LG KF755D Service Manual

Date: May, 2008 / Issue 1.0

Service Manual

Model : KF755d

Service Manual

KF755d

Internal Use Only

- 3 -

1. INTRODUCTION .............................. 5

1.1 Purpose................................................... 5

1.2 Regulatory Information............................ 5

2. PERFORMANCE...............................7

2.1 System Overview .....................................7

2.2 Usable environment .................................8

2.3 Radio Performance ..................................9

2.4 Current Consumption.............................18

2.5 RSSI.......................................................18

2.6 Battery Bar .............................................18

2.7 Sound Pressure Level............................19

2.8 Charging ................................................20

3. TECHNICAL BRIEF ........................21

3.1 Digital Baseband(DBB) & Multimedia

Processor...............................................21

3.2 GAM Hardware Subsystem ...................45

3.3 Audio Part ..............................................57

3.4 GPADC(General Purpose ADC) and

AUTOADC2 ...........................................65

3.5 Charger control ......................................66

3.6 Voltage Regulation.................................72

3.7 RF Technical Description.......................73

4. TROUBLE SHOOTING ...................84

4.1 Power ON Trouble .................................84

4.2 USB Trouble ..........................................85

4.3 SIM Detect Trouble ................................86

4.4 MicroSD card Trouble ............................87

4.5 Keypad, Touch Button and

Touch Screen Trouble ...........................88

4.6 Multi EL lighting Trouble ........................93

4.7 Camera Trouble .....................................97

4.8 Main LCD Trouble................................103

4.9 Keypad Backlight Trouble ....................105

4.10 Folder ON/OFF Trouble .....................107

4.11 Audio Trouble Shooting .....................109

4.12 Charger Trouble Shooting..................128

4.13 Checking Bluetooth Block ..................131

4.14 RF Component...................................138

4.15 Procedure to check ............................139

4.16 Checking Common Power

Source Block......................................140

4.17 Checking VCXO Block .......................145

4.18 Checking Front End Module Block.....150

4.19 Checking Front End Module

Block input logic .................................151

4.20 Checking WCDMA Block ...................154

4.21 Checking GSM Block .........................169

5. DOWNLOAD .................................184

5.1 LGDP2 .................................................184

5.2 Download .............................................186

6. BLOCK DIAGRAM ........................188

7. Circuit Diagram ............................191

8. BGM Pin Map................................203

9. PCB LAYOUT................................209

10. Calibration & RF Auto Test

Program (Hot Kimchi)................219

10.1 General Description ...........................219

10.2 XCALMON Environment ....................219

10.3 Calibration Environment.....................220

10.4 Program Operation ............................221

11. Stand-alone Test ........................226

11.1 General Description ...........................226

11.2 Program Operation ............................227

11.3 Stand-alone Test................................230

12. EXPLODED VIEW &

REPLACEMENT PART LIST ......233

12.1 EXPLODED VIEW .............................233

12.2 Replacement Parts ............................235

12.3 Accessory ..........................................256

Table Of Contents

LGE Internal Use Only

- 4 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

- 5 -

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

LGE Internal Use Only

Only for training and service purposes

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION

- 6 -

LGE Internal Use Only

2. PERFORMANCE

- 7 -

2.1 System Overview

2. PERFORMANCE

Item Specification

Shape GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset

Size 50.8X102.8X11.8 mm

Weight 116g (with standard battery)

Power 800mAh Li-Ion

Talk Time Over 170 Min (WCDMA, Tx=12 dBm, Voice)

Over 190 Min (GSM, Tx=Max, Voice)

Standby Time Over 220 hrs (WCDMA, DRX=2.56)

Over 220 hrs (GSM, Paging period=5)

Antenna Intenna type

Main LCD 2.4"(320x240), 260K TFT Color LCDs

Main LCD BL White LED Backlight

Vibrator Yes (Coin Type)

Speaker Yes

MIC Yes (SMD Type)

Receiver Yes

Earphone Jack Yes

SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V

Volume Key Push Type ( + , - )

Voice Key Push Type

External Memory T - Flash Socket

I/O Connect 18 Pin

LGE Internal Use Only

Only for training and service purposes

2.2 Usable environment

1) Environment

2) Environment (Accessory)

* CLA : 12~24V(DC).

