This is a family of 262144-word by 16-bit dynamic RAMs,
fabricated with the high performance CMOS process, and is ideal
for memory systems where high speed, low power dissipation, and
low costs are essential.
The use of double-layer metalization process technology and a
single-transistor dynamic storage stacked capacitor cell provide
high circuit density at reduced costs. Multiplexed address inputs
permit both a reduction in pins and an increase in system
densities. Self or extended refresh current is small enough for
battery back-up application.
This device has 2CAS and 1W terminals with a refresh cycle of
512 cycles every 8.2ms.
CMOS Input level 550µW (Max) *
Operating power dissipation
M5M44260Cxx-5,-5S 688mW (Max)
M5M44260Cxx-6,-6S 605mW (Max)
M5M44260Cxx-7,-7S 523mW (Max)
Self refresh capability *
Self refresh current 150µA (Max)
Extended refresh capability
Extended refresh current 150µA (Max)
Fast-page mode (512-column random access), Read-modify-write,
RAS-only refresh, CAS before RAS refresh, Hidden refresh
capabilities.
Early-write mode, LCAS / UCAS and OE to control output buffer
impedance
512 refresh cycles every 8.2ms (A0~A8)
512 refresh cycles every 128ms (A0~A8) *
Byte or word control for Read/Write operation (2CAS, 1W type)
* : Applicable to self refresh version (M5M44260CJ,TP-5S,-6S,-7S
: option) only
MITSUBISHI LSIs
MITSUBISHI LSIs
M5M44260CJ,TP-5,-6,-7,
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
DESCRIPTION
FEATURES
Type name
M5M44260CXX-5,-5S
M5M44260CXX-6,-6S
M5M44260CXX-7,-7S
XX=J,TP
RAS
time
CAS
access
time
(max.ns)
access
(max.ns)
501325
60
7015203035
Address
access
(max.ns)
time
OE
access
time
(max.ns)
13
15
20
(min.ns)
Standard 40pin SOJ, 44 pin TSOP (II)
Single 5V±10% supply
Low stand-by power dissipation
CMOS Input level 5.5mW (Max)
CAS before RAS refresh cycling
tRC=min.
output open
Limits
Nom
Max
5.0
0
5.5
0
6.0
0.8
Test conditions
Unit
V
V
V
V
Limits
Typ
MinMax
2.4
0
-10
-10
VCC
0.4
10
10
125
110
95
1.0
0.1 *
125
110
95
125
110
95
115
100
85
Unit
V
V
µA
µA
mA
2
mA
mA
mA
mA
RAS cycling CAS ≤ 0.2V or CAS
before RAS refresh cycling
ICC8(AV) *
ICC9(AV) *
Note 2: Current flowing into an IC is positive, out is negative.
3: ICC1 (AV), ICC3 (AV), ICC4 (AV), and ICC6 (AV)are dependent on cycle rate. Maximum current is measured at the fastest cycle rate.
4: ICC1 (AV) and ICC4 (AV) are dependent on output loading. Specified values are obtained with the output open.
5: Column Address can be changed once or less while RAS=VIL and CAS=VIH.
3
M5M44260CJ,TP-5,-5S : Under development
Average supply current
from VCC
Extended-refresh mode
Average supply current from VCC
Self-refresh mode
(Note 6)
(Note 6)
RAS ≤ 0.2V or ≥ VCC-0.2V
CAS ≤ 0.2V or ≥ VCC-0.2V
W ≤ 0.2V or ≥ VCC-0.2V
OE ≤ 0.2V or ≥ VCC-0.2V
A0~A8≤ 0.2V or ≥ VCC-0.2V,
DQ=open
tRC=250µs, tRAS=tRASmin~1µs
RAS=CAS ≤ 0.2V
output open
150
150
µA
µA
MITSUBISHI LSIs
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
CAPACITANCE
Symbol
CI (A)
CI (CLK)
CI / O
SWITCHING CHARACTERISTICS
Symbol
tCAC
tRAC
tAA
tCPA
tOEA
tCLZ
tOFF
tOEZ
Note 6: An initial pause of 500 µs is required after power-up followed by a minimum of eight initialization cycles (RAS-only refresh or CAS before RAS refresh
cycles).
