Mitsubishi M5M44800CTP-5S, M5M44800CTP-5, M5M44800CJ-7S, M5M44800CJ-7, M5M44800CJ-6S Datasheet

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MITSUBISHI LSIs
with the high performance CMOS process, and is ideal for large­capacity memory systems where high speed, low power dissipation, and low costs are essential. The use of double-layer metalization process technology and a single-transistor dynamic storage stacked capacitor cell provide high circuit density at reduced costs. Multiplexed address inputs permit both a reduction in pins and an increase in system densities. Self or extended refresh current is low enough for battery back-up application.
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
DESCRIPTION
This is a family of 524288-word by 8-bit dynamic RAMs, fabricated
FEATURES
RAS
CAS
Type name
M5M44800CXX-5,-5S M5M44800CXX-6,-6S M5M44800CXX-7,-7S
XX=J,TP
access
time
(max.ns)
Address
access
(max.ns)
access
time
(max.ns)
50 13 25 90 45013 6070152030
time
35
OE
access
time
(max.ns)
15 20
(min.ns)
Standard 28pin SOJ, 28pin TSOP (II) Single 5V±10% supply Low stand-by power dissipation CMOS lnput level 5.5mW (Max)
CMOS Input level 550µW (Max) * Operating power dissipation
M5M44800Cxx-5,-5S 495mW (Max) M5M44800Cxx-6,-6S 413mW (Max) M5M44800Cxx-7,-7S 358mW (Max) Self refresh capability * Self refresh current 150µA(Max) Extended refresh capability Extended refresh current 150µA(Max) Fast page mode(1024-column random access),Read-modify-write, RAS-only refresh, CAS before RAS refresh, Hidden refresh capabilities. Early-write mode, CAS and OE to control output buffer impedance 1024 refresh cycles every 16.4ms (A0 ~A9) 1024 refresh cycles every 128ms (A0 ~A9) * * :Applicable to self refresh version (M5M44800CJ,TP-5S,-6S,-7S :option) only
Cycle
time
110 130
Power
dissipa-
tion
(typ.mW)
375 325
PIN CONFIGURATION (TOP VIEW)
(5V)VCC
(5V)VCC 14
DQ1 DQ2 DQ3 DQ4
NC
W
RAS
A0 A1
A2 A3
1 2 3 4 5 6
8 9A9
10 11 12 13
13
Outline 28P0K(400mil SOJ)
(5V)VCC
(5V)VCC 14
DQ1 DQ2
DQ3 DQ4
NC
W
RAS
A0 A1
A2 A3
1 2 3 4 5 6
8 9A9
10 11 12 13
13
28
25 24 23 227
21 20 19 18 17 16 15
28 27
26 25
24 23 227
21 20 19 18 17 16 15
VSS(0V) DQ827 DQ726 DQ6 DQ5 CAS OE
NC A8 A7 A6 A5 A4
VSS(0V)
VSS(0V) DQ8 DQ7 DQ6 DQ5 CAS OE
NC A8 A7 A6 A5 A4
VSS(0V)
APPLICATION
Microcomputer memory, Refresh memory for CRT
PIN DESCRIPTION
Pin name A0~A9 DQ1~DQ8 RAS CAS W OE
Vcc Vss
Address inputs Data inputs/outputs
Row address strobe input Column address strobe input Write control input Output enable input Power supply (+5V) Ground (0V)
1
M5M44800CJ,TP-5,-5S:Under development
Function
Outline 28P3Y-H(400mil TSOP Normal Bend)
NC:NO CONNECTION
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
In addition to normal read, write, and read-modify-write operations the M5M44800CJ, TP provides a number of other functions, e.g.,
Row
address
address
Column
INPUTS / OUTPUTS
FUNCTION
Table 1 Input conditions for each mode
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
fast page mode, RAS-only refresh, and delayed-write. The input conditions for each are shown in Table 1.
