with the high performance CMOS process, and is ideal for largecapacity memory systems where high speed, low power
dissipation, and low costs are essential.
The use of double-layer metalization process technology and a
single-transistor dynamic storage stacked capacitor cell provide
high circuit density at reduced costs. Multiplexed address inputs
permit both a reduction in pins and an increase in system
densities. Self or extended refresh current is low enough for
battery back-up application.
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
DESCRIPTION
This is a family of 524288-word by 8-bit dynamic RAMs, fabricated
Standard 28pin SOJ, 28pin TSOP (II)
Single 5V±10% supply
Low stand-by power dissipation
CMOS lnput level 5.5mW (Max)
CMOS Input level 550µW (Max) *
Operating power dissipation
M5M44800Cxx-5,-5S 495mW (Max)
M5M44800Cxx-6,-6S 413mW (Max)
M5M44800Cxx-7,-7S 358mW (Max)
Self refresh capability *
Self refresh current 150µA(Max)
Extended refresh capability
Extended refresh current 150µA(Max)
Fast page mode(1024-column random access),Read-modify-write,
RAS-only refresh, CAS before RAS refresh, Hidden refresh
capabilities.
Early-write mode, CAS and OE to control output buffer impedance
1024 refresh cycles every 16.4ms (A0 ~A9)
1024 refresh cycles every 128ms (A0 ~A9) *
* :Applicable to self refresh version (M5M44800CJ,TP-5S,-6S,-7S
:option) only
Cycle
time
110
130
Power
dissipa-
tion
(typ.mW)
375
325
PIN CONFIGURATION (TOP VIEW)
(5V)VCC
(5V)VCC 14
DQ1
DQ2
DQ3
DQ4
NC
W
RAS
A0
A1
A2
A3
1
2
3
4
5
6
8
9A9
10
11
12
13
13
Outline 28P0K(400mil SOJ)
(5V)VCC
(5V)VCC 14
DQ1
DQ2
DQ3
DQ4
NC
W
RAS
A0
A1
A2
A3
1
2
3
4
5
6
8
9A9
10
11
12
13
13
28
25
24
23
227
21
20
19
18
17
16
15
28
27
26
25
24
23
227
21
20
19
18
17
16
15
VSS(0V)
DQ827
DQ726
DQ6
DQ5
CAS
OE
NC
A8
A7
A6
A5
A4
VSS(0V)
VSS(0V)
DQ8
DQ7
DQ6
DQ5
CAS
OE
NC
A8
A7
A6
A5
A4
VSS(0V)
APPLICATION
Microcomputer memory, Refresh memory for CRT
PIN DESCRIPTION
Pin name
A0~A9
DQ1~DQ8
RAS
CAS
W
OE
Vcc
Vss
Address inputs
Data inputs/outputs
Row address strobe input
Column address strobe input
Write control input
Output enable input
Power supply (+5V)
Ground (0V)
1
M5M44800CJ,TP-5,-5S:Under development
Function
Outline 28P3Y-H(400mil TSOP Normal Bend)
NC:NO CONNECTION
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
In addition to normal read, write, and read-modify-write operations
the M5M44800CJ, TP provides a number of other functions, e.g.,
Row
address
address
Column
INPUTS / OUTPUTS
FUNCTION
Table 1 Input conditions for each mode
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
fast page mode, RAS-only refresh, and delayed-write. The input
conditions for each are shown in Table 1.
