LG KG210 Service Manual
Date: April, 2006 / Issue 1.0
Service Manual
Model : KG210
Service Manual
KG210
- 3 -
1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. PERFORMANCE...............................9
2.1 H/W Features...........................................9
2.2 Technical Specification ..........................10
3. TECHNICAL BRIEF ........................15
3.1 Power Transceiver .................................15
3.2 FEM for Triband .....................................17
3.3 26 MHz Clock.........................................18
3.4 Baseband Processor..............................19
3.5 Battery Charging Block ..........................24
3.6 Display and Interface .............................26
3.7 Keypad Switches and Scanning ............28
3.8 Microphone ............................................29
3.9 Main Speaker.........................................30
3.10 Headset Interface.................................31
3.11 Key Back-light Illumination...................32
3.12 LCD Back-light Illumination..................33
3.13 VIBRATOR...........................................34
4. TROUBLE SHOOTING ...................35
4.1 RF Component.......................................35
4.2 RX Trouble.............................................36
4.3 TX Trouble .............................................42
4.4 Power On Trouble..................................49
4.5 Charging Trouble ...................................51
4.6 Vibrator Trouble .....................................53
4.7 LCD Trouble...........................................55
4.8 Speaker Trouble ....................................57
4.9 SIM Card Interface Trouble....................59
4.10 Earphone Trouble ................................61
4.11 KEY backlight Trouble .........................63
4.12 Receiver Trouble..................................65
4.13 Microphone Trouble .............................67
4.14 RTC Trouble ........................................69
4.15 Indication LED Trouble ........................71
4.16 Folder on/off Trouble............................73
5. DOWNLOAD.......................................75
5.1 Download ...............................................75
6. BLOCK DIAGRAM ..........................81
7. Circuit Diagram ..............................83
8. pcb layout .......................................89
9. ENGINEERING MODE ....................91
9.1 BB Test [MENU 1]..................................92
9.2 RF Test [MENU 2]..................................94
9.3 MF mode [MENU 3] ...............................94
9.4 Trace option [MENU 4] ..........................95
9.5 Call timer [MENU 5] ...............................95
9.6 Fact. Reset [MENU 6] ............................95
9.7 S/W version............................................95
10. STAND ALONE TEST ...................96
10.1 Introduction ..........................................96
10.2 Setting Method.....................................96
10.3 Means of Test ......................................97
11. AUTO CALIBRATION....................99
11.1 Overview ..............................................99
11.2 Equipment List .....................................99
11.3 Test Jig Operation..............................100
11.4 Procedure ..........................................101
11.5 AGC ...................................................104
11.6 APC....................................................104
11.7 ADC ...................................................104
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 105
12.1 Exploded View .................................. 105
12.2 Replacement Parts ............................107
12.3 Accessory ......................................... 121
Table Of Contents
- 4 -
1. INTRODUCTION
- 5 -
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
- 6 -
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
- 7 -
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
1. INTRODUCTION
- 8 -
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
2. PERFORMANCE
- 9 -
2.1 H/W Features
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 830mAh
Stand by TIME Up to 200 hrs : Paging Period 9, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power
GSM, EGSM: 32.5dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display LCD : CSTN 128 × 128 pixel 65K Color
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Status Indicator Menu Key, Clear Key
Send Key, END/PWR Key
Soft Key(Left/Right)
ANT Internal
EAR Phone Jack Yes (mono)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver One way speaker