2. PERFORMANCE

- 8 -

Item Specification Unit

Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.23) V

Operation Temp -20 ~ + 60 °C

Storage Temp -30 ~ + 85 °C

Humidity max. 85 %

Item Spec. Min Typ. Max Unit

Power Available power 100 220 240 Vac

LGE Internal Use Only

2. PERFORMANCE

- 9 -

2.3 Radio Performance

1) Transmitter-GSM Mode

No Item GSM DCS/PCS

1 Conducted MS allocated 100k~1GHz -39dBm 9k~1GHz -39dBm

Spurious Channel 1G~1710MHz -33dBm

Emission 1G~12.75GHz -33dBm 1710M~1785MHz -39dBm

1785M~12.75GHz -33dBm

Idle Mode 100k~880MHz -60dBm 100k~880MHz -60dBm

880M~915MHz -62dBm 880M~915MHz -62dBm

915M~1000Mz -60dBm 915M~1000MHz -60dBm

1G~1.71GHz -50dBm 1G~1.71GHz -50dBm

1.71G~1.785GHz -56dBm 1.71G~1.785GHz -56dBm

1.785G~12.75GHz -50dBm 1.785G~12.75GHz -50dBm

Radiated MS allocated 30M~1GHz -36dBm 30M~1GHz -36dBm

Spurious Channel 1G~1710MHz -30dBm

Emission 1G~4GHz -30dBm 1710M~1785MHz -36dBm

1785M~4GHz -30dBm

Idle Mode 30M ~ 880MHz -57dBm 30M~880MHz -57dBm

880M ~ 915MHz -59dBm 880M~915MHz -59dBm

915M~1GHz -57dBm 915M~1GHz -57dBm

1G~1.71GHz -47dBm 1G 1.71GHz -47dBm

1.71G~1.785GHz -53dBm 1.71G~1.785GHz -53dBm

1.785G~4GHz -47dBm 1.785G~4GHz -47dBm

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 10 -

No Item GSM DCS/PCS

2 Frequency Error ± 0.1ppm ± 0.1ppm

3 Phase Error ± 5(RMS) ± 5(RMS)

± 20(PEAK) ± 20(PEAK)

4 Frequency Error 3dB below reference sensitivity 3dB below reference sensitivity

Under Multipath and RA250 : ± 200Hz RA250: ± 250Hz

Interference Condition HT100 : ± 100Hz HT100: ± 250Hz

TU50 : ± 100Hz TU50: ± 150Hz

TU3 : ± 150Hz TU1.5: ± 200Hz

5 Output RF Due to 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

Spectrum modulation 200kHz -30dB 200kHz -30dB

250kHz -33dB 250kHz -33dB

400kHz -60dB 400kHz -60dB

600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB

1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB

3000 ~ 6000kHz -71dB ≥ 6000kHz -73dB

≥ 6000kHz -77dB

Due to 400kHz -19dB 400kHz -22dB

Switching 600kHz -21dB 600kHz -24dB

transient 1200kHz -21dB 1200kHz -24dB

1800kHz -24dB 1800kHz -27dB

7 Intermodulation attenuation - Frequency offset 800kHz

Intermodulation product should

be Less than 55dB below the

level of Wanted signal

No Item GSM DCS/PCS

8 Transmitter Output Power Level Power Toler. Level Power Toler.

533 ±3030 ±3

631 ±3128 ±3

729 ±3226 ±3

827 ±3324 ±3

925 ±3422 ±3

10 23 ±3 5 20 ±3

11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4

19 5 ±5 14 2 ±5

15 0 ±5

9 Burst timing Mask IN Mask IN

LGE Internal Use Only

2. PERFORMANCE

- 11 -

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 12 -

2) Transmitter-WCDMA Mode

No Item Specification

1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)