Operation
RAS
Read
Write (Early write)
Write (Delayed write)
Read-modify-write
RAS only refresh
Hidden refresh
CAS before RAS (Extended *) refresh
Self refresh *
Stand-by
Note : ACT : active, NAC : nonactive, DNC : don' t care, VLD : valid, IVD : invalid, APD : applied, OPN : open
ACT
ACT
ACT
ACT
ACT
ACT
ACT
ACT
NAC
CAS
ACT
ACT
ACT
ACT
NAC
ACT
ACT
ACT
DNC
W
NAC
ACT
ACT
ACT
DNC
DNC
DNC
DNC
Inputs
OE
ACT
DNC
DNC
ACT
DNC
ACT
DNCDNCDNCDNCOPNYESDNC
DNC
DNC
APD
APD
APD
APD
APD
DNC
DNC
DNC
APD
APD
APD
APD
DNC
DNC
DNC
DNC
Input/Output
InputOutput
OPN
VLD
VLD
VLD
DNC
OPN
DNC
DNC
VLD
OPN
IVD
VLD
OPN
VLD
OPN
OPN
Refresh Remark
YES
Fast page
YES
mode
YES
identical
YES
YES
YES
YES
NO
BLOCK DIAGRAM
COLUMN ADDRESS
STROBE INPUT
ROW ADDRESS
STROBE INPUT
WRITE CONTROL
INPUT
ADDRESS INPUTS
2
M5M44800CJ,TP-5,-5S:Under development
CAS
RAS
W
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
ROW &
COLUMN
ADDRESS
BUFFER
A0~A8
A0~
A9
ROW
DECODER
CLOCK GENERATOR
CIRCUIT
COLUMN DECODER
SENSE REFRESH
AMPLIFIER & I /O CONTROL
MEMORY CELL
(4194304BITS)
(8)
DATA IN
BUFFER
(8)
DATA OUT
BUFFER
VCC (5V)
VCC (5V)
VSS (0V)
VSS (0V)
DQ1
DQ2
DQ3
DQ4
DATA
DQ5
DQ6
DQ7
DQ8
OUTPUT ENABLE
OE
INPUT
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC
VI
VO
IO
Pd
Topr
Tstg
Supply voltage
Input voltage
Output voltage
Output current
Power dissipation
Operating temperature
Storage temperature
CAS before RAS refresh cycling
tRC=min.
output open
ICC3 (AV)
ICC4(AV)
ICC6(AV)
Average supply current
from VCC, RAS only
refresh mode
(Note 3,5)
Average supply current
from VCC, Fast Page
Mode
Average supply current
from VCC, CAS before RAS
refresh mode
(Note 3,4,5)
(Note 3,5)
RAS cycling CAS ≤ 0.2V or CAS
before RAS refresh cycling
RAS ≤ 0.2V or ≥ VCC-0.2V
Average supply current from VCC,
Extended-Refresh mode
(Note 6)ICC8(AV) *
CAS ≤ 0.2V or ≥ VCC-0.2V
W ≤ 0.2V or ≥ VCC-0.2V
OE ≤ 0.2V or ≥ VCC-0.2V
A0~A9≤ 0.2V or ≥ VCC-0.2V, DQ=open
tRC=125µs, tRAS=tRASmin~1µs
ICC9(AV) *
Note 2: Current flowing into an IC is positive, out is negative.
Note 3: ICC1 (AV), ICC3 (AV), ICC4 (AV) and ICC6 (AV) are dependent on cycle rate. Maximum current is measured at the fastest cycle rate.
Note 4: ICC1 (AV) and ICC4 (AV) are dependent on output loading. Specified values are obtained with the output open.
Note 5: Column address can be changed once or less while RAS=VIL and CAS=VIH
3
M5M44800CJ,TP-5,-5S:Under development
Average supply current from VCC,
Self-Refresh mode
(Note 6)
RAS=CAS ≤ 0.2V
output open
Limits
Typ
Vcc
0.4
10
10
90
75
65
1.0
0.1 *
90
75
65
90
75
65
80
65
55
150
150
Unit
V
V
µA
µA
mA
2
mA
mA
mA
mA
µA
µA
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
Note 6:An initial pause of 500µs is required after power-up followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh
cycles).
Note the RAS may be cycled during the initial pause. And 8 initialization cycles are required after prolonged periods (greater than 16.4ms) of RAS
inactivity before proper device operation is achieved.
Note 7:Measured with a load circuit equivalent to 2TTL loads and 100pF.
Note 8:Assumes that tRCD≥tRCD(max) and tASC≥tASC(max).
Note 9:Assumes that tRCD≤tRCD(max) and tRAD≤tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC will
increase by amount that tRCD exceeds the value shown.
nOR10:Assumes that tRAD≥tRAD(max) and tASC≤tASC(max).
