LG KG195 Service Manual

Date: September, 2007 / Issue 1.0

Service Manual

KG195

Model : KG195

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LGE Internal Use Only

AMENDMENT RECORD SHEET

For details of previous history refer to archival documents.

KG195 SERVICE MANUAL V1.5

AMENDMENT RECORD

New Issue Number - Date Changes This Issue, Page and Description Remarks

Draft 1.00 20.07.2007 All for Publication First draft Issue

Issue Number Date

Draft 1.00 20.07.2007

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LGE Internal Use Only

Only for training and service purposes

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LGE Internal Use Only

1. Introduction ..................................... 5

2. Precautions for Repair Work ......... 7

3. UNIT SPECIFICATION ................... 12

4. Circuit Description.........................23

4.1 LOGIC BLOCK DIAGRAM.....................24

4.2 LOGIC....................................................25

4.2.1 INTRODUCTION ............................25

4.2.2 SYSTEM BLOCK DIAGRAM ..........25

4.2.3 MEMORY SUBSYSTEM ................26

4.2.4 MTK6226 BASE BAND CHIP .........28

4.2.5 PMU IC MT 6305 ............................29

4.2.6 KEY SWITCHES.............................34

4.2.7 VIBRATOR .....................................35

4.2.8 KEY BACKLIGHT LED ...................35

4.2.9 BATTERY CHARGING...................36

4.2.10 REAL-TIME CLOCK (RTC) ..........39

4.2.11 EXTERNAL INTERFACE .............40

4.2.12 SIM INTERFACE ..........................41

4.2.13 SIGNAL CONTROL PATH FOR BACKLIGHT LED, CAMERA FLASH

LED AND INDICATOR LED..........42

4.2.14 DISPLAY SYSTEM.......................44

4.2.15 CAMERA.......................................46

4.2.16 AUDIO SUBSYSTEM ...................47

4.2.17 FM interface..................................50

4.2.18 Bluetooth interface........................51

4.2.19 RF Sub-systems ...........................52

5. Servicing........................................ 56

5.1 STRUCTURE.........................................57

5.2 ACCESSORIES.....................................61

5.3 EXPLODED DIAGRAM..........................63

5.4 DISASSEMBLY......................................66

5.5 SOLDERING..........................................70

6. Repairing ....................................... 72

6.1 TESTING ...............................................73

6.2 TROUBLE SHOOTING..........................85

6.3 Circuit Diagrams ....................................85

7. Device Information...................... 109

8. ATE TOOL .....................................128

9. Swoftware Download

Procedure .....................................176

9.1 Install Leo Download tool.....................176

9.2 Connect Download cable with

computer and mobile ...........................179

9.3 Install SW.............................................179

Table of Contents

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Only for training and service purposes

Table Of Contents

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LGE Internal Use Only

SECTION 1

Introduction

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LGE Internal Use Only

Only for training and service purposes

1. Introduction

This is the Electronic Service Manual for KG195 Triple Band GSM Digital Cellular Telephone from LG. It contains specific information on repair and test procedures. For details of user functions, general operation and installation, please refer to the User Guide.

The Service Manual is set out in the following sections.

1. Precautions for Repair Work: provides general guidelines for undertaking safe and efficient repair work.

2. Unit Specification: provides the technical specifications for KG195 Triple Band GSM Digital Cellular Telephone.

3. Introduction of Service Level:

a) Service Level 1: describes definition of Service Level 1, equipment and tools required for this

level.

b) Service Level 2: describes definition, equipment and tools required for Service Level 2.

4. Circuit Description: provides functional details of the circuits, block diagrams and component

purpose descriptions.

5. Servicing: defines the jigs, fixtures and test configurations required for servicing the product; and describes the processes of assembly and disassembly.

6. Troubleshooting: provides an aid to fault finding the product. Includes, using the signal levels and plots at various parts of the circuit.

7. Device Information: provides functional information and pin-outs of most of the semiconductor devices within the HHP.

8. Glossary: terms used in this GSM and this manual.

1. Introduction

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LGE Internal Use Only

SECTION 2

Precautions

for Repair Work

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2. Precautions for Repair Work

AC Power Cord:

Care must be taken not to damage the AC power cord as fire or electric shock may result.