Note the RAS may be cycled during the initial pause. And 8 initialization cycles are required after prolonged periods (greater than 8.2ms) of RAS
inactivity before proper device operation is achieved.
7: Measured with a load circuit equivalent to 2TTL loads and 100pF.
8: Assumes that tRCD≥tRCD(max) and tASC≥tASC(max).
9: Assumes that tRCD≤tRCD(max) and tRAD≤tRAD(max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, tRAC
will increase by amount that tRCD exceeds the value shown.
10: Assumes that tRAD≥tRAD(max) and tASC≤tASC(max).
11: Assumes that tCP≤tCP(max) and tASC≥tASC(max).
12: tOFF(max) and tOEZ (max) defines the time at which the output achieves the high impedance state (IOUT≤ ±10 µA ) and is not reference to VOH(min)
or VOL(max).
(Ta=0~70˚C, VCC=5V±10%, Vss=0V, unless otherwise noted, see notes 6,13,14)
Parameter
Access time from CAS
Access time from RAS
Columu address access time
Access time from CAS precharge
Access time from OE
Output low impedance time from CAS low
Output disable time after CAS high
Output disable time after OE high
VI=VSS
f=1MHz
VI=25mVrms
(Note 7,8)
(Note 7,9)
(Note 7,10)
(Note 7,11)
(Note 7)
(Note 7)
(Note 12)
(Note 12)
Limits
MinMax
M5M44260C-5,-5S M5M44260C-6,-6S M5M44260C-7,-7S
MinMax
13
50
25
30
13
5
13
13
Limits
MinMaxMinMax
5
15
60
30
35
15
15
15
Typ
5
7
7
20
70
35
40
20
5
20
20
Unit
pF
pF
pF
Unit
ns
ns
ns
ns
ns
ns
ns
ns
4
M5M44260CJ,TP-5,-5S : Under development
MITSUBISHI LSIs
CAS low pulse width
Refresh cycle time
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
(Ta=0~70˚C, VCC=5V±10%, VSS=0V, unless otherwise noted, see notes 6,13,14)
Limits
Symbol
tREF
tREFRefresh cycle time *
tRP
tRCD
tCRP
tRPC
tCPN
tRAD
tASR
tASC
tRAH
tCAH
tDZC
tDZO
tCDD
tODD
tT
Note 13: The timing requirements are assumed tT =5ns.
14: VIH(min) and VIL(max) are reference levels for measuring timing of input signals.
15: tRCD(max) is specified as a reference point only. If tRCD is less than tRCD(max), access time is tRAC. If tRCD is greater than tRCD(max), access time is
controlled exclusively by tCAC or tAA.
16: tRAD(max) is specified as a reference point only. If tRAD≥ tRAD(max) and tASC≤ tASC(max), access time is controlled exclusively by tAA.
17: tASC(max) is specified as a reference point only. If tRCD≥ tRCD(max) and tASC≥ tASC(max), access time is controlled exclusively by tCAC.
18: Either tDZC or tDZO must be satisfied.
19: Either tCDD or tODD must be satisfied.
20: tT is measured between VIH(min) and VIL(max).
RAS high pulse width
Delay time, RAS low to CAS low
Delay time, CAS high to RAS low
Delay time, RAS high to CAS low
CAS high pulse width
Column address delay time from RAS low
Row address setup time before RAS low
Column address setup time before CAS low
Row address hold time after RAS low
Column address hold time after CAS low
Delay time, data to OE low
Delay time, CAS high to data
Delay time, OE high to data
Transition time
Parameter
(Note 15)
(Note 16)
(Note 17)
(Note 18)Delay time, data to CAS low
(Note 18)
(Note 19)
(Note 19)
(Note 20)
M5M44260C-5,-5S
MinMax
8.2
128
30
18
5
10
13
13
13
13
37
0
25
0
7
0
8
0
0
50
1
M5M44260C-6,-6S
MinMaxMinMax
40
20
5
0
10
15
0
0
10
15
0
0
15
15
1
M5M44260C-7,-7S
8.28.2
128
45
30
10
50
128
50
20
5
0
10
15
0
0
10
15
0
0
20
20
1
50
35
10
50
Unit
ms
ms
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Read and Refresh Cycles
Symbol
tRC
tRAS
tCAS
tCSH
tRSH
tRCS
tRCH
tRRH
tRAL
tOCH
tORH
Note 21: Either tRCH or tRRH must be satisfied for a read cycle.