Note11:Assumes that tCP≤tCP(max) and tASC≥tASC(max).
Note12:tOFF(max), tOEZ(max) defines the time at which the output achieves the high impedance state (IOUT≤ ±10µA ) and is not reference to VOH(min) or
VOL(max).
Access time from CAS
Access time from RAS
Column address access time
Access time from CAS precharge
Access time from OE
Output low impedance time from CAS low
Output disable time after CAS high
Output disable time after OE high
Parameter
(Note 7,8)
(Note 7,9)
(Note 7,10)
(Note 7,11)
(Note 7)
(Note 7)
(Note 12)
(Note 12)
M5M44800C-5,-5S
MinMax
13
50
25
30
13
13
M5M44800C-6,-6S
MinMax
15
60
30
35
1513
55
15
15
M5M44800C-7,-7S
MinMax
20
70
35
40
20
5
20
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
4
M5M44800CJ,TP-5,-5S:Under development
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
Note 13: The timing requirements are assumed tT=5ns.
Note 14: VIH(min) and VIL(max) are reference levels for measuring timing of input signals.
Note 15: tRCD(max) is specified as a reference point only. If tRCD is less than tRCD(max), access time is tRAC. If tRCD is greater than tRCD(max), access time is
controlled exclusively by tCAC or tAA.
Note 16: tRAD(max) is specified as a reference point only. If tRAD≥ tRAD(max) and tASC≤tASC(max), access time is controlled exclusively by tAA.
Note 17: tASC(max) is specified as a reference point only. If tRCD≥ tRCD(max) and tASC≥tASC(max), access time is controlled exclusively by tCAC.
Note 18: Either tDZC or tDZO must be satisfied.
Note 19: Either tCDD or tODD must be satisfied.
Note 20: tT is measured between VIH(min) and VIL(max).
Refresh cycle time
Refresh cycle time *
RAS high pulse width
Delay time, RAS low to CAS low
Delay time, CAS high to RAS low
Delay time, RAS high to CAS low
CAS high pulse width
Column address delay time from RAS low
Row address setup time before RAS low
Column address setup time before CAS low
Row address hold time after RAS low
Column address hold time after CAS low
Delay time, data to CAS low
Delay time, data to OE low
Delay time, CAS high to data
Delay time, OE high to data
Transition time
Parameter
(Note 15)
(Note 16)
(Note 17)
(Note 18)
(Note 18)
(Note 19)
(Note 19)
(Note 20)
M5M44800C-5,-5S M5M44800C-6,-6S
MinMax
16.4
128
30
18
5
10
13
13
37
0
25
0
0
8
0
0
1
7
50
Limits
MinMax
16.4
128
40
20
10
15
10
15
1513
1513
45
5
0
30
0
10
0
0
0
50
1
M5M44800C-7,-7S
MinMax
50
20
5
0
10
15
0
0
10
15
0
0
20
20
1
16.4
128
50
35
10
50
Unit
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Read and Refresh Cycles
Symbol
tRC
tRAS
tCAS
tCSH
tRSH
tRCS
tRCH
tRRH
tRAL
tOCH
tORH
Note 21: Either tRCH or tRRH must be satisfied for a read cycle.
Read cycle time
RAS low pulse width
CAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Read Setup time before CAS low
Read hold time after CAS high
Read hold time after RAS high
Column address to RAS hold time
CAS hold time after OE low
RAS hold time after OE low
Parameter
(Note 21)
(Note 21)
M5M44800C-5,-5S M5M44800C-6,-6S
MinMax
90
10000
50
10000
13
50
13
0
0
0
25
13 15
13
Limits
MinMax
110
60
10000
15
10000
60
15
0
0
0
30
15
M5M44800C-7,-7S
MinMax
130
10000
70
10000
20
70
20
0
0
0
35
20
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
M5M44800CJ,TP-5,-5S:Under development
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
CAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Write setup time before CAS low
Write hold time after CAS low
CAS hold time after W low
RAS hold time after W low
Write pulse width
Data setup time before CAS low or W low
Data hold time after CAS low or W low
Note 22: tRWC is specified as tRWC(min)=tRAC(max)+tODD(min)+tRWL(min)+tRP(min)+4tT.