Battery Pack:

Only use the specified batteries and chargers with this equipment. Do not short the battery terminals together. Keep the battery pack away from fire and sources of ignition. Remember to recharge the battery pack after each use.

Before Powering up the Equipment:

• Only switch on the telephone’s power once the test or installation set-up is complete.

• Switching on at the wrong time may result in electric shock or damage to system components.

• Always ensure that the power is switched off before making connections / disconnection’s.

• It is important to check that the correct DC voltage is applied to the equipment to prevent electrical

damage.

Component Polarity:

Always check the polarity of connections and components before soldering. Particular attention must be paid to IC.s, diodes, transistors, capacitors and any other semiconductor device that is polarity dependent.

Electrostatic Damage (ESD):

Semiconductor devices are easily damaged by electrostatic discharge. Many of the procedures detailed in this manual involve disassembly of the equipment and therefore handling of the printed circuit boards. To protect these devices from ESD a wrist strap connected to ground must be worn. In addition to this the work surface must be covered with an anti-electrostatic mat, which should also be grounded. If printed circuit boards are to be stored without being re-assembled into their equipment, then they must be kept in an anti-electrostatic bag.

2. Precautions for Repair Work

LGE Internal Use Only

Only for training and service purposes

Important

CAUTION:

Please read the following cautions, notes and warnings before progressing through this manual or undertaking any repair action. Remember: SAFETY FIRST!

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2. Precautions for Repair Work

Electrostatic Damage (ESD):

Semiconductor devices are easily damaged by electrostatic discharge. Many of the procedures detailed in this manual involve disassembly of the equipment and therefore handling of the printed circuit boards. To protect these devices from ESD a wrist strap connected to ground must be worn. In addition to this the work surface must be covered with an anti-electrostatic mat, which should also be grounded. If printed circuit boards are to be stored without being re-assembled into their equipment, then they must be kept in an anti-electrostatic bag.

Grounding:

Each piece of test equipment should be electrically grounded. A third (grounding) pin is provided as a safety feature. Ensure that the electrical outlet also contains this feature.

Cosmetic Protection during Repair Work:

Always ensure that the working surface is kept clean and free from abrasive materials. The LCD is very susceptible to scratches and damage. It should be covered with clear adhesive vinyl while the equipment is disassembled.

Storage of Faulty Components:

Any components that are replaced due to failure should be kept safely in an antielectrostatic container. NEC’s Quality or Research & Development Departments may require them to make quality and reliability investigations.

No Fault Found Equipment:

In some cases the reported symptom may not be apparent. You may subject the equipment to a controlled amount of stress, vibration and temperature variation to see if the fault occurs. Care should be taken not to apply excessive stress or vibration or extreme temperature variations as further faults may develop.

Soldering and Disordering:

The solder used is only Pb-free. Fast, accurate and high quality soldering is required to minimise the risk of heat damage to the electronic components. It is necessary to adjust the temperature of soldering tip to 330 degrees or less. The soldering tip should not be in contact with components or PCB tracks for longer than 4 seconds (average). This time depends on temperature conditions of parts. Heat the pad on the PCB and the lead, quickly apply solder, remove heat and cool. After soldering is complete, ensure that all solder joints are of good quality - no dry joints, solder bridges, cracks or excess solder. The majority of chip components are machine mounted using solder paste. Removal of the solder is not sufficient for chip component removal. Each solder point must be heated simultaneously and quickly (to prevent component and PCB damage). When the solder has melted, remove the component with tweezers.

LGE Internal Use Only

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2. Precautions for Repair Work

Short Circuits:

Care must be taken to avoid short circuits. Soldering, solder dust, screws, metal clippings, metal wrist watches etc. can cause short circuits on PCBs which may result in component damage.

Test Equipment Calibration:

Your test equipment should be calibrated before use. Frequent calibration is essential to ensure high quality and reliable repairs.