Class4: +21dBm(±2dB)

2 Frequency Error ± 0.1ppm

3 Open Loop Power control in uplink ± 9dB@normal, ± 12dB@extreme

4 Inner Loop Power control in uplink Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +

5 Minimum Output Power -50dBm(3.84MHz)

6 Out-of-synchronization handling of output power Qin/Qout : PCCH quality levels

Toff@DPCCH/Ior : -22 -> -28dB

Ton@DPCCH/Ior : -24 -> -18dB

7 Transmit OFF Power -56dBm(3.84MHz)

8 Transmit ON/OFF Time Mask ± 25us

PRACH,CPCH,uplinlk compressed mode

9 Change of TFC ± 25us

Power varies according to the data rate DTX :

DPCH off (minimize interference between UE)

10 Power setting in uplink compressed ± 3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

12 Spectrum emission Mask -35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M -39-

10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

LGE Internal Use Only

2. PERFORMANCE

- 13 -

No Item Specification

14 Spurious Emissions (*: additional requirement) -36dBm@f=9~150KHz, 1K BW -

-36dBm@f=150KHz~30MHz, 10k

-36dBm@f=30~1000MHz, 100k

-30dBm@f=1~12.75GHz, 1M

-41dBm*@1893.5~1919.6MHz, 300k

-67dBm*@925~935MHz, 100k

-79dBm*@935~960MHz, 100k

-71dBm*@1805~1880MHz, 100k

15 Transmit Intermodulation -31dBc@5MHz, Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

16 Error Vector Magnitude (EVM) 17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

17 Transmit OFF Power -15dB@SF=4, 768kbps,

multi-code transmission

- 14 -

2. PERFORMANCE

3)Receiver-GSM Mode

LGE Internal Use Only

Only for training and service purposes

No Item GSM850/900 DCS & PCS

1 Sensitivity (TCH/FS Class II) -105dBm -105dBm

2 Co-Channel Rejection (TCH/FS C/Ic=7dB C/Ic=7dB

Class II, RBER, TU high/FH)

3 Adjacent 200kHz C/Ia1=-12dB C/Ia1=-12dB

Channel

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

4 Intermodulation Rejection Wanted Signal: -98dBm Wanted Signal :-96dBm 1st

1’st interferer: -44dBm 1’st interferer: -44dBm

2’st interferer: -45dBm 2’st interferer: -44dBm

5 Blocking Response Wanted Signal: -101dBm Wanted Signal: -101dBm

(TCH/FS Class II, RBER) Unwanted Signal: Unwanted Signal:

Depend on freq. Depend on freq.

- 15 -

2. PERFORMANCE

4) Receiver-WCDMA Mode

LGE Internal Use Only

No Item Specification

1 Reference Sensitivity Level -106.7dBm(3.84M)

2 Maximum Input Level -25dBm(3.84MHz)

-44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(class3)

3 Adjacent Channel Selectivity (ACS) 33dB

UE@+20dBm output power(class3)

4In-band Blocking -56dBm/3.84MHz@10MHz

UE@+20dBm output power(class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(class3)

5 Out-band Blocking -44dBm/3.84MHz@f=2050~2095 &

2185~2230MHz, band a)

UE@+20dBm output power(class3)

-30dBm/3.84MHz@f=2025~2050 &

2230~2255MHz, band a)

UE@+20dBm output power(class3)

-15dBm/3.84MHz@f=1~2025 &

2255~12500MHz, band a)

UE@+20dBm output power(class3)

6 Spurious Response -44dBm CW

UE@+20dBm output power(class3)

7 Intermodulation Characteristic -46dBm CW@10MHz &

-46dBm/3.84MHz@20MHz

UE@+20dBm output power(class3)