Operation
RAS
Read Write (Early write)
Write (Delayed write) Read-modify-write
RAS only refresh Hidden refresh
CAS before RAS (Extended *) refresh
Self refresh * Stand-by
Note : ACT : active, NAC : nonactive, DNC : don' t care, VLD : valid, IVD : invalid, APD : applied, OPN : open
ACT ACT
ACT ACT
ACT ACT
ACT ACT
NAC
CAS ACT ACT
ACT ACT
NAC ACT ACT
ACT
DNC
W
NAC ACT
ACT ACT
DNC DNC
DNC DNC
Inputs
OE
ACT DNC
DNC ACT
DNC ACT
DNC DNC DNC DNC OPN YESDNC DNC
DNC
APD APD
APD APD
APD DNC
DNC DNC
APD APD
APD APD DNC
DNC
DNC DNC
Input/Output
Input Output
OPN
VLD VLD VLD
DNC OPN
DNC DNC
VLD
OPN
IVD
VLD
OPN
VLD
OPN OPN
Refresh Remark
YES
Fast page
YES
mode
YES
identical
YES YES
YES
YES
NO
BLOCK DIAGRAM
COLUMN ADDRESS STROBE INPUT
ROW ADDRESS
STROBE INPUT
WRITE CONTROL
INPUT
ADDRESS INPUTS
2
M5M44800CJ,TP-5,-5S:Under development
CAS RAS
W
A0 A1 A2 A3 A4
A5 A6 A7 A8 A9
ROW &
COLUMN
ADDRESS
BUFFER
A0~A8
A0~ A9
ROW
DECODER
CLOCK GENERATOR
CIRCUIT
COLUMN DECODER
SENSE REFRESH
AMPLIFIER & I /O CONTROL
MEMORY CELL
(4194304BITS)
(8) DATA IN BUFFER
(8)
DATA OUT
BUFFER
VCC (5V) VCC (5V)
VSS (0V) VSS (0V)
DQ1 DQ2 DQ3 DQ4
DATA
DQ5 DQ6 DQ7 DQ8
OUTPUT ENABLE
OE
INPUT
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC VI VO
IO Pd Topr
Tstg
Supply voltage Input voltage Output voltage Output current Power dissipation Operating temperature Storage temperature
Parameter
With respect to VSS
Ta=25˚C
RECOMMENDED OPERATING CONDITIONS (Ta=0~70˚C, unless otherwise noted) (Note 1)
Symbol
VCC VSS
VIH VIL
Note 1 : All voltage values are with respect to Vss. * * : VIL(min) is -2.0V when pulse width is less than 25ns. (Pulse width is with respect to VSS.)
Supply voltage Supply voltage High-level input voltage, all inputs Low-level input voltage, all inputs
Parameter
Min Nom Max
4.5 0
2.4
-0.5 * *
Limits
5.0 0
Conditions
5.5 0
6.0
0.8
Unit
V V V
V
MITSUBISHI LSIs
Ratings
-1~7
-1~7
-1~7 50
1000
0~70
-65~150
Unit
V V V
mA
mW
˚C ˚C
ELECTRICAL CHARACTERISTICS
Symbol
VOH VOL
IOZ I I
ICC1 (AV)
High-level output voltage Low-level output voltage
Off-state output current
Input current Average supply current
from VCC, operating
Parameter
(Note 3,4,5)
(Ta=0~70˚C, VCC=5V±10%, VSS=0V, unless otherwise noted) (Note 2)
M5M44800C-5,-5S M5M44800C-6,-6S M5M44800C-7,-7S
Test conditions
IOH=-5mA IOL=4.2mA Q floating, 0V VOUT 5.5V 0V VIN +6.0V, Other inputs pins=0V
RAS, CAS cycling tRC=tWC=min. output open
Min Max
2.4 0
-10
-10
RAS= CAS =VIH, output open
ICC2
Supply current from VCC, stand-by
(Note 6)
RAS= CAS VCC -0.5V output open
M5M44800C-5,-5S M5M44800C-6,-6S M5M44800C-7,-7S M5M44800C-5,-5S M5M44800C-6,-6S M5M44800C-7,-7S M5M44800C-5,-5S M5M44800C-6,-6S M5M44800C-7,-7S
RAS cycling, CAS= VIH tRC=min. output open
RAS=VIL, CAS cycling tPC=min. output open
CAS before RAS refresh cycling tRC=min. output open
ICC3 (AV)
ICC4(AV)
ICC6(AV)
Average supply current from VCC, RAS only refresh mode
(Note 3,5)
Average supply current from VCC, Fast Page Mode
Average supply current from VCC, CAS before RAS refresh mode
(Note 3,4,5)
(Note 3,5)
RAS cycling CAS 0.2V or CAS before RAS refresh cycling
RAS 0.2V or VCC-0.2V Average supply current from VCC, Extended-Refresh mode
(Note 6)ICC8(AV) *
CAS 0.2V or VCC-0.2V
W 0.2V or VCC-0.2V
OE 0.2V or VCC-0.2V
A0~A9 0.2V or VCC-0.2V, DQ=open
tRC=125µs, tRAS=tRASmin~1µs
ICC9(AV) *
Note 2: Current flowing into an IC is positive, out is negative.
