Page 1
Date: April, 2006 / Issue 1.0
Service Manual
Model : KG210
Service Manual
KG210
Page 2
- 3 -
1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. PERFORMANCE...............................9
2.1 H/W Features...........................................9
2.2 Technical Specification ..........................10
3. TECHNICAL BRIEF ........................15
3.1 Power Transceiver .................................15
3.2 FEM for Triband .....................................17
3.3 26 MHz Clock.........................................18
3.4 Baseband Processor..............................19
3.5 Battery Charging Block ..........................24
3.6 Display and Interface .............................26
3.7 Keypad Switches and Scanning ............28
3.8 Microphone ............................................29
3.9 Main Speaker.........................................30
3.10 Headset Interface.................................31
3.11 Key Back-light Illumination...................32
3.12 LCD Back-light Illumination..................33
3.13 VIBRATOR...........................................34
4. TROUBLE SHOOTING ...................35
4.1 RF Component.......................................35
4.2 RX Trouble.............................................36
4.3 TX Trouble .............................................42
4.4 Power On Trouble..................................49
4.5 Charging Trouble ...................................51
4.6 Vibrator Trouble .....................................53
4.7 LCD Trouble...........................................55
4.8 Speaker Trouble ....................................57
4.9 SIM Card Interface Trouble....................59
4.10 Earphone Trouble ................................61
4.11 KEY backlight Trouble .........................63
4.12 Receiver Trouble..................................65
4.13 Microphone Trouble .............................67
4.14 RTC Trouble ........................................69
4.15 Indication LED Trouble ........................71
4.16 Folder on/off Trouble............................73
5. DOWNLOAD.......................................75
5.1 Download ...............................................75
6. BLOCK DIAGRAM ..........................81
7. Circuit Diagram ..............................83
8. pcb layout .......................................89
9. ENGINEERING MODE ....................91
9.1 BB Test [MENU 1]..................................92
9.2 RF Test [MENU 2]..................................94
9.3 MF mode [MENU 3] ...............................94
9.4 Trace option [MENU 4] ..........................95
9.5 Call timer [MENU 5] ...............................95
9.6 Fact. Reset [MENU 6] ............................95
9.7 S/W version............................................95
10. STAND ALONE TEST ...................96
10.1 Introduction ..........................................96
10.2 Setting Method.....................................96
10.3 Means of Test ......................................97
11. AUTO CALIBRATION....................99
11.1 Overview ..............................................99
11.2 Equipment List .....................................99
11.3 Test Jig Operation..............................100
11.4 Procedure ..........................................101
11.5 AGC ...................................................104
11.6 APC....................................................104
11.7 ADC ...................................................104
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 105
12.1 Exploded View .................................. 105
12.2 Replacement Parts ............................107
12.3 Accessory ......................................... 121
Table Of Contents
Page 3
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Page 4
1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
Page 5
1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
Page 6
1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
Page 7
1. INTRODUCTION
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PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
Page 8
2. PERFORMANCE
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2.1 H/W Features
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 830mAh
Stand by TIME Up to 200 hrs : Paging Period 9, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power
GSM, EGSM: 32.5dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display LCD : CSTN 128 × 128 pixel 65K Color
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Status Indicator Menu Key, Clear Key
Send Key, END/PWR Key
Soft Key(Left/Right)
ANT Internal
EAR Phone Jack Yes (mono)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver One way speaker
Travel Adapter Yes
MIDI 40 Poly (Mono SPK)
Page 9
2. PERFORMANCE
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2.2 Technical Specification
Item Description Specification
GSM
TX: 890 + n x 0.2 MHz
RX: 935 + n x 0.2 MHz (n=1~124)
EGSM
1Frequency Band TX: 890 + (n-1024) x 0.2 MHz
RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)
DCS
TX: 1710 + (n-512) x 0.2 MHz
RX: 1805 + (n-512) x 0.2 MHz (n=512~885)
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
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2. PERFORMANCE
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Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
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2. PERFORMANCE
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Item Description Specification
DCS
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM, EGSM
8 Bit Error Ratio
BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
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2. PERFORMANCE
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Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Current
Fast Charge : < 430 mA
Slow Charge : < 160 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0~ -105 dBm
Battery Bar Number Voltage
0 3.48 ~ 3.63 V
23 Battery Indicator 1 3.63 ~ 3.70 V
2 3.70 ~ 3.76 V
3 3.76 ~ 3.89 V
4 3.89 V ~
24 Low Voltage Warning
3.63 0.03V (Call) every 1 minutes
3.48 0.03V (Standby)
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2. PERFORMANCE
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Item Description Specification
25 Forced shut down Voltage 3.33 0.03 V
1 Li-ion Battery
26 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 830mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 800 mA
Page 14
3. TECHNICAL BRIEF
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3.1 Power Transceiver (SKY77328, U500)
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The
module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks,
impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control
(PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides
the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die,
one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other
supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to
distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a
multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and
output ports of the SKY77328 are internally matched to a 50 Ω load to reduce the number of external
components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA
module maximizes handset standby time. The SKY77328 also contains band-select switching circuitry
to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In
Figure 1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the
Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an
internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC™)
function, which is insensitive to variations in temperature, power supply, process, and input power.
The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. Figure 1. Functional
Block Diagram
3. TECHNICAL BRIEF
Figure1. Functional Block Diagram
Page 15
3. TECHNICAL BRIEF
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SKY77328 PAM Pin Configuration-20-Pin
Leadless (Top View)
Figure 6. Typical Case Makings
Table 4. SKY77328 Pin Names and Signal Descriptions
Pin Mame Description
1BSBand Select
2 VCC1A VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC)
3 DCS/PCS IN RF input 1710-1910 MHz (DCS1800, PCS1900)
4 GND IN RF input 824-915 MHz (GSM850/900)
5 GND RF and DC Ground
6 VCC1B RF and DC Ground
7 GND RF and DC Ground
8 GND RF and DC Ground
9 GND RF and DC Ground
10 GND RF and DC Ground
11 GSM OUT RF Output 824-915 MHz (GSM850/900)
12 GND RF and DC Ground
13 GND RF and DC Ground
14 GND RF and DC Ground
15 DCS/PCS OUT RF Output 1710-1910 MHz (DCS 1800, PCS1900)
17 VBATT Battery input to high side of intemal sense resistor
18 ENABLE BiCMOS Enable
19 RSVD(GND) RF and DC Ground
20 VAPC Power Control Bias Voltage
GMD PAD(21) GND Ground Pad, bottom
Page 16
3. TECHNICAL BRIEF
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3.2 FEM for Triband
Table 3-1 Band SW Logic Table
Figure 3- 2 FEM CIRCUIT DIAGRAM
270p
C540
C541
270p
R518 0
GND11
22
23
GND12
GND13
24
GND2
4
GND3
6
7
GND4
GND5
16
17
GND6
GND7
18
19
GND8
GND9
20
PCS_RX1
14
15
PCS_RX2
3
VC_DCSPCS
9
VC_EGSM
HWXQ511
FL500
1
ANT
5
DCSPCS_TX
DCS_RX1
12
13
DCS_RX2
EGSM_RX1
10
11
EGSM_RX2
EGSM_TX
8
GND1
2
21
GND10
R516 0
ANT_SW2
ANT_SW1
Select Mode Vc(EGSM) Vc(DCS/PCS)
EGSM-Rx Low Low
EGSM-Tx High Low
DCS-Rx Low Low
PCS-Rx Low Low
DCS/PCS Low High
Page 17
3. TECHNICAL BRIEF
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3.3 26 MHz Clock (VCTCXO, X500)
The 26 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which
oscillates at a frequency of 26 MHz. It is used within the SKY77328, base band
processor(AD6720,U101), Midi(U203, YMU762C-QZ).
Figure 3-3. VCTCXO CIRCUIT DIAGRAM
2V75_VVCXO
X500
C544
2.2u
VCONT
GND
26MHz
1
2
3
OUT
4
VCC
C543
1000p
R521
15K
AFC
Page 18
3. TECHNICAL BRIEF
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3.4 Baseband Processor (AD6720 , U101)
• AD6720 is an ADI designed processor
• AD6720 consists of
1. Control Processor Subsystem including:
• 32-bit MCU ARM7TDMI® Control Processor
• 39 MHz operation at 1.8V
• 1Mb of on-chip System SRAM Memory
2.DSP Subsystem including:
• 16-bit Fixed Point DSP Processor
• 91 MIPS[1] at 1.8V
• Data and Program SRAM
• Program Instruction Cache
• Full Rate, Enhanced Full Rate and Half Rate
• Speech Encoding/Decoding
• Capable of Supporting AMR & PDC Speech Algorithms
3.Peripheral Functions
• Parallel and Serial Display Interface
• Keypad Interface
• Flash Memory Interface
• Page-Mode Flash Support
• 1.8V and 3.0V, 64 kbps SIM Interface
• Universal System Connector Interface
• Data Services Interface
• Battery Interface (e.g. Dallas)
4. Other
• Supports 13 MHz and 26 MHz Input Clocks
• 1.8V Typical Core Operating Voltages
• 289-Ball Package (12x12mm) , 0.65mm Ball pitch
5. The AD6720 baseband transmit section supports the following
• mobile station GMSK modulation power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2
Page 19
3. TECHNICAL BRIEF
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Figure 3-4 SYSTEM INTERCONECTION OF AD6720 EXTERNAL INTERFACE
Page 20
3. TECHNICAL BRIEF
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3.4.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL
The X-TAL oscillates 32.768KHz
The backlight of LCD module is controlled by AD6720 via AAT3157 , U404. The control signals related
to Backlight LED are given bellow.
Signals Description
MLED Current source for backlight LED
LCD_DIM_CTL Control LCD backlight level in 16 steps
MLED[1:2] This pins are returned-paths for backlight LED current source (MLED)
Table 3-3. DESCRIPTION OF LCD BACKLIGHT LED CONTROL
Page 21
3. TECHNICAL BRIEF
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C. RF interface
The AD6720 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON ,
PA_EN, S_EN, S_DATA, S_CLK, RF_PWR_DWN.
Signals Description
PA_BAND (GPO 17) PAM Band Select
ANT_SW1 (GPO 9) Antenna switch Band Select
ANT_SW2 (GPO 11) Antenna switch Band Select
RF_PWR_DWN(GPO 4) Power down Input
CLKON RF LDO Enable/Disable
PA_EN (GPO 16) PAM Enable/Disable
S_EN (GPO 19) PLL Enable/Disable
S_DATA (GPO 20) Serial Data to PLL
S_CLK (GPO 21) Clock to PLL
Table 3-4. RF CONTROL SIGNALS DESCRIPTION
Page 22
3. TECHNICAL BRIEF
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D. SIM interface
The AD6720 provides SIM Interface Module. The AD6720 checks status periodically during
established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,
SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-5
in detail.
Signals Description
SIM_DATA
This pin receives and sends data to SIM card.
This model can support only 3.0 volt interface SIM card.
SIM_CLK Clock 3.25MHz frequency.
SIM_RST
Reset SIM block
(GPIO_23)
Table 3-5. SIM CONTROL SIGNALS DESCRIPTION
Figure 3-5. SIM Interface of AD6720
SIM CONNECTOR
220n
C128 C135
1000p
3
CLK
GND1
4
7
GND2
GND3
89
GND4
GND5
10
IO
6
RST
2
1
VCC
5
VPP
J100
2V85_VSIM
C133
NA
0
R126
20K
R120
2V85_VSIM
22p
C134
SIM_RST
SIM_CLKSIM_DATA
Page 23
3. TECHNICAL BRIEF
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E. LDO Block
There are 8 LDOs in the AD6720.
- VCORE : supplies Digital baseband Processor core and AD6720 digital core
- VMEM : supplies external memory and the interface to the external memory on the digital
baseband processor (1,8V or 2.8V, 150mA)
- VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)
- VSIM : supplies the SIM interface circuitry on the digital processor and SIM card
(2.85V, 20mA)
- VRTC : supplies the Real-Time Clock module (1.8 V, 20µA)
- VABB : supplies the analog portions of the AD6720
- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)
- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
3.5 Battery Charging Block
1. It can be used to charge Lithium Ion batteries.
Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware.
2. Charging Process
- Check charger is inserted or not
- If AD6720 detects that Charger is inserted, the CC-CV charging starts.
- Exception : When battery voltage is lower than 3.2V, the precharge(low current charge mode)
starts firstly.
- And the battery voltage reach to 3.2V the CC-CV charging starts.
3. Pins used for charging
- VCHG : charger supply.