Note 23: tWCS, tCWD, tRWD and tAWD and, tCPWD are specified as reference points only. If tWCS≥tWCS(min) the cycle is an early write cycle and the DQ pins
will remain high impedance throughout the entire cycle. If tCWD≥tCWD(min), tRWD≥tRWD(min), tAWD≥tAWD(min) and tCPWD≥tCPWD(min) (for fast page
mode cycle only), the cycle is a read-modify-write cycle and the DQ will contain the data read from the selected address. If neither of the above
condition (delayed write) of the DQ (at access time and until CAS or OE goes back to VIH ) is indeterminate.
Read write/read modify write cycle time
RAS low pulse width
CAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Read setup time before CAS low
Delay time, CAS low to W low
Delay time, RAS low to W low
Delay time, address to W low
CAS hold time after W low
RAS hold time after W low
Write pulse width
Data setup time before CAS low or W low
Data hold time after CAS low or W low
OE hold time after W low
Parameter
(Note 22)
(Note 23)
(Note 23)
(Note 23)
M5M44800C-5,-5S M5M44800C-6,-6S
MinMax
126
86
10000
49
10000
86
49
0
31
68
43
13 15 20
13 15 20
13 15 20
Limits
MinMax
150
100
10000
55
10000
100
55
0
35
80
50
10 8 15
0 0 0
10 8 15
M5M44800C-7,-7S
MinMax
180
120
10000
70
10000
120
70
0
45
95
60
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
6
M5M44800CJ,TP-5,-5S:Under development
MITSUBISHI LSIs
M5M44800CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (524288-WORD BY 8-BIT) DYNAMIC RAM
Fast Page Mode Cycle (Read, Early Write, Read-Write, Read-Modify-Write Cycle) (Note 24)
Limits
Symbol
tPC
tPRWC
tRAS
tCP
tCPRH
tCPWD
Note 24: All previously specified timing requirements and switching characteristics are applicable to their respective Fast page mode cycle.
Note 25: tRAS(min) is specified as two cycles of CAS input are performed.
Note 26: tCP(max) is specified as a reference point only.
Fast page mode read/write cycle time
Fast page mode read write/read modify write cycle time
RAS low pulse width for read or write cycle
CAS high pulse width
RAS hold time after CAS precharge
Delay time, CAS precharge to W low
Parameter
(Note 25)
(Note 26)
(Note 23)
CAS before RAS Refresh Cycle, Extended Refresh Cycle * (Note 27)
Symbol
tCSR
tCHR
tCAS
Note 27: Eight or more CAS before RAS cycles instead of eight RAS cycles are necessary for proper operation of CAS before RAS refresh mode.
CAS setup time before RAS low
CAS hold time after RAS low
CAS low pulse width
Parameter
M5M44800C-5,-5S
MinMax
35
7180
85
100000
8
12
30
48
M5M44800C-5,-5S
MinMax
5
10
20
M5M44800C-6,-6S
MinMax
40
100000
100
M5M44800C-6,-6S
10
35
55
MinMax
5
10
20
15
Limits
M5M44800C-7,-7S
MinMax
45
95
100000
115
M5M44800C-7,-7S
MinMax
10
40
65
5
15
25
15
Unit
ns
ns
ns
ns
ns
ns
Unit
ns
ns
ns
Self Refresh Cycle * (Note 28)
Symbol
tRASS
tRPS
tCHS
CBR self refresh RAS low pulse width
CBR self refresh RAS high precharge time
CBR self refresh CAS hold time
Parameter
M5M44800C-5,-5S
MinMax
100
90
-50-50-50
Limits
M5M44800C-6,-6S
MinMax
100
110
M5M44800C-7,-7S
MinMax
100
130
Unit
µs
ns
ns
7
M5M44800CJ,TP-5,-5S:Under development
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