-57dBm@f=9KHz~1GHz, 100k BW

8 Spurious Emissions -47dBm@f=1~12.75GHz, 1M

-60dBm@f=1920~1980MHz, 3.84MHz

-60dBm@f=2110~2170MHz, 3.84MHz

- 16 -

2. PERFORMANCE

5) Transmitter

5.1 Transmitter

LGE Internal Use Only

Only for training and service purposes

No Item Specification

1 Out Power Class 2 : -6~4dBm

2 Power Density Power density < 20dBm per 100kHz EIRP

3 Power Control Option

2dB ≤ step size ≤ 8dB

4 TX Output Spectrum -Frequency range fmax & fmin @ below the level of -30dBm

(100khz BW) within 2.4GHz~2.4835GHz

5 TX Output Spectrum -20dB Bandwidth ≤ 1MHz

6 Tx Output Spectrum -Adjacent channel Po ≤ -20dBm @ C/I = 2MHz

≤ -40dBm @ C/I ≥ 3MHz

7 Modulation Characteristics 140kHz ≤ delta f1 avg ≤ 175kHz

delta f2max ≥ 115kHz at least 99.9% of all

deltaf2max delta f2avg/deata f1avg ≥ 0.8

8 Init. Carrier Freq. Tolerance ≤ ±75KHz

9 Carrier Frequency Drift 1 slot : ≤ ±25kHz

3 slot : ≤ ±40kHz

5 slot : ≤ ±40kHz

Maximum drift rate ≤ 20KHz/50usec

10 Out of Band Spurious Emissions Freq.Range Operating Standby

30MHz~1GHz -36dBm -57dBm

Above 1GHz~ -30dBm -47dBm

12.75GHz

1.8~1.9GHz -47dBm -47dBm

5.15~5.3GHz -47dBm -47dBm

- 17 -

2. PERFORMANCE

5.2 Transmitter

LGE Internal Use Only

No Item Specification

1 Sensitivity single slot packets BER ≤ 0.1%@-70dBm

2 Sensitivity multi slot packets BER ≤ 0.1%@-70dBm

3 C/I performance BER ≤ 0.1%@ (Low,Mid,High Frequency)

2405MHz, 2441MHz, 2477MHz

Interference Ratio

Co-Channel interference, C/I co-channel 11dB

Adjacent(1MHz)interference, C/I 1MHz 0dB

Adjacent(2MHz)interference, C/I 2MHz -30dB

Adjacent( ≥ 3MHz)interference, C/I ≥ 3MHz -40dB

Adjacent( ≥ 3MHz)interference to in band -9dB

mirror frequency, C/I image ±1MHz -20dB

4Blocking Characteristic BER ≤ 0.1%@wanted signal -67dBm

interfering Signal Frequency Power Level

30MHz~2000MHz -10dBm

2000MHz~2400MHz -27dBm

2500MHz~3000MHz -27dBm

3000MHz~12.75GHz -10dBm

5 Intermodluation Performance BER ≤ 0.1%@wanted signal -64dBm

static sinwave signal at f1=-39dBm

a BT modulated signal f2=-39dBm(payload PRBS15)

6 Maximum Input Level BER ≤ 0.1%@-20dBm

- 18 -

2. PERFORMANCE

2.4 Current Consumption

(VT test : Speaker off, LCD backlight On)

2.5 RSSI

2.6 Battery Bar

LGE Internal Use Only

Only for training and service purposes

Stand by Voice Call VT

WCDMA Only 220 Hours = 3.6 mA 170 Min = 280 mA 125 Min= 380 mA

(DRX=2.56) (Tx=12dBm) (Tx=12dBm)

GSM 220 Hours = 3.6 mA 190 Min = 250 mA

(paging=5period) (Tx=Max)