Note 3: ICC1 (AV), ICC3 (AV), ICC4 (AV) and ICC6 (AV) are dependent on cycle rate. Maximum current is measured at the fastest cycle rate. Note 4: ICC1 (AV) and ICC4 (AV) are dependent on output loading. Specified values are obtained with the output open. Note 5: Column address can be changed once or less while RAS=VIL and CAS=VIH
3
M5M44800CJ,TP-5,-5S:Under development
Average supply current from VCC, Self-Refresh mode
(Note 6)
RAS=CAS 0.2V output open
Limits
Typ
Vcc
0.4 10 10
90 75 65
1.0
0.1 * 90 75
65 90 75 65 80 65 55
150
150
Unit
V
V µA µA
mA
2
mA
mA
mA
mA
µA
µA
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
CAPACITANCE
Symbol Parameter Test conditions
CI (A) CI (CLK)
CI / O
SWITCHING CHARACTERISTICS
(Ta=0~70˚C, VCC=5V±10%, VSS=0V, unless otherwise noted)
Input capacitance, address inputs Input capacitance, clock inputs Input/Output capacitance, data ports
VI=VSS f=1MHz
VI=25mVrms
(Ta=0~70˚C, VCC = 5V±10%, VSS=0V, unless otherwise noted, see notes 6,13,14)
Limits
Min Max
Typ
5 7
7
Unit
pF pF pF
Limits
Symbol
tCAC tRAC tAA tCPA tOEA tCLZ
tOFF tOEZ
Note 6:An initial pause of 500µs is required after power-up followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh cycles). Note the RAS may be cycled during the initial pause. And 8 initialization cycles are required after prolonged periods (greater than 16.4ms) of RAS inactivity before proper device operation is achieved.
Note 7:Measured with a load circuit equivalent to 2TTL loads and 100pF. Note 8:Assumes that tRCD tRCD(max) and tASC tASC(max). Note 9:Assumes that tRCD tRCD(max) and tRAD tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC will
increase by amount that tRCD exceeds the value shown.
nOR10:Assumes that tRAD tRAD(max) and tASC tASC(max). Note11:Assumes that tCP tCP(max) and tASC tASC(max). Note12:tOFF(max), tOEZ(max) defines the time at which the output achieves the high impedance state (IOUT ±10µA ) and is not reference to VOH(min) or
VOL(max).
Access time from CAS Access time from RAS Column address access time Access time from CAS precharge Access time from OE
Output low impedance time from CAS low Output disable time after CAS high Output disable time after OE high
Parameter
(Note 7,8) (Note 7,9)
(Note 7,10) (Note 7,11)
(Note 7) (Note 7)
(Note 12) (Note 12)
M5M44800C-5,-5S
Min Max
13 50 25 30
13 13
M5M44800C-6,-6S
Min Max
15 60
30 35
1513
55
15 15
M5M44800C-7,-7S
Min Max
20 70 35 40 20
5
20 20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
4
M5M44800CJ,TP-5,-5S:Under development
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
TIMING REQUIREMENTS (For Read, Write, Read-Modify-Write, Refresh, and Fast-Page Mode Cycles)
(Ta=0~70˚C, VCC = 5V±10%, VSS=0V, unless otherwise noted, see notes 6,13,14)
Symbol
tREF tREF
tRP tRCD tCRP tRPC tCPN tRAD tASR tASC tRAH tCAH tDZC tDZO tCDD tODD tT
Note 13: The timing requirements are assumed tT=5ns.