Cleaning:

Before cleaning ensure that the telephone is switched off and disconnected from the power source. Cleaning should be done using a soft dry cloth. If the equipment is heavily soiled a soft cloth soaked in a mild synthetic detergent diluted in water may be used. Never use benzene or any other chemicals to clean the equipment.

RF Shielding:

It is advisable to carry out detailed measurements and repair (in particular RX) in a shielded area to minimise RF interference.

AC Adapter and Battery Charger:

The AC adapter and battery chargers are for indoor use only. Ensure that the devices are not exposed to rain or moisture.

Electrical Safety:

Electrical equipment is hazardous if misused. Any repairs must be carried out with care and only by authorised personnel. Ensure all power sources are switched off and power cords removed before undertaking any repairs.

Hazardous Waste:

The battery pack, if incorrectly disposed of, is an environmental hazard. It must be disposed of in accordance with the regulations of the country concerned. Never dispose of the battery pack in fire or water.

Confidentiality:

The circuitry within this equipment contains several components that are regarded as company confidential. Only use NEC specified parts as replacements.

RF Injury:

To avoid RF injury, direct exposure to radio frequency energy should be avoided. In particular, exposed parts of your body (especially the eyes and face) should not come into contact with the antenna while the equipment is transmitting.

LGE Internal Use Only

Only for training and service purposes

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2. Precautions for Repair Work

Storage Conditions:

It is recommended that the following storage conditions should be avoided to prevent damage to the equipment: -

Dusty. Humid. Near to magnetic equipment In direct sunlight

Ventilation:

Repair areas should be well ventilated and fume extraction systems should be installed where necessary. Potential hazardous substances are solder fumes, flux, alcohol etc.

PCB Handling:

It is recommend that cotton gloves are worn during repair work. This is to protect your hands from chemical contamination and to protect the PCBs from fingerprints and humidity.

SIM Card:

• Do not bend.

• Clean by using a soft dry cloth.

AUDIO Parts:

• Be careful for alien substance/oils and fats, etc. not to adhere to the terminal contact part of MIC, the receiver, the speaker.

• Be careful to handle AUDIO parts with electrostatics measures at the worker/in the working place.

• Be careful not to spend a stress on the MIC side part to the utmost.

• Be careful not to pressurize the coil joint (protection Bond part) of the receiver and speaker because they are easy of broken.

• Be careful for alien substance to approach to sound hole part of the speaker.

• Be careful sufficiently so as not to blow air with the process into the receiver, speaker/MIC sound hole. It causes sounds being small by the diaphragm transformation or vibration.

LGE Internal Use Only

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LGE Internal Use Only

Only for training and service purposes

SECTION 3

Unit Specifications

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3. UNIT SPECIFICATION

LGE Internal Use Only

Solution MT6226 Media Tek

Type Bar type

Antenna Type Internal (tri-Band)

Main Display 1.77”, 128x160

GPRS Class 10

MMS Yes, 1.1

Camera 0.3M (OV7670)

Battery 750mAh BYD cell

Audio player Yes (support MP3 and AAC playback)

FM Receiver Yes, US/Europe band(87.5~108MHz)

MPEG4/H.263 Yes (support 3GP)

H.264 No(no support)

AAC+ No

FM as alarm Yes

Scheduled FM recording Yes

MP4 for incoming call/

power on off animation Yes

and screen saver

Loud Speaker Yes

Audio player--real resuming Yes, for MP3 only

Video recording Yes

Memory Size 128Mb NOR Flash + 32Mb

PSRAM + 512Mb NAND

Internal NAND 512Mb NAND

Memory Card T-flash

Bluetooth Yes, version 1.2

USB Yes, slave 1.1

IrMC No

WAP Yes, 2.0

PRODUCT FEATURES AND SPECIFICATION

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Only for training and service purposes

3. UNIT SPECIFICATION

Java Yes

PoC No

EMAIL No

Status LED Yes

DRM No

Dictionary No

MPEG4 caller ID Yes

Finger handwriting No

Touch Panel No

Caption No

OTA Yes

AB repeat No

Music Equalizer Yes

Image Editing No

In flight mode Yes

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3. UNIT SPECIFICATION

Category Requirement Description Parameter Support

Shall support multiple radio bands/power

- 850 MHz/class 4 (2W) N

Frequency - 900 MHz/class 4 (2W) Y

- 1800 MHz/class 1 (1W) Y

- 1900 MHz/class 1 (1W) Y

Antenna Shall support [Internal/External] antenna Internal Y

Shall support GPRS bearer

- release [R#] R98 Y

GPRS - multi-slot class [class #] 10 Y

- Service class [Class #] Class B Y

- Coding scheme [CSn] CS1,CS2, CS3, CS4 Y Shall support following data transaction mode and services.