No WCDMA GSM

1 BAR 7 → 5-93 (+/- 2dB) -90 (+/- 2dB)

2 BAR 5 → 4 -98 (+/- 2dB) -104 (+/- 2dB)

3 BAR 4 → 2 -101 (+/- 2dB) -108 (+/- 2dB)

4 BAR 2 → 1 -104 (+/- 2dB) -110 (+/- 2dB)

5 BAR 1 → 0 -106 (+/- 2dB) -112 (+/- 2dB)

Indication Standby

Bar 3 → 2 3.69 ± 0.05V

Bar 2 → 1 3.53 ± 0.05V

Bar 1 → Icon Blinking 3.40 ± 0.05V

Low voltage, warning message 3.40 ± 0.05V

Power OFF 3.26 ± 0.05V

- 19 -

2. PERFORMANCE

2.7 Sound Pressure Level

LGE Internal Use Only

No Test Item Specification

1 Sending Loudness Rating (SLR)

NOM

8 ± 3 dB

MAX

2 Receiving Loudness Rating (RLR)

NOM -1 ± 3dB

MAX -15 ± 3dB

3 Side Tone Masking Rating (STMR)

NOM

17dB over

MAX

4 Echo Loss (EL)

NOM

40dB over

MAX

5 Sending Distortion (SD) refer to TABLE 30.3

6 Receiving Distortion (RD) refer to TABLE 30.4

7 Idle Noise-Sending (INS)

NOM

-64dBm0p under

MAX

8 Idle Noise-Receiving (INR)

NOM -47dBPA under

MAX -36dBPA under

9 Sending Loudness Rating (SLR)

NOM

8 ± 3dB

MAX

10 Receiving Loudness Rating (RLR)

NOM -1 ± 3dB

MAX -12 ± 3dB

11 Side Tone Masking Rating (STMR)

NOM 25dB over

MAX

12 Echo Loss (EL)

NOM

40dB over

MAX

13 Sending Distortion (SD) refer to TABLE 30.3

14 Receiving Distortion (RD) refer to TABLE 30.4

15 Idle Noise-Sending (INS)

NOM

-55dBm0p under

MAX

16 Idle Noise-Receiving (INR)

NOM -45dBPA under

MAX -40dBPA under

MS

HEAD SET

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

- 20 -

2.8 Charging

• Normal mode: Complete Voltage: 4.2V

Charging Current: 500mA

• Await mode: In case of During a Call, should be kept 3.9V

(GSM: It should be kept 3.9V in all power level

WCDMA: It will not be kept 3.9V in some power level)

• Extend await mode: At Charging prohibited temperature(0°C under or 45°C over)

(GSM: It should be kept 3.7V in all power level

WCDMA: It will not be kept 3.7V in some power level)

No Test Item Specification

TDMA NOISE

GSM

SEND

GSM: Power Level: 5 REV.

DCS: Power Level: 0

DCS

SEND

17

(Cell Power: -90 ~ -105dBm) REV.

Acoustic(Max Vol.)

GSM

SEND

MS/HEADSET SLR: 8 ± 3dB REV.

MS/HEADSET RLR: -13 ± 1dB/-15dB

DCS

SEND

(SLR/RLR: mid-Value Setting) REV.

MS

Headset

-62dBm

under

LGE Internal Use Only

3. TECHNICAL BRIEF

- 21 -

3.1 Digital Baseband(DBB) & Multimedia Processor

3.1.1 General Description

• Access subsystem

- Access Central Processing Unit (CPU) subsystem - ARM926, Joint Test Action Group (JTAG),

Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM

- Access peripheral subsystems - Subscriber Identity Module (SIM) interface, IrDA®, Universal

Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on

- Digital Signal Processor (DSP) subsystem - CEVA-X1620, JTAG, Static Random Access Memory

(SRAM), and Program Data Read Only Memory (PDROM)

- EDGE/GSM/GPRS (EGG) subsystem - EGG hardware accelerators

- WCDMA subsystem - WCDMA hardware accelerators

• Application subsystem

- Application CPU subsystem - containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM

- Application peripheral subsystems - I2C¢‚, keypad, UART, and so on

- Graphics subsystem - XGAM subsystem

- Audio Processing Execution (APEX) and video encoder subsystems In addition to the two

subsystems above, there is also a test block, chip control block, and a pad multiplexing block

residing at the top level

• DSP

- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the

DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB

instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to

the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP

megacell is clocked at 208 MHz.

- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a

direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB.

The AHB slave interface allows the CPU and the DMA to access in the program and data RAM

residing in the DSPSUB.

3. TECHNICAL BRIEF

- 22 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

• Multi-media Processor(MMIC : ZR3453X )

- The ZR3453X is an advanced multimedia coprocessor for cellular devices. ZR3453X is an MCP

that includes a multimedia core and SDRAM memory chip. The multimedia core performs audio

and video recording, playback, and editing; still image capture (DSC), viewing, and editing;

MIDI/MP3 playback (for ring tones); 3D acceleration (for gaming). The memory chip in the MCP is

a 16MB (2MB) mobile SDRAM (that can be enlarged by packaging to 64MB), used both for

program code and for working data (both stream data and frame buffers).

• WCDMA subsystem

- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem

- An interface to the WCMDA together with memory control and an internal single port RAM. The

WCDMA subsystem has three AHB slave interfaces.

- The Ericsson DB 3150 also includes HSDPA class 6 functionality.

- The WCDMA subsystem is handled and provided by Ericsson.

• XGAM subsystem

- The XGAM subsystem is a graphics acceleration module that provides hardware support in the

creation of visual imagery and the transfer of this data to a display. The XGAM also provides

support for connecting a Camera module. The visual data could be graphics, still images, or video.

- The XGAM subsystem is handled and provided by Ericsson.

• Operation and Services

- I

2

C™ Interface

- SIM Interfaces

- General Purpose I/O (GPIO) Interface

- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM

- JTAG

- RTC

- ETM (in Prototype Package)

- 23 -

3. TECHNICAL BRIEF

LGE Internal Use Only

(

Figure 3-1-1 KF755d Block Diagram

<LCD>

t Sensor

Ligh

From Zoran LCD IF

EMIF

EMIF1

ory

MMem

SDRAM (1G)

NAND (2G)

A

NT

GSM/ EDGE PA + Ant Sw.

P

LED

2

DI

VGA>

<

CDI

SUB PMIC

Digital Baseband Process or (Dual

Application CPU

DB

cc ess

A CPU

RF3000

GSM /

EDGE

Transceive

<u- SD card >

Key_IF

315

0

)

core

r

I2C_2

Transceiv

Touc

GPIO_I2C_2

Touch Panel

GPIO_I2C_1

EL Controller

SD_IF

GPIO_I2C_2

Accelerometer

RF3100

WCDMA

r

e

h Button

I2S

S PI

USB

I2S_1

< USB

Transceiver >

I2C_1

Baseban

_0

PCM

AB3000

Analog

Process

or

Audio)

(

d

Headset

FM_ANT

USB

TV_Out

Connector

18Pin Cradle

AB3000

Analog Baseband Processor

(Power

Manageme

<Spk>

BAT_IF

SIM_IF

nt)

Vibrator_IF(PWM)

<Mic

U

<SIM>

Amp

Zoran_GPIO

>

Zoran_CD

<5 Mega>

Zoran_I2

< Zoran >

To EMP CAM IF

nocomeR

kcajraE

TRA

BSU

tuO VT

C

SH0.2

I

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 24 -

3.1.2 External memory interface

RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory

area.

A. KF755d

• 2Gb NAND flash memory +1G SDRAM

DD evicece P art Nam e M akerer Itemem Tim e S ize Speeeed

Program sp eed 2 00µs1Page=(2K + 64)Bytes 10 .32M Byte/s

Erase spee d 1 .5m s 1Block=(128K+4K)Bytes 88M B yte/s

NAND flash KAL0 0900BM -DJ55 Samsung

Figure 3-1-1 KF755d Block Diagram

Figure 3- 1- 2. External Memory Configuration of KF755d

• Data Communication

- IrDA ® (SIR)

- UARTs (ACB, EDB (RS232))

