4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
PRELIMINARY
Some of contents are described for general products
and are subject to change without notice.
DESCRIPTION
The M5M4V4S40CTP is a 2-bank x 131,072-word x 16-bit
Synchronous DRAM, with LVTTL interface. All inputs and
outputs are referenced to the rising edge of CLK. The
M5M4V4S40CTP achieves very high speed data rates up to
83MHz, and is suitable for main memory or graphic memory
in comp uter systems.
FEATURES
- Single 3.3v±0.3v power supply
- Clock frequency 83MHz / 67MHz
- Fully synchronous operation referenced to clock rising edge
- Dual bank operation controlled by BA(Bank Address)
- /CAS latency- 1/2/3 (programmable)
- Burst length- 1/2/4/8/FP (programmable)
- Sequential and interleave burst (programmable)
- Byte control by DQMU and DQML
- Random column access
- Auto precharge / All bank precharge controlled by A8
- Auto and self refresh
- 1024 refresh cycles /16.4ms
- LVTTL Inter fac e
- 400-mil, 50-pin Thin Small Outline Package
(TSOP II) with 0.8mm lead pitch
4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
BLOCK DIAGRAM
Mode
Register
Memory Array
Bank #0
M5M4V4S40CTP-12, -15
DQ0-15
I/O Buffer
Memory Array
Bank #1
Address Buffer
A0-8BA
Clock Buffer
CLKCKE
Type Designation Code
M 5M 4 V 4 S 4 0 C TP - 12
Control Circuitry
Control Signal Buffer
/CS /RAS /CAS/WEDQML
These rules are only applied to the Synchronous DRAM family.
Cycle Time (min.) 12: 12ns, 15: 15ns
Package Type TP: TSOP(II)
Process Generation
Function 0: Random Column, 1: 2N-rule
Organization 2n 4: x16
Synchronous DRAM
Density 4:4M bits
Interface V:LVTTL
Memory Style (DRAM)
Use, Recommended Operati ng Conditions, etc
Mitsubishi Mai n Designation
DQMU
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M5M4V4S40CTP-12, -15
4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
PIN FUNCTION
CLKInputMaster Clock: All other input s ar e refer enc ed to the rising edge of CLK.
Clock Enable: CKE controls the int er nal clock. When CKE is low, the
CKEInput
/CSInputChip Select: When /CS is high, all commands are inhibited.
/RAS, /CAS, /WEIn put/RAS, /CAS , and /WE are used to def ine bas ic co mmands.
A0-8Input
internal clock for the following cycle is disabled. CKE is also used to select
auto and self refresh. After self- r efresh mode is started, CKE acts as an
asynchronous input to maintain and exit the mode.
A0-8 specify the Row and Column addresses within the selected bank.
The Row Address is set by A0-8 and the Column Address is s et by A0-7.
A8 is also used to indicate the precharge option. When A8 is high during
read or write command, an auto prechar ge is per form ed. When A8 is
high during a precharge command, both banks are precharged.
Bank Address: BA is not simply A9. BA specifies the bank to which a
BAInput
DQ0-15Input / OutputData In and data out are referenced to t he r is ing edge of CLK.
DQMLInput
DQMUInput
Vdd, VssPower SupplyPower Supply for the memory array and per ipheral circuitr y.
VddQ, VssQPower SupplyPower Supply for the outp ut buf fers only .
command is applied. BA must be set during the ACT, PRE, READ,
and WRITE commands.
Lower Din(0-7) Mask; Lower Dout(0-7) Disable; When DQML is high
during burst write Din( 0- 7) for the cur r ent cycle is masked. When DQML
is high during burst read Dout(0-7) is disabled two cycles later.
Upper Din(8-15) Mask; Uppe r Dout( 8- 15) Dis able; When DQMU is high
during burst write Din( 8- 15) for the cur r ent cy c le is masked. When DQMU
is high during burst read Dout(8-15) is disabled two cycles later.
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SDRAM (Rev. 0.3)
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M5M4V4S40CTP-12, -15
4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
BASIC FUNCTIONS
The M5M4V4S40CTP has the following basic functions, bank (row) activate, burst read/write, bank
(row) precharge, and auto/self refresh. Each command is defined by the control signals (/RAS, /CAS and
/WE) at the rising edge of CLK. The inputs /CS ,CKE and A8 are used for chip select, refresh options, and
precharge options, respectively.
Please see the command truth table for detailed definitions.
Refresh Option @refresh command
Precharge Option @precharge or read/write command
define basic commands
Activate (ACT) [/RAS =L, /CAS =/WE =H]
The ACT command activates a row in an idle bank. The bank address, BA, is used to select which of
the two banks wi ll be ac tiva ted.
Read (READ) [/RAS =H, /CAS =L, /WE =H]
The READ command starts burst read from the active bank indicated by BA. The first output data
appears afte r /CA S latency. If A8 =H whe n R EA D is i ssu ed the bank is au tom a tic ally prech a rge d af te r
the last burst read (READA). Note: READA is no t valid for FP b urs t operat io ns.