Travel Adapter Yes
MIDI 40 Poly (Mono SPK)
2. PERFORMANCE
- 10 -
2.2 Technical Specification
Item Description Specification
GSM
TX: 890 + n x 0.2 MHz
RX: 935 + n x 0.2 MHz (n=1~124)
EGSM
1Frequency Band TX: 890 + (n-1024) x 0.2 MHz
RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)
DCS
TX: 1710 + (n-512) x 0.2 MHz
RX: 1805 + (n-512) x 0.2 MHz (n=512~885)
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
2. PERFORMANCE
- 11 -
Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5
Output RF Spectrum 6,000 -71
(due to modulation) DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6
(due to switching transient) 600 -21
1,200 -21
1,800 -24
2. PERFORMANCE
- 12 -
Item Description Specification
DCS
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM, EGSM
8 Bit Error Ratio
BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500
*
-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*
Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
2. PERFORMANCE
- 13 -
Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Current
Fast Charge : < 430 mA
Slow Charge : < 160 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0~ -105 dBm
Battery Bar Number Voltage
0 3.48 ~ 3.63 V
23 Battery Indicator 1 3.63 ~ 3.70 V
2 3.70 ~ 3.76 V
3 3.76 ~ 3.89 V
4 3.89 V ~
24 Low Voltage Warning
3.63 0.03V (Call) every 1 minutes
3.48 0.03V (Standby)
2. PERFORMANCE
- 14 -
Item Description Specification
25 Forced shut down Voltage 3.33 0.03 V
1 Li-ion Battery
26 Battery Type
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 830mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 800 mA
3. TECHNICAL BRIEF
- 15 -
3.1 Power Transceiver (SKY77328, U500)
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The
module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks,
impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control
(PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides
the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die,
one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other
supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to
distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a
multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and
output ports of the SKY77328 are internally matched to a 50 Ω load to reduce the number of external
components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA
module maximizes handset standby time. The SKY77328 also contains band-select switching circuitry
to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In
Figure 1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the
Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an
internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC™)
function, which is insensitive to variations in temperature, power supply, process, and input power.
The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. Figure 1. Functional
Block Diagram
3. TECHNICAL BRIEF
Figure1. Functional Block Diagram
3. TECHNICAL BRIEF
- 16 -
SKY77328 PAM Pin Configuration-20-Pin
Leadless (Top View)
Figure 6. Typical Case Makings
Table 4. SKY77328 Pin Names and Signal Descriptions
Pin Mame Description
1BSBand Select
2 VCC1A VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC)
3 DCS/PCS IN RF input 1710-1910 MHz (DCS1800, PCS1900)
4 GND IN RF input 824-915 MHz (GSM850/900)
5 GND RF and DC Ground
6 VCC1B RF and DC Ground
7 GND RF and DC Ground
8 GND RF and DC Ground
9 GND RF and DC Ground
10 GND RF and DC Ground
11 GSM OUT RF Output 824-915 MHz (GSM850/900)
12 GND RF and DC Ground
13 GND RF and DC Ground
14 GND RF and DC Ground
15 DCS/PCS OUT RF Output 1710-1910 MHz (DCS 1800, PCS1900)
17 VBATT Battery input to high side of intemal sense resistor
18 ENABLE BiCMOS Enable
19 RSVD(GND) RF and DC Ground
20 VAPC Power Control Bias Voltage
GMD PAD(21) GND Ground Pad, bottom
3. TECHNICAL BRIEF
- 17 -
3.2 FEM for Triband
Table 3-1 Band SW Logic Table
Figure 3- 2 FEM CIRCUIT DIAGRAM
270p
C540
C541
270p
R518 0
GND11
22
23
GND12
GND13
24
GND2
4
GND3
6
7
GND4
GND5
16
17
GND6
GND7
18
19
GND8
GND9
20
PCS_RX1
14
15
PCS_RX2
3
VC_DCSPCS
9
VC_EGSM
HWXQ511
FL500
1
ANT
5
DCSPCS_TX
DCS_RX1
12
13
DCS_RX2
EGSM_RX1
10
11
EGSM_RX2
EGSM_TX
8
GND1
2
21
GND10
R516 0
ANT_SW2
ANT_SW1
Select Mode Vc(EGSM) Vc(DCS/PCS)
EGSM-Rx Low Low
EGSM-Tx High Low
DCS-Rx Low Low
PCS-Rx Low Low
DCS/PCS Low High
3. TECHNICAL BRIEF
- 18 -
3.3 26 MHz Clock (VCTCXO, X500)
The 26 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which
oscillates at a frequency of 26 MHz. It is used within the SKY77328, base band
processor(AD6720,U101), Midi(U203, YMU762C-QZ).