- Slave USB

• Package

- 12 by 12 mm 344 balls, 0.5mm pitch

FPBGA Production Package

LGE Internal Use Only

3. TECHNICAL BRIEF

- 25 -

3.1.3 Hardware Architecture

A. Block Diagram

Figure 3-1-3. Access system of Ericsson DB3150

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 26 -

Figure 3-1-4. Application system of Ericsson DB3150

LGE Internal Use Only

3. TECHNICAL BRIEF

- 27 -

B. CPU Subsystem

• Access CPU subsystem

The digital baseband controller includes an access CPU subsystem, which includes the submodules

described below.

- 32 KiB I-cache

- 16 KiB D-cache

- Page table

- Memory Management Unit (MMU)

- JTAG

- ETM9

- 26 KiB I-TCM

- 8 KiB D-TCM

• Application CPU subsystem

The digital baseband controller includes an Application CPU subsystem, which includes the

submodules described below.

- 32 KiB I-cache

- 16 KiB D-cache

- Page table

- MMU

- JTAG

- ETM9

- 8 KiB I-TCM

- 8 KiB D-TCM

C. Peripheral Hardware Subsystem

The digital baseband controller includes hardware that supports mobile terminal peripherals such as a

MMC, SD, UART, I2C, USB, keypad, and infrared. Collectively, this hardware comprises the

Peripheral subsystem.

The functional blocks of the Peripheral subsystem connect to the peripheral bus through four separate

bridges, which provide a simple interface to support different timing and memory access

arrangements.

LGE Internal Use Only

Only for training and service purposes

D. DSP Hardware Subsystem

The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the DSP

CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB

instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to the

megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP

megacell is clocked at 208 MHz.

The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a direct

access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB. The AHB

slave interface allows the CPU and the DMA to access in the program and data RAM residing in the

DSPSUB.

E. XGAM Subsystem

The XGAM subsystem is a graphics acceleration module that provides hardware support in the

creation of visual imagery and the transfer of this data to a display. The XGAM also provides support

for connecting a Camera module. The visual data could be graphics, still images, or video.

The XGAM subsystem is handled and provided by Ericsson.

F. System Control Subsystem

The SYSCON resides at the top level of the circuit architecture and is responsible for clock generation

and clock and reset distribution within the digital baseband controller, as well as to external devices.

The block is a slave peripheral under control of the ARM processor. The programming of the SYSCON

controls the fundamental modes of operation within the digital baseband controller. Individual blocks

can also be reset and their clocks held inactive by accessing the appropriate control registers.

3. TECHNICAL BRIEF

- 28 -

LGE Internal Use Only

3. TECHNICAL BRIEF

- 29 -

3.1.4 RF Interface

A. Asta Interface

Asta controls GSM RF part using these signals through GSM RF chip-Gimli.

• RF_DATA_A

• RF_DATA_B

• RF_DATA_C

• RF_DATA_STRB

B. WCDMA Radio Link Interface

• RF_WCDMA_PA_0_EN

• RF_WCDMA_PA_1_EN

• RF_WCDMA_DCDC_EN

• RF_WCDMA_PWRDET_EN

Y4

RF_DATA_A RF_DATA_B

AA2 Y3

RF_DATA_C

Y2

RF_DATA_STRB

QDATA_AMP_MSB

IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR

Figure 3-1- 5. Schematic of Asta RF Interface

Figure 3-1-6. Schematic of WCDMA RF Interface

RF_DATA_STRB

RF_WCDMA_PA_0_EN RF_WCDMA_PA_1_EN

RF_WCDMA_DCDC_EN

RF_WCDMA_PWRDET_EN

RF_DATA_A RF_DATA_B RF_DATA_C

ADC_I_NEG

ADC_I_POS ADC_Q_NEG ADC_Q_POS

Y4 AA2 Y3 Y2

AB8 V7 AB5 AB6

Y10 W10 W9 Y9

QDATA_AMP_MSB

IDATA_FREQ_MSB AMP_LSB_FREQ_LSB DCLK_DATSTR

WTX_BAND_1_EN

TP300

WDCDC_EN WPOW_DET_EN

WRX_I_N WRX_I_P WRX_Q_N WRX_Q_P

DAC_I_NEG DAC_I_POS

Y8 W8 W7

WTX_I_N WTX_I_P

LGE Internal Use Only

Only for training and service purposes

3.1.5 SIM Interface

SIM interface scheme is shown in Figure3-1-6.