- GATEDRIVE : charge DAC output
- ISENSE : charge current sense input
- VBATSENSE : battery voltage sense input.
- BATTYPE : battery type identification input
- REFCHG : voltage reference output
4. TA (Travel Adaptor)
- Input voltage: AC 85V ~ 260V, 50~60Hz
- Output voltage: DC 5.2V ( 0.2 V )
- Output current: Max 800mA ( 50mA )
5. Battery
- Li-ion battery (Max 4.2V, Nom 3.7V)
- Standard battery: Capacity - 830mAh
Page 24
3. TECHNICAL BRIEF
- 25 -
Figure 3-6. CIRCUIT FOR BATTERY CHARGING
PRE
CHARGING
NORMAL
CHARGING
PRE_CHARGE_R INDLED_R
VBAT
C140
R129
1u
0.2
TPCF8102-TE85L-F
D101
CUS02
G5S
4
D4
3D36
D2
D5
2
D6
D1
1
Q102
R121
1.5K
VCHARGE
7
8
C127
0.1u
R131
330
R633
10K
C139
4.7u
R118
10
Q101
31
2
UMX1NTN
BATT_TEMP
1V8_VRTC
4
56
C137
0.1u
R132 82K
R119
1K
C146
0.1u
R127
2.2K
C138
4.7u
VBATVCHARGE
R632
7.5K
R122
10K
KEY_BACKLIGHT
C131 1u
HOOK_DET
TCK
TMS
TDI
TDO1
JTAGEN
KEY_ROW0
POWERKEY
USC0
1uC136
R138
NA
J15
P8
R5
T12
D17
C15
C14
A13
A14
B14
T13
C12
A12
C13
B13
F17
B12
F5
F2
F6
G3
F4
T16
U17
M5
LIGHT3
GPO_22
GPO_23
VMEMSEL
REF
REFOUT
TEMP1
TEMP2
AUXADC1
AUXADC2
VRTC
VCHG
GATEDRIVE
ISENSE
VBATSENSE
REFCHG
BATTYPE
GPIO_18
GPIO19_TMS
GPIO_20
GPIO_21_TDI
JTAGEN
KEYOUT
KEYON
USC0
Page 25
3. TECHNICAL BRIEF
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3.6 Display and Interface
• Main LCD
Controlled by LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, IFMODE, L_DATA[00:15] ports
• LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
• LCD_RST : This pin resets LCD module. This signal comes from AD6720 directly.
• LCD_RS: This pin determines whether the data to LCD module are display data or control data.
• WR : Write control Signal
• RD : Read control Signal. But this pin used only for debugging.
• DATA[00:15] : Parallel data lines.
• LCD_ID[1:2] : LCD type selection signals
- LCD_ID1 : LCD maker(2.4V is SII, 0V is HyeLCD)
- LCD_ID[2:3] : for the future using
• For using 65K color, data buses should be 16 bits.
Properties Spec. Unit
Active Screen Size 35.78*40.05*2.8 mm
Color Depth 65,536 colors
Resolution 128 X RGB X 128 dots
Page 26
3. TECHNICAL BRIEF
- 27 -
DATA12
DATA13
DATA14
DATA15
_RD
DATA08
DATA09
DATA10
DATA11
C_CD01
C_CD02
C_CD03
FL603
ICVE21054E250R401FR
G2
10
G1
5
FL605
ICVE21184E150R500FR
5
G1
10
G2
MLED1
MLED2
C_CD00
4
INOUT_A4
INOUT_B4
6
3
INOUT_A3
INOUT_B3
7
2
INOUT_A2
INOUT_B2
8
1
INOUT_A1
INOUT_B1
9
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
4
6
3
INOUT_A3
INOUT_B3
7
2
INOUT_A2
INOUT_B2
8
1
INOUT_A1
INOUT_B1
9
MOTOR
9
1
8
INOUT_B1
INOUT_A1
2
INOUT_B2
INOUT_A2
3
L_DATA15
6
INOUT_B37INOUT_B4
INOUT_A3
INOUT_A4
4
180R618
180R607
180R615
180R611
R609 180
R619 180
R613 180
R617 180
R605 180
FL601
5
ICVE21054E250R401FR
G1
INOUT_A4
10
G2
INOUT_B4
LCD_RD
C_CD04
C_CD05
FL607
ICVE21184E150R500FR
6
G2
INOUT_B3
INOUT_B4
10
G1
5
INOUT_A3
INOUT_A4
4
7
3
C_CD06
8
INOUT_B2
INOUT_A2
2
C_CD07
9
INOUT_B1
INOUT_A1
1
NA
Out of PDM
0
R624
R640
100K
59660
1
CN600
5
789
101112131415161718
505152535455565758
49
2V8_C_PWR
2V85_VCAM
128x128 LCD CONNECTOR
100KR625
LCD_MAKER(TO GPIO_17)
LCD_ID1
9
8
7
6
1
2
3
4
5
G1
INOUT_A3
INOUT_A4
10
G2
INOUT_B3
INOUT_B4
7
6
FL600
ICVE21054E250R401FR
180R604
ADD01
180R612
180R608
180R616
R606 180
R602 180
R601 180
R610 180
R614 180
R603 180
_WR
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
_LCD_CS
DATA07
L_DATA01
L_DATA00
180R600
INOUT_A1
INOUT_A2
INOUT_B1
INOUT_B2
8
L_DATA03
L_DATA02
G2
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
10
G1
5
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
1
2
3
4
9
FL602
ICVE21054E250R401FR
R626
L_DATA07
L_DATA06
L_DATA05
L_DATA04
C600
100
R627
LCD_RESET
212223242526272829330 31
19220
MLED
BACK_BATT
4
5
G1
INOUT_A4
10
G2
INOUT_B4
6
FL604
ICVE21184E150R500FR
22p
100K
L_MAIN_LCD_CS
394404142434445464748
3
INOUT_A3
INOUT_B3
7
2
INOUT_A2
INOUT_B2
8
LCD_WR
1
INOUT_A1
INOUT_B1
9
LCD_RS
363738
323334
35
C604 NA
0.1uC603
C602 39p
39pC601
NA
2V8_C_PWR
FL606
ICVE21184E150R500FR
10
5
NA
C641
R630
NA
R629
9
8
INOUT_B1
FL608
INOUT_A1
ICVE21184E150R500FR
1
2
C_SDA
7
INOUT_B2
INOUT_A2
3
C_SCK
INOUT_B3
INOUT_A3
C_RST
6
4
INOUT_B4
INOUT_A4
G2
10
G1
5
NA
Out of PDM
9
1
8
INOUT_B1
INOUT_A1
2
R641
C_MCLK
7
INOUT_B2
INOUT_A2
3
C_PCLK
SPK_RCV_P
6
INOUT_B3
INOUT_B4
INOUT_A4
INOUT_A3
4
0
C_VS
C_HS
SPK_RCV_N
G2
G1
Page 27
3. TECHNICAL BRIEF
- 28 -
3.7 Keypad Switches and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad
layer of the PCB when pressed. There are 26 switches (Normal Key 24EA, Volume up down side key),
connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in
Figure 3-11, except for the power switch (KB1), which is connected independently. Functions, the row
and column lines of the keypad are connected to ports of AD6720. The columns are outputs, while the
rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and
column are connected together, causing the row input to go low and generate an interrupt. The
columns/rows are then scanned by AD6720 to identify the pressed key.
Figure 3-11. Keypad Switches and Scanning
POWERKEY
VBAT
R300
END
10K
R301
680
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
SW304
R320 680
R326
R331 680
R336
R339 680
R342 680
R343
R344 680
680R324
680
680
680R341
680
VA304
R302
100
EVL14K02200
VA306
EVL14K02200
VA307
EVL14K02200
SW300
VA305
T
EVL14K02200
R303
VA301
100
SW312
SW317
SW322
*
CN601
123
4
VA302
EVL14K02200
1
4
7
EVL14K02200
2
SW308
SW313
5
SW318
8
SW323 SW325
0
VOL_UP/DOWN
VA303
EVL14K02200
3
SW309
SW314
6
SW319
9
SW324
#
SW305
SW310SW307
SW315
SW320
VA312
CLR
LEFT
UP
RIGHT
DOWN
EVL14K02200
SW306
VA313
SW311
SW316
SW321
SW326
EVL14K02200
FAV
MENU
SEL
SEND
CONF
Page 28
3. TECHNICAL BRIEF
- 29 -
3.8 Microphone
The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to
AIN1P and AININ pins of AD6720. The voltage supply VMIC is output from AD6720, and is a biased
voltage for the AIN1P. The AIN1P and AIN1N signals are then A/D converted by the voiceband ADC
part of AD6720.The digitized speech (PCM 8KHz ,16KHz) is then passed to the DSP section of
AD6720 for processing (coding, interleaving etc).
Figure 3-12. Connection between Microphone and AD6535
CLOSE TO MIC
2.2K
R215
10u
C215
2.2K
R220
2V5_VMIC
VA205
EVL5M02200
0
R217
OB4-15L42-C33L
1
2
MIC200
C220
39p
0.1u
C223
EVL5M02200
VA206
C226
39p39p
C225
1K
R213
100
R216
C221
39p
C219
39p
R219
100
VINNORN
VINNORP
Page 29
3. TECHNICAL BRIEF
- 30 -
3.9 Main Speaker
The main speaker is driven directly by AD6720 AOUT1P and AOUT1N pins and the gain is controlled
by the PGA in an AD6720. The receiver is placed in the folder cover and connected to AOUT1x
terminal via FPCB.
Figure 3-13. MAIN SPEAKER
ACOUSTIC & MIDI
VBAT
VA201
EVL5M02200
1u
C205
EVL5M02200
VA200
IN1
A2
IN2
C1
NC1
A1
NC2
C4
NO1
A4
NO2
B4
V+
U204
MAX4684EBC_T
C3
COM1
A3
COM2
B1
GND
C2
100K
R631
C200
10u
SPK_P
REC_N
REC_P SPK_RCV_P
SPK_RCV_N
SPK_N
SPK_SEL
L17
AIN3N
AIN3P
L16
K17
AOUT1N
AOUT1P
H16
C147
39p
R135 4.7
R133 4.7
REC_N
REC_P
R212
33K
VSS
_CS
29
_IRQ
3
31
_RD
4
_RST
28
_WR
2V85_VCAM
12
EQ2
13
14
EQ3
HPOUT_L
10
HPOUT_R
11
IOVDD
32
2
LED
MTR
19
NC
5
6
PLLC
SPOUT1
17
18
SPOUT2
15
SPVDD
16
SPVSS
VDD
7
VREF
9
8
30
A0
1
CLK1
D0
27
D1
26
D2
25
D3
24
23
D4
22
D5
21
D6
20
D7
EQ1
YMU762C-QZ
U203
2V85_VCAM
20K
R211
1u
C228
120K
R214
1000p
C222
C214
0.01u
0.1u
C224
0.1u
C227
0.1u
C213
R210
NA
C218
270p
R218
3.3K
VBAT
C229
1u
SPK
SPK_N
13MHz
26M_MIDI
DATA12
DATA13
DATA14
DATA15
_MIDI_CS
_MIDI_IRQ
_RD
_MIDI_RESET
_WR
SPK_P
ADD00
DATA08
DATA09
DATA10
DATA11
Page 30
3. TECHNICAL BRIEF
- 31 -
3.10 Headset Interface
This phone has 6 electrodes such as GND, AUXIP, AUXIN (this pin is floating), AUXOP,
JACK_DETECT, HOOK_DETECT. This type supports mono sound
Switching from Receiver to Headset Jack
If jack is inserted, JACK_DETECT goes from low to high.
Audio path is switched from receiver to earphone by JACK_DETECT interrupt.
Switching from Headset Jack to Receiver
If jack is removed, JACK_DETECT goes from high to low.
Audio path is switched from earphone to receiver by JACK_DETECT interrupt.
Hook detection
If hook-button is pressed, HOOK_DETECT is changed from high to low.
This is detected by AUXADC2.
And then hook is detected.
