MOTOROLA MC10171L, MC10171FNR2 Datasheet



SEMICONDUCTOR TECHNICAL DATA

3–107

REV 5

 Motorola, Inc. 1996

3/93

    


The MC10171 is a binary coded 2 line to dual 4 line decoder with selected

outputs low. With either E

0 or E1 high, the corresponding selected 4 outputs are

high. The common enable E, when high, forces all outputs high.

PD= 325 mW typ/pkg (No Load)
tpd= 4.0 ns typ

tr, tf= 2.0 ns typ (20%–80%)

LOGIC DIAGRAM

V

CC1

= PIN 1

V

CC2

= PIN 16

VEE= PIN 8

E0 14

A 9

B 7

E

15

E1

2

10 Q0 3

11 Q0 2

12 Q0 1

13 Q0 0

3 Q1 3

4 Q1 2

5 Q1 1

6 Q1 0

TRUTH TABLE

ENABLE INPUTS INPUTS OUTPUTS

E E0 E1 A B Q10 Q11 Q12 Q13 Q00 Q01 Q02 Q03
L L L L L L H H H L H H H

L L L L H H L H H H L H H
L L L H L H H L H H H L H
L L L H H H H H L H H H L
L L H L L H H H H L H H H
L H L L L L H H H H H H H
H X X X X H H H H H H H H



DIP

PIN ASSIGNMENT

V

CC1

E1
Q13
Q12

Q11

Q10

B

V

EE

V

CC2

E
E0
Q00
Q01
Q02
Q03
A

16
15
14
13
12
11
10

9

1
2
3
4
5
6
7
8

L SUFFIX

CERAMIC PACKAGE

CASE 620–10

P SUFFIX

PLASTIC PACKAGE

CASE 648–08

FN SUFFIX

PLCC

CASE 775–02

Pin assignment is for Dual–in–Line Package.

For PLCC pin assignment, see the Pin Conversion

T ables on page 6–11 of the Motorola MECL Data

Book (DL122/D).

MC10171

MOTOROLA MECL Data

DL122 — Rev 6

3–108

ELECTRICAL CHARACTERISTICS

Test Limits

Pin

Under

–30°C +25°C +85°C

Characteristic Symbol

Under

Test

Min Max Min Typ Max Min Max

Unit

Power Supply Drain Current I

E

8 85 65 77 85 mAdc

Input Current I

inH

14 350 220 220 µAdc

I

inL

14 0.5 0.5 0.3 µAdc

Output Voltage Logic 1 V

OH

6

13

–1.060
–1.060

–0.890
–0.890

–0.960
–0.960

–0.810
–0.810

–0.890
–0.890

–0.700
–0.700

Vdc

Output Voltage Logic 0 V

OL

13 –1.890 –1.675 –1.850 –1.650 –1.825 –1.615 Vdc

Threshold Voltage Logic 1 V

OHA

6

13

–1.080
–1.080

–0.980
–0.980

–0.910
–0.910

Vdc

Threshold Voltage Logic 0 V

OLA

6

13

–1.655
–1.655

–1.630
–1.630

–1.595
–1.595

Vdc

Switching Times (50Ω Load) ns
Propagation Delay t

7+6+

t

7–6–

t

7+13+

t

7–13–

6

6
13
13

1.5

1.5

1.5

1.5

6.2

6.2

6.2

6.2

1.5

1.5

1.5

1.5

4.0

4.0

4.0

4.0

6.0

6.0

6.0

6.0

1.5

1.5

1.5

1.5

6.4

6.4

6.4

6.4

Rise Time (20 to 80%) t

6+

t

13+

6
13

1.0

1.0

3.3

3.3

1.1

1.1

2.0

2.0

3.3

3.3

1.1

1.1

3.4

3.4

Fall Time (20 to 80%) t

6–

t

13–

6
13

1.0

1.0

3.3

3.3

1.1

1.1

2.0

2.0

3.3

3.3

1.1

1.1

3.4

3.4

MC10171

3–109 MOTOROLAMECL Data

DL122 — Rev 6

ELECTRICAL CHARACTERISTICS (continued)

TEST VOLTAGE VALUES (Volts)

@ Test Temperature V

IHmax

V

ILmin

V

IHAminVILAmax

V

EE

–30°C –0.890 –1.890 –1.205 –1.500 –5.2
+25°C –0.810 –1.850 –1.105 –1.475 –5.2
+85°C –0.700 –1.825 –1.035 –1.440 –5.2

Pin

TEST VOLTAGE APPLIED TO PINS LISTED BELOW

Characteristic Symbol

Und

er

Test

V

IHmax

V

ILmin

V

IHAminVILAmax

V

EE

(VCC)

Gnd

Power Supply Drain Current I

E

8 2,7,9,14,15 8 1, 16

Input Current I

inH

14 14 8 1, 16

I

inL

14 14 8 1, 16

Output Voltage Logic 1 V

OH

6

13

15
15

8
8

1, 16
1, 16

Output Voltage Logic 0 V

OL

13 2,7,9,14,15 8 1, 16

Threshold Voltage Logic 1 V

OHA

6

13

15
15

8
8

1, 16
1, 16

Threshold Voltage Logic 0 V

OLA

6

13

2,9,14,15
2,7,14,15

7
9

8
8

1, 16

1, 16
Switching Times (50Ω Load) +0.31V Pulse In Pulse Out –3.2 V +2.0 V
Propagation Delay t

7+6+

t

7–6–

t

7+13+

t

7–13–

6

6
13
13

2,9,14,15
2,9,14,15
2,9,14,15
2,9,14,15

7
7
7
7

6

6
13
13

8
8
8
8

1, 16
1, 16
1, 16
1, 16

Rise Time (20 to 80%) t

6+

t

13+

6

13

7
7

6
13

8
8

1, 16
1, 16

Fall Time (20 to 80%) t

6–

t

13–

6

13

7
7

6
13

8
8

1, 16
1, 16

Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50-ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.

MC10171

MOTOROLA MECL Data

DL122 — Rev 6

3–110

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 775–02

ISSUE C

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).

–M–

–N–

–L–

Y BRK

W

V

D

D

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

X

G1

B

U

Z

VIEW D–D

20 1

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

S

0.010 (0.250) N

S

T

C

G

VIEW S

E

J

R

Z

A

0.004 (0.100)

–T–

SEATING
PLANE

S

L–M

M

0.007 (0.180) N

S

T

S

L–M

M

0.007 (0.180) N

S

T

H

VIEW S

K

K1

F

G1

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50

Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 ––– 1.02 –––

____

MC10171

3–111 MOTOROLAMECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

916

K

PLANE

–T–

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01

____

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.

–A–

–B–

–T–

F

E

G

N

K

C

SEATING
PLANE

16 PLD

S

A

M

0.25 (0.010) T

16 PLJ

S

B

M

0.25 (0.010) T

M

L

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C ––– 0.200 ––– 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC 1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC 2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC 7.62 BSC
M 0 15 0 15
N 0.020 0.040 0.51 1.01

____

16 9

18

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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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MC10171/D

*MC10171/D*

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