Write (WRITE) [/RAS =H, /CAS =/WE =L]
The WRITE command starts burst write to the active bank indicat ed by BA. Total data length t o be
written is set by burst length. If A8 =H when WRITE is issued the bank is automatically precharged
after the last burst write (WRITEA). No te : WRI TEA is not valid fo r FP bur st op eratio ns .
Precharge (PRE) [/RAS =L, /CAS =H, /WE =L]
The PRE command deactivates the active bank indicated by BA. This command also terminates burst
read and write operations. If A8 =H when PRE is issued both banks are automatically precharged (PREA).
Auto-Refresh (REFA) [/RAS =/CAS =L, /WE =CKE =H]
The REFA command starts an auto-refresh cycle. The refresh address, including the bank address, is
generated internally. After this command, the banks are precharged automatically.
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M5M4V4S40CTP-12, -15
4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
COMMAND TRUTH TABLE
COMMANDMNEMONIC
DeselectDESELHXHXXXXXX
No OperationNOPHXLHHHXXX
Row Address Entry &
Bank Activate
Single Bank PrechargePREHXLLHLVLX
Precharge All BanksPREAHXLLHLXHX
Column Address Entry
& Write
Column Address Entry
& Write with Auto Precharge
ACTHXLLHHVVV
WRITEHXLHLLVLV
WRITEAHXLHLLVHV
CKE
n-1
CKE
n
/CS/RAS/CAS/WEBAA8A0-7
Column Address Entry
& Read
Column Address Entry
& Read with Auto Precharge
Auto-RefreshREFAHHLLLHXXX
Self-Refresh EntryREFSHLLLLHXXX
Self-Refresh ExitREFSX
Burst TerminateTBSTHXLHHLXXX
Mode Register SetMRSHXLLLLVLV*1
H=High Level, L=Low Level, V=Valid, X=Don’t Care, n=CLK cycle number
NOTE:
1. A7 =0, A0-A6 =Mode Address
READ HXLHLHVLV
READAHXLHLHVHV
LHHXXXXXX
LHLHHHXXX
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4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
FUNCTION TRUTH TABLE
Current State/CS/RAS/CAS/WEAddressCommandAction
IDLEHXXXXDESELNOP
LHHHXNOP NOP
LHHLXTBSTILLEGAL*2
LHLXBA, CA, A8READ / WRITE ILLEGAL*2
LLHHB A , RAACTBank Active, Latch RA
LLHLBA, A8PRE / PREANOP*4
LLLHXREFAAuto-Refresh*5
LLLL
ROW ACTIVEHXXXXDESELNOP
LHHHXNOP NOP
LHHLXTBST NOP
Op-Code,
Mode-Add
MRSMode Register Set*5
LHLHBA , CA, A8READ / READA
LHLLBA, CA, A8
LLHHBA, RAACTBank Active / ILLEGAL*2
LLHLBA, A8PRE / PREAPrecharge / Precharge All
LLLHXREFAILLEGAL
LLLL
READHXXXXDESELNOP (Continue Burst to END)
LHHHXNOPNOP (Continue Burst to END)
LHHLXTBSTTerminate Burst
LHLHBA , CA, A8READ / READA
LHLLBA, CA, A8
Op-Code,
Mode-Add
WRITE /
WRITEA
MRSILLEGAL
WRITE /
WRITEA
Begin Read, Latch CA,
Determine Auto-Prechar ge
Begin Write, Latch CA,
Determine Auto-Prechar ge
Terminate Burst, Latch CA,
Begin New Read, Determine
Auto-Precharge*3
Terminate Burst, Latch CA,
Begin Write, Determine AutoPrecharge*3
LLXXXXXNOP (Maintain Self -Re fres h)
HHXXXXXRefer to Function Truth Table
HLLLLHXEnter Self-Refr es h
/CS/RAS /CAS/WEAddAction
n
HLHXXXXEnter Power Down
HLLHHHXEnter Power Down
HLLHHLXILLEGAL
HLLHLXXILLEGAL
HLLLXXXILLEGAL
LXXXXXXRefer to Current State =Power Down
ANY STATE
other than
listed above
ABBREVIATIONS:
H=High Level, L=Low Level, X=Don’t Care
NOTES:
1. CKE Low to High transition wil l re-enable CLK and other inputs asynchron ous ly . A minimum setup time must be
satisfied before any command other than EXIT.