Figure 3-14. HEADSET JACK INTERFACE
JACK_DETECT
JACK_DETECT
L REMOVE
INSERT
H
C207
39p
U201
LMV7291MGX-NOPB
CLOSE TO EARJACK
2V8_VEXT
5
VCC
GND
2
4
3
C201
0.1u
2V8_VEXT
VIN-
VIN+
C202
R205
R208
330K
NA
1M
AUXIN
1
OUT
AUXOP
AUXIP
R204
2V5_JACK
R200
1K
R201
20K
C206
NA
R202
1.5K
C203
39p
22u
R203
HOOK_DET
0
2V8_VEXT
C216
1u
U202
1
GND4NC
2
VOUTVin
NCP563Q25T1
2V5_JACK
3
C217
1u
J200
VA204
EVL5M02200
5
1
3
4
2
C209 0.1u
C210
39p
C208 10u
R209
1M
R206 4.7
4.7R207
C212
C211
39p
39p
VA202
EVL5M02200
VA203
EVL5M02200
Page 31
3. TECHNICAL BRIEF
- 32 -
3.11 Key Back-light Illumination
In key back-light illumination, there are 14 Blue LEDs in Main Board, which are driven by
KEY_BACKLIGHT signal from AD6720.
Figure 3-15. KEY BACK-LIGHT ILLUMINTION
VBAT
VBAT
KEY BACKLIGHT
1uC308
R345 100
LD300
LEBB-S14H
100R346
LD301
LEBB-S14H
1u
1u
C309 1u
C310 1u
C311
C312
C313 1u
C314 1u
R347 100
LD302
LEBB-S14H
100R348
LD303
LEBB-S14H
100R349
LD304
LEBB-S14H
R350 100
LD305
LEBB-S14H
100
R351
LD306
LEBB-S14H
R352 100
LD307
LEBB-S14H
100R353
LD308
LEBB-S14H
R354 100
LD309
LEBB-S14H
100R355
LD310
LEBB-S14H
R356 100
LD311
LEBB-S14H
R357 100
LD312
LEBB-S14H
100R358
LD313
LEBB-S14H
1u
C315
1u
C316
1u
C317
1u
C318
1u
C319
1u
C320
1u
C321
Q300
31
4
56
IMX9T110
2
R360
C322
27p
R361
10
10
KEY_BACKLIGHT
R359
12K
R362
12K
C323
27p
R363
R364
10
10
Page 32
3. TECHNICAL BRIEF
- 33 -
3.12 LCD Back-light Illumination
LCD backlight LEDs is controlled by AD6720 via AAT3157, U404.
Figure 3-16. MAIN LCD BACKLIGHT ILLUMINATION
MLED
LCD_DIM_CTL
WHITE_LED LDO
U404
AAT3157ITP-T1
11
5
8
4
IN
CP
EN_SET
GND
C1+
C2+
10
9
C1-
7
6
C2-
1
D1
2
D2
3
D3
12
NC
C417
1u
C420
1u
FB400
R412
20K
C450
NA
C418
VBAT
1u
R499
100K
C419
1u
C421
1u
MLED1
MLED2
Page 33
3.13 VIBRATOR
The vibrator is placed in the folder cover and contacted to LCD MODULE. The vibrator is
driven from VIBRATOR (GPIO_0) of AD6720
- 34 -
3. TECHNICAL BRIEF
Figure 3-17. MOTOR
VIBRATOR
VBAT
47K
R101
C117
4.7u
Q100
EMZ2
23
64
1
5
R103
10
R104
220
7.5K
R106
VBAT
R105
20K
MOTOR
VIBRATOR
Page 34
TEST POINT
4. TROUBLE SHOOTING
- 35 -
4. TROUBLE SHOOTING
4.1 RF Component
SW500
FL500
U500
U501
X500
U503
Figure 4-1
U500 Power Amp Module (SKY77328)
U501 RF Main Chip (SI4210)
U503 2.85V Regulator
X500 VCTCXO, 26MHz Clock
FL500 FEM
SW500 Mobile Switch
Page 35
4.2 RX Trouble
4. TROUBLE SHOOTING
- 36 -
Checking Flow
START
HP8960 : Test mode
62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1) Check
regulator circuit
(2) Check
VCTCXO
(3) Check
Mobile SW
&FEM
(4) Check
RX IQ
Redownload SW or
Do calibration again
Page 36
4. TROUBLE SHOOTING
- 37 -
(1) Checking Regulator Circuit
U503
U503. 5
(OUT)
U503. 3
(EN)
Regulator Circuit is OK
See next Page to check
VCTCXO
Voltage at
Pin5 of U503
Is 2.85V?
Level at
Pin3 of U503
Is high?
YES
NO
Replace U503
YES
NO
Change main board
100K
R523
RF2V85
VBAT
U503
MIC5255-2.85BM5
BYP
43
EN
2
GND
IN1OUT
5
C546
0.01u
0
R522
C547
4.7u
C545
1u
CLKON
TEST POINT
CIRCUIT
Checking Flow
Page 37
4. TROUBLE SHOOTING
- 38 -
(2) Checking FEM & Mobile SW
X500.3
(OUT)
X500.4
(VCC)
X500
Check Pin 3.
Refer to Graph 4 -1(b)
26 MHzO.K?
No
No
VCTCXO Circuit is OK
See next Page to check
Mobile SW
VCTCXO Circuit is OK
See next Page to check
Mobile SW
Yes
Check Pin 4.
Refer to Graph
4-1(a)
2.75V OK?
No
Yes
Changing X500
Check U101
2.2u
C544
2
GND
3
OUT
VCC
4
VCONT
1
26MHz
X500
NA
C542 C543
1000p
R520
100
R521
15K
2V75_VVCXO
AFC
TEST POINT
CIRCUIT
Waveform
Checking Flow
Graph 1(a)
Graph 1(b)
Page 38
(3) Checking Mobile SW & FEM
4. TROUBLE SHOOTING
- 39 -
ANT SW Control GSM& DCS RX Mode
Graph 2
Table 1
TEST POINT
CIRCUIT Waveform
Select Mode Vc(EGSM) Vc(DCS/PCS)
EGSM-Rx LOW LOW
EGSM-Tx HIGH LOW
DCS-Rx LOW LOW
PCS-Rx LOW LOW
DCS/PCS-Tx LOW HIGH
SW500.ANT
TP500 TP502
TP501
R503
0
R588
2.2nH
G1
SW500.RF
VC_DCSPCS(VC1)
VC_EGSM(VC2)
R502
5.6nH
C588
0.5p
SW500
KMS-506
ANT
G2
RF
SW500
FL500
FL301. 10
VC1
VC_DCSPCS
VC_EGSM
VC2
C541
C540
FL500.10
(C533)
FL500.12
(C533)
Low
Low
Low
Low
Low
Low
C515
22p
3
9
PCS_RX2
GND13
24
GND12
23
GND11
22
GND10
21
GND9
20
GND8
19
GND7
18
GND6
17
GND5
16
GND4
7
GND3
6
GND2
4
GND1
2
1
VC_EGSM
VC_DCSPCS
ANT
PCS_RX1
DCS_RX2
DCS_RX1
EGSM_RX2
EGSM_RX1
DCSPCS_TX
EGSM_TX
FL500
HWXQ511
C540
C541
270p
270p
15
14
13
12
11
10
5
8
R516 0
R518 0
ANT_SW1
ANT_SW2
Page 39
4. TROUBLE SHOOTING
- 40 -
Checking Flow
Table 4-2
ANT_SW1 ANT_SW2
GSM_TX HIGH LOW
DCS_TX LOW HIGH
RX LOW LOW
For these 2 test case,
No Call connection is needed
Check SW500 Pin ANT,RF
with RF Cable connected.
Check SW500 Pin ANT,RF
with No RF Cable Connected
Check C540,C541
Check whether Ant SW
Set as RX mode
Refer to Table 4-2
Check RF Level of
FL500.10 (for GSM) &
FL500.12(for DCS)
Open
Yes
Short
Yes
VC1 :Low
VC2 :Low
Yes
Pin10 : ~ -62dBm
Pin 12 : ~ -63dBm
Yes
Ant SW & Mobile SW is OK
See next Page to check
Rx IQ Signal
No
No
No
No
Changing SW500
Changing SW500
Changing the Board.
Changing FL500
For this RF Level test case,
RX Stand alone Mode is needed
refer to chapter 11
Page 40
4. TROUBLE SHOOTING
- 41 -
(4) Checking RX IQ
Redownload software and calibration again
Similar?
No
Replace U501
Yes
No
Check C523,C526.
Check if there is any
Major difference
Refer to graph 4-3
C523
C526
U501
NAR514
XOUT
8
BQP
5
BIN
6
BIP
7
BQN
C526
39p
39p
C523
26M_DBB
IN
IP
QN
QP
TEST POINT
Checking Flow
Waveform
CIRCUIT
Graph 3
Figure 5
Page 41
4.3 TX Trouble
4. TROUBLE SHOOTING
- 42 -
Checking Flow
START
HP8960 : Test mode
62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
(1)Check
regulator circuit
(2)Check
VCTCXO
(3)Check
Mobile SW
& FEM
(4)Check
PAM control
signal
(5)Check
TX IQ
Redownload SW or
Do calibration again
Page 42
4. TROUBLE SHOOTING
- 43 -
(1) Checking Regulator Circuit
U503. 5
(OUT)
U503. 3
(EN)
U503
Regulator Circuit is OK
See next Page to check
VCTCXO
Voltage at
Pin5 of U503
Is 2.85V?
Level at
Pin3 of U503
Is high?
YES
NO
Replace U503
YES
NO
Change main board
100K
R523
RF2V85
VBAT
U503
MIC5255-2.85BM5
BYP
43
EN
2
GND
IN1OUT
5
C546
0.01u
0
R522
C547
4.7u
C545
1u
CLKON
TEST POINT
CIRCUIT
Checking Flow
Figure 6
Page 43
(2) Checking VCTCXO Circuit
4. TROUBLE SHOOTING
- 44 -
TEST POINT
CIRCUIT
Waveform
Checking Flow
Graph 4(a)
Graph 4(b)
Figure 7
X500.4
(VCC)
26 MHzO.K?
4(b)
2.75V OK?
4(a)
Check U101
X500
X500.3
(OUT)
Check Pin 3.
Refer to Graph
Check Pin 4.
Refer to Graph
2V75_VVCXO
X500
R520
100
C542 C543
NA
C544
2.2u
3
OUT
4
VCC
VCONT
GND
26MHz
1
2
1000p
No
No
No
R521
15K
Yes
Yes
VCTCXO Circuit is OK
VCTCXO Circuit is OK
See next Page to check
See next Page to check
Mobile SW
Mobile SW
Changing X500
AFC
Page 44
4. TROUBLE SHOOTING
- 45 -
(3) Checking Mobile SW & FEM
SW500.ANT
SW500.RF
VC_DCSPC
S
VC_EGSM
FL500
SW500
Graph 5(b) DCS,PCS Tx mode
Graph 5(a) GSM Tx mode
TEST POINT
CIRCUIT
Waveform
2.2nH
R588
270p
ANT
G1
G2
RF
C540
SW500
KMS-506
C588
0.5p
C541
270p
R518 0
TP500 TP502
0
R503
5.6nH
R502
C515
22p
GND11
22
23
GND12
GND13
24
GND2
4
GND3
6
7
GND4
GND5
16
17
GND6
GND7
18
19
GND8
GND9
20
PCS_RX1
14
15
PCS_RX2
3
VC_DCSPCS
9
VC_EGSM
HWXQ511
FL500
1
ANT
5
DCSPCS_TX
DCS_RX1
12
13
DCS_RX2
EGSM_RX1
10
11
EGSM_RX2
EGSM_TX
8
GND1
2
21
GND10
TP501
R516 0
ANT_SW2
ANT_SW1
Figure 8
Page 45
4. TROUBLE SHOOTING
- 46 -
Checking Flow
Table 4-3
ANT SW VC_EGSM VC_CDSPCS
DCS_TX 0 1
EGSM TX 1 0
EGSM, DCS RX 0 0
Check C540,C541
Check whether Ant SW
Set as TX mode
Refer to Graph 5
Refer to Table 4-3
For the test,
TX Stand alone Mode is needed. Refer to
chapter 11 (PL=7 for GSM, PL=2 for DCS)
Check VC_EGSM,
VC_DCSPCS
Yes
No
Changing board
Check RF Level of
FL500 Pin 9(for GSM) & Pin 3 (for DCS)
Check SW500.ANT, RF with RF
Cable connected.
Check SW500.ANT,RF
with RF Cable disconnected
Pin9 : ~29.5dBm
Pin 3 : ~26.5dBm
Yes
Open
Yes
Short
Yes
END
No
No
No
Go to 4.3.5 Checking PAM
control signal
Changing SW500
Changing SW500
Page 46
4. TROUBLE SHOOTING
- 47 -
(4) Checking PAM Control Signal
U500
R502 (PAM_EN)
R503
(TX_RAMP)
1K
R513
GSM_IN
4
VBATT17VCC1A2VCC1B
6
1
BS
3
DCS_PCS_IN
18
ENABLE
5
GND1
7
U500
SKY77328
220
R506
C500
22u
27p
C506
100R501
R508
180
39p
C522
VBAT
100R500
0.01u
C519 C520
0.01u
C505
27p
PA_BAND
TX_RAMP
PA_EN
Go to Next Step
Similar?