Figure 3-3. VCTCXO CIRCUIT DIAGRAM
2V75_VVCXO
X500
C544
2.2u
VCONT
GND
26MHz
1
2
3
OUT
4
VCC
C543
1000p
R521
15K
AFC
3. TECHNICAL BRIEF
- 19 -
3.4 Baseband Processor (AD6720 , U101)
• AD6720 is an ADI designed processor
• AD6720 consists of
1. Control Processor Subsystem including:
• 32-bit MCU ARM7TDMI® Control Processor
• 39 MHz operation at 1.8V
• 1Mb of on-chip System SRAM Memory
2.DSP Subsystem including:
• 16-bit Fixed Point DSP Processor
• 91 MIPS[1] at 1.8V
• Data and Program SRAM
• Program Instruction Cache
• Full Rate, Enhanced Full Rate and Half Rate
• Speech Encoding/Decoding
• Capable of Supporting AMR & PDC Speech Algorithms
3.Peripheral Functions
• Parallel and Serial Display Interface
• Keypad Interface
• Flash Memory Interface
• Page-Mode Flash Support
• 1.8V and 3.0V, 64 kbps SIM Interface
• Universal System Connector Interface
• Data Services Interface
• Battery Interface (e.g. Dallas)
4. Other
• Supports 13 MHz and 26 MHz Input Clocks
• 1.8V Typical Core Operating Voltages
• 289-Ball Package (12x12mm) , 0.65mm Ball pitch
5. The AD6720 baseband transmit section supports the following
• mobile station GMSK modulation power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2
3. TECHNICAL BRIEF
- 20 -
Figure 3-4 SYSTEM INTERCONECTION OF AD6720 EXTERNAL INTERFACE
3. TECHNICAL BRIEF
- 21 -
3.4.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL
The X-TAL oscillates 32.768KHz
The backlight of LCD module is controlled by AD6720 via AAT3157 , U404. The control signals related
to Backlight LED are given bellow.
Signals Description
MLED Current source for backlight LED
LCD_DIM_CTL Control LCD backlight level in 16 steps
MLED[1:2] This pins are returned-paths for backlight LED current source (MLED)
Table 3-3. DESCRIPTION OF LCD BACKLIGHT LED CONTROL
3. TECHNICAL BRIEF
- 22 -
C. RF interface
The AD6720 control RF parts through PA_BAND, ANT_SW1, ANT_SW2, ANT_SW3 , CLKON ,
PA_EN, S_EN, S_DATA, S_CLK, RF_PWR_DWN.
Signals Description
PA_BAND (GPO 17) PAM Band Select
ANT_SW1 (GPO 9) Antenna switch Band Select
ANT_SW2 (GPO 11) Antenna switch Band Select
RF_PWR_DWN(GPO 4) Power down Input
CLKON RF LDO Enable/Disable
PA_EN (GPO 16) PAM Enable/Disable
S_EN (GPO 19) PLL Enable/Disable
S_DATA (GPO 20) Serial Data to PLL
S_CLK (GPO 21) Clock to PLL
Table 3-4. RF CONTROL SIGNALS DESCRIPTION
3. TECHNICAL BRIEF
- 23 -
D. SIM interface
The AD6720 provides SIM Interface Module. The AD6720 checks status periodically during
established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep
mode. In order to communicate with SIM card, 3 signals SIM_DATA, SIM_CLK,
SIM_RST(GPIO_23) are required. The descriptions about the signals are given by bellow Table 3-5
in detail.
Signals Description
SIM_DATA
This pin receives and sends data to SIM card.
This model can support only 3.0 volt interface SIM card.
