Mitsubishi Electric Corporation Semiconductor Group CR08AS Datasheet

MITSUBISHI SEMICONDUCTOR THYRISTOR
CR08AS
LOW POWER USE
NON-INSULATED TYPE, GLASS PASSIVATION TYPE
CR08AS
T (AV) ........................................................................0.8A
•V
DRM ..............................................................400V/600V
GT .........................................................................100µA
OUTLINE DRAWING
4.4±0.1
1.6±0.2
2
1
0.8 MIN
1.5±0.11.5±0.1 (Back side)
2
1
3
0.5±0.07
0.4±0.07
3
SOT-89
Dimensions
1.5±0.1
2.5±0.1
3.9±0.3
+0.03
0.4
–0.05
T
1
TERMINAL
1
T
2
TERMINAL
2
GATE TERMINAL
3
in mm
APPLICATION
Solid state relay, strobe flasher, ignitor, hybrid IC
MAXIMUM RATINGS
Symbol
RRM
V VRSM VR (DC) VDRM VD (DC)
Symbol
I
T (RMS)
IT (AV) ITSM
2
t
I
PGM PG (AV) VFGM VRGM IFGM Tj Tstg
1. With Gate-to-cathode resistance RGK=1k
Repetitive peak reverse voltage Non-repetitive peak reverse voltage DC reverse voltage Repetitive peak off-state voltage DC off-state voltage
RMS on-state current Average on-state current Surge on-state current
2
I
t
for fusing
Peak gate power dissipation Average gate power dissipation Peak gate forward voltage Peak gate reverse voltage Peak gate forward current Junction temperature Storage temperature Weight
Parameter
Parameter
8 (marked “AD”)
11
Commercial frequency, sine half wave, 180° conduction, T 60Hz sine half wave 1 full cycle, peak value, non-repetitive
Value corresponding to 1 cycle of half wave 60Hz, surge on-state current
Typical value
400 500 320 400 320
Conditions
Voltage class
12 (marked “AF”)
600 720 480 600 480
2
a=51°C
Ratings
1.26
0.8 10
0.42
0.5
0.1
6 6
0.3
–40 ~ +125 –40 ~ +125
48
Unit
V V V V V
Unit
A A A
2
s
A
W W
V V A
°C °C
mg
Feb.1999
MITSUBISHI SEMICONDUCTOR THYRISTOR
NON-INSULATED TYPE, GLASS PASSIVATION TYPE
ELECTRICAL CHARACTERISTICS
Symbol
I
RRM
IDRM VTM VGT VGD IGT IH Rth (j-a)
2.Soldering with ceramic plate (25mm × 25mm × t0.7).3.If special values of I
The above values do not include the current flowing through the 1k resistance between the gate and cathode.
Repetitive peak reverse current Repetitive peak off-state current On-state voltage Gate trigger voltage Gate non-trigger voltage Gate trigger current Holding current Thermal resistance
Item
I
GT (µA)
Parameter
j=125°C, VRRM applied, RGK=1k
T T
j=125°C, VDRM applied, RGK=1k
T
a=25°C, ITM=2.5A, instantaneous value
T
a=25°C, VD=6V, IT=0.1A
Tj=125°C, VD=1/2VDRM, RGK=1k T
j=25°C, VD=6V, IT=0.1A
Tj=25°C, VD=12V, RGK=1k Junction to ambient
GT are required, choose at least two items from those listed in the table below. (Example: AB, BC)
A
1 ~ 30
B
20 ~ 50
C
40 ~ 100
Test conditions
4
4
2
CR08AS
LOW POWER USE
Limits
Typ.
Min.
0.2
— —
1
1.5
Max.
0.5
0.5
1.5
0.8 —
100
65
Unit
mA mA
V V V
3
µA
3
mA
°C/W
GT
, VGT measurement circuit.
4. I
GSIGT
I
3V
DC
A3 A2
GK
R 1k
V1
21
V
GT
SWITCH
SWITCH 1 : IGT measurement SWITCH 2 : V
GT
measurement
(Inner resistance of voltage meter is about 1k)
PERFORMANCE CURVES
MAXIMUM ON-STATE CHARACTERISTICS
2
10
7
Ta = 25°C
5 3
2
1
10
7 5
3 2
0
10
7 5
ON-STATE CURRENT (A)
3 2
–1
10
TUT
A1
60
6V DC
RATED SURGE ON-STATE CURRENT
10
9 8 7 6 5 4 3 2 1
SURGE ON-STATE CURRENT (A)
501 423
0
10023 5710
44
1
23 5710
2
ON-STATE VOLTAGE (V)
CONDUCTION TIME
(CYCLES AT 60Hz)
Feb.1999
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