Yes
No
Check TX_RAMP and PA_EN
Check if there is
Any Major Difference or not
Go to Next Step
Similar?
Yes
No
Go to Next Step
Similar?
Yes
No
Redownload S/W
Check TX_RAMP and PA_EN
Check if there is
Any Major Difference or not
Refer to Graph 6
TEST POINT
Waveform
Checking Flow
CIRCUIT
Graph 6
Figure 9
Page 47
(5) Checking TX IQ
4. TROUBLE SHOOTING
- 48 -
TEST POINT
CIRCUIT
Checking Flow
Waveform
Graph 7
Figure 10
U501
C526
XOUT
8
BIP
7
BIN
6
BQP
5
BQN
C523
NAR514
IP
C523
39p
IN
26M_DBB
QP
C526
39p
QN
Check if there is
Major Difference
Any
Refer to Graph7
Similar?
Yes
Redownload the Software
And calibrate
No
Replace U101
Page 48
4. TROUBLE SHOOTING
- 49 -
4.4 Power On Trouble
C111
(2V8_VMEM)
C115
(2V75_VVCXO)
C114
(2V5_VMIC)
C116
(2V85_VSIM)
C110
(2V8_VEXT)
C112
(2V75_VABB)
C113
(1V8_VCORE)
U101
2V8_VEXT
VMIC
P16
VSIM
R14
F16
VVCXO
C11
VEXT01
VMEM
R13
VABB
G17
U11
VCORE
DATA0
A11
D9
DATA1
C114 1u
1V8_VCORE
1uC113
2V85_VSIM
C112 1u
2V5_VMIC
C110 1u
2V75_VABB
2V75_VVCXO
C115 1u
2V8_VMEM
C111 1u
1uC116
DATA01
DATA00
TEST POINT
CIRCUIT
Figure 11
Page 49
4. TROUBLE SHOOTING
- 50 -
Checking Flow
START
Check Battery Voltage
> 3.35V
YES
Push power-on key
And check the level change
of PWRKEY
YES
Check the voltage of
The LDO outputs at U101
YES
Logic level at KEYON of U101
= HIGH
NO
NO
NO
VCORE=1.8V VVCXO=2.75V
VMEM=2.8V VSIM=1.8V or 2.85V
VEXT=2.8V VABB=2.75V
VMIC=2.5V
NO
Charge or Change Battery
Check the contact of power key
Or dome-switch
Replace U101
Re-download software
YES
Does it work properly?
YES
THE PHONE WILL
POWER ON.
NO
The power-on procedure is
Completed. The problem may
be elsewhere.
Does it work properly?
NO
Replace the main board
Page 50
4. TROUBLE SHOOTING
- 51 -
4.5 Charging Trouble
D101
Q102
R129
R131
C137
0.1u
R132 82K
0.2
R129
T13
VRTC
T12
VMEMSEL
B13
VBATSENSE
C12
VCHG
TEMP1
C14
TEMP2
A13
M5
USC0
D17
REF
REFCHG
F17
REFOUT
C15
LIGHT3
J15
C13
ISENSE
F4
JTAGEN
U17
KEYON
T16
KEYOUT
P8
GPO_22
R5
GPO_23
F2
GPIO_18
F5
GPIO_20
F6
GPIO_21_TDI
G3
GPIO19_TMS
GATEDRIVE
A12
A14
AUXADC1
AUXADC2
B14
BATTYPE
B12
VBAT
C140
1u
D101
CUS02
1uC136
R131
330
C139
4.7u
0.1u
C146
G5S
1
D1
2
D2
3
D36D4
7
D5
8
D6
4
TPCF8102-TE85L-F
Q102
C138
2.2K
R127
4.7u
C131 1u
NA
R138
1V8_VRTC
VCHARGE
KEY_BACKLIGHT
BATT_TEMP
HOOK_DET
TDO1
TDI
TCK
TMS
KEY_ROW0
POWERKEY
JTAGEN
USC0
TEST POINT
CIRCUIT
Figure 12
Page 51
4. TROUBLE SHOOTING
- 52 -
Checking Flow
START
I/O Connector(CN300)
Is well-soldered ?
YES
Voltage at anode of
D101 = 5.2V ?
YES
Q102,D101,R129 are
well-soldered?
YES
Voltage across R129 is
about 10~100mV?
YES
0.7V < voltage(R131) < 1.3V?
NO
NO
NO
NO
NO
Resolder the CN300
Pin 4,5 : VCHARGE
Pin12,19 : GND
The TA is out of order
Change the TA
Resolder the
Q102, D101, R129
Replace the
Q102 , D101
Replace the
Q102
YES
Battery is charged?
YES
Charging is
properly operating
NO
The battery may have
problems.
Change the battery.
Page 52
4. TROUBLE SHOOTING
- 53 -
4.6 Vibrator Trouble
Soldering C heck in LC D Module
R105
R106
Q100
Q300.3
R101
(Q100.2)
Q100.1
Q100.6
+
-
R103
VIBRATOR
VBAT
47K
R101
C117
4.7u
Q100
EMZ2
23
64
1
5
R103
10
R104
220
7.5K
R106
VBAT
R105
20K
MOTOR
VIBRATOR
TEST POINT
CIRCUIT
Figure 13
Page 53
4. TROUBLE SHOOTING
- 54 -
Checking Flow
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
START
Is the voltage at pin 3
of Q100 high ?
YES
Is the voltage at pin 2
of Q100 low ?
YES
Is the voltage at pin 1
of Q100 high ?
YES
Check the soldering
of CN600 ?
YES
Check the soldering
of vibrator ?
NO
NO
NO
NO
NO
Check the soldering
of R105, R106
YES
Check the soldering
of R101
YES
Check the soldering
of R103
YES
Replace Q100
NO
Resolder R105, R106
NO
Resolder R101
NO
Resolder R103
Resolder CN600
Resolder vibrator
YES
Replace vrbrator
YES
Vibrator
Working well !
Page 54
4. TROUBLE SHOOTING
- 55 -
4.7 LCD Trouble
CN600
FL600
FL601
FL602
FL603
FL604
TEST POINT
Figure 14
LCD Module
LCD Module connection
connector( 60Pin, male )
Figure 15
Page 55
4. TROUBLE SHOOTING
- 56 -
Checking Flow
START
Is the connection of
FPCB with connector on
PCB(CN600) ok ?
YES
NO
Reassemble FPCB with CN600 connector
Check the connection LCD
module with connector
On FPCB ?
NO
Reassemble LCD module with connector on FPCB
Check the soldering of
CN600 ?
NO
Change the FPCB and try again
YES
YES
YES
Check the soldering of
EMI filter ?
Resoldering CN600
NO
Resoldering EMI filter(FL600~FL604)
Does LCD work
properly ?
NO
Replace LCD module
YES
LCD working well !
YES
Page 56
4. TROUBLE SHOOTING
- 57 -
4.8 Speaker Trouble
TEST POINT
CIRCUIT DIAGRAM
Figure 18
Soldering Check
U203
U203.17
U203.18
R212
33K
VSS
_CS
29
_IRQ
3
31
_RD
4
_RST
28
_WR
2V85_VCAM
12
EQ2
13
14
EQ3
HPOUT_L
10
HPOUT_R
11
IOVDD
32
2
LED
MTR
19
NC
5
6
PLLC
SPOUT1
17
18
SPOUT2
15
SPVDD
16
SPVSS
VDD
7
VREF
9
8
30
A0
1
CLK1
D0
27
D1
26
D2
25
D3
24
23
D4
22
D5
21
D6
20
D7
EQ1
YMU762C-QZ
U203
2V85_VCAM
20K
R211
1u
C228
120K
R214
1000p
C222
C214
0.01u
0.1u
C224
0.1u
C227
0.1u
C213
R210
NA
C218
270p
R218
3.3K
VBAT
C229
1u
SPK
SPK_N
13MHz
26M_MIDI
DATA12
DATA13
DATA14
DATA15
_MIDI_CS
_MIDI_IRQ
_RD
_MIDI_RESET
_WR
SPK_P
ADD00
DATA08
DATA09
DATA10
DATA11
Page 57
4. TROUBLE SHOOTING
- 58 -
Checking Flow
START
Check the signal level
ofU204.17
= 2.85V?
Yes
Check the state of
contact of dual mode speaker
Yes
Speaker
Working well!!
No
Re-Place U204
No
Replace speaker
Page 58
4. TROUBLE SHOOTING
- 59 -
4.9 SIM Card Interface Trouble
TEST POINT
CIRCUIT DIAGRAM
J100
J100.1
(C128)
SIM CONNECTOR
220n
C128 C135
1000p
3
CLK
GND1
4
7
GND2
GND3
89
GND4
GND5
10
IO
6
RST
2
1
VCC
5
VPP
J100
2V85_VSIM
C133
NA
0
R126
20K
R120
2V85_VSIM
22p
C134
SIM_RST
SIM_CLKSIM_DATA
Figure 19
Page 59
4. TROUBLE SHOOTING
- 60 -
Checking Flow
START
Does the SIM cards
supports 3V ?
YES
Voltage at pin1 of
J100 is 2.85V?
YES
Change the SIM Card
And try again.
Does it work
Properly?
YES
Change SIM Card
NO
NO
NO
Change the SIM Card. Our phone
supports only 3V SIM card.
Voltage output
of VSIM LDO
Is 2.85V?
YES
Replace J100
Redownload SW.
Does it work
Properly?
YES
SIM Card will be detected.
YES
NO
Resolder J100
Change the main board
Page 60
4. TROUBLE SHOOTING
- 61 -
4.10 Earphone Trouble
TEST POINT
CIRCUIT DIAGRAM
J200
C208
R206
U201
Figure 20
CLOSE TO EARJACK
JACK_DETECT
INSERT
L REMOVE
H
1M
R209
1u
C217
VA204
EVL5M02200
U202
NCP563Q25T1
1
GND4NC
3
VOUTVin
2
C216
1u
2V5_JACK
R202
1.5K
39p
C206
2V8_VEXT
NA
R204
R203
0
NA
C202
C209 0.1u
39p
C207
J200
1
2
3
4
5
2V8_VEXT
330K
R208
R206 4.7
4.7R207
C203
22u
1M
R205
C211
39p
C212
39p
EVL5M02200
VA203
C208 10u
R201
20K
2V8_VEXT
C201
0.1u
39p
C210
GND
2
OUT
1
VCC
5
VIN+
3
4
VIN-
2V5_JACK
LMV7291MGX-NOPB
U201
1K
R200
EVL5M02200
VA202
HOOK_DET
AUXIP
AUXIN
AUXOP
JACK_DETECT
Page 61
4. TROUBLE SHOOTING
- 62 -
Checking Flow
START
Resolder J200
Does the audio
profile of the phone
change to the
earphone mode?
YES
Set the audio part of the test
Equipment to echo mode
Can you hear your
voice from
the earphone?
YES
Earphone will work properly
NO
Change the earphone
NO
Level at pin1
of U201 is high
YES
and try again
Can you hear your
voice from
the earphone?
YES
Change earphone
YES
NO
Set the audio part of
the test equipment to
PRBS or continuous
Download software.
Does it work well?
Replace U201
wave mode
Can you hear
the sound from
the earphone?
YES
Resolder component
Download software
No
Voltage at
C208
=1.2V ?
YES
Check soldering
C208
R206
YES
Change the main board.
NO
Change the main board.
Page 62
4. TROUBLE SHOOTING
- 63 -
4.11 KEY backlight Trouble
Q300
R359
TEST POINT
Figure 21
Page 63
4. TROUBLE SHOOTING
- 64 -
CIRCUIT
Checking Flow
VBAT
VBAT
KEY BACKLIGHT
1uC308
C309 1u
C310 1u
1u
1u
C312
C311
KEY_BACKLIGHT
C313 1u
C314 1u
R345 100
LD300
LEBB-S14H
100R346
LD301
LEBB-S14H
R359
12K
R347 100
LD302
LEBB-S14H
R362
12K
100R348
LD303
LEBB-S14H
C323
27p
100R349
LD304
LEBB-S14H
R363
10
START
R350 100
LD305
LEBB-S14H
R364
10
100
R351
LD306
LEBB-S14H
Q300
4
56
IMX9T110
31
2
R352 100
LD307
LEBB-S14H
LD308
LEBB-S14H
C322
27p
100R353
LD309
LEBB-S14H
R360
10
R354 100
LD310
LEBB-S14H
R361
10
100R355
R356 100
LD311
LEBB-S14H
R357 100
LD312
LEBB-S14H
100R358
LD313
LEBB-S14H
1u
C315
1u
C316
1u
C317
1u
C318
1u
C319
1u
C320
1u
C321
Is the level at R359
High?