SIM_CLK Clock 3.25MHz frequency.
SIM_RST
Reset SIM block
(GPIO_23)
Table 3-5. SIM CONTROL SIGNALS DESCRIPTION
Figure 3-5. SIM Interface of AD6720
SIM CONNECTOR
220n
C128 C135
1000p
3
CLK
GND1
4
7
GND2
GND3
89
GND4
GND5
10
IO
6
RST
2
1
VCC
5
VPP
J100
2V85_VSIM
C133
NA
0
R126
20K
R120
2V85_VSIM
22p
C134
SIM_RST
SIM_CLKSIM_DATA
3. TECHNICAL BRIEF
- 24 -
E. LDO Block
There are 8 LDOs in the AD6720.
- VCORE : supplies Digital baseband Processor core and AD6720 digital core
- VMEM : supplies external memory and the interface to the external memory on the digital
baseband processor (1,8V or 2.8V, 150mA)
- VEXT : supplies Radio digital interface and high voltage interface (2.8V, 170mA)
- VSIM : supplies the SIM interface circuitry on the digital processor and SIM card
(2.85V, 20mA)
- VRTC : supplies the Real-Time Clock module (1.8 V, 20µA)
- VABB : supplies the analog portions of the AD6720
- VMIC : supplies the microphone interface circuitry (2.5 V, 1 mA)
- VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
3.5 Battery Charging Block
1. It can be used to charge Lithium Ion batteries.
Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware.
2. Charging Process
- Check charger is inserted or not
- If AD6720 detects that Charger is inserted, the CC-CV charging starts.
- Exception : When battery voltage is lower than 3.2V, the precharge(low current charge mode)
starts firstly.
- And the battery voltage reach to 3.2V the CC-CV charging starts.
3. Pins used for charging
- VCHG : charger supply.
- GATEDRIVE : charge DAC output
- ISENSE : charge current sense input
- VBATSENSE : battery voltage sense input.
- BATTYPE : battery type identification input
- REFCHG : voltage reference output
4. TA (Travel Adaptor)
- Input voltage: AC 85V ~ 260V, 50~60Hz
- Output voltage: DC 5.2V ( 0.2 V )
- Output current: Max 800mA ( 50mA )
5. Battery
- Li-ion battery (Max 4.2V, Nom 3.7V)
- Standard battery: Capacity - 830mAh
3. TECHNICAL BRIEF
- 25 -
Figure 3-6. CIRCUIT FOR BATTERY CHARGING
PRE
CHARGING
NORMAL
CHARGING
PRE_CHARGE_R INDLED_R
VBAT
C140
R129
1u
0.2
TPCF8102-TE85L-F
D101
CUS02
G5S
4
D4
3D36
D2
D5
2
D6
D1
1
Q102
R121
1.5K
VCHARGE
7
8
C127
0.1u
R131
330
R633
10K
C139
4.7u
R118
10
Q101
31
2
UMX1NTN
BATT_TEMP
1V8_VRTC
4
56
C137
0.1u
R132 82K
R119
1K
C146
0.1u
R127
2.2K
C138
4.7u
VBATVCHARGE
R632
7.5K
R122
10K
KEY_BACKLIGHT
C131 1u
HOOK_DET
TCK
TMS
TDI
TDO1
JTAGEN
KEY_ROW0
POWERKEY
USC0
1uC136
R138
NA
J15
P8
R5
T12
D17
C15
C14
A13
A14
B14
T13
C12
A12
C13
B13
F17
B12
F5
F2
F6
G3
F4
T16
U17
M5
LIGHT3
GPO_22
GPO_23
VMEMSEL
REF
REFOUT
TEMP1
TEMP2
AUXADC1
AUXADC2
VRTC
VCHG
GATEDRIVE
ISENSE
VBATSENSE
REFCHG
BATTYPE
GPIO_18
GPIO19_TMS
GPIO_20
GPIO_21_TDI
JTAGEN
KEYOUT
KEYON
USC0
3. TECHNICAL BRIEF
- 26 -
3.6 Display and Interface
• Main LCD
Controlled by LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, IFMODE, L_DATA[00:15] ports
• LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin
• LCD_RST : This pin resets LCD module. This signal comes from AD6720 directly.
• LCD_RS: This pin determines whether the data to LCD module are display data or control data.
• WR : Write control Signal
• RD : Read control Signal. But this pin used only for debugging.
• DATA[00:15] : Parallel data lines.
• LCD_ID[1:2] : LCD type selection signals
- LCD_ID1 : LCD maker(2.4V is SII, 0V is HyeLCD)
- LCD_ID[2:3] : for the future using
• For using 65K color, data buses should be 16 bits.
Properties Spec. Unit
Active Screen Size 35.78*40.05*2.8 mm
Color Depth 65,536 colors
Resolution 128 X RGB X 128 dots
3. TECHNICAL BRIEF
- 27 -
DATA12
DATA13
DATA14
DATA15
_RD
DATA08
DATA09
DATA10
DATA11
C_CD01
C_CD02
C_CD03
FL603
ICVE21054E250R401FR
G2
10
G1
5
FL605
ICVE21184E150R500FR
5
G1
10
G2
MLED1
MLED2
C_CD00
4
INOUT_A4
INOUT_B4
6
3
INOUT_A3
INOUT_B3
7
2
INOUT_A2
INOUT_B2
8
1
INOUT_A1
INOUT_B1
9
L_DATA08
L_DATA09
L_DATA10
L_DATA11
L_DATA12
L_DATA13
L_DATA14
4
6
3
INOUT_A3
INOUT_B3
7
2
INOUT_A2
INOUT_B2
8
1
INOUT_A1
INOUT_B1
9
MOTOR
9
1
8
INOUT_B1
INOUT_A1
2
INOUT_B2
INOUT_A2
3
L_DATA15
6
INOUT_B37INOUT_B4
INOUT_A3
INOUT_A4
4
180R618
180R607
180R615
180R611
R609 180
R619 180
R613 180
R617 180
R605 180
FL601
5
ICVE21054E250R401FR
G1
INOUT_A4
10
G2
INOUT_B4
LCD_RD
C_CD04
C_CD05
FL607
ICVE21184E150R500FR
6
G2
INOUT_B3
INOUT_B4
10
G1
5
INOUT_A3
INOUT_A4
4
7
3
C_CD06
8
INOUT_B2
INOUT_A2
2
C_CD07
9
INOUT_B1
INOUT_A1
1
NA
Out of PDM
0
R624
R640
100K
59660
1
CN600
5
789
101112131415161718
505152535455565758
49
2V8_C_PWR
2V85_VCAM
128x128 LCD CONNECTOR
100KR625
LCD_MAKER(TO GPIO_17)
LCD_ID1
9
8
7
6
1
2
3
4
5
G1
INOUT_A3
INOUT_A4
10
G2
INOUT_B3
INOUT_B4
7
6
FL600
ICVE21054E250R401FR
180R604
ADD01
180R612
180R608
180R616
R606 180
R602 180
R601 180
R610 180
R614 180
R603 180
_WR
DATA00
DATA01
DATA02
DATA03
DATA04
DATA05
DATA06
_LCD_CS
DATA07
L_DATA01
L_DATA00
180R600
INOUT_A1
INOUT_A2
INOUT_B1
INOUT_B2
8
L_DATA03
L_DATA02
G2
INOUT_B1
INOUT_B2
INOUT_B3
INOUT_B4
10
G1
5
INOUT_A1
INOUT_A2
INOUT_A3
INOUT_A4
1
2
3
4
9
FL602
ICVE21054E250R401FR
R626
L_DATA07
L_DATA06
L_DATA05
L_DATA04
C600
100
R627
LCD_RESET
212223242526272829330 31
19220
MLED
BACK_BATT
4
5
G1
INOUT_A4
10
G2
INOUT_B4
6
FL604
ICVE21184E150R500FR
22p
100K
L_MAIN_LCD_CS
394404142434445464748
3
INOUT_A3
INOUT_B3
7
2
INOUT_A2
INOUT_B2
8
LCD_WR
1
INOUT_A1
INOUT_B1
9
LCD_RS
363738
323334
35
C604 NA
0.1uC603
C602 39p
39pC601
NA
2V8_C_PWR
FL606
ICVE21184E150R500FR
10
5
NA
C641
R630
NA
R629
9
8
INOUT_B1
FL608
INOUT_A1
ICVE21184E150R500FR
1
2
C_SDA
7
INOUT_B2
INOUT_A2
3
C_SCK
INOUT_B3
INOUT_A3
C_RST
6
4
INOUT_B4
INOUT_A4
G2
10
G1