Read cycle time
RAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Read setup time before CAS low
Read hold time after CAS high
Read hold time after RAS high
Column address to RAS hold time
CAS hold time after OE low
RAS hold time after OE low
Parameter
(Note 21)
(Note 21)
Limits
M5M44260C-5,-5S M5M44260C-6,-6S M5M44260C-7,-7S
MinMax
90
10000
50
13
10000
50
13
0
0
0
25
13
13
MinMaxMinMax
110
60
15
60
15
0
30
15
15
10000
10000
0
0
130
70
20
70
20
0
35
20
20
10000
10000
0
0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
5
M5M44260CJ,TP-5,-5S : Under development
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
CAS low pulse width
Write Cycle (Early Write and Delayed Write)
Symbol
tWC
tRAS
tCAS
tCSH
tRSH
tWCS
tWCH
tCWL
tRWL
tWP
tDS
tDH
tOEH
Write cycle time
RAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Write setup time before CAS low
Write hold time after CAS low
CAS hold time after W low
RAS hold time after W low
Write pulse width
Data setup time before CAS low or W low
Data hold time after CAS low or W low
OE hold time after W low
Parameter
MITSUBISHI LSIs
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
Limits
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(Note 23)
M5M44260C-5,-5S M5M44260C-6,-6S M5M44260C-7,-7S
MinMax
90
10000
50
10000
13
50
13
0
8
13
13
8
0
8
13
MinMaxMinMax
110
60
15
60
15
10
15
15
10
10
15
10000
10000
0
0
130
70
20
70
20
15
20
20
15
15
20
10000
10000
0
0
Read-Write and Read-Modify-Write Cycles
Limits
Symbol
tRWC
tRAS
tCAS
tCSH
tRSH
tRCS
tCWD
tRWD
tAWD
tCWL
tRWL
tWP
tDS
tDH
tOEH
Note 22: tRWC is specified as tRWC(min)=tRAC(max)+tODD(min)+tRWL(min)+tRP(min)+4tT.
23: tWCS, tCWD, tRWD and tAWD and tCPWD are specified as reference points only. If tWCS≥ tWCS(min) the cycle is an early write cycle and the DQ pins
will remain high impedance throughout the entire cycle. If tCWD≥ tCWD(min), tRWD≥ tRWD(min), tAWD≥ tAWD(min) and tCPWD≥ tCPWD(min)
(for fast page mode cycle only), the cycle is a read-modify-write cycle and the DQ will contain the data read from the selected address.
If neither of the above condition (delayed write) of the DQ (at access time and until CAS or OE goes back to VIH) is indeterminate.
Read write/read modify write cycle time
RAS low pulse width
CAS low pulse width
CAS hold time after RAS low
RAS hold time after CAS low
Read setup time before CAS low
Delay time, CAS low to W low
Delay time, RAS low to W low
Delay time, address to W low
CAS hold time after W low
RAS hold time after W low
Write pulse width
Data setup time before CAS low or W low
Data hold time after CAS low or W low
OE hold time after W low
Parameter
(Note 22)
(Note 23)
(Note 23)
(Note 23)
M5M44260C-5,-5S M5M44260C-6,-6S M5M44260C-7,-7S
MinMax
126
10000
86
49
86
49
0
31
68
43
13
13
8
0
8
MinMaxMinMax
150
10000
100
1000010000
55
100
55
0
35
80
50
15
15
10
0
10
151320
180
120
70
120
70
45
95
60
20
20
15
15
10000
10000
0
0
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
6
M5M44260CJ,TP-5,-5S : Under development
MITSUBISHI LSIs
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
Note 24: All previously specified timing requirements and switching characteristics are applicable to their respective fast page mode cycle.
25: tRAS(min) is specified as two cycles of CAS input are performed.
26: tCP(max) is specified as a reference point only.
Fast page mode read/write cycle time
Fast page mode read write/read modify write cycle time
RAS low pulse width for read or write cycle
CAS high pulse width
RAS hold time after CAS precharge
Delay time, CAS precharge to W low
Parameter
(Note 25)
(Note 26)
(Note 23)
M5M44260C-5,-5S M5M44260C-6,-6S M5M44260C-7,-7S
Min
Max
35
71
85
100000
8
12
30
48
CAS before RAS Refresh Cycle, Extended Refresh Cycle * (Note 27)
Symbol
tCSR
tCHR
tCAS
Note 27: Eight or more CAS before RAS cycles instead of eight RAS cycles are necessary for proper operation of CAS before RAS refresh mode.
CAS setup time before RAS low
CAS low pulse width
Parameter
M5M44260C-5,-5S
MinMax
5
10CAS hold time after RAS low
2020
Limits
MinMaxMinMax
40
80
100
100000
10
15
35
55
Limits
M5M44260C-6,-6S
MinMaxMinMax
5
10
45
95
115
10
40
65
M5M44260C-7,-7S
5
15
25
100000
15
Unit
ns
ns
ns
ns
ns
ns
Unit
ns
ns
ns
Self Refresh Cycle * (Note 28)
tRASS
tRPS
tCHS
CBR self refresh RAS low pulse width
CBR self refresh RAS high precharge time
CBR self refresh CAS hold time
Limits
ParameterSymbol
M5M44260C-5,-5S
MinMax
100
90
-50
M5M44260C-6,-6S
MinMaxMinMax
110
-50
M5M44260C-7,-7S
100100
130
-50
Unit
µs
ns
ns
7
M5M44260CJ,TP-5,-5S : Under development
Timing Diagrams (Note 29)
Read Cycle
MITSUBISHI LSIs
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
tRC
RAS
LCAS/UCAS
A0~A8
W
DQ1~DQ16
(INPUTS)
DQ1~DQ16
(OUTPUTS)
OE
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VOH
VOL
VIH
VIL
tCRP
tASR
ADDRESS
ROW
tRAH
tRAD
Hi-Z
tRCD
tRCS
tDZC
tASC
tRAC
tRAS
tCSH
COLUMN
ADDRESS
tDZO
tCAH
tAA
tCLZ
tCAC
tCAS
tRAL
tOEA
tRSH
tOCH
Hi-Z
DATA VALID
tORH
tOFF
tOEZ
tRCH
tRPC
tCDD
tODD
tRP
tCRP
tASR
ROW
ADDRESS
tRRH
Hi-Z
8
M5M44260CJ,TP-5,-5S : Under development
Note 29
Indicates the don't care input.
VIH(min)≤ VIN≤ VIH(max) or VIL(min)≤ VIN≤ VIL(max)
Indicates the invalid output.
Byte Read Cycle
MITSUBISHI LSIs
M5M44260CJ,TP-5,-6,-7,-5S,-6S,-7S
FAST PAGE MODE 4194304-BIT (262144-WORD BY 16-BIT) DYNAMIC RAM
tRC
RAS
UCAS
(or LCAS)
LCAS
(or UCAS)
A0~A8
W
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
VIH
VIL
tCRP
tASR
ADDRESS
ROW
tRAH
tRAD
tRCD
tRCS
tASC
ADDRESS
tRAS
tCSH
COLUMN
tCAH
tCAS
tRAL
tRSH
tCPN
tRCH
tRPC
tRRH
tRP
tCRP
tASR
ROW
ADDRESS
DQ1~DQ8
(or DQ9~DQ16)
(INPUTS)
DQ1~DQ8
(or DQ9~DQ16)
(OUTPUTS)
DQ9~DQ16
(or DQ1~DQ8)
(INPUTS)
DQ9~DQ16
(or DQ1~DQ8)
(OUTPUTS)
OE
VIH
VIL
VOH
VOL
VIH
VIL
VOH
VOL
VIH
VIL
Hi-Z
tDZC
tRAC
tDZO
tAA
tCLZ
tCAC
Hi-Z
tOEA
Hi-Z
tOCH
DATA VALID
tORH
tCDD
tOFF
Hi-Z
tOEZ
tODD
9
M5M44260CJ,TP-5,-5S : Under development
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