Motorola MC10H350FN, MC10H350P Datasheet

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SEMICONDUCTOR TECHNICAL DATA

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  " !# #

The MC10H350 is a member of Motorola’s 10H family of high performance
ECL logic. It consists of 4 translators with differential inputs and TTL outputs.
The 3–state outputs can be disabled by applying a HIGH TTL logic level on the
common OE input.

The MC10H350 is designed to be used primarily in systems incorporating
both ECL and TTL logic operating off a common power supply. The separate
VCC power pins are not connected internally and thus isolate the noisy TTL V
runs from the relatively quiet ECL VCC runs on the printed circuit board. The
differential inputs allow the H350 to be used as an inverting or noninverting
translator, or a dif ferential line receiver . The H350 can also drive CMOS with the
addition of a pullup resistor.

• Propagation Delay, 3.5 ns Typical • MECL 10K–Compatible

MAXIMUM RATINGS

Characteristic Symbol Rating Unit

Power Supply (VEE = Gnd) V
Operating T emperature Range T
Storage T emperature Range — Plastic

— Ceramic

CC

A

T

stg

7.0 Vdc

0 to +75 °C

–55 to +150
–55 to +165

ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (See Note 1)

TA = 0°C to 75°C

Characteristic Symbol Min Max Unit

Power Supply Current TTL

Input Current High Pin 9

Input Current Low Pin 9

Input Voltage High Pin 9 V
Input Voltage Low Pin 9 V
Differential Input Voltage (1)

Voltage Common Mode

Output Voltage High

IOH = 3.0 mA

Output Voltage Low

IOL = 20 mA

Short Circuit Current

V

= 0 V

OUT

Output Disable Current High

V

= 2.7 V

OUT

Output Disable Current Low

V

= 0.5 V

OUT

(1) Common mode input voltage to pins 3–4, 5–6, 1 1–12, 13–14 must be between the values of 2.8

V and 5.0 V. This common mode input voltage range includes the differential input swing.

(2) For single ended use, apply 3.75 V (VBB) to either input depending on output polarity required.

Signal level range to other input is 3.3 V to 4.2 V.

(3) Any unused gates should have the inverting inputs tied to VCC and the non–inverting inputs tied

to ground to prevent output glitching.

(4) 1.0 V to 2.0 V w/50 pF into 500 ohms.

*Positive Emitter Coupled Logic

Pins 3–6, 11–14 (1)

Pins 3–6, 11–14

ECL

Others

Others

I

I

I

V

DIFF

V

V

V

I

I

OZH

I

OZL

CC

I

IH

INH

I

IL

INL

IH
IL

CM

OH

OL

OS

—
—

—
—

—
—

2.0 — Vdc
— 0.8 Vdc

350 — mV

2.8 V

2.7 — Vdc

— 0.5 Vdc

–60 –150 mA

— 50 µA

— –50 µA

20
12

20
50

–0.6

50

CC

CC

°C
°C

mA

µA

mA

µA

Vdc



L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

LOGIC DIAGRAM

9

3
4

5
6

11
12

13
14

VCC (+5.0 VDC) = PINS 1 AND 16

GND = PIN 8

DIP

PIN ASSIGNMENT

ECL V

CC

A

OUT

A

IN

A

IN

B

IN

B

IN

B

OUT

GND

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

1
2
3
4
5
6
7
8

Book (DL122/D).

16
15
14
13
12
11
10

9

2

7

10

15

TTL V
C

OUT

C

IN

C

IN

D

IN

D

IN

D

OUT

OE

CC

9/96

 Motorola, Inc. 1996

2–57

REV 6

MC10H350

ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ±5%) (See Notes 1 & 4)

TA = 0°C to 75°C

Characteristic Symbol Min Max Unit

AC PARAMETERS (CL = 50 pF) (VCC = 5.0 ± 5%) (TA = 0°C to 75°C)

Propagation Delay

Data
Rise Time t
Fall Time t
Output Disable Time t

Output Enable Time t

t

pdLZ

t

pdHZ
pdZL

t

pdZH

pd

r
f

1.5 5.0 ns

0.3 1.6 ns

0.3 1.6 ns

2.0

2.0

2.0

2.0

6.0

6.0

8.0

8.0

3–STATE SWITCHING WAVEFORMS

ns

ns

V

OUT

OE

3–STATE OUTPUT LOW ENABLE AND
DISABLE TIMES

1.5 V1.5 V

T

PZL

T

PLZ

1.5 V

0.3 V

D.U.T
.

OE

V

V

OL

OUT

TEST LOAD

+7.0 V OPEN

500

500

ALL OTHERT

Ω

Ω

PZL

50 PF

, T

PLZ

, O, C,

3–STATE OUTPUT HIGH ENABLE AND
DISABLE TIMES

1.5 V1.5 V

T

PZH

T

1.5 V

0.3 V

PHZ

Q

VOH≈ 3.5 V

*INCLUDES JIG AND PROBE CAPACITANCE

Application Note: Pin 9 is an OE and the 10H350 is disabled when OE is at VIH or higher.

MOTOROLA MECL Data

2–58

DL122 — Rev 6

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

MC10H350

–L–

20 1

Z

C

G

G1

0.010 (0.250) N

S

T

–N–

L–M

S

Y BRK

–M–

W

V

A

0.007 (0.180) N

0.007 (0.180) N

R

E

0.004 (0.100)

J

PLANE

SEATING

–T–

VIEW S

S

0.007 (0.180) N

B

U

M

0.007 (0.180) N

S

L–M

T

M

S

S

L–M

T

S

D

Z

D

X

0.010 (0.250) N

G1

S

S

L–M

T

S

VIEW D–D

M

M

S

L–M

T

L–M

T

S

S

S

0.007 (0.180) N

H

M

S

L–M

T

S

K1

K

0.007 (0.180) N

F

M

S

L–M

T

S

VIEW S

DL122 — Rev 6

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DA TUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

2–59 MOTOROLAMECL Data

DIM MIN MAX MIN MAX

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81

J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21

W 0.042 0.048 1.07 1.21

X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2 10 2 10

____

G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

MILLIMETERSINCHES

MC10H350

–T–

SEATING
PLANE

F

18

OUTLINE DIMENSIONS

L SUFFIX

CERAMIC DIP PACKAGE

–A–

16 9

–B–

18

C

N

E

G

16 PLD

0.25 (0.010) T

M

S

A

–A–

916

B

F

C

S

–T–

H

G

D

16 PL

0.25 (0.010) T

K

M

A

CASE 620–10

ISSUE V

L

K

16 PLJ

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

SEATING
PLANE

J

M

M

0.25 (0.010) T

M

L

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

DIM MIN MAX MIN MAX

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31

S

B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

L 0.300 BSC 7.62 BSC
M 0 15 0 15

____

N 0.020 0.040 0.51 1.01

Y14.5M, 1982.

FORMED PARALLEL.

DIM MIN MAX MIN MAX

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

MILLIMETERSINCHES

MILLIMETERSINCHES

____

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MOTOROLA MECL Data

2–60

*MC10H350/D*

◊

MC10H350/D

DL122 — Rev 6