5
NA
Out of PDM
9
1
8
INOUT_B1
INOUT_A1
2
R641
C_MCLK
7
INOUT_B2
INOUT_A2
3
C_PCLK
SPK_RCV_P
6
INOUT_B3
INOUT_B4
INOUT_A4
INOUT_A3
4
0
C_VS
C_HS
SPK_RCV_N
G2
G1
3. TECHNICAL BRIEF
- 28 -
3.7 Keypad Switches and Scanning
The key switches are metal domes, which make contact between two concentric pads on the keypad
layer of the PCB when pressed. There are 26 switches (Normal Key 24EA, Volume up down side key),
connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in
Figure 3-11, except for the power switch (KB1), which is connected independently. Functions, the row
and column lines of the keypad are connected to ports of AD6720. The columns are outputs, while the
rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and
column are connected together, causing the row input to go low and generate an interrupt. The
columns/rows are then scanned by AD6720 to identify the pressed key.
Figure 3-11. Keypad Switches and Scanning
POWERKEY
VBAT
R300
END
10K
R301
680
KEY_ROW0
KEY_ROW1
KEY_ROW2
KEY_ROW3
KEY_ROW4
KEY_COL0
KEY_COL1
KEY_COL2
KEY_COL3
KEY_COL4
SW304
R320 680
R326
R331 680
R336
R339 680
R342 680
R343
R344 680
680R324
680
680
680R341
680
VA304
R302
100
EVL14K02200
VA306
EVL14K02200
VA307
EVL14K02200
SW300
VA305
T
EVL14K02200
R303
VA301
100
SW312
SW317
SW322
*
CN601
123
4
VA302
EVL14K02200
1
4
7
EVL14K02200
2
SW308
SW313
5
SW318
8
SW323 SW325
0
VOL_UP/DOWN
VA303
EVL14K02200
3
SW309
SW314
6
SW319
9
SW324
#
SW305
SW310SW307
SW315
SW320
VA312
CLR
LEFT
UP
RIGHT
DOWN
EVL14K02200
SW306
VA313
SW311
SW316
SW321
SW326
EVL14K02200
FAV
MENU
SEL
SEND
CONF
3. TECHNICAL BRIEF
- 29 -
3.8 Microphone
The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to
AIN1P and AININ pins of AD6720. The voltage supply VMIC is output from AD6720, and is a biased
voltage for the AIN1P. The AIN1P and AIN1N signals are then A/D converted by the voiceband ADC
part of AD6720.The digitized speech (PCM 8KHz ,16KHz) is then passed to the DSP section of
AD6720 for processing (coding, interleaving etc).
Figure 3-12. Connection between Microphone and AD6535
CLOSE TO MIC
2.2K
R215
10u
C215
2.2K
R220
2V5_VMIC
VA205
EVL5M02200
0
R217
OB4-15L42-C33L
1
2
MIC200
C220
39p
0.1u
C223
EVL5M02200
VA206
C226
39p39p
C225
1K
R213
100
R216
C221
39p
C219
39p
R219
100
VINNORN
VINNORP
3. TECHNICAL BRIEF
- 30 -
3.9 Main Speaker
The main speaker is driven directly by AD6720 AOUT1P and AOUT1N pins and the gain is controlled
by the PGA in an AD6720. The receiver is placed in the folder cover and connected to AOUT1x
terminal via FPCB.