YES
Are all LEDs
Working?
YES
Backlight will work properly.
NO
NO
Check U101
Check the soldering
each R and LED
NO
Replace or resoldering
component
Page 64
4. TROUBLE SHOOTING
- 65 -
4.12 Receiver Trouble
TEST POINT
CIRCUIT DIAGRAM
R135R133
U101
C154
39p
TCK_ABB
F12
TDI_ABB
E13
G11
TDO_ABB
F13
TMS
AIN2P
L17
AIN3N
AIN3P
L16
K17
AOUT1N
AOUT1P
H16
R15
AOUT2N1
P14
AOUT2N2
AOUT2P1
R16
P15
AOUT2P2
AOUT3N
J17
H17
AOUT3P
C147
39p
C153
39p
R135 4.7
R133 4.7
NAR136
C150
39p
C152
39p
C151
39p
AUXOP
SPK
REC_N
REC_P
Figure 22
Page 65
4. TROUBLE SHOOTING
- 66 -
Checking Flow
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.
START
Does waveform at
R133 and R135
fluctuate?
YES
Is CN600 connected
properly?
YES
Is receiver connected
Properly?
YES
Receiver will work properly.
NO
NO
NO
Replace main board
Reassemble CN600
Resoldering receiver
Page 66
4. TROUBLE SHOOTING
- 67 -
4.13 Microphone Trouble
TEST POINT
CIRCUIT DIAGRAM
R219
C220
C223
R217
R208
CLOSE TO MIC
2.2K
R215
10u
C215
2.2K
R220
2V5_VMIC
VA205
EVL5M02200
0
R217
OB4-15L42-C33L
1
2
MIC200
C220
39p
0.1u
C223
EVL5M02200
VA206
C226
39p39p
C225
1K
R213
100
R216
C221
39p
C219
39p
R219
100
VINNORN
VINNORP
Figure 23
Page 67
4. TROUBLE SHOOTING
- 68 -
Checking Flow
SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
START
Voltage VMIC of U101
= DC 2.5V?
YES
Check the signal
Level at each side
of MIC200.
Is it a few tens
mV AC?
YES
Check the soldering of
R207, R208, R212,
C210, C213
YES
Microphone will work
properly.
NO
NO
NO
Replace U101
Replace microphone
Resolder component
Page 68
4. TROUBLE SHOOTING
- 69 -
4.14 RTC Trouble
TEST POINT
CIRCUIT DIAGRAM
R113
U101
X
1
0
0
C125
NA
100R153C124 1000p
R113
10M
T10
OSCIN
OSCOUT
U10
D8
NC2
NC1
C2
KEYPADROW0
T5
U4
KEYPADROW1
KEYPADROW2
R8
KEYPADROW3
R6
KEYPADROW4
R7
CLKIN
B1
12
3
4
32.768KHz
X100
MC-146
C118
NA
26M_DBB
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0
Figure 24
Page 69
4. TROUBLE SHOOTING
- 70 -
Checking Flow
START
Is the voltage
level at R113
about 1.2V
YES
Replace X100and try again.
YES
RTC will work properly
NO
Check the soldering of R113.
Page 70
4. TROUBLE SHOOTING
- 71 -
4.15 Indication LED Trouble
TEST POINT
CIRCUIT DIAGRAM
Q400
R404
R403
LD400
C403
Q101
1.5K
R121
C127
0.1u
4
R119
1K
2
56
31
UMX1NTN
Q101
VBATVCHARGE
7.5K
R632
R118
10
R633
10K
10K
R122
PRE_CHARGE_R INDLED_R
GREEN RED
EMH10
Q400
2
56
31
4
VBAT
R431
12K
12K
R430
12
34
27p
LD400
SML-521MUWT86
C403
100
R404
270
R403
INDLED_R INDLED_G
Figure 25
Page 71
4. TROUBLE SHOOTING
- 72 -
Checking Flow
Indication LED only operates in trickle charging mode.
START
VBAT is 3.6~4.2V
YES
Is LED working?
YES
LED will work properly
NO
NO
Check the soldering of VBAT(R048/R406)
Check the soldering of
Q400, Q101,LD400,
Page 72
4. TROUBLE SHOOTING
- 73 -
4.16 Folder on/off Trouble
TEST POINT
CIRCUIT DIAGRAM
U400
U400.6
(R400)
FLIP SWITCH
(GPIO_5)
GND2
4
2
NC1
5
NC2
1
OUTPUT
7
PGND
6
VDD
U400
A3212EEH-T
3
GND1
2V8_VMEM
100K
R400
1u
C400
0.01u
C401
FLIP
Figure 26
Page 73
4. TROUBLE SHOOTING
- 74 -
Checking Flow
START
Is there the magnet
in the folder side?
YES
Voltage at pin 1
of U400 = 2.8V?
YES
Open folder.
Voltage at pin 1 of U400
=2.8V
YES
Close folder.
Voltage at pin 1 of U400
= 0V
NO
NO
NO
NO
Place the magnet properly.
Voltage of VMEM at U101
= 2.8V?
YES
Resolder U400
Resolder R400 and U400
Replace U400
NO
Replace U101
YES
Does it work properly?
YES
Folder on/off will
work properly
NO
Change Main board
Page 74
5. DOWNLOAD
- 75 -
5. DOWNLOAD
5.1 Download
A. Download Setup
Figure 5-1 describes Download setup
Figure 5-1. Download Setup
Page 75
- 76 -
5. DOWNLOAD
B. Multi Download Procedure
1. Run GSM Multi Download program and select Setting
KG210
Page 76
- 77 -
5. DOWNLOAD
2. Select Configuration from the menu and you may see this window
3. Press key to select DLL file and press Open
Page 77
- 78 -
5. DOWNLOAD
4. Press key to select the mot files
5. Select AlchemyData.mot and press open
6. Repeat step 4-5 to select CodeData.mot
Page 78
- 79 -
5. DOWNLOAD
7. Check if the ADI option is set to Hermes
8. Press OK to end Configuration
Select Rate
Page 79
- 80 -
5. DOWNLOAD
9. Press START to execute download
10. Once downloading is started, press STOP button to keep from re-downloading after downloading
is completed.
KG210
Start
Stop
Page 80
- 81 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
Page 81
- 82 -
Page 82
- 83 -
VBAT
PWR
URXD
UTXD
3G 2.5G
GND
RX
TX
UFLS
ON_SW
4 136
C
15
DRAWING
C
B
4
5
E
Date
E
MODEL
Name
D
10
3
D
LG Electronics Inc.
LG Electronics Inc.
8
16
Approved
Checked
Section
E
A
D
(USC6)
NAME
6
F
(128 + 64PSRAM)
Date
DRAWING
12
5
E
7
B
1
MEMORY
L
G(42)-A-5505-10:01
C
F
D
1
2
23
Iss.
14
(ATLAS : Athena + Typhoon A)
F
NO.
8
A
Charge & Precharge Circuit
Sheet/
11
Sheets
Sign & Name
Designer
9
2006
02/06
BUTTERFLY(KG210)
1/6
MAIN CHIP, Base Band
7
VIBRATOR
VER-1.1
Notice No.
C
SIM CONNECTOR
9
NA
FB100
C137
0.1u
R124
C154
39p
220n
C125
NA
C128
C107
0.1u
C121
0.1u
C135
1000p
VBAT
4
5
VCC
47K
R101
GND
2
1
3
3
CLK
GND1
4
7
GND2
GND389GND4
GND5
10
IO
6
RST
2
1
VCC
5
VPP
TC7SH08FS
U102
J100
C117
4.7u
1.5K
R121
CLKOUT
2V8_VEXT
R109 0
R132 82K
R100
TP108
2V8_VMEM
1K
100R153
1V8_VRTC
C124 1000p
0.2
R129
C127
0.1u
4
R119
1K
2
56
31
UMX1NTN
Q101
R113
10M
47p
C141
TP101
47n
C130
A6
VMIC
P16
N1
VPEG
T13
VRTC
VSIM
R14
E6
VSIM_2
VSSRTC
T8
F16
VVCXO
VCORE1A9VCORE2C1VCORE3
VCORE4
P1
B10
VCXOEN
VDDRTC
T9
C11
VEXT01
VEXT02
L1
J1
VEXT1
VEXT2H1VEXT3
K1
VMEM
R13
VMEM1D1VMEM2
A10
A4
VMEM3
T12
VMEMSEL
VMEN4
USC1
M7
USC2
L2
USC3
USC4
M3
N6
USC5
USC6
N5
VABB
G17
E15
VBAT11
VBAT12
U13
VBAT21
F15
T11
VBAT22
B11
VBAT3
U12
VBAT8
B13
VBATSENSE
C12
VCHG
U11
VCORE
M1
RESET
RXON
M12
SGND1
U16
T14
SGND2
E4
SIMCLK
E2
SIMDATAOP
SPWR1
P13
SPWR2
T15
TCK_ABB
F12
TDI_ABB
E13
G11
TDO_ABB
TEMP1
C14
TEMP2
A13
F13
TMS
N15
TXON
M5
USC0
L3
D4
NRAMCS
B3
NRD
B5
A3
NRESET
NROMCS
D3
NWR
C4
T10
OSCIN
OSCOUT
U10
C16
PA
U14
PWRON
A17
QN
QP
B17
D17
REF
A15
REFBB
REFCHG
F17
REFOUT
C15
R12
R2
D8
NC2
R9
NC20
NC21
T3
T4
NC22
NC3
E1
F1
NC4
NC5
F3
NC6
G1
G7
NC7
H5
NC8
NC9
J9
C10
NDISPLAYCS
NGPCS0
C3
A2
NGPCS1
D5
NHWR
NLWR
K13
LIGHT1
F14
LIGHT2
H13
LIGHT3
J15
L14
MCLK
L12
MCLKEN
NC1
C2
NC10
J12
NC11
K12
L5
NC12
NC13
L6
L8
NC14
NC15
M8
NC16
M9
NC17
P7
NC18
P10
NC19
H10
IP
A16
C13
ISENSE
F4
JTAGEN
U17
KEYON
T16
KEYOUT
T6
KEYPADCOL0
U5
KEYPADCOL1
KEYPADCOL2
U6
T7
KEYPADCOL3
KEYPADCOL4
U7
KEYPADROW0
T5
U4
KEYPADROW1
KEYPADROW2
R8
KEYPADROW3
R6
KEYPADROW4
R7
LGND
GPO_19
GPO_1_TXON
N14
GPO_2
G2
M6
GPO_20
K2
GPO_21
P8
GPO_22
R5
GPO_23
GPO_24
P11
H3
GPO_3
GPO_4
H4
GPO_5
R10
GPO_6_ASM
M15
GPO_7
H2
H6
GPO_8
GPO_9
J3
B16
IN
INT
GPIO_23
D2
GPIO_24
GPIO_3
N2
GPIO_32
B2
H9
GPIO_4_INT
GPIO_5
N8
P9
GPIO_6
P2
GPIO_7
P3
GPIO_8
GPIO_9
R1
GPO_0_RXON
N12
J4
GPO_10
J2
GPO_11
J5
GPO_16
GPO_17
L7
GPO_18
L4
K3
F2
GPIO_0
M2
N4
GPIO_1
T1
GPIO_10
R3
GPIO_11
GPIO_12
T2
GPIO_13
U1
P5
GPIO_14
U2
GPIO_15
GPIO_16
R4
GPIO_17
P6
GPIO_18
F5
N3
GPIO_2
GPIO_20
F6
GPIO_21_TDI
G3
E5
GPIO_22
E3
K6
GND3
K4
G6
GND4
GND51
D10
D15
GND52
G16
GND53
H15
GND54
J16
GND55
K16
GND56
GND61
A1
B4
GND62
GND63D7GND7M4GND8
N7
GND9
P4
E14
GPI
GPIO19_TMS
DATA14
DATA15
C5
E8
DATA2
DATA3
C9
A8
DATA4
DATA5
C8
DATA6
B8
DATA7
E7
DATA8
A7
C7
DATA9
U15
DBBON
DGND
R11
GATEDRIVE
A12
GND1
U9
U3
GND10U8GND11
GND2
CLKIN
CLKON
B9
CLKOUT_GATE
L13
CLKOUT_MCLK
M14
K15
CSDI1
M16
CSDI2
K14
CSDO
N16
CSDO_2
M10
CSFS1
M11
CSFS2
DATA0
A11
D9
DATA1
DATA10
B7
DATA11
C6
B6
DATA12
DATA13
D6
A5
J8
ASDO2
H11
J13
ASFS1
ASFS2
J14
L15
ASM
A14
AUXADC1
AUXADC2
B14
BATTYPE
B12
BSDI1
L10
BSDI2
K10
L9
BSDO1
BSDO2
K11
BSIFS1
J11
BSIFS2
K8
J10
BSOFS1
K9
BSOFS2
B1
AIN1N
M17
AIN1P
P17
AIN2N
R17
AIN2P
L17
AIN3N
AIN3P
L16
K17
AOUT1N
AOUT1P
H16
R15
AOUT2N1
P14
AOUT2N2
AOUT2P1
R16
P15
AOUT2P2
AOUT3N
J17
H17
AOUT3P
ASDI1
J7
ASDI2
H12
ASDO1
AGND01
L11
AGND02
M13
AGND03
AGND04
N9
N10
AGND05
N11
AGND06
AGND11
G15
H14
AGND12
AGND2
B15
F10
AGND31
G10
AGND32
AGND33
G12
G13
AGND34
AGND35
G14
N13
AGND36
AGND4
T17
N17
ADD16
D16
ADD17
D14
ADD18
ADD19
D11
K5
ADD2
D12
ADD20
ADD21
D13
ADD22
E10
ADD3
H7
G4
ADD4
ADD5
G5
ADD6
G9
H8
ADD7
ADD8
G8
ADD9
F9
E17
AFCDAC
C17
P12
ABBRESET
ADD0
K7
J6
ADD1
F7
ADD10
ADD11
F8
E9
ADD12
E12
ADD13
ADD14
E16
F11
ADD15
E11
VBAT
2V85_VSIM
VBAT
U101
AD6720
C114
NAR114
1u
VBAT
R115 0
VCHARGE
7.5K
2V5_VMIC
C120
R632
0.1u
C133
NA
ASFS
R112 0
39p
OJ103
C148
C140
1u
1V8_VCORE
OJ101
Q100
EMZ2
23
64
1
5
2V85_VCAM
C102
0.1u
NA
D100
3
1
2
R134
TP103
KDR331V
D101
C147
CUS02
39p
R111 0
C104
1u
0.1u
C113
12
3
4
TP105
R103
2V8_VMEM
32.768KHz
X100
MC-146
10
0.1u
C122
R130 NA
2V8_VMEM
C153
39p
2V85_VSIM
R145
NA
ASM
R135
C112 1u
4.7
R133 4.7
OJ100
ABBRESET
300R110
R116 NA
0.1u
C126
NAR136
OJ102
0
R126
R117
20K
39p
C145
2V5_VMIC
R104
220
7.5K
R106
C150
39p
100K
R123
C118
NA
R118
10
C132 1u
C108
22p 0.1u
C1090.1u
TXON
C106
C110 1u
20K
R120
200
R125
1uC136
VBAT
2V75_VABB
R102 0
NA
TP104
2V85_VSIM
R108
C143
0.1u
ABB_IRQ
TP100
39p
C144
2V75_VVCXO
R131
330
R105
20K
9
ON_SW
5
RTS
11
2
RX
TX
3
VBAT
6
UART100
12
CTS
10
DSR
1
GND
4
NC1
NC2
7
8
NC3
NC4
C139
4.7u
0.1u
D6
_P2_CS
K2
F4
_RST
_R_LB
C2
_R_OE
H1
F3
_R_UB
_R_WE
D5
J1
_S_CS1
F5
_WE
_WP
E4
C123
D4
B4
VSS1
C4
VSS2
L1
VSS3
VSS4
L2
VSS5
L5
VSS6
L6
L7
VSS7
L8
VSS8
G7
WAIT
E5
_ADV
K1
_CE1
G8
_CE2
_CE3
K3
_OE1
J2
H8
_OE2
_P1_CS
A8M1
NC6M2NC7
NC8M7NC9
M8
K8
P_MODE
P_VCC
K5
C5
S_CS2
K4
S_VCC
B5
VCC11
L4
VCC12
B6
VCC21
VCC22
K6
VCCQ1
J8
VCCQ2
K7
VCCQ3
L3
VPP
D11
D12
H5
D13
G6
H6
D14
J7
D15
G3
D2
D3
H4
D4
J5
D5
G5
D6
J6
D7
H7
D8
G2
J3
D9
A1
NC1A2NC2
NC3A7NC4
A21
C7
A22
C3
A23
A24
D3
A25
E3
A3
D1
A4
B1
A5
C1
F2
A6
E2
A7
F6
A8
D7
A9
C6
CLK
H2
D0
H3
D1
G4
D10
J4
A0
G1
A1
F1
E7
A10
B8
A11
A12
C8
D8
A13
F7
A14
A15
E8
A16
F8
A17
D2
A18
B2
A19
B3
E1
A2
A20
E6
B7
PF38F3050L0ZBQ0
U100
C149
0.1u
C146
G5S
39p
1
D1
2
D2
3D36
D4
7
D5
8
D6
4
TPCF8102-TE85L-F
Q102
2V8_VEXT
22p
C134
C115 1u
C152
39p
TP102
C119
0.1u
C138
2.2K
R127
2V85_VSIM
4.7u
C131 1u
MCLKEN
1V8_VCORE
R137
NA
R138
0
1V8_VRTC
TP107
R633
10K
C142
0.068u
22p
RXON
C101
VCHARGE
C151
39p
2V8_VMEM
TP106
C111
C129
1u
47n
22u
VBAT
C100
1u
22p
C116
C105
22p
C103
10K
R122
1V8_VCORE
R128
NA
ADD23
_LCD_CS
_ROM_CS2
INDLED_G
PRE_CHARGE_R
KEY_BACKLIGHT
INDLED_R
HOOK_DET
ONNOFF
26M_DBB
_UBS
_RD
_RESET
_WR
_ROM_CS2
_ROM_CS1
_ROMCS1
_ROM_CS1
_WAIT
PRE_CHARGE_R
ADD23
_ROM_CS1
_ROMCS1
ADD18
ADD17
ADD16
ADD15
ADD14
ADD13
ADD12
ADD11
ADD10
ADD01
ADD00
CAM_HOLD
_MIDI_RESET
_RD
VINNORP
VINNORN
AFC
ADD09
ADD08
ADD07
ADD06
ADD05
ADD04
ADD03
ADD22
ADD21
ADD20
ADD02
ADD19
13MHz
CLKON
BATT_TEMP
HOOK_DET
ASM
AUXOP
AUXIP
DATA09
DATA08
DATA07
DATA06
DATA05
DATA04
DATA03
DATA02
DATA15
DATA14
DATA13
DATA12
DATA11
DATA10
DATA01
DATA00
DSR
DEBUG_TX
SIM_RST
TDO1
TDI
_WAIT
TCK
LCD_ID1
LCD_DIM_CTL
CAM_RST
CHG_DET
LCD_RESET
SPK_SEL
DEBUG_RX
VIBRATOR
TMS
RPWRON
RF_PWR_DWN
S_CLK
S_DATA
ONNOFF
S_EN
PA_BAND
PA_EN
ANT_SW2
RF_RST
JACK_DETECT
_MIDI_IRQ
KEY_ROW4
KEY_ROW3
KEY_ROW2
KEY_ROW1
KEY_ROW0
KEY_COL4
KEY_COL3
KEY_COL2
KEY_COL1
KEY_COL0
KEY_ROW0
POWERKEY
JTAGEN
IP
IN
ANT_SW1
USC1
USC0
SIM_DATA
SIM_CLK
QP
QN
TX_RAMP
_WR
_ROM_CS1
_RESET
_RD
_RAM_CS1
_LBS
_UBS
_MIDI_CS
CAM_INT
USC5
USC4
USC3
USC2
DATA12
DATA13
DATA14
DATA15
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
_LBS
_RESET
_WR
_RAM_CS1
ADD01
ADD02
ADD11
ADD12
ADD13
ADD14
ADD15
ADD16
ADD17
ADD18
ADD19
ADD20
ADD03
ADD21
ADD22
ADD04
ADD05
ADD06
ADD07
ADD08
ADD09
ADD10
DATA00
DATA01
DATA10
DATA11
AUXIN
SPK
SIM_RST
SIM_CLKSIM_DATA
REC_N
REC_P
ASM
BACK_BATT
FLIP
USC1
USC2
DSR
RPWRON
USC5
USC4
MOTOR
VIBRATOR
7. CIRCUIT DIAGRAM
Page 83
- 84 -
A
1
7
D
CLOSE TO EARJACK
3
9
LGIC(42)-A-5505-10:01
Date
4
BUTTERYFLY(KG210)
Notice No.
Sheet/Sheets
A
C
NO.
C
2
DRAWING
BB
DRAWING
Designer
Section
1 10
Iss.
2
LG Electronics In
c.
CLOSE TO MIC
ACOUSTIC & MIDI
3
06/02
2006
JACK_DETECT
65
INSERT
D
Date
A
L
NAME
Name
LG Electronics Inc.
REMOVE
VER-1.1
E
H
MODEL
Checked
R212
2/6
AUDIO
B
5
84
Sign & Name
Approved
33K
2.2K
R215
1M
R209
1u
VBAT
VSS
_CS
29
_IRQ
3
31
_RD
4
_RST
28
_WR
2V85_VCAM
C217
12
EQ2
13
14
EQ3
HPOUT_L
10
HPOUT_R
11
IOVDD
32
2
LED
MTR
19
NC
5
6
PLLC
SPOUT1
17
18
SPOUT2
15
SPVDD
16
SPVSS
VDD
7
VREF
9
8
30
A0
1
CLK1
D0
27
D1
26
D2
25
D3
24
23
D4
22
D5
21
D6
20
D7
EQ1
VA201
EVL5M02200
YMU762C-QZ
U203
10u
C215
VA204
EVL5M02200
U202
NCP563Q25T1
1
GND4NC
3
VOUTVin
2
C216
1u
2V5_JACK
R202
1.5K
39p
C206
2V85_VCAM
2.2K
R220
20K
R211
1u
2V8_VEXT
1u
C228
C205
2V5_VMIC
120K
R214
NA
R204
R203
0
NA
C202
C209
1000p
0.1u
C222
39p
C207
VA205
EVL5M02200
J200
1
2
3
4
5
0
2V8_VEXT
R217
330K
R208
EVL5M02200
VA200
C214
OB4-15L42-C33L
1
2
0.01u
MIC200
R206 4.7
4.7R207
C220
39p
0.1u
C223
0.1u
EVL5M02200
VA206
C203
C224
22u
1M
R205
C211
39p
C212
39p
EVL5M02200
VA203
C208 10u
R201
20K
C226
0.1u
C227 39p39p
C225
0.1u
C213
R210
NA
2V8_VEXT
IN1
A2
IN2
C1
NC1
A1
NC2
C4
NO1
A4
NO2
B4
V+
U204
MAX4684EBC_T
C3
COM1
A3
COM2
B1
GND
C2
100K
R631
C218
270p
C200
1K
R213
10u
C201
0.1u
39p
C210
R218
3.3K
100
R216
GND
2
OUT
1
VCC
5
VIN+
3
4
VIN-
VBAT
2V5_JACK
LMV7291MGX-NOPB
U201
C229
1u
C221
39p
C219
39p
1K
R200
R219
100
EVL5M02200
VA202
SPK
SPK_N
13MHz
26M_MIDI
HOOK_DET
SPK_P
REC_N
REC_P SPK_RCV_P
SPK_RCV_N
SPK_N
SPK_SEL
DATA12
DATA13
DATA14
DATA15
_MIDI_CS
_MIDI_IRQ
_RD
_MIDI_RESET
_WR
SPK_P
VINNORN
VINNORP
ADD00
DATA08
DATA09
DATA10
DATA11
AUXIP
AUXIN
AUXOP
JACK_DETECT
7. CIRCUIT DIAGRAM
Page 84
- 85 -
2006
8
2
Sign & Name
BUTTERFLY(KG210)
-
E
2
7
#
RESET
Sheet/Sheets
5
C
Pin 7
Trace32
USC6
RIGHT
Designer
A
-
T
USC2
PIN
4
Pin 11
DRAWING
10
Approved
USC0
USC1
FAV
VOL_UP/DOWN
6
2
DOWN
1
7
TCK
Pin 18
B
TDO_1
(GPIO_13)
1
TDI
Pin 24
KEY BACKLIGHT
Pin 1
7
CLOCK
8
02/06
DAI
LG Electronics Inc.