SIMDAT0, SIMCLK0, SIMRST0 ports are used to communicate DBB(Asta) with ABB(Veronica) and

filter.

3.1.6 UART Interface

UART signals are connected to Asta GPIO through IO connector

3. TECHNICAL BRIEF

- 30 -

SIM (Interface between DBB and ABB)

SIMDAT0 SIM card bidirectional data line

SIMCLK0 SIM card reference clock

SIMRST0 SIM card async/sync reset

Resource Name Note

UART0

ACC_GPIO_2 ACC_UART_RX ACC Receive Data

ACC_GPIO_3 ACC_UART_TX ACC Transmit Data

UART1

APP_GPIO_0 APP_UART_RX APP Receive Data

APP_GPIO_1 APP_UART_TX APP Transmit Data

Table 3-1-2. SIM Interface

Table 3-1-3. UART Interface

Figure 3-1-7. SIM Interface

Asta

SIMDAT0

SIMCLK0

SIMRST0

VDD E

10K

SDAT SIMDAT

SCLK SIMCLK

SRST

SIMVCC

Veronica

SIMRST

10K

VDD

DAT

CLK CARD

RST

LGE Internal Use Only

3.1.7 GPIO (General Purpose Input/Output) map

In total 39 allowable resources. This model is using 39 resources.

GPIO Map, describing application, I/O state, and enable level are shown in below table.

3. TECHNICAL BRIEF

- 31 -

Table 3-1-4. Asta ACC GPIO Map Table

DB3150's GPIO GPIO Mapping Init Status

ACC_GPIO_0 ACC_GP00_USB_STP Output low

ACC_GPIO_1 ACC_GP01_USB_DIR input

ACC_GPIO_2 ACC_GP02_UART0_RX input

ACC_GPIO_3 ACC_GP03_UART0_TX Output

ACC_GPIO_4 ACC_GP04_USB_CLK input

ACC_GPIO_5 ACC_GP05_USB_NXT input

ACC_GPIO_6 ACC_GP06_USB_DAT4 input / Output

ACC_GPIO_7 ACC_GP07_USB_DAT5 input / Output

ACC_GPIO_8 ACC_GP10_USB_DAT6 input / Output

ACC_GPIO_9 ACC_GP11_USB_DAT7 input / Output

ACC_GPIO_10 ACC_GP12_TOUCH_LDO_EN Output low

ACC_GPIO_11 ACC_GP13_SPK_AMP_EN Output low

ACC_GPIO_12 ACC_GP14_BT_SPI_INT Input

ACC_GPIO_13 ACC_GP15_FLIPSENSE Input

ACC_GPIO_14 ACC_GP16_FM_GPIO2 Input

ACC_GPIO_15 ACC_GP17_PHFSENSE Input

ACC_GPIO_16 ACC_GP20_USB_CS_PD input / Output

ACC_GPIO_17 ACC_GP21_VC_IO_OFF Output low

ACC_GPIO_18 ACC_GP22_USB_DAT3 input / Output

ACC_GPIO_19 ACC_GP23_BT_SPI_CS0n Output

ACC_GPIO_20 ACC_GP24_BT_SPI_DAT0 Output low

ACC_GPIO_21 ACC_GP25_BT_SPI_DAT1 Input

ACC_GPIO_22 ACC_GP26_BT_SPI_CLK Output low

ACC_GPIO_23 ACC_GP27_AMP_SW_EN Output low

LG KF755D Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual