

ECL — 50 — 45 — 50 mA

pp y

Current

TTL — 20 — 15 — 20 mA

Reverse Current

Pins 7, 8, 12, 14
Pin 9

I

R

I

INH

——25

100——2080——25100

µA

Forward Current

Pins 7, 8, 12, 14
Pin 9

I

F

I

INL

——–0.8

–3.2——

–0.6
–2.4——

–0.8
–3.2

mA

Input Breakdown
Voltage

V

(BR)in

5.5 — 5.5 — 5.5 — Vdc

Input Clamp Voltage

(Iin = –18 mA)

V

I

— –1.5 — –1.5 — –1.5 Vdc

High Output

Voltage (1)

V

OH

3.98 4.16 4.02 4.19 4.08 4.27 Vdc

Low Output

Voltage (1)

V

OL

3.05 3.37 3.05 3.37 3.05 3.37 Vdc

High Input Voltage V

IH

2.0 — 2.0 — 2.0 — Vdc

Low Input Voltage V

IL

— 0.8 — 0.8 — 0.8 Vdc

(1) With VCC at 5.0 V. VOH/VOL change 1:1 with VCC.
*Positive Emitter Coupled Logic



LOGIC DIAGRAM

DIP

PIN ASSIGNMENT

B OUT
B OUT

N.C.
A OUT
A OUT

V

CC

B IN

A IN

ECL V

CC

C OUT
C OUT
D OUT
D OUT
VCC 2
C IN
N.C.

20
19
18
17
16
15
14

13

1
2
3
4
5
6
7
8

COMMON

STROBE

GND

D IN
TTL V

CC

12
11

9
10

14

19
18

12

16
17

8

5
4

71

2

9

B IN

A IN

COMMON

STROBE

D IN

C IN

B OUT
B OUT
A OUT
A OUT

D OUT
D OUT
C OUT
C OUT

VCC (+5.0 VDC) = PINS 6, 11, 15, 20

GND = PIN 10

L SUFFIX

CERAMIC PACKAGE

CASE 732–03

P SUFFIX

PLASTIC PACKAGE

CASE 738–03

FN SUFFIX

PLCC

CASE 775–02

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–36 of the Motorola MECL Data

Book (DL122/D).

MC10H351

MOTOROLA MECL Data

DL122 — Rev 6

2–78

AC PARAMETERS

0° 25° 75°

Characteristic Symbol Min Max Min Max Min Max Unit

Propagation Delay (1) t

pd

0.4 2.2 0.4 2.2 0.4 2.1 ns

Rise Time (20% to 80%) t

r

0.4 1.9 0.4 2.0 0.4 2.1 ns

Fall Time (80% to 20%) t

f

0.4 1.9 0.4 2.0 0.4 2.1 ns

Maximum Operating Frequency f

max

150 — 150 — 150 — MHz

(1) Propagation delay is measured on this circuit from +1.5 volts on the input waveform to the 50% point on the output waveform.

NOTE:

Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through
a 50–ohm resistor to VCC –2.0 Vdc.

MC10H351

2–79 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79

F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81

J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50

Z 2 10 2 10

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

____

MC10H351

MOTOROLA MECL Data

DL122 — Rev 6

2–80

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 738–03

ISSUE E

L SUFFIX

CERAMIC DIP PACKAGE

CASE 732–03

ISSUE E

NOTES:

1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

3. DIMENSIONS A AND B INCLUDE MENISCUS.

DIM MIN MAX

INCHES

A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022
F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M 0 15
N 0.010 0.040

__

A

20

110

11

B

F

C

SEATING
PLANE

D

H

G

K

N

J

M

L

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

M

L

J 20 PL

M

B

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022

G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC

M 0 15 0 15

N 0.51 1.010.020 0.040

____

E

1.27 1.770.050 0.070

1

11

10

20

–A–

SEATING
PLANE

K

N

FG

D

20 PL

–T–

M

A

M

0.25 (0.010) T

E

B

C

F

1.27 BSC0.050 BSC

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MC10H351/D

*MC10H351/D*

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