- Fax N

- Data N

Data Service - WAP [rel #] 2.0 Y

- SMS Y

- EMS [rel #] Code 5.0 Y

- MMS [rel #] 1.1 Y

Java

Support JAVA MIDP [ver #] 2.0 Y Support JAVA CLDC [ver #] 1.0 Y Shall support multiple voice codec Y

- FR Y

- EFR Y Voice codec - HR Y Audio - AMR NB (air link) N decoder Shall support multiple audio decoders

- MP3 Y

- AAC Y

- AAC+ N

The physical dimension is [Length x Width x 103.5*46.3*12.4mm Y Thickness mm]

Physical

The overall volume is [# cc] 59 Y The weight is [# g] TBC Y

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Only for training and service purposes

3. UNIT SPECIFICATION

Category Requirement Description Parameter Support

Shall support main display with following Y characteristics:

- Size 1.77” Y

Display - Type TFT, Transmissive Y

- Color depth 262K Y

- Pixel resolution [width x height] 128x160 Y

- Active area [W x H mm]

28.032(W)x 35.04(H) mm

Y Shall support high resolution camera with Y following characteristics:

Camera

- Active pixel array up to resolution [ X x Y pixels] 640x480 Y

- Sensor type [CMOS or CCD] CMOS Y Shall support FM radio bands

FM radio - US/Europe band 87.5~108MHz Y

- Japan band 76~90MHz N

Battery Shall support Li-Ion battery with minimum 750mAh Y

capacity of [mAh]. Shall support following device to connect external devices.

- USB [ver, host or slave or OTG] 1.1, slave Y

- Bluetooth [ver, power class] 1.2, class 2 Y

GAP SDAP

Connectivity DUN

SPP

- Bluetooth profiles HSP Y

HFP OPP FTP

A2DP Shall support mass data storage for different Y multimedia content.

- Build-in NAND [MB]. Used as mobile disk. Y

Storage

(Notes : Designed footprint shall be possible to support multiple memory capacity)

- Micro SD Y

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LGE Internal Use Only

3. UNIT SPECIFICATION

Category Requirement Description Parameter Support

Indication

Shall support LED for status indication. 1 Yellow Green LED Y

Shall support LED for charger-in status indication. 1 Orange LED Y Vibrator Shall support in built vibration alert Y SIM Card Shall support SIM card both 1.8V and 3V. Y

Shall support Y

- 12 alphanumeric/number keys (0-9,#,*)

Keypad

- 4 function keys (on hook, off hook, left softkey, right softkey)

- 4 way navigation keys (up, down, left, right)

- 3 side keys(one on the right and two on the left)

Shall support illumination color [color] for

10 LED Blue

Y keypad backlight. Shall design in a nub on or around key Y number 5. Shall support AWB (Automatic White Balance) Y

Camera Shall support automatic flicker reduction N

Shall support gamma correction Y

* Battery life is Network dependent; variations may occur.

The KG195 HHP works closely with the network and the standby and talk times achieved depend upon this. In particular the location of the HHP within the network, the type of SIM, reception of area messages, the use of AMR, Full Rate speech, Half Rate speech or Enhanced Full Rate speech and other factors will affect both standby and talk times.

