MITSUBISHI SEMICONDUCTOR
Preliminary BA01232
Specifications are subject to change without notice. HBT HYBRID IC
DESCRIPTION
The BA01232 is GaAs RF amplifier designed for
W-CDMA hand-held phone.
OUTLINE DRAWING
①
FEATURES
Low voltage Vcc=3.5V
High power Po=26.5dBm @1920∼1980MHz
High gain Gp=27.5dB @Po=26.5dBm
2stage amplifier
Internal input and output matching
Small size package 4x4x1.2mm
②
③ ④
4.00 1.40
APPLICATION
W-CDMA(UTRA/FDD) mobile transmitter
(UE Power Class 3).
ABSOLUTE MAXIMUM RATINGS (Ta=25°C)
Symbol
Parameter Condition Ratings* Unit
Vcc Supply voltage of HPA 6 V
Pin Input power ZG=ZL=50Ω 7 dBm
Tc(op)
Operating case temp. -20 ∼ +85 °C
Unit : millimeters
⑥
⑤
①Pin
②Vc1
③Vc2
4.00
④Pout
⑤Vcb
⑥Vref
Tstg Storage temp. -30 ∼ +95 °C
*Note : Each maximum rating is guaranteed independently .
ELECTRICAL CHARACTERISTICS(Ta=25°C)
Symbol
Parameter
Test conditions**
f Frequency 1920
Limits
MIN TYP MAX
1980 MHz
Icqt Idle current No RF input 35 mA
Ict Total current 252 mA
PAE Power added efficiency 50 %
Pin Input Power -1.0 dBm
ρin Return loss -6 dB
Adjacent channel leakage power
at 5MHz
ACLR
Adjacent channel leakage power
at 10MHz
2Sp/3Sp
2nd/3rd harmonics -30 dBc
Po=26.5dBm
Vc1=Vc2=3.5V
Vref=2.9V
Vcb=2.9V
-41 -38 dBc
-54 -48 dBc
Unit
RX noise
RX band noise
-140
dBm/Hz
**NOTE : ZG=ZL=50Ω
3.84Mcps spreading, HPSK.
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and reliable, but there is always the possibility
that trouble may occur with them. Trouble with semiconductors may lead to personal injury, appropriate measures such as (i)placement of
substitutive, auxiliary, circuits, (ii)use of non-flammable material or (iii)prevention against any malfunction or mishap.
MITSUBISHI ELECTRIC CORP.
Feb.,04