Figure 3-13. MAIN SPEAKER
ACOUSTIC & MIDI
VBAT
VA201
EVL5M02200
1u
C205
EVL5M02200
VA200
IN1
A2
IN2
C1
NC1
A1
NC2
C4
NO1
A4
NO2
B4
V+
U204
MAX4684EBC_T
C3
COM1
A3
COM2
B1
GND
C2
100K
R631
C200
10u
SPK_P
REC_N
REC_P SPK_RCV_P
SPK_RCV_N
SPK_N
SPK_SEL
L17
AIN3N
AIN3P
L16
K17
AOUT1N
AOUT1P
H16
C147
39p
R135 4.7
R133 4.7
REC_N
REC_P
R212
33K
VSS
_CS
29
_IRQ
3
31
_RD
4
_RST
28
_WR
2V85_VCAM
12
EQ2
13
14
EQ3
HPOUT_L
10
HPOUT_R
11
IOVDD
32
2
LED
MTR
19
NC
5
6
PLLC
SPOUT1
17
18
SPOUT2
15
SPVDD
16
SPVSS
VDD
7
VREF
9
8
30
A0
1
CLK1
D0
27
D1
26
D2
25
D3
24
23
D4
22
D5
21
D6
20
D7
EQ1
YMU762C-QZ
U203
2V85_VCAM
20K
R211
1u
C228
120K
R214
1000p
C222
C214
0.01u
0.1u
C224
0.1u
C227
0.1u
C213
R210
NA
C218
270p
R218
3.3K
VBAT
C229
1u
SPK
SPK_N
13MHz
26M_MIDI
DATA12
DATA13
DATA14
DATA15
_MIDI_CS
_MIDI_IRQ
_RD
_MIDI_RESET
_WR
SPK_P
ADD00
DATA08
DATA09
DATA10
DATA11
3. TECHNICAL BRIEF
- 31 -
3.10 Headset Interface
This phone has 6 electrodes such as GND, AUXIP, AUXIN (this pin is floating), AUXOP,
JACK_DETECT, HOOK_DETECT. This type supports mono sound
Switching from Receiver to Headset Jack
If jack is inserted, JACK_DETECT goes from low to high.
Audio path is switched from receiver to earphone by JACK_DETECT interrupt.
Switching from Headset Jack to Receiver
If jack is removed, JACK_DETECT goes from high to low.
Audio path is switched from earphone to receiver by JACK_DETECT interrupt.
Hook detection
If hook-button is pressed, HOOK_DETECT is changed from high to low.
This is detected by AUXADC2.
And then hook is detected.
Figure 3-14. HEADSET JACK INTERFACE
JACK_DETECT
JACK_DETECT
L REMOVE
INSERT
H
C207
39p
U201
LMV7291MGX-NOPB
CLOSE TO EARJACK
2V8_VEXT
5
VCC
GND
2
4
3
C201
0.1u
2V8_VEXT
VIN-
VIN+
C202
R205
R208
330K
NA
1M
AUXIN
1
OUT
AUXOP
AUXIP
R204
2V5_JACK
R200
1K
R201
20K
C206
NA
R202
1.5K
C203
39p
22u
R203
HOOK_DET
0
2V8_VEXT
C216
1u
U202
1
GND4NC
2
VOUTVin
NCP563Q25T1
2V5_JACK
3
C217
1u
J200
VA204
EVL5M02200
5
1
3
4
2
C209 0.1u
C210
39p
C208 10u
R209
1M
R206 4.7
4.7R207
C212
C211
39p
39p
VA202
EVL5M02200
VA203
EVL5M02200
Loading...