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LGE Internal Use Only

Only for training and service purposes

3. UNIT SPECIFICATION

Transmitting Frequency Range: EGSM : 880 - 915MHz

DCS1800 : 1710 - 1785MHz

PCS1900 : 1850 - 1910MHz

Receiving Frequency Range: EGSM : 925 - 960MHz

DCS1800 : 1805 - 1880MHz

PCS1900 : 1930 - 1990MHz

TX - RX Duplex Spacing: EGSM : 45MHz

DCS1800 : 95MHz

PCS1900 : 80MHz

Channel Spacing: EGSM : 200KHz

DCS1800 : 200KHz

PCS1900 : 200KHz

Number of Channels (ARFCN): GSM : 124 (Numbered 1 to 124) std.

EGSM : 50 (Numbered 975 to 1023 & 0)

DCS1800 : 374 (Numbered 512 to 885)

PCS1900 : 299 (Numbered 512 to 810)

Power Class: EGSM : Class 4 MTS (33 +/- 2dBm)

DCS1800 : Class 1 MTS (30 +/- 2dBm)

PCS1900 : Class 1 MTS (30 +/- 2dBm)

Tx Peak Current: 2500mA

GPRS Class: Class 10; Operation class B

GPRS Coding Scheme: CS1/CS2/CS3/CS4

Data Rates (Packet): EGSM/DCS1800/PCS1900 :

Uplink : Up to 21.4Kbps (1 slot)

Downlink : Up to 85.6Kbps (4 slots)

Data Rates (Circuit Switch): EGSM/DCS1800/PCS1900 : Up to 9600Kbps

RF Power Output

TX Frequency Output

Phase and Frequency Error

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LGE Internal Use Only

3. UNIT SPECIFICATION

Low Channel (Ch 975) 880.2 MHz Mid Channel (Ch 62) 902.4 MHz High Channel (Ch 124) 914.8 MHz

TX Frequency Calculation (Ftx)MHz 890 + (ARFCN x 0.2)MHz

(0 - 124) 890 + 0.2x(ARFCN - 1024)MHz

(975 - 1023)

Power Levels 15 decrements in 2dB steps

Power Control Level 5 33dBm +/-2dB Power Control Level 6 31dBm +/-3dB Power Control Level 7 29dBm +/-3dB Power Control Level 8 27dBm +/-3dB Power Control Level 9 25dBm +/-3dB Power Control Level 10 23dBm +/-3dB Power Control Level 11 21dBm +/-3dB Power Control Level 12 19dBm +/-3dB Power Control Level 13 17dBm +/-3dB Power Control Level 14 15dBm +/-3dB Power Control Level 15 13dBm +/-3dB Power Control Level 16 11dBm +/-5dB Power Control Level 17 9dBm +/-5dB Power Control Level 18 7dBm +/-5dB Power Control Level 19 5dBm +/-5dB

Peak Phase Error < 20 degrees RMS Phase Error < 5 degrees Frequency Stability < +/- 90Hz

TRANSMITTER (EGSM)

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LGE Internal Use Only

Only for training and service purposes

3. UNIT SPECIFICATION

RF Power Output

TX Frequency Output

Phase and Frequency Error

Low Channel (Ch 512) 1710.2 MHz Mid Channel (Ch 699) 1747.6 MHz High Channel (Ch 885) 1784.8 MHz TX Frequency Calculation (F

tx)MHz 1710.2 + 0.2 x (ARFCN - 512) = Ftx MHz

Power Levels 16 decrements in 2dB steps

Power Control Level 0 30dBm +/-2dB Power Control Level 1 28dBm +/-3dB Power Control Level 2 26dBm +/-3dB Power Control Level 3 24dBm +/-3dB Power Control Level 4 22dBm +/-3dB Power Control Level 5 20dBm +/-3dB Power Control Level 6 18dBm +/-3dB Power Control Level 7 16dBm +/-3dB Power Control Level 8 14dBm +/-3dB Power Control Level 9 12dBm +/-4dB Power Control Level 10 10dBm +/-4dB Power Control Level 11 8dBm +/-4dB Power Control Level 12 6dBm +/-4dB Power Control Level 13 4dBm +/-4dB Power Control Level 14 2dBm +/-5dB Power Control Level 15 0dBm +/-5dB

Peak Phase Error < 20 degrees RMS Phase Error < 5 degrees Frequency Stability < +/- 180Hz