1
C
5
SEL
TXD
Date
A
I/O CONNECTOR
Checked
LGIC(42)-A-5505-10:01
END
RX
-
UART
DRAWING
USC5
93
VER-1.1
3
NO.
6
A
6
CLR
RTS/CTS(PC)
CTS/RTS(PC)
3 5
0
MMI, I/O Connector
3/6
9
(USC6)
Section
-
UP
TX
4
Pin 9
D
CONF
MODEL
USC4
DAI
JTAGEN
LEFT
RXD
D
SEND
MENU
Pin 2
NAME
LG Electronics In
c.
_RESET
(GPIO_32)
PIN
*
TMS
4
2V8
SW310SW307
2V8_VEXT
SW320
NAR311
SW313
NAR312
R344 680
SW309
VA300
EVL5M02200
R321 100K
680R341
100
R351
NA
LD301
LEBB-S14H
R316
12K
R359
VBAT
R332 47
VA305
EVL14K02200
SW324
VBAT
VCHARGE
R325 47
R331 680
C309 1u
C318
C301
1u
1u
27p
C323
100R348
100
R302
10p
C312
C305
SW316
1u
R319 100K
100R349
VBAT
SW305
R317 100K
680
R343
R329 47
R326
680
680
R356 100
R336
7
8
9
1uC308
2
20
21
22
23
24
25
26 27
28
29
3
4
5
6
ENRY0005301
CN300
1
10
11
12
13
14
15
16
17
18
19
NAR310
EVL14K02200
VA301
R300
10K
C313 1u
LEBB-S14H
LD304
C314 1u
R328 47
10
R364
10
R363
LD312
LEBB-S14H
R337
100K
LEBB-S14H
LD302
VA302
EVL14K02200
C300 22u
C303
1u
C302
1u
R315
LEBB-S14H
100K
SW311
LD313
SW322
NAR308
CN601
123
4
680R324
100
R303
SW304
SW318
LEBB-S14H
LD310
LEBB-S14H
LD308
R327 NA
SW315
2V8_VMEM
C307
NA
VA304
EVL14K02200
R357 100
R339 680
10
R360
R350 100
R309
2V8_VEXT
NA
R323 47
SW319
C311
100R353
1u
LD311
EVL14K02200
VA307
LEBB-S14H
EVL14K02200
VA303
R334 47
R333 47
27p
LEBB-S14H
LD309
C322
1u
IMX9T110
Q300
2
56
31
4
C317
R320 680
VA313
EVL14K02200
SW312
R335 47
VA306
EVL14K02200
R301
680
C310 1u
100R346
SW300
R342 680
1u
C321
LD307
LEBB-S14H
R352 100
SW326
C320
1u
C316
1u
R307 NA
100K
R340
C306 3p
SW317
VBAT
NAR314
100KR318
10
R361
1u
SW314
C319
EVL14K02200
VA312
EVL5M02200
VA310
EVL5M02200VA311
SW308
LEBB-S14H
LD303
SW321
SW306
C304 39p
1u
C315
NAR313
SW323 SW325
R347 100
R345 100
12K
R362
R330 47
R354 100
LEBB-S14H
LEBB-S14H
LD300
LD306
100R355
LEBB-S14H
LD305
100R358
47R322
USC0
CAM_INT
BATT_TEMP
JTAGEN
_RESET
TMS
TCK
TDI
TDO1
CHG_DET
RPWRON
DEBUG_TX
DEBUG_RX
USC5
USC4
USC1
USC2
DSR
USC3
KEY_ROW2
KEY_COL1
KEY_COL0
KEY_COL4
KEY_ROW1
KEY_COL3
KEY_ROW3
KEY_ROW4
KEY_COL2
KEY_ROW0
POWERKEY
KEY_BACKLIGHT
7. CIRCUIT DIAGRAM
Page 85
- 86 -
DRAWING
Designer
Section
LGIC(42)-A-5505-10:01
STATUS
FLIP SWITCH
9
4/6
3
Name
12
DRAWING
GREEN
VER-1.1
(USC6)
INDICATOR LED
NO.
4
Approved
2
Sheets
5
Date
76
NAME
C
ACTIVE
WHITE_LED LDO
C_PWDN
D
Checked
1
HIGH
4
83
5
LOW
C
B
Notice No. Date
B
(GPIO_5)
RED
Iss.
BUTTERFLY(KG210)
A
MODEL
LG Electronics Inc.
E
(1%)
CAMERA CTL IC
Sheet/
LG Electronics Inc.
1u
CL761A
N.A
Out of PDM
NA
Out of
PDM
NA
Out of PDM
NA
Sign & Name
(1608)
D
DEACTIVE
CAMERA IC/ CHARGE PUMP
10
A
C417
R416
NA
C418
1u
C405
1u
C413
NA
NA
R415
GND2
4
2
NC1
5
NC2
1
OUTPUT
7
PGND
6
VDD
U400
A3212EEH-T
3
GND1
FB400
EMH10
Q400
2
56
31
4
2V85_VCAM
VBAT
R408 NA
EN_SET
11
GND
4
5
IN
NC
12
2V85_VCAM
2V8_VMEM
U404
AAT3157ITP-T1
C1+
10
9
C1-
7
C2+
6
C2-
CP
8
1
D1
D2
2
3
D3
R414
NA
C404
1000p
C411
NA
100K
R412
R400
20K
R431
12K
12K
R430
NA
C415
12
34
27p
LD400
SML-521MUWT86
C403
NA
C416
L6
TEST_EN
T_MODE0
M7
A8
VDDC1
A10
VDDC2
D2
VDDC3
H10
VDDC4
VDDI1
B9
VDDI2
C7
J2
VDDL
VDDS
K5
A2
XIN
XOUT
A1
M_SD11
D3
C2
M_SD12
M_SD13B1M_SD14E3M_SD15
C1
A6
M_SD2B6M_SD3C6M_SD4A4M_SD5B4M_SD6C4M_SD7
M_SD8C3M_SD9
B3
M_WR_N
F3
M6
SCAN_EN
G2
STROBE
L_RD_N
K1
L2
L_RESET_N
K2
L_WR_N
MS_CS_N
A9
M_8BIT
D9
C8
M_ADS
E2
M_CS_N
M_HOLDF1M_INTR
E1
M_RD_ND1M_RESET_N
G3
D8
M_SA0
B10
M_SA1
M_SD0B7M_SD1
A7
M_SD10
A3
F10
L_DA10
E10
L_DA11
L_DA12
F9
D10
L_DA13
L_DA14
E9
C10
L_DA15
H2
L_DA16
L_DA17
G1
K10
L_DA2
H8
L_DA3
L_DA4
H9
J10
L_DA5
G10
L_DA6
L_DA7
G9
G8
L_DA8
F8
L_DA9
GNDC2
B5
GNDC3
C5
F2
GNDC4
GNDC5
L5
B2
GNDI1
E8
GNDI2
GNDI3
J3
K6
GNDI4
GPIO_0J1GPIO_1H3GPIO_2
H1
LS_CS_N
K9
L_ADS
K3
L_CS_N
L1
L10
L_DA0
L_DA1
J9
C_D1
K7
M8
C_D2L8C_D3K8C_D4
C_D5M9C_D6
L9
J8
C_D7
K4
C_HS
C_MCLK
M1
L4
C_PCLK
C_PWDN
L3
C_RST
M3
C_SCK
M5
M4
C_SDA
M2
C_VS
GNDC1
A5
EUSY0240501
U403
M10
CIS_TYPE0
CIS_TYPE1
C9
B8
CIS_TYPE2
C_D0
L7
C421
1u
C420
1u
C419
R402
0
2V85_VCAM
1u
C408
C410
NA
NA
1u
R407
VBAT
C400
1u
C402
NA
R417
100
R404
2V85_VCAM
270
R403
2V8_VEXT
2V85_VCAM
NA
C412
G
S
NA
R401
Q401
SI1305-E3
D
C409
NA
VBAT
R405
NA
R499
100K
C414
GND
2
1
IN5OUT
NA
2V8_C_PWR
U401
AAT3236IGV-2.85-T1
4
BYPEN
3
0.01u
C401
FLIP
NA
C450
MLED1
MLED2
LCD_DIM_CTL
MLED
ONNOFF
CAM_INT
INDLED_R INDLED_G
26M_CAM
L_MAIN_LCD_CS
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
DATA08
DATA09
_WR
L_DATA05
L_DATA06
L_DATA07
L_DATA08
L_DATA09
LCD_RD
LCD_WR
ADD01
_LCD_CS
CAM_HOLD
_RD
CAM_RST
ADD01
ADD02
DATA00
DATA01
C_SCK
C_SDA
C_VS
LCD_RS
L_DATA00
L_DATA01
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
L_DATA15
L_DATA02
L_DATA03
L_DATA04
C_CD00
C_CD01
C_CD02
C_CD03
C_CD04
C_CD05
C_CD06
C_CD07
C_HS
C_MCLK
C_PCLK
C_RST
7. CIRCUIT DIAGRAM
Page 86
- 87 -
9
23
5 10
VER-1.1
Designer
4
MODEL
A
Date Name
8
D
Approved
Iss.
2
Notice No.
1
2006
Checked
Sign & Name
LG Electronics Inc.
1
NO.
6
Section
02/06
RF PART
B
5
3
5dB
Sheet/Sheets
DRAWING
Date
LGIC(42)-A-5505-10:01
A
LG Electronics Inc
.
1K
R513
BUTTERFLY(KG210)
5 / 6
NAME
DRAWING
7
4dB
4
E
14
GND816GND9
GSM_IN
4
GSM_OUT
11
PGND
21
RSVD_GND
19
20
VAPC
VBATT17VCC1A2VCC1B
6
1
BS
3
DCS_PCS_INDCS_PCS_OUT
15
18
ENABLE
5
GND17GND2
GND3
8
9
GND4
GND5
10
12
GND6
GND7
13
C507
U500
SKY77328
33p
10p
2.2nH
R588
C508
27p
C521
NA
C509
R515
0
270p
ANT
G1
G2
RF
C540
SW500
KMS-506
180
R510
220
R506
C588
0.5p
C530
27p
2.2u
C544
C500
22u
NA
C518
27p
C532
27p
C506
2pC524
100R501
NAR514
C541
270p
R518 0
R511
0
R508
180
C533
L501
1.5p
2
GND
3
OUT
VCC
4
VCONT
1
6.8nH
26MHz
X500
0.1u
C511
39p
C522
12
13
VDD2VDD3
28
29
VDD4
11
VIO
26
XDIV32XEN
XMODE
25
XOUT
8
XTAL131XTAL2
30
_PDN
9
10
_RESET
2
_SEN
4
BQP
5
GND
14
PGND
33
RFIAN
24
RFIAP
23
RFIDN
20
RFIDP
19
RFIEN
22
RFIEP
21
RFIPN
18
RFIPP
17
16
RFOH
RFOL
15
SCLK
1
3
SDIO
VDD1
SI4210
U501
27
AFC
BIN
6
BIP
7
BQN
TP500
0R561
C536
2.2u
C517
NA
TP502
L599
12nH
VBAT
C526
39p
SN74AHC1GU04DCKR
U502
100R500
NA
C542
100K
R523
0
R503
5.6nH
R502
0.01u
C519 C520
0.01u
12p
C501
RF2V85
C502
0.01u
C504
33p18p
C503
VBAT
C505
27p
R519
1M
C515
C516
27p
22p
GND11
22
23
GND12
GND13
24
GND2
4
GND3
6
7
GND4
GND5
16
17
GND6
GND7
18
19
GND8
GND9
20
PCS_RX1
14
15
PCS_RX2
3
VC_DCSPCS
9
VC_EGSM
HWXQ511
FL500
1
ANT
5
DCSPCS_TX
DCS_RX1
12
13
DCS_RX2
EGSM_RX1
10
11
EGSM_RX2
EGSM_TX
8
GND1
2
21
GND10
R507
220
2V75_VVCXO
39p
1000p
C523
C538
24
R505
R509
30
L500
C543
1000p
5.6nH
R560 0
R520
100
R521
15K
C534
22p
C510
22p
TP501
U503
MIC5255-2.85BM5
BYP43EN
2
GND
IN1OUT
5
RF2V85
C546
0.01u
C514 10p
1.8p
27p
C531
C525
C528 1.5p
0.1u
C535
1.5pC529
R516 0
1000p
C537
2V75_VVCXO
2V8_VEXT
R512
NA
1.5pC527
L502
27nH
RF2V85
0
R522
100p
C547
C512
4.7u
C545
1u
26M_MIDI
26M_DBB
26M_CAM
RF_RST
CLKON
26M_DBB
PA_BAND
TX_RAMP
PA_EN
ANT_SW2
S_DATA
ANT_SW1
S_EN
S_CLK
IN
IP
QN
QP
AFC
RF_PWR_DWN
7. CIRCUIT DIAGRAM
Page 87
- 88 -
Approved
VER-1.1
2
NameIss.
MODEL
LG Electronics Inc.
Date
NO.
LCD_MAKER(TO GPIO_17)
67
A
9
C
1
NAME
B
3
DRAWING
E
VGA CAMERA
3
Checked
Date
8
128x128 LCD CONNECTOR
2V85_VCAM
6/6
LCD CONNECTOR
NA
Out of PDM
NA
Out of PDM
DRAWING
C
Notice No.
LG Electronics Inc.
5
Sheet/
2
BUTTERFLY(KG210)
B
D
Sheets
10
Designer
Section
1 4
LGIC(42)-A-5505-10:01
A
4
D
Sign & Name
5
R619 180
0.1uC603
180R607
0
R624
C600
22p
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
180R615
5G110
G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
R627
100K
ICVE21184E150R500FR
FL604
R606 180
180R604
R609 180
R626
100
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
6
R602 180
FL606
ICVE21184E150R500FR
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
3
NA
C641
R603 180
5G110
G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
ICVE21054E250R401FR
FL600
R601 180
2V8_C_PWR
C602 39p
0
R641
50
51
52
53
54
55
56
57
58
59
6
60
7
8
9
36
37
38
39
4
40
41
42
43
44
45
46
47
48
49
5
21
22
23
24
25
26
27
28
29
3
30 31
32
33
34
35
CN600
1
10
11
12
13
14
15
16
17
18
19
2
20
R617 180
R605 180
39pC601
R610 180
INOUT_B4
6
FL602
ICVE21054E250R401FR
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
180R608
G110G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
6
ICVE21184E150R500FR
FL608
5
FL607
ICVE21184E150R500FR
G15G2
10
INOUT_A1
1
2
INOUT_A2
INOUT_A3
3
4
INOUT_A4
9
INOUT_B1
INOUT_B2
8
7
INOUT_B3
INOUT_B4
R613 180
180R611
NA
R630
5
G110G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
INOUT_B4
6
ICVE21054E250R401FR
FL603
R614 180
180R612
180R600
5G110
G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
ICVE21184E150R500FR
FL605
180R616
180R618
C604 NA
R629
NA
R640
100K
100KR625
5G110
G2
1
INOUT_A1
INOUT_A2
2
3
INOUT_A3
INOUT_A4
4
INOUT_B1
9
8
INOUT_B2
INOUT_B3
7
6
INOUT_B4
2V8_C_PWR
L_MAIN_LCD_CS
ICVE21054E250R401FR
FL601
DATA12
DATA13
DATA14
DATA15
_RD
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
L_DATA15
LCD_RD
_WR
_LCD_CS
L_DATA07
L_DATA06
L_DATA05
L_DATA04
L_DATA03
L_DATA02
L_DATA01
L_DATA00
LCD_WR
LCD_RS
DATA08
DATA09
DATA10
DATA11
LCD_RESET
MOTOR
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
DATA07
ADD01
MLED1
MLED2
SPK_RCV_P
MLED
BACK_BATT
C_CD01
C_CD02
C_CD03
SPK_RCV_N
C_CD06
C_CD04
C_CD05
C_CD07
LCD_ID1
C_RST
C_SCK
C_SDA
C_HS
C_MCLK
C_PCLK
C_VS
C_CD00
7. CIRCUIT DIAGRAM
Page 88
- 89 -
8. PCB LAYOUT
Page 89
- 90 -
8. PCB LAYOUT
Page 90
- 91 -
9. ENGINEERING MODE
A. About Engineering Mode
Engineering mode is designed to allow a service man/engineer to view and test the basic functions
provided by a handset.
B. Access Codes
The key sequence for switching the engineering mode on is 2945#*#. Pressing END will switch back to
non-engineering mode operation.
C. Key Operation
Use Up and Down key to select a menu and press ‘select’ key to progress the test. Pressing ‘back’ key
will switch back to the original test menu.
D. Engineering Mode Menu Tree
9. ENGINEERING MODE
Engineering Mode
BB Test RF Test MF Mode Trace
option
Call Timer
LED
LCD
Backlight
Buzzer
Vibrator
ADC
Battery
DAI
SAR Test
All Auto Test
LED
Backlight
Buzzer
Vibrator
LCD
Key PAD
MicSpkTest
UART On
UART Off
All Calls
Reset
Fact.
Reset
S/W
Version
Page 91
- 92 -
9. ENGINEERING MODE
9.1 BB Test [MENU 1]
9.1.1 LED
This menu is to test the LED.
1) Green On
2) Green Off
3) Red On
4) Red Off
9.1.2 LCD
1) COLOUR : WHITE, RED, GREEN, BLUE, BLACK
2) Contrast Value
9.1.3 Backlight
This menu is to test the LCD Backlight and Keypad EL Backlight.
1) Backlight on : LCD Backlight and Keypad EL Backlight light on at the same time.
2) Backlight off : LCD Backlight and Keypad EL Backlight light off at the same time.
3) Backlight value : This controls brightness of Backlight. When entering into the menu, the present
backlight-value in the phone is displayed. Use Left/Right key to adjust the level of
brightness. The value of the brightness set at last will be saved in the NVRAM.
9.1.4 Buzzer
This menu is to test the melody sound.
1) Melody on : Melody sound is played through the speaker.
2) Melody off : Melody sound is off.
9.1.5 Vibrator
This menu is to test the vibration mode.
1) Vibrator on : Vibration mode is on.
2) Vibrator off : Vibration mode is off.
Page 92
- 93 -
9. ENGINEERING MODE
9.1.6 ADC (Analog to Digital Converter)
This displays the value of each ADC.
1) MVBAT ADC : Main Voltage Battery ADC
2) AUX ADC : Auxiliary ADC
3) TEMPER ADC : Temperature ADC
9.1.7 BATTERY
1) Bat Cal : This displays the value of Battery Calibration.
The following menus are displayed in order : BAT_LEV_4V, BAT_LEV_3_LIMIT,
BAT_LEV_2_LIMIT, BAT_LEV_1_LIMIT, BAT_IDLE_LI MIT, BAT_INCALL_LIMIT,
SHUT_DOWN_VOLTAGE, BAT_RECHARGE_LMT
2) TEMP Cal : This displays the value of Temperature Calibration.
The following menus are displayed in order : TEMP_HIGH_LIMIT,
TEMP_HIGH_RECHARGE_LMT, TEMP_LOW_RECHARGE_LMT, TEMP_LOW_LIMIT
9.1.8 DAI (Digital Audio Interface)
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
1) DAI AUDIO : DAI audio mode
2) DAI UPLINK : Speech encoder test
3) DAI DOWNLINK : Speech decoder test
4) DAI OFF : DAI mode off
Page 93
- 94 -
9. ENGINEERING MODE
9.2 RF Test [MENU 2]
9.2.1 SAR test
This menu is to test the Specific Absorption Rate.
1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required.
2) SAR test off : TX process off
9.3 MF mode [MENU 3]
This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will
process the test automatically, and phone displays the previous menu after completing the test.
9.3.1 All auto test
LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker.
9.3.2 LED
This menu is to test the LED.
1) Green On
2) Both Off
3) Red On
9.3.3 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
9.3.4 Buzzer
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2,
Volume 3, Volume 0 (mute), Volume 4, Volume 5.
9.3.5 Vibrator
Vibrator is on for about 1.5 seconds.
9.3.6 LCD
1)LCD
Main LCD screen resolution tests horizontally and vertically one by one and fills the screen.
Page 94
- 95 -
9. ENGINEERING MODE
9.3.7 Key pad
When a pop-up message shows ‘Press Any Key’, you may press any keys including side keys, but not
[Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test will be
completed in 15 seconds automatically.
9.3.8 MicSpk Test
The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically.
9.4 Trace option [MENU 4]
This is NOT a necessary menu to be used by neither engineers nor users.
9.5 Call timer [MENU 5]
This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing.
1) All calls : This displays total conversation time. User cannot reset this value.
2) Reset settings : This resets total conversation time to this, [00:00:00].
9.6 Fact. Reset [MENU 6]
This Factory Reset menu is to format data block in the flash memory and this procedure set up the
default value in data block.
Attention
1 Fact. Reset (i.e.Factory Reset) should be only used during the Manufacturing process.
2 Servicemen should NOT progress this menu, otherwise some of valuable data such as Setting
value, RF Calibration data, etc. cannot be restored again.
9.7 S/W version
This displays software version stored in the phone.
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10. STAND ALONE TEST
10.1 Introduction
This manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
10.2 Setting Method
A. COM port
a. Move your mouse on the “Connect” button, then click the right button of the mouse and select “Com
setting”.
b. In the “Dialog Menu”, select the values as explained below.
- Port : select a correct COM port
- Baud rate : 38400
- Leave the rest as default values
B. Tx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APC
a. Select either Power level or Scaling Factor.
b. Power level
- Input appropriate value GSM (between 5~19) or DCS (between 0~15)
c. Scaling Factor
- A ‘Ramp Factor’ appears on the screen.
- You may adjust the shape of the Ramp or directly input the values.
C. Rx
1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Gain Control Index (0~ 26) and RSSI level
- See if the value of RSSI is close to -16dBm when setting the value between 0 ~ 26 in Gain Control
Index.
- Normal phone should indicate the value of RSSI close to -16dBm.
10. STAND ALONE TEST
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10. STAND ALONE TEST
10.3 Means of Test
a. Select a COM port
b. Set the values in Tx or Rx
c. Select band and channel
d. After setting them all above, press connect button.
e. Press the start button
Figure 10-1. HW test program
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10. STAND ALONE TEST
Figure 10-2. HW test setting
Figure 10-3. Ramping profile
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11. AUTO CALIBRATION
11.1 Overview
Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery Calibration
with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply).
Auto-cal generates calibration data by communicating with phone and measuring equipment then write
it into calibration data block of flash memory in GSM phone.
11.2 Equipment List
Figure 11-1. Equipment Setup
11. AUTO CALIBRATION
Equipment for Calibration Type / Model Brand
Wireless Communication Test Set HP-8960 Agilent
RS-232 Cable and Test JIG LG
RF Cable LG
Power Supply HP-66311B Agilent
GPIO interface card HP-GPIB Agilent
Calibration & Final test software LG
Test SIM Card
PC (for Software Installation) Pentium II class above 300MHz
Table 11-1. Calibration Equipment List.
GSM Test Set(8960)
GPIB Cable
Power Supply
GPIB
Cable
PC
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11. AUTO CALIBRATION
Figure 11-2 The top view of Test JIG
11.3 Test Jig Operation
1234
ADI-REMOTE
TI-REMOTE
PS
VBAT
JTAG2
JTAG1 USB
TA
+
PS
_
POWER
ON
OFF
TA
POWER
MON
Status
UART
Status
ON
OFF
MON
UART
PHONE
Power Source Description
Power Supply Usually 4.0V
Table 11-2 Jig Power
Switch Number Name Description
Switch 1 ADI-REMOTE In ON state, phone is awaked. It is used ADI chipset.
Switch 2 TI-REMOTE In ON state, phone is awaked. It is used TI chipset.
Switch 3 VBAT Power is provided for phone from battery
Switch 4 PS Power is provided for phone from Power supply
Table 11-3 Jig DIP Switch
LED Number Name Description
LED 1 Power Power is provided for Test Jig
LED 2 TA Indicate charging state of the phone battery
LED 3 UART Indicate data transfer state through the UART port
LED 4 MON Indicate data transfer state through the MON port
Table 11-4 LED Description
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11. AUTO CALIBRATION
1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of
TEST JIG, in general)
2. Set the Power Supply 4.0V
3. Set the 3
rd
, 4thof DIP SW ON state always
4. Press the Phone power key, if the Remote ON is used, 1stON state
11.4 Procedure
1. Connect as Fig 11-2 (RS232 serial cable is connected between COM port of PC and MON port of
TEST JIG, in general.)
2. Run Hot_Kimchi.exe to start calibration.
3. From the Calibration Lib menu, Select F3000, then, Press APPLY!
(3)
KG210
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