2. Power-Down and Self-Refresh can be entered only from the All Banks Idle State.
3. Must be legal command.
HHXXXXXRefer to Function Truth Table
HLXXXXXBegin CLK Suspend at Next Cycle*3
LHXXXXXExit CLK Suspend at Next Cycle*3
LLXXXXXMaintain CLK Suspend
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4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
SIMPLIFIED STATE DIAGRAM
MODE
REGISTER
SET
CLK
SUSPEND
MRS
M5M4V4S40CTP-12, -15
SELF
REFRESH
REFS
REFSX
REFA
IDLE
CKEL
CKEH
ACT
CKEL
AUTO
REFRESH
POWER
DOWN
WRITE
SUSPEND
WRITEA
SUSPEND
POWER
APPLIED
CKEH
ROW
ACTIVE
WRITE
CKEL
WRITE
CKEH
WRITEAREADA
CKEL
WRITEA
CKEH
POWER
ON
WRITEA
WRITE
WRITEA
PREPRE
PRE
READA
READ
READA
PRE
PRE
CHARGE
TBST(for Full Page)TBST(for Full Page)
READ
READ
READA
CKEL
CKEH
CKEL
CKEH
READ
SUSPEND
READA
SUSPEND
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Automatic Sequence
Command Sequence
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SDRAM (Rev. 0.3)
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M5M4V4S40CTP-12, -15
4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
POWER ON SEQUENCE
Before starting normal operations, the fol l o wing power on sequence is necessary to prevent the SDRAM
from damage and malfunctions.
1. Apply power and start the clock, CLK. Attempt to maintain CKE high, DQMU/DQML high and NOP
conditions on the inputs.
2. Maintain stable power, stable clock, and NOP input conditions for a minimum of 500µs.
3. Issue precharge commands for all banks (PRE or PREA).
4. After all banks reach an idl e state and after the row the precharg e time (t RP) issue 8 or more auto-refresh
commands.
5. Finally, issu e a mode re gist er set (MRS) comm and to in itializ e the mo de re gis te r.
After tRSC fro m the MRS c o mm a nd , the SDR A M w ill be in an idle state and re ady for nor m al ope ratio ns .
MODE REGISTER
Burst Length, Burst Type, and /CAS Latency can be programmed by setting the mode register (MRS). The
mode register stores this data until the next MRS command. An MRS command can only be issued when
both banks are idle. After tRSC from an MRS operation, the SDRAM is ready for new commands.
OPCODE
OPCODE
LATENCY
MODE
OP
0 0
0 1
1 0
1 1
BAA8 A7A6A5 A4A3A2 A1A0
0
LTMODEBTBL
CL
0 0 0
0 0 1
0 1 0
0 1 1
1 X X
Burst read / Burst write
Burst read / Single write
/CAS LATENCY
R
1
2
3
R
R
R
BURST
TYPE
BURST
LENGTH
0
1
CLK
/CS
/RAS
/CAS
/WE
BA, A8 -A0
BT= 0BT= 1
BL
0 0 0
0 0 1
0 1 0
0 1 1
1 0 0
1 0 1
1 1 0
1 1 1
SEQUENTIAL
INTERLEAVED
1
2
4
8
R
R
R
F.P.
V
1
2
4
8
R
R
R
R
MITSUBISHI ELECTRIC
R is Reserved for Future Use
F.P. = Full Page (256)
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SDRAM (Rev. 0.3)
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M5M4V4S40CTP-12, -15
4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
[ CAS LATENCY ]
/CAS latency, CL, is used to synchronize the first output data with the CLK frequency, i.e., the speed of
CLK determines which CL should be used. The DRAM column access, tCAC, determines the CL timing
requirements.
/CAS Latency Timing (BL=4)
CLK
Command
Address
DQQ0Q1Q2Q3
DQQ0Q1Q2Q3
DQQ0Q1Q2Q3
ACT
X
READ
tRCD
Y
CL=1
CL=2
CL=3
[ BURST LENGTH ]
The burst length, BL, determines the number of consecutive writes or reads that will be automatically
performed after the initial write or read command. For BL=1,2,4,8 the output data is tristated (Hi-Z) after
the last read. For BL=FP (Full Page) the TBST (Burst Terminate) command must be used to stop the output
of data.
tRCD
CLK
Command
Address
DQ
DQ
DQ
DQQ0Q1Q2Q3
DQQ0Q1Q2Q3
ACT
X
READ
Y
Q0
Q0Q1
Q0Q1Q2Q3
Burst Lengt h Timing (CL=2)
Q4Q5Q6Q7
Q4Q5Q6Q7Q8Q255 Q0Q1
BL=1
BL=2
BL=4
BL=8
BL=FP
Full Page counter rolls over and continues to count.
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SDRAM (Rev. 0.3)
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4M (2-BANK x 131072-WORD x 16-BIT) Synchronous DRAM
[ BURST ADDRESS SEQUENCE ]
CLK
Command
Address
DQ
CL= 3
BL= 4
Initial Address BL
A2A1 A0
Read
Y
/CAS LatencyBurst LengthBurst Length
M5M4V4S40CTP-12, -15
Write
Y
Q0Q1Q2Q3
Internal addresses ar e determ ined by B ur st Type.