TRANSMITTER (DCS1800)

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LGE Internal Use Only

3. UNIT SPECIFICATION

RF Power Output

TX Frequency Output

Phase and Frequency Error

Low Channel (Ch 512) 1850.2MHz Mid Channel (Ch 657) 1879.2MHz High Channel (Ch 810) 1909.8MHz TX Frequency Calculation (F

tx)MHz 1850.2 + 0.2 x (ARFCN - 512) = Ftx MHz

Power Levels 16 decrements in 2dB steps

Power Control Level 0 30dBm +/-2dB Power Control Level 1 28dBm +/-3dB Power Control Level 2 26dBm +/-3dB Power Control Level 3 24dBm +/-3dB Power Control Level 4 22dBm +/-3dB Power Control Level 5 20dBm +/-3dB Power Control Level 6 18dBm +/-3dB Power Control Level 7 16dBm +/-3dB Power Control Level 8 14dBm +/-3dB Power Control Level 9 12dBm +/-4dB Power Control Level 10 10dBm +/-4dB Power Control Level 11 8dBm +/-4dB Power Control Level 12 6dBm +/-4dB Power Control Level 13 4dBm +/-4dB Power Control Level 14 2dBm +/-5dB Power Control Level 15 0dBm +/-5dB

Peak Phase Error < 20 degrees RMS Phase Error < 5 degrees Frequency Stability < +/- 185Hz

TRANSMITTER (PCS1900)

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LGE Internal Use Only

Only for training and service purposes

3. UNIT SPECIFICATION

RX Frequency Input

Low Channel (Ch 975) 925.2 MHz Mid Channel (Ch 62) 947.4 MHz High Channel (Ch 124) 959.8 MHz

RX Frequency Calculation (Frx)MHz

(0 - 124) Ftx + 45 Mhz = Frx MHz

(975 - 1023) Ftx + 45 Mhz = Frx MHz

BER (Bit Error Ratio) Type II BER <2.4% at -102dBm

Type II BER <0.1% at -15dBm

Low Channel (Ch 512) 1805.2 MHz Mid Channel (Ch 699) 1842.6 MHz High Channel (Ch 885) 1879.8 MHz RX Frequency Calculation (Frx) Ftx + 95 Mhz = Frx MHz

BER (Bit Error Ratio) Type II BER <2.4% at -102dBm

Type II BER <0.1% at -23dBm

Low Channel (Ch 512) 1930.2MHz Mid Channel (Ch 657) 1959.2MHz High Channel (Ch 810) 1989.8 MHz RX Frequency Calculation (Frx) Ftx + 80 Mhz = Frx MHz

BER (Bit Error Ratio) Type II BER <2.4% at -102dBm

Type II BER <0.1% at -23dBm

RECEIVER (EGSM)

RECEIVER (DCS1800)

RECEIVER (PCS1900)

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LGE Internal Use Only

SECTION 4

Circuit

Description

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LGE Internal Use Only

Only for training and service purposes

4. Circuit Description

4.1 LOGIC BLOCK DIAGRAM

4.2.1 INTRODUCTION

The logic part of 7332 phone is based on Leonardo that is MTK Systems platform. The circuit comprises the following main functional blocks:

• Memory Subsystem

• Baseband CPU(MTK6226): Baseband Controller, 52MHz 32bit RISC ARM7EJ-STM

• MT6305: PMIC handles all baseband power

• FM Radio IC(SI4703)

• Main LCM (262K TFT)

• Camera (0.3M plxels CMOS sensor)

• Bluetooth(BC313141A18)

• TOSHIBA MCP(128+32+512MB)

• User I/O (KEY,MINI SD CARD,USB Client,SIM card )

4.2.2 SYSTEM BLOCK DIAGRAM

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LGE Internal Use Only

4. Circuit Description

4.2 LOGIC

LOGIC AND BASE BAND PORTION

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4. Circuit Description

LGE Internal Use Only

Only for training and service purposes

4.2.3 MEMORY SUBSYSTEM

KG195 handset memory; Memory: (NOR128MB+PSRAM32MB+NAND512MB) Its detail is as follows.