Note 14: VIH(min) and VIL(max) are reference levels for measuring timing of input signals. Note 15: tRCD(max) is specified as a reference point only. If tRCD is less than tRCD(max), access time is tRAC. If tRCD is greater than tRCD(max), access time is
controlled exclusively by tCAC or tAA.
Note 16: tRAD(max) is specified as a reference point only. If tRAD tRAD(max) and tASC tASC(max), access time is controlled exclusively by tAA. Note 17: tASC(max) is specified as a reference point only. If tRCD tRCD(max) and tASC tASC(max), access time is controlled exclusively by tCAC. Note 18: Either tDZC or tDZO must be satisfied. Note 19: Either tCDD or tODD must be satisfied. Note 20: tT is measured between VIH(min) and VIL(max).
Refresh cycle time Refresh cycle time * RAS high pulse width Delay time, RAS low to CAS low
Delay time, CAS high to RAS low Delay time, RAS high to CAS low CAS high pulse width Column address delay time from RAS low Row address setup time before RAS low Column address setup time before CAS low Row address hold time after RAS low Column address hold time after CAS low
Delay time, data to CAS low Delay time, data to OE low
Delay time, CAS high to data Delay time, OE high to data Transition time
Parameter
(Note 15)
(Note 16)
(Note 17)
(Note 18) (Note 18) (Note 19) (Note 19) (Note 20)
M5M44800C-5,-5S M5M44800C-6,-6S
Min Max
16.4 128
30 18 5
10
13
13
37
0
25 0 0 8
0 0
1
7
50
Limits
Min Max
16.4 128
40 20
10 15
10 15
1513 1513
45 5 0
30 0
10
0
0 0
50
1
M5M44800C-7,-7S
Min Max
50 20
5
0 10 15
0
0 10 15
0
0 20
20
1
16.4 128
50
35
10
50
Unit
ms ms
ns
ns ns ns ns ns ns ns ns ns ns ns
ns ns ns
Read and Refresh Cycles
Symbol
tRC tRAS
tCAS tCSH tRSH tRCS
tRCH tRRH
tRAL tOCH
tORH
Note 21: Either tRCH or tRRH must be satisfied for a read cycle.
Read cycle time RAS low pulse width
CAS low pulse width CAS hold time after RAS low RAS hold time after CAS low Read Setup time before CAS low Read hold time after CAS high Read hold time after RAS high Column address to RAS hold time CAS hold time after OE low RAS hold time after OE low
Parameter
(Note 21) (Note 21)
M5M44800C-5,-5S M5M44800C-6,-6S
Min Max
90
10000
50
10000
13 50 13
0 0
0 25 13 15 13
Limits
Min Max
110
60
10000
15
10000
60
15
0
0 0 30
15
M5M44800C-7,-7S
Min Max
130
10000
70
10000
20 70 20
0
0 0 35 20 20
Unit
ns ns ns ns ns
ns ns ns
ns ns ns
5
M5M44800CJ,TP-5,-5S:Under development
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
Write Cycle (Early Write and Delayed Write)
Symbol
tWC tRAS tCAS tCSH tRSH tWCS tWCH tCWL tRWL tWP tDS tDH tOEH
Write cycle time RAS low pulse width
CAS low pulse width CAS hold time after RAS low RAS hold time after CAS low Write setup time before CAS low Write hold time after CAS low CAS hold time after W low
RAS hold time after W low
Write pulse width Data setup time before CAS low or W low Data hold time after CAS low or W low
OE hold time after W low
Parameter
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
Limits
Unit
ns ns ns ns ns ns ns ns ns ns ns ns
ns
(Note 23)
M5M44800C-5,-5S M5M44800C-6,-6S
Min
90
50
13
50
13
13
13
0
8
13
Max
10000 10000
0 8
8
Min 110 60 15
60 15
10 15 15
10
10 15
Max
10000 10000
0
0
M5M44800C-7,-7S
Min
Max
130
10000
70
10000
20 70 20
0
15 20 20
15
0 15 20
Read-Write and Read-Modify-Write Cycles
Symbol
tRWC tRAS tCAS tCSH tRSH tRCS tCWD tRWD tAWD tCWL tRWL ns tWP tDS tDH tOEH
Note 22: tRWC is specified as tRWC(min)=tRAC(max)+tODD(min)+tRWL(min)+tRP(min)+4tT.
Note 23: tWCS, tCWD, tRWD and tAWD and, tCPWD are specified as reference points only. If tWCS tWCS(min) the cycle is an early write cycle and the DQ pins
will remain high impedance throughout the entire cycle. If tCWD tCWD(min), tRWD tRWD(min), tAWD tAWD(min) and tCPWD tCPWD(min) (for fast page mode cycle only), the cycle is a read-modify-write cycle and the DQ will contain the data read from the selected address. If neither of the above condition (delayed write) of the DQ (at access time and until CAS or OE goes back to VIH ) is indeterminate.
Read write/read modify write cycle time RAS low pulse width
CAS low pulse width CAS hold time after RAS low
RAS hold time after CAS low
Read setup time before CAS low Delay time, CAS low to W low Delay time, RAS low to W low
Delay time, address to W low CAS hold time after W low RAS hold time after W low Write pulse width Data setup time before CAS low or W low
Data hold time after CAS low or W low OE hold time after W low
Parameter
(Note 22)
(Note 23) (Note 23) (Note 23)
M5M44800C-5,-5S M5M44800C-6,-6S
Min Max
126
86
10000
49
10000 86 49
0 31 68 43
13 15 20 13 15 20
13 15 20
Limits
Min Max 150
100
10000
55
10000
100
55 0
35 80 50
10 8 15
0 0 0
10 8 15
M5M44800C-7,-7S
Min Max
180 120
10000
70
10000
120
70 0
45 95 60
Unit
ns ns ns
ns ns ns ns ns ns ns
ns ns ns ns
6
M5M44800CJ,TP-5,-5S:Under development
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
Fast Page Mode Cycle (Read, Early Write, Read-Write, Read-Modify-Write Cycle) (Note 24)
Limits
Symbol
tPC tPRWC tRAS tCP tCPRH tCPWD
Note 24: All previously specified timing requirements and switching characteristics are applicable to their respective Fast page mode cycle.
Note 25: tRAS(min) is specified as two cycles of CAS input are performed. Note 26: tCP(max) is specified as a reference point only.
Fast page mode read/write cycle time Fast page mode read write/read modify write cycle time
RAS low pulse width for read or write cycle CAS high pulse width
RAS hold time after CAS precharge Delay time, CAS precharge to W low
Parameter
(Note 25) (Note 26)
(Note 23)
CAS before RAS Refresh Cycle, Extended Refresh Cycle * (Note 27)
Symbol
tCSR tCHR
tCAS
Note 27: Eight or more CAS before RAS cycles instead of eight RAS cycles are necessary for proper operation of CAS before RAS refresh mode.
CAS setup time before RAS low CAS hold time after RAS low CAS low pulse width
Parameter
M5M44800C-5,-5S
Min Max 35
71 80 85
100000
8
12 30 48
M5M44800C-5,-5S
Min Max
5
10 20
M5M44800C-6,-6S
Min Max
40
100000
100
M5M44800C-6,-6S
10 35 55
Min Max 5
10 20
15
Limits
M5M44800C-7,-7S
Min Max
45 95
100000
115
M5M44800C-7,-7S
Min Max
10 40
65
5 15
25
15
Unit
ns ns ns
ns ns ns
Unit
ns ns ns
Self Refresh Cycle * (Note 28)
Symbol
tRASS tRPS tCHS
CBR self refresh RAS low pulse width CBR self refresh RAS high precharge time CBR self refresh CAS hold time
Parameter
M5M44800C-5,-5S
Min Max 100
90
-50 -50 -50
Limits
M5M44800C-6,-6S
Min Max 100 110
M5M44800C-7,-7S
Min Max 100 130
Unit
µs
ns ns
7
M5M44800CJ,TP-5,-5S:Under development
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