Motorola MC10171P, MC10171FN Datasheet


SEMICONDUCTOR TECHNICAL DATA
     
E0 14
A 9
B 7
E
15
2
E1
0 or E1 high, the corresponding selected 4 outputs are
PD= 325 mW typ/pkg (No Load) tpd= 4.0 ns typ
tr, tf= 2.0 ns typ (20%–80%)
LOGIC DIAGRAM
10 Q0 3
11 Q0 2
12 Q0 1
13 Q0 0
3 Q1 3
4 Q1 2
5 Q1 1
6 Q1 0
V
= PIN 1
CC1
V
= PIN 16
CC2 VEE= PIN 8

CERAMIC PACKAGE
PLASTIC PACKAGE
DIP
PIN ASSIGNMENT
V
CC1
E1 Q13 Q12 Q11 Q10
V
EE
1 2 3 4 5 6
B
7 8
L SUFFIX
CASE 620–10
P SUFFIX
CASE 648–08
FN SUFFIX
PLCC
CASE 775–02
16 15 14 13 12 11 10
V E E0 Q00 Q01 Q02 Q03 A
9
CC2
TRUTH TABLE
ENABLE INPUTS INPUTS OUTPUTS
E E0 E1 A B Q10 Q11 Q12 Q13 Q00 Q01 Q02 Q03 L L L L L L H H H L H H H
L L L L H H L H H H L H H L L L H L H H L H H H L H L L L H H H H H L H H H L L L H L L H H H H L H H H L H L L L L H H H H H H H H X X X X H H H H H H H H
3/93
Motorola, Inc. 1996
3–107
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
T ables on page 6–11 of the Motorola MECL Data
Book (DL122/D).
REV 5
MC10171
Under
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Characteristic Symbol
Power Supply Drain Current I Input Current I
Output Voltage Logic 1 V
Output Voltage Logic 0 V Threshold Voltage Logic 1 V
Threshold Voltage Logic 0 V
Switching Times (50 Load) ns Propagation Delay t
Rise Time (20 to 80%) t
Fall Time (20 to 80%) t
E
inH
I
inL OH
OL
OHA
OLA
7+6+
t
7–6–
t
7+13+
t
7–13–
6+
t
13+
6–
t
13–
Under
Test
8 85 65 77 85 mAdc 14 350 220 220 µAdc 14 0.5 0.5 0.3 µAdc
6 13
13 –1.890 –1.675 –1.850 –1.650 –1.825 –1.615 Vdc
6 13
6 13
6
6 13 13
6 13
6 13
–30°C +25°C +85°C
Min Max Min Typ Max Min Max
–1.060 –1.060
–1.080 –1.080
1.5
1.5
1.5
1.5
1.0
1.0
1.0
1.0
–0.890 –0.890
–1.655 –1.655
6.2
6.2
6.2
6.2
3.3
3.3
3.3
3.3
–0.960 –0.960
–0.980 –0.980
1.5
1.5
1.5
1.5
1.1
1.1
1.1
1.1
4.0
4.0
4.0
4.0
2.0
2.0
2.0
2.0
–0.810 –0.810
–1.630 –1.630
6.0
6.0
6.0
6.0
3.3
3.3
3.3
3.3
–0.890 –0.890
–0.910 –0.910
1.5
1.5
1.5
1.5
1.1
1.1
1.1
1.1
–0.700 –0.700
–1.595 –1.595
6.4
6.4
6.4
6.4
3.4
3.4
3.4
3.4
Unit
Vdc
Vdc
Vdc
MOTOROLA MECL Data
3–108
DL122 — Rev 6
MC10171
Und
(VCC)
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
@ Test Temperature V
–30°C –0.890 –1.890 –1.205 –1.500 –5.2 +25°C –0.810 –1.850 –1.105 –1.475 –5.2 +85°C –0.700 –1.825 –1.035 –1.440 –5.2
Pin
Characteristic Symbol
Power Supply Drain Current I Input Current I
Output Voltage Logic 1 V
Output Voltage Logic 0 V Threshold Voltage Logic 1 V
Threshold Voltage Logic 0 V
Switching Times (50 Load) +0.31V Pulse In Pulse Out –3.2 V +2.0 V Propagation Delay t
Rise Time (20 to 80%) t
Fall Time (20 to 80%) t
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the same manner.
E
inH
I
inL
OH
OL
OHA
OLA
7+6+
t
7–6–
t
7+13+
t
7–13–
6+
t
13+
6–
t
13–
er
Test
8 2,7,9,14,15 8 1, 16 14 14 8 1, 16 14 14 8 1, 16
6 13
13 2,7,9,14,15 8 1, 16
6 13
6 13
6
6 13 13
6 13
6 13
IHmax
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
V
IHmax
15 15
V
ILmin
V
ILmin
2,9,14,15 2,7,14,15
2,9,14,15 2,9,14,15 2,9,14,15 2,9,14,15
V
IHAminVILAmax
V
IHAminVILAmax
15 15
7 9
7 7 7 7
7 7
7 7
6
6 13 13
6 13
6 13
V
EE
V
EE
8 8
8 8
8 8
8 8 8 8
8 8
8 8
Gnd
1, 16 1, 16
1, 16 1, 16
1, 16 1, 16
1, 16 1, 16 1, 16 1, 16
1, 16 1, 16
1, 16 1, 16
DL122 — Rev 6
3–109 MOTOROLAMECL Data
MC10171
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
–L–
20 1
Z
C
G
G1
0.010 (0.250) N
S
T
–N–
L–M
S
Y BRK
–M–
W
V
A
0.007 (0.180) N
0.007 (0.180) N
R
E
0.004 (0.100)
J
PLANE
SEATING
–T–
VIEW S
S
0.007 (0.180) N
B
U
M
0.007 (0.180) N
S
L–M
T
M
S
S
L–M
T
S
D
Z
D
X
0.010 (0.250) N
G1
S
S
L–M
T
S
VIEW D–D
M
M
S
L–M
T
L–M
T
S
S
S
0.007 (0.180) N
H
M
S
L–M
T
S
K1
K
0.007 (0.180) N
F
M
S
L–M
T
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DA TUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
MOTOROLA MECL Data
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 ––– 0.51 ––– K 0.025 ––– 0.64 ––– R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y ––– 0.020 ––– 0.50 Z 2 10 2 10
____
G1 0.310 0.330 7.88 8.38 K1 0.040 ––– 1.02 –––
3–110
MILLIMETERSINCHES
DL122 — Rev 6
OUTLINE DIMENSIONS
CERAMIC DIP PACKAGE
–A–
16 9
–B–
18
C
–T–
SEATING PLANE
E
F
G
16 PLD
0.25 (0.010) T
M
–A–
916
B
18
F
C
S
H
G
D
16 PL
0.25 (0.010) T
K
M
K
N
S
A
PLASTIC DIP PACKAGE
SEATING
–T–
PLANE
M
A
L SUFFIX
CASE 620–10
ISSUE V
L
M
16 PLJ
0.25 (0.010) T
P SUFFIX
CASE 648–08
ISSUE R
L
J
MC10171
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY.
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C ––– 0.200 ––– 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31
M
S
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
M
L 0.300 BSC 7.62 BSC M 0 15 0 15
____
N 0.020 0.040 0.51 1.01
Y14.5M, 1982.
FORMED PARALLEL.
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01
MILLIMETERSINCHES
MILLIMETERSINCHES
____
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MC10171/D
DL122 — Rev 6
3–111 MOTOROLAMECL Data
*MC10171/D*
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