The consists of 128M-bit NOR Type Flash memory, 32M-bit PSRAM, NAND512MB in a 107-ball FBGA

4.2.3.1 Memory

Type and capacity of memories, used for 311-0000-00015 are as follows:

311-0000-00015 is the Stacked Memory comprising of the above four memories.

4.2.3.2 Memory Interface Description

MT6226 incorporates a powerful and flexible memory controller, External Memory Interface, to connect with a variety of memory components. This controller provides one generic access scheme for FLASH Memory, SRAM and PSRAM. Up to 8 memory banks can be supported simultaneously, BANK0 BANK7, with a maximum size of 64MB each. Since most of the FLASH Memory, SRAM and PSRAM have similar AC requirements, a generic configuration scheme to interface them is desired. This way, the software program can treat different components by simply specifying certain predefined parameters. All these parameters are based on cycle time of system clock. The interface definition based on such scheme is listed in following table. Note that, this interface always operates data in Little Endian format for all types of accesses.

Description Manufacturer Type of memory Capacity

311-0000-00015 TOSHIBA Flash Memory (NOR) 128Mb

Flash Memory (NAND) 512Mb PSRAM 32Mb

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4. Circuit Description

LGE Internal Use Only

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LGE Internal Use Only

Only for training and service purposes

4.2.4 MTK6226 BASE BAND CHIP

Details the block diagram of MT6226. Based on a dual-processor architecture, MT6226 integrates both an ARM7EJ-S core and a digital signal processor core. ARM7EJ-S is the main processor that is responsible for running high-level GSM/GPRS protocol software as well as multi-media applications.

The digital signal processor handles the low-level MODEM as well as advanced audio functions. Except for some mixed-signal circuitries, the other building blocks in MT6226 are connected to either the microcontroller or the digital signal processor.

Specifically, MT6226 consists of the following subsystems:

1. Microcontroller Unit (MCU) Subsystem - includes an ARM7EJ-S RISC processor and its accompanying memory management and interrupt handling logics.

2. Digital Signal Processor (DSP) Subsystem - includes a DSP and its accompanying memory, memory controller, and interrupt controller.

3. MCU/DSP Interface - where the MCU and the DSP exchange hardware and software information.

4. Microcontroller Peripherals - includes all user interface modules and RF control interface modules.

5. Microcontroller Coprocessors - runs computing-intensive processes in place of Microcontroller.

6. DSP Peripherals - hardware accelerators for GSM/GPRS channel codec.

7. Multi-media Subsystem - integrates several advanced accelerators to support multi-media applications.

8. Voice Front End - the data path for converting analog speech from and to digital speech.

9. Audio Front End - the data path for converting tereo audio from stereo audio source

10. Baseband Front End - the data path for converting digital signal from and to a nalog signal of RF

modules.

11. Timing Generator - generates the control signals related to the TDMA frame timing.

12. Power, Reset and Clock subsystem - manages the power, reset, and clock distribution inside

MT6226. Details of the individual subsystems and blocks are described in following Chapters.

4. Circuit Description

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4. Circuit Description

LGE Internal Use Only

4.2.5 PMU IC MT 6305

The MT6305 is a power management system chip optimized for GSM handsets, especially those based on the Media Tek MT620x system solution. It contains seven Low Drop Out Regulators (LDO), one to power each of the critical GSM sub-blocks. Sophisticated controls are available for power-up during battery charging, keypad interface, and RTC alarm. The MT6305 is optimized for maximum battery life, featuring a ground current of only 107µ A and 187µ A when the phone is in standby and operation respe ctively.

Phone State CHRON -UVLO PWRBB(-PWRKEY) SRCLKEN Vrtc Vd, Vio, Vm Va, Vtcxo

No Battery or Vbat <2.5V X L X X Off Off Off

2.5V < Vbat < 3.2V L L X X On Off Off

Pre-Charging H L X X On Off Off

Charger-on H H X X On Off Off

Switched off L H X X On Off Off

Stand-by L H H X On On Off

Active L H H H On On On

LG KG195 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual